CA2734635A1 - Ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method - Google Patents
Ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method Download PDFInfo
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- CA2734635A1 CA2734635A1 CA2734635A CA2734635A CA2734635A1 CA 2734635 A1 CA2734635 A1 CA 2734635A1 CA 2734635 A CA2734635 A CA 2734635A CA 2734635 A CA2734635 A CA 2734635A CA 2734635 A1 CA2734635 A1 CA 2734635A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
- G01N29/38—Detecting the response signal, e.g. electronic circuits specially adapted therefor by time filtering, e.g. using time gates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
- G01N29/40—Detecting the response signal, e.g. electronic circuits specially adapted therefor by amplitude filtering, e.g. by applying a threshold or by gain control
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/106—Number of transducers one or more transducer arrays
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Abstract
According to one embodiment, An ultrasonic flaw detecting apparatus comprising: a transducer in which a piezoelectric element array for transmitting ultrasonic waves to and receiving echo signals from a test object; an element driving unit for scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves; a synthesizing unit for synthesizing an internal image of the test object based on the echo signals received by the piezoelectric element array; and a signal replacing unit for replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed.
Description
ULTRASONIC FLAW DETECTING APPARATUS AND
ULTRASONIC FLAW DETECTING METHOD
FIELD
The present invention relates to an ultrasonic flaw detecting technique that visualizes a flaw state in a structure or a component such as a void and crack of a joint region by using an ultrasonic wave transmitted/received by a piezoelectric element.
BACKGROUND
It is widely practiced to use an ultrasonic flaw detecting apparatus to evaluate a flaw state such as a void and a crack of a joint region in a structure or a component that is a test object.
An ultrasonic wave transmitted from a piezoelectric element to such a test object is reflected chiefly by a surface, a flaw, and a bottom of the object and the piezoelectric element receives echo signals from them. Assuming that a moment a surface echo has been received is a starting point and a moment a bottom echo is received is an ending point, an echo signal that is received within a range from the starting point to the ending point is treated as a flaw echo. Then, information such as a position and a size of the flaw in the test object is visualized by detecting intensity and a timing of the flaw echo (for example, see Patent Document 1 (Japanese Patent Laid-Open No. 2003-121426)).
It is known that in an ultrasonic flaw detecting apparatus, spatial resolution of a detected flaw decreases with increasing depth of a test object. Therefore, conventional ultrasonic flaw detecting apparatuses have a problem that if a flaw is at or near a bottom or a corner of a test object, visibility of a visualized flaw decreases because multiple echoes interfere with a flaw echo (see Fig. 6(C)).
The present invention has been made in view of such circumstances, and provided an ultrasonic flaw detecting technique that can accurately and rapidly detect a flaw at or near a bottom or a corner of a test object.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 illustrates an embodiment of an ultrasonic flaw detecting method for inspecting a test object (a square billet) by an ultrasonic flaw detecting apparatus;
Fig. 2 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a first embodiment;
Fig. 3(A) illustrates ultrasonic scans by piezoelectric element array;
Fig. 3(B) illustrates transmitted ultrasonic waves and received echo signals;
Fig. 4 is a block diagram illustrating a modified example of the ultrasonic flaw detecting apparatus in accordance with the first embodiment;
ULTRASONIC FLAW DETECTING METHOD
FIELD
The present invention relates to an ultrasonic flaw detecting technique that visualizes a flaw state in a structure or a component such as a void and crack of a joint region by using an ultrasonic wave transmitted/received by a piezoelectric element.
BACKGROUND
It is widely practiced to use an ultrasonic flaw detecting apparatus to evaluate a flaw state such as a void and a crack of a joint region in a structure or a component that is a test object.
An ultrasonic wave transmitted from a piezoelectric element to such a test object is reflected chiefly by a surface, a flaw, and a bottom of the object and the piezoelectric element receives echo signals from them. Assuming that a moment a surface echo has been received is a starting point and a moment a bottom echo is received is an ending point, an echo signal that is received within a range from the starting point to the ending point is treated as a flaw echo. Then, information such as a position and a size of the flaw in the test object is visualized by detecting intensity and a timing of the flaw echo (for example, see Patent Document 1 (Japanese Patent Laid-Open No. 2003-121426)).
It is known that in an ultrasonic flaw detecting apparatus, spatial resolution of a detected flaw decreases with increasing depth of a test object. Therefore, conventional ultrasonic flaw detecting apparatuses have a problem that if a flaw is at or near a bottom or a corner of a test object, visibility of a visualized flaw decreases because multiple echoes interfere with a flaw echo (see Fig. 6(C)).
The present invention has been made in view of such circumstances, and provided an ultrasonic flaw detecting technique that can accurately and rapidly detect a flaw at or near a bottom or a corner of a test object.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 illustrates an embodiment of an ultrasonic flaw detecting method for inspecting a test object (a square billet) by an ultrasonic flaw detecting apparatus;
Fig. 2 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a first embodiment;
Fig. 3(A) illustrates ultrasonic scans by piezoelectric element array;
Fig. 3(B) illustrates transmitted ultrasonic waves and received echo signals;
Fig. 4 is a block diagram illustrating a modified example of the ultrasonic flaw detecting apparatus in accordance with the first embodiment;
Fig. 5(A) illustrates echo signals that have not yet been processed by a signal replacing unit;
Fig. 5(B) illustrates the processing by the signal replacing unit;
Fig. 5(C) illustrates the echo signals that have been processed by the signal replacing unit;
Fig. 6(A) is a conceptual diagram illustrating a distribution of flaws in a test object;
Fig. 6(B) illustrates a visualized flaw distribution in which a bottom echo is removed;
Fig. 6(C) illustrates a visualized flaw distribution in which a bottom echo remains;
Fig. 7(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a second embodiment;
Fig. 7(B) illustrates ultrasonic scans in a comparative example;
Fig. 7(Q- is a graph showing a distribution of pixel intensity of an internal image synthesized in the second embodiment;
Fig. 7(D) is a graph showing a distribution of pixel intensity of an internal image synthesized in the comparative example;
Fig. 8(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a third embodiment;
Fig. 8(B) illustrates ultrasonic scans in a comparative example;
Fig. 5(B) illustrates the processing by the signal replacing unit;
Fig. 5(C) illustrates the echo signals that have been processed by the signal replacing unit;
Fig. 6(A) is a conceptual diagram illustrating a distribution of flaws in a test object;
Fig. 6(B) illustrates a visualized flaw distribution in which a bottom echo is removed;
Fig. 6(C) illustrates a visualized flaw distribution in which a bottom echo remains;
Fig. 7(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a second embodiment;
Fig. 7(B) illustrates ultrasonic scans in a comparative example;
Fig. 7(Q- is a graph showing a distribution of pixel intensity of an internal image synthesized in the second embodiment;
Fig. 7(D) is a graph showing a distribution of pixel intensity of an internal image synthesized in the comparative example;
Fig. 8(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a third embodiment;
Fig. 8(B) illustrates ultrasonic scans in a comparative example;
Fig. 8(C) illustrates ultrasonic scans in another comparative example;
Fig. 8(D) is an internal image synthesized in the third embodiment of Fig. 8(A);
Fig. 8(E) is an internal image synthesized in the comparative example of Fig. 8(B);
Fig. 8(F) is an internal image synthesized in the comparative example of Fig. 8(C);
Fig. 9(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a fourth embodiment;
Fig. 9(B) illustrates ultrasonic scans by the ultrasonic flaw detecting apparatus in accordance with the fourth embodiment;
Fig. 9(C) illustrates ultrasonic scans by the ultrasonic flaw detecting apparatus in accordance with the fourth embodiment;
Fig. 10 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a fifth embodiment; and Fig. 11 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a sixth embodiment.
DETAILED DESCRIPTION
(First Embodiment) Hereinafter, some embodiments will be described with reference to the accompanying drawings.
Fig. 8(D) is an internal image synthesized in the third embodiment of Fig. 8(A);
Fig. 8(E) is an internal image synthesized in the comparative example of Fig. 8(B);
Fig. 8(F) is an internal image synthesized in the comparative example of Fig. 8(C);
Fig. 9(A) illustrates ultrasonic scans by an ultrasonic flaw detecting apparatus in accordance with a fourth embodiment;
Fig. 9(B) illustrates ultrasonic scans by the ultrasonic flaw detecting apparatus in accordance with the fourth embodiment;
Fig. 9(C) illustrates ultrasonic scans by the ultrasonic flaw detecting apparatus in accordance with the fourth embodiment;
Fig. 10 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a fifth embodiment; and Fig. 11 is a block diagram of an ultrasonic flaw detecting apparatus in accordance with a sixth embodiment.
DETAILED DESCRIPTION
(First Embodiment) Hereinafter, some embodiments will be described with reference to the accompanying drawings.
An ultrasonic flaw detecting apparatus comprising: a transducer 2 in which a piezoelectric element array 25 for transmitting ultrasonic waves to and receiving echo signals from a test object 3; an element driving unit 11 for scanning the piezoelectric element array 25 at a predetermined cycle and causing the ultrasonic waves; a synthesizing unit 15 for synthesizing an internal image of the test object 3 based on the echo signals received by the piezoelectric element array 25;
and a signal replacing unit 17 for replacing the received echo signal with an echo signal in which a bottom echo of the test object 3 is removed.
As illustrated in Fig. 1, the ultrasonic flaw detecting apparatus in accordance with the present embodiment includes a main body 1 connected with a transducer 2 via a cable.
The ultrasonic flaw detecting apparatus abuts the transducer 2 on a surface 3a of a bar of steel (a square billet 3) that is a test object 3, and moves the square billet 3 to synthesize an internal three-dimensional image by a synthetic aperture focusing technique.
Consequently, the ultrasonic flaw detecting method for online detecting of a flaw 4 in the square billet 3 is achieved.
As shown in Fig. 2, in the transducer 2, a piezoelectric element array 25 for transmitting ultrasonic waves and receiving echo signals to and from the square billet 3. These piezoelectric elements of the array 25 are disposed in a linear arrangement in a direction (X axis direction), which is perpendicular to a moving direction of the square billet 3 (Y
axis direction). Note that the piezoelectric elements array 25 may be disposed in a row or a matrix arrangement.
An ultrasonic wave is transmitted into the square billet 3 through a shoe 24 in contact with a front of the transducer 2 and a couplant 26, which is a sound propagation medium composed of liquid. Then, the transmitted ultrasonic wave turns into echo signals U including a flaw echo reflected from the flaw 4 in the square billet 3, a surface echo reflected from a surface 3a and a bottom echo reflected from a bottom 3b, and these echoes signals U are received at the transducer 2.
As shown in Fig. 2, the main body 1 of the ultrasonic flaw detecting apparatus includes a signal generating unit 10, an element driving unit 11, a signal detecting unit 12, an amplifying unit 13, an A/D converting unit 14, a synthesizing unit 15, a replacement setting unit 16, a signal replacing unit 17, a displaying unit 22, and a controlling unit 23 for controlling operations of these function units.
Such a configuration of the main body 1 allows for imaging the flaw 4 based on the synthetic aperture focusing technique (SAFT).
The SAFT is a technique that identifies a location of the flaw 4 by focusing on the fact that the flaw 4 exists on an arc having a radius of a propagation distance from, as a center, a piezoelectric element array 25 that receives a flaw echo and sequentially shifting a position of a piezoelectric element array 25 that transmits an ultrasonic wave.
The signal generating unit 10 generates sequential pulsed electrical signals so that the piezoelectric elements array 25 causing ultrasonic waves. The generated electrical signals are sent to the element driving unit 11 and sequentially input to a selected piezoelectric element of the array 25, and the ultrasonic scans are performed.
The piezoelectric element of the array 25, by nature of a piezoelectric body, generates an ultrasonic wave if the element receives an electrical signal, and conversely, if an ultrasonic wave is received, the piezoelectric element array 25 outputs an electrical signal.
As shown in Fig. 3(A), the element driving unit 11 scans the piezoelectric element array 25 at a predetermined cycle to transmit ultrasonic waves to the square billet 3.
Assuming that a sequence number of the piezoelectric element of the array 25 is N and the cycle of the ultrasonic scan is T, a transmission interval At of the ultrasonic waves between the adjacent piezoelectric element of the array 25 is represented by At = T /.N.
As described later, in the element driving unit 11, the cycle T is adjusted so as to prevent multiple reflection of surface echoes from the square billet 3 from affecting an internal image. The adjustment of the cycle T is performed through trial and error in order not to include ghosts of multiple reflections in a synthesized internal image.
It is assumed here that shaded one of the piezoelectric elements of the array 25 in an upper part of Fig. 3(A) is driven.
Then, as shown in an upper side of Fig. 3(B), an ultrasonic wave T1 is transmitted, and after a surface echo S11 is received first, a bottom echo B 1 is received. Later, multiple echoes S1z, S13, S14, S15, and S16 from the surface are sequentially detected with decreasing intensity at a predetermined interval.
After the transmission interval At, shaded one of the piezoelectric element of the array 25 in a middle part of Fig.
3(A) is driven to transmit an ultrasonic wave T2 as shown in a middle of Fig. 3(B). Then, after a surface echo S21 is received first, a bottom echo B2 is received. Later, multiple echoes S22, S23, and S24 from the surface are sequentially detected with decreasing intensity at the predetermined interval.
Also, after this transmission interval At, this flow is true of a case shown in a lower part of Fig. 3(A) and a lower side of Fig. 3(B).
In these cases, if multiple echoes derived from the previous ultrasonic wave are superimposed on a signal area V, which forms an internal image of the square billet 3, the internal image includes ghosts. Therefore, the cycle T of the ultrasonic scans (or the transmission interval At of ultrasonic waves from adjacent piezoelectric elements of the array 25) is adjusted so as not to perform a multiple echo derived from the previous ultrasonic wave from being superimposed on a signal area V.
As shown in Fig. 2, the signal detecting unit 12 detects an electrical signal converted from an echo signal U at the piezoelectric element array 25. The weak analog electrical signal detected is amplified at the amplifying unit 13, and then converted into a digital signal at the A/D converting unit 14.
The synthesizing unit 15 synthesizes an internal image of the square billet 3 based on each of the echo signals converted into the digital signals. The synthesizing unit 15, in which an internal parallel processor, processes input digital signals synthetically using the synthetic aperture focusing technique (SAFT) and generate three-dimensional image information interior of the square billet 3 is visualized .
The replacement setting unit 16 determines a threshold value or a maximum peak of an echo signal and sets a certain range including and around the determining point as a range of the bottom echo described later based on Fig. 5(B).
The signal replacing unit 17 replaces a received echo signal (Fig. 5(A)) with an echo signal (Fig. 5(C)) in which a bottom echo of the square billet 3 has been removed.
It should be noted that Fig. 2 shows that the signal replacing unit 17 performs the replacement after an echo signal is input to the synthesizing unit 15, but as shown in a modified example of Fig. 4, the signal replacing unit 17 may perform the replacement before an echo signal is input to the synthesizing unit 15.
The synthesizing unit 15 has a function to, if such signal replacing is performed, modify pixel signals of an internal image synthesized from portions in which bottom echoes are removed, to an average intensity level of neighboring pixel signals.
This avoids a case in which if synthesizing is executed with a signal of a bottom echo simply reset to zero, three-dimensional image information of a corresponding portion is different from a flawless normal portion.
Next, operations of the replacement setting unit 16 and the signal replacing unit 17 will be described with reference to Fig. 5.
As shown in Fig. 5(A), echo signals forming three-dimensional image information that have not been processed by the signal replacing unit 17 include waveforms of a surface echo S, a bottom echo B, and a flaw echo D. As a method set at the replacement setting unit 16, for removing the surface echo S and the bottom echo B, a method that uses a threshold value R and a method that detects a peak top P will be illustrated.
First, the method that uses the threshold value R will be described.
The threshold value R is set in the replacement setting unit 16, and the signal replacing unit 17 replaces intensity of signals exceeding the set threshold value R with zero in three-dimensional image information that the synthesizing unit 15 has generated (or echo signals that exist before the three-dimensional image information is generated).
Then, as shown in shaded parts of Fig. 5(B), there remain signal waveforms under the threshold value R around the signals that have been replaced with zero. Because the remaining waveforms may be accidentally detected as a flaw, signal intensity across an extended range W around the signals that exceed the threshold value R is replaced with zero to remove the surface echo S and the bottom echo B.
Next, the method that detects the peak top P will be described.
In this case, the replacement setting unit 16 has a function to set the peak top P of an echo signal. Typically, since intensity of the surface echo S and the bottom echo B is higher than intensity of the flaw echo D, locations of the surface echo S and the bottom echo B can be identified certainly.
To detect a flaw located at a deeper position with high accuracy, it is more important to certainly identify a location of the bottom echo B than the surface echo S. If a shape of the square billet 3, which is the test object, is determined, because an appearance range of the surface echo S and the bottom echo B can also be roughly determined, the peak top P
may be detected within the determined appearance range.
and a signal replacing unit 17 for replacing the received echo signal with an echo signal in which a bottom echo of the test object 3 is removed.
As illustrated in Fig. 1, the ultrasonic flaw detecting apparatus in accordance with the present embodiment includes a main body 1 connected with a transducer 2 via a cable.
The ultrasonic flaw detecting apparatus abuts the transducer 2 on a surface 3a of a bar of steel (a square billet 3) that is a test object 3, and moves the square billet 3 to synthesize an internal three-dimensional image by a synthetic aperture focusing technique.
Consequently, the ultrasonic flaw detecting method for online detecting of a flaw 4 in the square billet 3 is achieved.
As shown in Fig. 2, in the transducer 2, a piezoelectric element array 25 for transmitting ultrasonic waves and receiving echo signals to and from the square billet 3. These piezoelectric elements of the array 25 are disposed in a linear arrangement in a direction (X axis direction), which is perpendicular to a moving direction of the square billet 3 (Y
axis direction). Note that the piezoelectric elements array 25 may be disposed in a row or a matrix arrangement.
An ultrasonic wave is transmitted into the square billet 3 through a shoe 24 in contact with a front of the transducer 2 and a couplant 26, which is a sound propagation medium composed of liquid. Then, the transmitted ultrasonic wave turns into echo signals U including a flaw echo reflected from the flaw 4 in the square billet 3, a surface echo reflected from a surface 3a and a bottom echo reflected from a bottom 3b, and these echoes signals U are received at the transducer 2.
As shown in Fig. 2, the main body 1 of the ultrasonic flaw detecting apparatus includes a signal generating unit 10, an element driving unit 11, a signal detecting unit 12, an amplifying unit 13, an A/D converting unit 14, a synthesizing unit 15, a replacement setting unit 16, a signal replacing unit 17, a displaying unit 22, and a controlling unit 23 for controlling operations of these function units.
Such a configuration of the main body 1 allows for imaging the flaw 4 based on the synthetic aperture focusing technique (SAFT).
The SAFT is a technique that identifies a location of the flaw 4 by focusing on the fact that the flaw 4 exists on an arc having a radius of a propagation distance from, as a center, a piezoelectric element array 25 that receives a flaw echo and sequentially shifting a position of a piezoelectric element array 25 that transmits an ultrasonic wave.
The signal generating unit 10 generates sequential pulsed electrical signals so that the piezoelectric elements array 25 causing ultrasonic waves. The generated electrical signals are sent to the element driving unit 11 and sequentially input to a selected piezoelectric element of the array 25, and the ultrasonic scans are performed.
The piezoelectric element of the array 25, by nature of a piezoelectric body, generates an ultrasonic wave if the element receives an electrical signal, and conversely, if an ultrasonic wave is received, the piezoelectric element array 25 outputs an electrical signal.
As shown in Fig. 3(A), the element driving unit 11 scans the piezoelectric element array 25 at a predetermined cycle to transmit ultrasonic waves to the square billet 3.
Assuming that a sequence number of the piezoelectric element of the array 25 is N and the cycle of the ultrasonic scan is T, a transmission interval At of the ultrasonic waves between the adjacent piezoelectric element of the array 25 is represented by At = T /.N.
As described later, in the element driving unit 11, the cycle T is adjusted so as to prevent multiple reflection of surface echoes from the square billet 3 from affecting an internal image. The adjustment of the cycle T is performed through trial and error in order not to include ghosts of multiple reflections in a synthesized internal image.
It is assumed here that shaded one of the piezoelectric elements of the array 25 in an upper part of Fig. 3(A) is driven.
Then, as shown in an upper side of Fig. 3(B), an ultrasonic wave T1 is transmitted, and after a surface echo S11 is received first, a bottom echo B 1 is received. Later, multiple echoes S1z, S13, S14, S15, and S16 from the surface are sequentially detected with decreasing intensity at a predetermined interval.
After the transmission interval At, shaded one of the piezoelectric element of the array 25 in a middle part of Fig.
3(A) is driven to transmit an ultrasonic wave T2 as shown in a middle of Fig. 3(B). Then, after a surface echo S21 is received first, a bottom echo B2 is received. Later, multiple echoes S22, S23, and S24 from the surface are sequentially detected with decreasing intensity at the predetermined interval.
Also, after this transmission interval At, this flow is true of a case shown in a lower part of Fig. 3(A) and a lower side of Fig. 3(B).
In these cases, if multiple echoes derived from the previous ultrasonic wave are superimposed on a signal area V, which forms an internal image of the square billet 3, the internal image includes ghosts. Therefore, the cycle T of the ultrasonic scans (or the transmission interval At of ultrasonic waves from adjacent piezoelectric elements of the array 25) is adjusted so as not to perform a multiple echo derived from the previous ultrasonic wave from being superimposed on a signal area V.
As shown in Fig. 2, the signal detecting unit 12 detects an electrical signal converted from an echo signal U at the piezoelectric element array 25. The weak analog electrical signal detected is amplified at the amplifying unit 13, and then converted into a digital signal at the A/D converting unit 14.
The synthesizing unit 15 synthesizes an internal image of the square billet 3 based on each of the echo signals converted into the digital signals. The synthesizing unit 15, in which an internal parallel processor, processes input digital signals synthetically using the synthetic aperture focusing technique (SAFT) and generate three-dimensional image information interior of the square billet 3 is visualized .
The replacement setting unit 16 determines a threshold value or a maximum peak of an echo signal and sets a certain range including and around the determining point as a range of the bottom echo described later based on Fig. 5(B).
The signal replacing unit 17 replaces a received echo signal (Fig. 5(A)) with an echo signal (Fig. 5(C)) in which a bottom echo of the square billet 3 has been removed.
It should be noted that Fig. 2 shows that the signal replacing unit 17 performs the replacement after an echo signal is input to the synthesizing unit 15, but as shown in a modified example of Fig. 4, the signal replacing unit 17 may perform the replacement before an echo signal is input to the synthesizing unit 15.
The synthesizing unit 15 has a function to, if such signal replacing is performed, modify pixel signals of an internal image synthesized from portions in which bottom echoes are removed, to an average intensity level of neighboring pixel signals.
This avoids a case in which if synthesizing is executed with a signal of a bottom echo simply reset to zero, three-dimensional image information of a corresponding portion is different from a flawless normal portion.
Next, operations of the replacement setting unit 16 and the signal replacing unit 17 will be described with reference to Fig. 5.
As shown in Fig. 5(A), echo signals forming three-dimensional image information that have not been processed by the signal replacing unit 17 include waveforms of a surface echo S, a bottom echo B, and a flaw echo D. As a method set at the replacement setting unit 16, for removing the surface echo S and the bottom echo B, a method that uses a threshold value R and a method that detects a peak top P will be illustrated.
First, the method that uses the threshold value R will be described.
The threshold value R is set in the replacement setting unit 16, and the signal replacing unit 17 replaces intensity of signals exceeding the set threshold value R with zero in three-dimensional image information that the synthesizing unit 15 has generated (or echo signals that exist before the three-dimensional image information is generated).
Then, as shown in shaded parts of Fig. 5(B), there remain signal waveforms under the threshold value R around the signals that have been replaced with zero. Because the remaining waveforms may be accidentally detected as a flaw, signal intensity across an extended range W around the signals that exceed the threshold value R is replaced with zero to remove the surface echo S and the bottom echo B.
Next, the method that detects the peak top P will be described.
In this case, the replacement setting unit 16 has a function to set the peak top P of an echo signal. Typically, since intensity of the surface echo S and the bottom echo B is higher than intensity of the flaw echo D, locations of the surface echo S and the bottom echo B can be identified certainly.
To detect a flaw located at a deeper position with high accuracy, it is more important to certainly identify a location of the bottom echo B than the surface echo S. If a shape of the square billet 3, which is the test object, is determined, because an appearance range of the surface echo S and the bottom echo B can also be roughly determined, the peak top P
may be detected within the determined appearance range.
It is necessary to replace signal intensity across an extended range W around a signal having the detected peak top P with zero. This is same as the above-mentioned method that uses the threshold value R.
As described above, by the functions of the signal replacing unit 17 that use the method for using the threshold value R and the method for detecting the peak top P, as shown in Fig. 5(C), after the replacement processing, the surface echo S (dashed line) and the bottom echo B (dashed line) are removed from three-dimensional image information, and only the waveform of the flaw echo D is extracted.
The displaying unit 22 (Fig. 2) captures and displays the three-dimensional image information that the signal replacing unit 17 has performed the replacement processing.
Fig. 6(A) conceptually illustrates a distribution of flaws 4 in the square billet 3. Fig. 6(B) shows an image of a visualized flaw distribution in which the signal replacing unit 17 executes the replacement processing to remove a bottom echo. Fig. 6(C) shows a visualized image in which the signal replacing unit 17 does not execute the replacement processing and the bottom echo remains.
Such replacement processing can avoid effect caused by multiple echoes from the bottom to accurately detect the flaws 4 in the square billet 3, which is the test object.
(Second Embodiment) In the second embodiment, the piezoelectric elements array 25 are divided into at least two areas (in an example of Fig. 7(A), divided into two areas) and the element driving unit 11 performs ultrasonic scans at each area.
The square billet 3 having a flaw distribution conceptually illustrated in Fig. 7(A) is divided into two areas G1 and G2, and then the ultrasonic scans are performed. In this case, because a cycle of the ultrasonic scans is half a cycle of the non-division case (multiplied by a reciprocal number to a division number), a test time of the square billet 3 can be reduced.
Fig. 7(C) is a distribution graph of pixel intensity in the case where the synthesizing is performed with such division scans, and signals corresponding to four flaws 4 are significantly detected. The resultant distribution is not much different from a pixel intensity distribution (Fig. 7(D)) of the case in which division scans are not performed on an area G
(Fig. 7(B)) as a comparative example.
(Third Embodiment) In the third embodiment, synthesizing unit 15 synthesizes broadly an area closer to a corner relative to an opposite area bordered by a perpendicular line from each of the piezoelectric elements of the array 25.
Specifically, as shown in Fig. 8(A), an image of a square billet 3 in which flaws 4 are distributed was synthesized with the area closer to the corner having an angle of 50 and an area closer to a center having an angle of 3 , i.e., with an outward area having a wider angle. As a result, as shown in Fig. 8(D), a resultant image shows that the flaw images at or near the corner and a flat portion are clear.
On the other hand, comparative examples are shown as a case in which area to be synthesized is symmetrical to a perpendicular line from each of the piezoelectric element of the array 25.
If both angle of an area closer to a corner and an area closer to a center are set wide to 5 (Fig. 8(B)), in a resultant image, flaw images at or near the corner were clear, but flaw images at or near a flat portion were obscure (Fig. 8(E)). It is considered that the deterioration of image quality was caused by too increased synthesized images that form the flat portion.
If both angle of an area closer to a corner and an area closer to a center were set narrow to 3 (Fig. 8(C)), in a resultant image, flaw images at or near a flat portion were clear, but flaw images at or near the corner were obscure (Fig.
8(F)). It is considered that the deterioration of image quality was caused by too decreased synthesized images that form the corner.
(Fourth Embodiment) In the fourth embodiment, the element driving unit 11 operates with a range of transmitting and receiving of the piezoelectric element array 25 changed according to the size of the square billet 3.
As described above, by the functions of the signal replacing unit 17 that use the method for using the threshold value R and the method for detecting the peak top P, as shown in Fig. 5(C), after the replacement processing, the surface echo S (dashed line) and the bottom echo B (dashed line) are removed from three-dimensional image information, and only the waveform of the flaw echo D is extracted.
The displaying unit 22 (Fig. 2) captures and displays the three-dimensional image information that the signal replacing unit 17 has performed the replacement processing.
Fig. 6(A) conceptually illustrates a distribution of flaws 4 in the square billet 3. Fig. 6(B) shows an image of a visualized flaw distribution in which the signal replacing unit 17 executes the replacement processing to remove a bottom echo. Fig. 6(C) shows a visualized image in which the signal replacing unit 17 does not execute the replacement processing and the bottom echo remains.
Such replacement processing can avoid effect caused by multiple echoes from the bottom to accurately detect the flaws 4 in the square billet 3, which is the test object.
(Second Embodiment) In the second embodiment, the piezoelectric elements array 25 are divided into at least two areas (in an example of Fig. 7(A), divided into two areas) and the element driving unit 11 performs ultrasonic scans at each area.
The square billet 3 having a flaw distribution conceptually illustrated in Fig. 7(A) is divided into two areas G1 and G2, and then the ultrasonic scans are performed. In this case, because a cycle of the ultrasonic scans is half a cycle of the non-division case (multiplied by a reciprocal number to a division number), a test time of the square billet 3 can be reduced.
Fig. 7(C) is a distribution graph of pixel intensity in the case where the synthesizing is performed with such division scans, and signals corresponding to four flaws 4 are significantly detected. The resultant distribution is not much different from a pixel intensity distribution (Fig. 7(D)) of the case in which division scans are not performed on an area G
(Fig. 7(B)) as a comparative example.
(Third Embodiment) In the third embodiment, synthesizing unit 15 synthesizes broadly an area closer to a corner relative to an opposite area bordered by a perpendicular line from each of the piezoelectric elements of the array 25.
Specifically, as shown in Fig. 8(A), an image of a square billet 3 in which flaws 4 are distributed was synthesized with the area closer to the corner having an angle of 50 and an area closer to a center having an angle of 3 , i.e., with an outward area having a wider angle. As a result, as shown in Fig. 8(D), a resultant image shows that the flaw images at or near the corner and a flat portion are clear.
On the other hand, comparative examples are shown as a case in which area to be synthesized is symmetrical to a perpendicular line from each of the piezoelectric element of the array 25.
If both angle of an area closer to a corner and an area closer to a center are set wide to 5 (Fig. 8(B)), in a resultant image, flaw images at or near the corner were clear, but flaw images at or near a flat portion were obscure (Fig. 8(E)). It is considered that the deterioration of image quality was caused by too increased synthesized images that form the flat portion.
If both angle of an area closer to a corner and an area closer to a center were set narrow to 3 (Fig. 8(C)), in a resultant image, flaw images at or near a flat portion were clear, but flaw images at or near the corner were obscure (Fig.
8(F)). It is considered that the deterioration of image quality was caused by too decreased synthesized images that form the corner.
(Fourth Embodiment) In the fourth embodiment, the element driving unit 11 operates with a range of transmitting and receiving of the piezoelectric element array 25 changed according to the size of the square billet 3.
As shown in Figs. 9(A), 9(B), and 9(C), this allows for ultrasonic flaw detection of square billets 3a, 3b, and 3c of unequal size without moving the transducer 2.
In addition, in the fourth embodiment, the division scans shown in the second embodiment and the synthesis of an image having a wider angle in an outward area shown in the third embodiment can be performed for square billets 3 of unequal size.
(Fifth Embodiment) Fig. 10 is the block diagram of the ultrasonic flaw detecting apparatus in accordance with the fifth embodiment.
Note that in Fig. 10, same or corresponding portions as those shown in Fig. 2 are denoted by same reference numerals, and detailed descriptions of these portions will be omitted by citing the above-described descriptions.
The ultrasonic flaw detecting apparatus in accordance with the fifth embodiment further includes a two-dimensional image generating unit 18 and a gate setting unit 19.
The two-dimensional image generating unit 18 generates a perspective image of a test object parallel to a surface 3a or a bottom 3b from three-dimensional image information synthesized by the synthesizing unit 15. That is, in Fig. 10, the displaying unit 22 displays the perspective image showing a distribution of flaws 4 that the square billet 3 is seen along a direction parallel to an. XY plane. This allows for easy recognition of locations of the distributed flaws 4 in the square billet 3.
The gate setting unit 19 allows the two-dimensional image generating unit 18 to generate a perspective image for each level in a depth direction. The gate setting unit 19 sets one or more gate ranges in the depth direction (Z direction), and the displaying unit 22 displays an XY plane perspective image of a flaw 4 included in the gate range. This allows for recognition of a flaw distribution for each depth level.
(Sixth Embodiment) Fig. 11 is the block diagram of the ultrasonic flaw detecting apparatus in accordance with the sixth embodiment.
Note that in Fig. 11, same or corresponding portions as those shown in Fig. 10 are denoted by same reference numerals, and detailed descriptions of these portions will be omitted by citing the above-described descriptions. The ultrasonic flaw detecting apparatus in accordance with the sixth embodiment further includes a threshold value setting unit 20 and a binarizing unit 21.
The binarizing unit 21 represents the internal image as a binary image with binarized brightness levels, and the threshold value setting unit 20 sets a threshold value of the brightness level to obtain the binary image.
The binarizing unit 21 extracts a portion exceeding the threshold value from a two-dimensional image generated by the two-dimensional image generating unit 18 and allows the displaying unit 22 to display the binary image.
This allows for easy recognition and determination of whether the square billet 3 has a flaw 4 or not.
The present invention is not restricted to the embodiments described above, and may be modified as needed within a range of common technical idea. In the embodiments, a square billet is illustrated as a test object, but they may also be applied to a flat plate.
In addition, although apparatuses for online detecting of a flaw in a test object have been illustrated, the present invention can also be applied to an offline apparatus.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel apparatus and method described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the apparatus and method described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
In addition, in the fourth embodiment, the division scans shown in the second embodiment and the synthesis of an image having a wider angle in an outward area shown in the third embodiment can be performed for square billets 3 of unequal size.
(Fifth Embodiment) Fig. 10 is the block diagram of the ultrasonic flaw detecting apparatus in accordance with the fifth embodiment.
Note that in Fig. 10, same or corresponding portions as those shown in Fig. 2 are denoted by same reference numerals, and detailed descriptions of these portions will be omitted by citing the above-described descriptions.
The ultrasonic flaw detecting apparatus in accordance with the fifth embodiment further includes a two-dimensional image generating unit 18 and a gate setting unit 19.
The two-dimensional image generating unit 18 generates a perspective image of a test object parallel to a surface 3a or a bottom 3b from three-dimensional image information synthesized by the synthesizing unit 15. That is, in Fig. 10, the displaying unit 22 displays the perspective image showing a distribution of flaws 4 that the square billet 3 is seen along a direction parallel to an. XY plane. This allows for easy recognition of locations of the distributed flaws 4 in the square billet 3.
The gate setting unit 19 allows the two-dimensional image generating unit 18 to generate a perspective image for each level in a depth direction. The gate setting unit 19 sets one or more gate ranges in the depth direction (Z direction), and the displaying unit 22 displays an XY plane perspective image of a flaw 4 included in the gate range. This allows for recognition of a flaw distribution for each depth level.
(Sixth Embodiment) Fig. 11 is the block diagram of the ultrasonic flaw detecting apparatus in accordance with the sixth embodiment.
Note that in Fig. 11, same or corresponding portions as those shown in Fig. 10 are denoted by same reference numerals, and detailed descriptions of these portions will be omitted by citing the above-described descriptions. The ultrasonic flaw detecting apparatus in accordance with the sixth embodiment further includes a threshold value setting unit 20 and a binarizing unit 21.
The binarizing unit 21 represents the internal image as a binary image with binarized brightness levels, and the threshold value setting unit 20 sets a threshold value of the brightness level to obtain the binary image.
The binarizing unit 21 extracts a portion exceeding the threshold value from a two-dimensional image generated by the two-dimensional image generating unit 18 and allows the displaying unit 22 to display the binary image.
This allows for easy recognition and determination of whether the square billet 3 has a flaw 4 or not.
The present invention is not restricted to the embodiments described above, and may be modified as needed within a range of common technical idea. In the embodiments, a square billet is illustrated as a test object, but they may also be applied to a flat plate.
In addition, although apparatuses for online detecting of a flaw in a test object have been illustrated, the present invention can also be applied to an offline apparatus.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel apparatus and method described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the apparatus and method described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (12)
1. An ultrasonic flaw detecting apparatus comprising:
a transducer in which a piezoelectric element array for transmitting ultrasonic waves to and receiving echo signals from a test object;
an element driving unit for scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves;
a synthesizing unit for synthesizing an internal image of the test object based on the echo signals received by the piezoelectric element array; and a signal replacing unit for replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed.
a transducer in which a piezoelectric element array for transmitting ultrasonic waves to and receiving echo signals from a test object;
an element driving unit for scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves;
a synthesizing unit for synthesizing an internal image of the test object based on the echo signals received by the piezoelectric element array; and a signal replacing unit for replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed.
2. The ultrasonic flaw detecting apparatus according to claim 1, wherein the signal replacing unit performs the replacement before or after the echo signal is input to the synthesizing unit.
3. The ultrasonic flaw detecting apparatus according to claim 1, further comprising a replacement setting unit for determining a threshold value or a maximum peak of the received echo signal and setting a certain range including and around the determining point as the bottom echo.
4. The ultrasonic flaw detecting apparatus according to claims 1, wherein the synthesizing unit modifies pixel signals of the internal image synthesized from portions in which the bottom echoes are removed, to an average intensity level of neighboring pixel signals.
5. The ultrasonic flaw detecting apparatus according to claims 1, wherein the synthesizing unit synthesizes broadly an area closer to a corner of the test object relative to an opposite area bordered by a perpendicular line from each of the piezoelectric elements of the array.
6. The ultrasonic flaw detecting apparatus according to claims 1, wherein the element driving unit performs the scans with the piezoelectric element array dividing the test object into at least two areas.
7. The ultrasonic flaw detecting apparatus according to claims 1, wherein the element driving unit changes a range of the transmitting and the receiving of the piezoelectric element array according to a size of the test object.
8. The ultrasonic flaw detecting apparatus according to claims 1, wherein the element driving unit adjusts the cycle so as to prevent multiple reflection of surface echoes from the test object from affecting the internal image.
9. The ultrasonic flaw detecting apparatus according to claims 1, further comprising a two-dimensional image generating unit for generating, from the internal image synthesized by the synthesizing unit, a perspective image parallel to the surface or the bottom of the test object.
10. The ultrasonic flaw detecting apparatus according to claim 9, further comprising a gate setting unit for allowing the perspective image to be generated for each level in a depth direction.
11. The ultrasonic flaw detecting apparatus according to claims 1, further comprising a binarizing unit for representing the internal image with binarized brightness levels.
12. An ultrasonic flaw detecting method comprising the steps of:
setting a test object to a transducer in which a piezoelectric element array for transmitting ultrasonic waves and receiving echo signals;
scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves;
synthesizing an internal image of the test object based on the echo signals received by the of piezoelectric element array;
and replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed.
setting a test object to a transducer in which a piezoelectric element array for transmitting ultrasonic waves and receiving echo signals;
scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves;
synthesizing an internal image of the test object based on the echo signals received by the of piezoelectric element array;
and replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed.
Applications Claiming Priority (2)
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| JP2010069348A JP2011203037A (en) | 2010-03-25 | 2010-03-25 | Ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method |
| JP069348/2010 | 2010-03-25 |
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| CA2734635A1 true CA2734635A1 (en) | 2011-09-25 |
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| JP (1) | JP2011203037A (en) |
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| DE102008027228B4 (en) * | 2008-05-29 | 2018-12-13 | Ge Inspection Technologies Gmbh | Method and device for the non-destructive ultrasound examination of a test piece with mutually angled, flat surfaces |
| US9213019B2 (en) | 2011-11-18 | 2015-12-15 | General Electric Company | Method of determining a size of a defect using an ultrasonic linear phased array |
| CN103033816B (en) * | 2012-12-07 | 2014-06-04 | 清华大学 | Synthetic aperture focused ultrasonic imaging implementation method based on arc scanning transition |
| US9671374B2 (en) * | 2015-03-04 | 2017-06-06 | The Boeing Company | Ultrasound probe assembly, system, and method that reduce air entrapment |
| JP5997861B1 (en) * | 2016-04-18 | 2016-09-28 | 株式会社日立パワーソリューションズ | Ultrasonic imaging apparatus and image generation method of ultrasonic imaging apparatus. |
| EP3382386B1 (en) * | 2017-03-29 | 2020-10-14 | Fujitsu Limited | Defect detection using ultrasound scan data |
| JP7102726B2 (en) * | 2017-12-21 | 2022-07-20 | 大同特殊鋼株式会社 | How to determine the flaw detection range of an ultrasonic flaw detector |
| JP7091676B2 (en) * | 2018-01-30 | 2022-06-28 | 日本製鉄株式会社 | Ultrasonic flaw detection method |
| CN111323485A (en) * | 2020-04-09 | 2020-06-23 | 上海工程技术大学 | Imaging method and device for detecting internal defects of track slab |
| JP7436835B2 (en) | 2020-04-20 | 2024-02-22 | 日本製鉄株式会社 | Inspection device and method for square billets, and method for manufacturing steel materials from square billets |
| CN114034774B (en) * | 2021-11-10 | 2024-01-16 | 湖北省质安检测鉴定有限公司 | House structure rapid scanning and flaw detection method |
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| US3986389A (en) * | 1975-11-03 | 1976-10-19 | Jones & Laughlin Steel Corporation | Gating control system in ultrasonic inspection apparatus |
| DE3139570C2 (en) * | 1981-10-05 | 1983-09-29 | Krautkrämer GmbH, 5000 Köln | Method and circuit device for determining and displaying maximum values of the ultrasonic signals reflected by reflectors in a test piece |
| DE3418486C1 (en) | 1984-05-18 | 1986-01-02 | Krautkrämer GmbH, 5000 Köln | Ultrasound test method and circuit device for automatic determination of unsound areas close to the rear wall |
| JPH0798042B2 (en) * | 1989-02-14 | 1995-10-25 | 株式会社東芝 | Ultrasonic diagnostic equipment |
| JP2875570B2 (en) * | 1990-02-27 | 1999-03-31 | 日立建機株式会社 | Ultrasonic inspection equipment |
| JP3629913B2 (en) * | 1997-09-05 | 2005-03-16 | Ｊｆｅスチール株式会社 | Ultrasonic flaw detection method and apparatus |
| CA2277460C (en) | 1999-07-13 | 2003-02-18 | Daniel Levesque | Method and system for high resolution ultrasonic imaging of small defects or anomalies |
| JP4511679B2 (en) * | 2000-03-24 | 2010-07-28 | Ｇｅヘルスケア・ジャパン株式会社 | Ultrasonic image generation method, ultrasonic image generation apparatus, and ultrasonic diagnostic apparatus |
| JP2003121426A (en) | 2001-10-15 | 2003-04-23 | Nippon Steel Corp | Ultrasonic test equipment and ultrasonic inspection method |
| JP2003299066A (en) * | 2002-04-05 | 2003-10-17 | Matsushita Electric Ind Co Ltd | Image processing apparatus and its method |
| US6981417B1 (en) * | 2002-04-26 | 2006-01-03 | Sonoscan, Inc. | Scanning acoustic micro imaging method and apparatus for non-rectangular bounded files |
| JP4437656B2 (en) * | 2003-10-02 | 2010-03-24 | 川崎重工業株式会社 | Ultrasonic flaw detector |
| JP2005156305A (en) * | 2003-11-25 | 2005-06-16 | Daido Steel Co Ltd | Evaluation method of internal defect |
| US7222514B2 (en) * | 2004-06-21 | 2007-05-29 | The Boeing Company | Laminate material testing methods and systems |
| JP4606860B2 (en) * | 2004-12-03 | 2011-01-05 | 川崎重工業株式会社 | Defect identification method and apparatus by ultrasonic inspection |
| JP4564867B2 (en) * | 2005-03-14 | 2010-10-20 | 日本クラウトクレーマー株式会社 | Ultrasonic flaw detection method and apparatus |
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| JP5090315B2 (en) * | 2008-10-29 | 2012-12-05 | 株式会社日立製作所 | Ultrasonic flaw detection apparatus and ultrasonic flaw detection method |
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| CA2734635C (en) | 2016-08-16 |
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