CA2525881A1 - Single action assembly for out-of-plane mems microstructures - Google Patents
Single action assembly for out-of-plane mems microstructures Download PDFInfo
- Publication number
- CA2525881A1 CA2525881A1 CA 2525881 CA2525881A CA2525881A1 CA 2525881 A1 CA2525881 A1 CA 2525881A1 CA 2525881 CA2525881 CA 2525881 CA 2525881 A CA2525881 A CA 2525881A CA 2525881 A1 CA2525881 A1 CA 2525881A1
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- CA
- Canada
- Prior art keywords
- plane
- friction
- microstructure
- held
- place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0003—MEMS mechanisms for assembling automatically hinged components, self-assembly devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Description
SINGLE ACTION ASSEMBLY FOR OUT-OF-PLANE MEMS MICROSTRUCTURES
TECHNICAL FIELD
The invention applies to surface micromachined structures. In particular, the invention relates to a method for assembling out-of-plane structures and related apparatus.
BACKGROUND
Surface micromachined Micro-Electro-Mechanical Systems (MEMS) devices are fabricated in-plane. In order to create out-of-plane devices, the MEMS
microstructures require assembly.
Micromanipulator probes are a well established tool in the microelectronics industry for precisely positioning probe-tips for measuring, powering, actuating, and positioning micro-structures.
The wire-bonder is a well established tool in the microelectronics industry for the automation of creating wire contacts between an integrated circuit and the electronic package. The precision of the bonder is highly accurate and is robotically controlled.
A simple and rapid method of assembly using the micromanipulator probe or wire-bonder is desired for assembling out-of-plane microstructures.
SUMMARY OF THE INVENTION
The invention relates to a mechanical design that allows the out-of-plane assembly of surface micromachined structures manufactured on a substrate. The substrate is, for example, a silicon wafer or chip.
The method of the invention involves manufacturing any device that requires out-of-plane assembly with spring flexures that are more compliant in-plane than out-of-plane.
By applying a lateral force in one dimension using a tool such as the micromianipulator or wire-bonder, the spring flexures naturally rotate and lock the device out-of-plane using friction [FIG 1 and FIG 2] or with a combination of a locking mechanism [FIG 3 to FIG
7].
The angle of the device to the substrate can be selectively designed by modifying the location of the locking mechanism.
The number of linkages and dimensions of the spring flexures are not limited in the invention. Depending on the material or application, the dimensions and number of linkages can be modified to suit the application.
Using the micromanipulator or an automated wire-bonder in combination with a lateral force, microstructures using this design can be rapidly assembled.
BRIEF DESCRIPTION OF THE DRAWINGS
In figures which illustrate non-limiting embodiments of the invention:
FIG 1 is an example of the basic design for single action out-of-plane assembly with a two loop spring linkage.
FIG 2 is an example of the basic design using a triangular spring flexure.
FIG 3 is an example of the design in FIG 1 including the locking mechanism FIG 4 is an example of the design in FIG3 with a variation of the locking mechanism FIG 5 is an example of the design in FIG3 with a variation of the locking mechanism FIG 6 is an example of the design in FIG3 with a variation of the locking mechanism FIG 7 is an example of the design in FIG3 with a variation of the locking mechanism FIG 8 is the diagram of the design in FIG7 assembled out-of-plane FIG 9 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 10 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 11 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 13 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 14 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 15 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 16 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 17 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 18 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 19 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 20 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 21 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 22 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 23 is a set of photomicrographs showing the assembly sequence for the two loop spring linkage design.
DETAILED DESCRIPTION
Throughout the following description, specific details are set forth in order to provide a more thorough understanding of the invention. However, the invention may be practiced without these particulars. In other instances, well known elements have not been shown or described in detail to avoid unnecessarily obscuring the invention.
Accordingly, the specification and drawings are to be regarded in an illustrative, rather than a restrictive, sense.
The invention relates to a mechanical design that allows for the out-of-plane assembly of surface micromachined structures manufactured on a substrate. The substrate is, for example, a silicon wafer or chip.
The method of the invention involves manufacturing any device that requires out-of-plane assembly with spring flexures that are more compliant out-of-plane than in-plane.
The typical aspect ratio of the width of the spring flexures to its thickness is approximately 3:1. However, depending on the material properties or application, the aspect ratio can be modified to suit the need.
By applying a lateral force using a tool such as the micromianipulator probe-tip or wire-bonder on the bottom edge of the device along the plane, the spring flexures naturally rotate and lock the device out-of-plane using friction between the bottom edge and the substrate [FIG 1 and FIG 2] or with a combination of a locking mechanism [FIG
3 to FIG
7].
The sequence for assembly can be seen in FIG 23.
The microstructure to be rotated out-of-plane can be attached either to the top of the device or underneath in the case where a cavity in the substrate exists.
Examples of microstructures utilizing the invention are shown in FIG 9 to FIG 22.
The angle of the device to the substrate can be selectively designed by modifying the location of the locking mechanism.
The number of linkages and the dimensions of the spring flexures are not limited in the invention. Depending on the material used or application, the dimensions and number of linkages can be modified to suit the application.
Using the micromanipulator or an automated wire-bonder in combination with a lateral force, microstructures using this design can be rapidly assembled.
As will be apparent to those skilled in the art in the light of the foregoing disclosure, many alterations and modifications are possible in the practice of this invention without departing from the spirit or scope thereof. Accordingly, the scope of the invention is to be construed in accordance with the substance defined by the following claims.
TECHNICAL FIELD
The invention applies to surface micromachined structures. In particular, the invention relates to a method for assembling out-of-plane structures and related apparatus.
BACKGROUND
Surface micromachined Micro-Electro-Mechanical Systems (MEMS) devices are fabricated in-plane. In order to create out-of-plane devices, the MEMS
microstructures require assembly.
Micromanipulator probes are a well established tool in the microelectronics industry for precisely positioning probe-tips for measuring, powering, actuating, and positioning micro-structures.
The wire-bonder is a well established tool in the microelectronics industry for the automation of creating wire contacts between an integrated circuit and the electronic package. The precision of the bonder is highly accurate and is robotically controlled.
A simple and rapid method of assembly using the micromanipulator probe or wire-bonder is desired for assembling out-of-plane microstructures.
SUMMARY OF THE INVENTION
The invention relates to a mechanical design that allows the out-of-plane assembly of surface micromachined structures manufactured on a substrate. The substrate is, for example, a silicon wafer or chip.
The method of the invention involves manufacturing any device that requires out-of-plane assembly with spring flexures that are more compliant in-plane than out-of-plane.
By applying a lateral force in one dimension using a tool such as the micromianipulator or wire-bonder, the spring flexures naturally rotate and lock the device out-of-plane using friction [FIG 1 and FIG 2] or with a combination of a locking mechanism [FIG 3 to FIG
7].
The angle of the device to the substrate can be selectively designed by modifying the location of the locking mechanism.
The number of linkages and dimensions of the spring flexures are not limited in the invention. Depending on the material or application, the dimensions and number of linkages can be modified to suit the application.
Using the micromanipulator or an automated wire-bonder in combination with a lateral force, microstructures using this design can be rapidly assembled.
BRIEF DESCRIPTION OF THE DRAWINGS
In figures which illustrate non-limiting embodiments of the invention:
FIG 1 is an example of the basic design for single action out-of-plane assembly with a two loop spring linkage.
FIG 2 is an example of the basic design using a triangular spring flexure.
FIG 3 is an example of the design in FIG 1 including the locking mechanism FIG 4 is an example of the design in FIG3 with a variation of the locking mechanism FIG 5 is an example of the design in FIG3 with a variation of the locking mechanism FIG 6 is an example of the design in FIG3 with a variation of the locking mechanism FIG 7 is an example of the design in FIG3 with a variation of the locking mechanism FIG 8 is the diagram of the design in FIG7 assembled out-of-plane FIG 9 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 10 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 11 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 13 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 14 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 15 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 16 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 17 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the triangular flexure spring and held in place by friction FIG 18 is a scanning electron microscope image of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 19 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 20 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 21 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 22 is a photograph of an example of a microstructure rotated out-of-plane using the loop spring linkage and held in place by friction FIG 23 is a set of photomicrographs showing the assembly sequence for the two loop spring linkage design.
DETAILED DESCRIPTION
Throughout the following description, specific details are set forth in order to provide a more thorough understanding of the invention. However, the invention may be practiced without these particulars. In other instances, well known elements have not been shown or described in detail to avoid unnecessarily obscuring the invention.
Accordingly, the specification and drawings are to be regarded in an illustrative, rather than a restrictive, sense.
The invention relates to a mechanical design that allows for the out-of-plane assembly of surface micromachined structures manufactured on a substrate. The substrate is, for example, a silicon wafer or chip.
The method of the invention involves manufacturing any device that requires out-of-plane assembly with spring flexures that are more compliant out-of-plane than in-plane.
The typical aspect ratio of the width of the spring flexures to its thickness is approximately 3:1. However, depending on the material properties or application, the aspect ratio can be modified to suit the need.
By applying a lateral force using a tool such as the micromianipulator probe-tip or wire-bonder on the bottom edge of the device along the plane, the spring flexures naturally rotate and lock the device out-of-plane using friction between the bottom edge and the substrate [FIG 1 and FIG 2] or with a combination of a locking mechanism [FIG
3 to FIG
7].
The sequence for assembly can be seen in FIG 23.
The microstructure to be rotated out-of-plane can be attached either to the top of the device or underneath in the case where a cavity in the substrate exists.
Examples of microstructures utilizing the invention are shown in FIG 9 to FIG 22.
The angle of the device to the substrate can be selectively designed by modifying the location of the locking mechanism.
The number of linkages and the dimensions of the spring flexures are not limited in the invention. Depending on the material used or application, the dimensions and number of linkages can be modified to suit the application.
Using the micromanipulator or an automated wire-bonder in combination with a lateral force, microstructures using this design can be rapidly assembled.
As will be apparent to those skilled in the art in the light of the foregoing disclosure, many alterations and modifications are possible in the practice of this invention without departing from the spirit or scope thereof. Accordingly, the scope of the invention is to be construed in accordance with the substance defined by the following claims.
Claims (4)
1. A MEMS microstructure providing out-of-plane orientation using a single lateral force.
2. The structure of claim 1, additionally mounted to the substrate via spring flexures.
3. The structure of claim 1, having a locking mechanism that can hold the structure out-of-plane once assembled.
4. Wherein the action of claim 1, can be provided by, but not limited to, a micromanipulator or wire-bonder from the microelectronics industry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2525881 CA2525881A1 (en) | 2005-11-10 | 2005-11-10 | Single action assembly for out-of-plane mems microstructures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2525881 CA2525881A1 (en) | 2005-11-10 | 2005-11-10 | Single action assembly for out-of-plane mems microstructures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2525881A1 true CA2525881A1 (en) | 2007-05-10 |
Family
ID=38024461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2525881 Abandoned CA2525881A1 (en) | 2005-11-10 | 2005-11-10 | Single action assembly for out-of-plane mems microstructures |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2525881A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009127273A2 (en) * | 2008-04-18 | 2009-10-22 | Robert Bosch Gmbh | Method for the production of a micromechanical component, and micromechanical component |
-
2005
- 2005-11-10 CA CA 2525881 patent/CA2525881A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009127273A2 (en) * | 2008-04-18 | 2009-10-22 | Robert Bosch Gmbh | Method for the production of a micromechanical component, and micromechanical component |
| WO2009127273A3 (en) * | 2008-04-18 | 2010-05-06 | Robert Bosch Gmbh | Method for the production of a micromechanical component having electrode units on two planes, and micromechanical component |
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