Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Hitachi, Ltd.
Hanae Shimokawa
Tasao Soga
Hiroaki Okudaira
Toshiharu Ishida
Tetsuya Nakatsuka
Yoshiharu Inaba
Asao Nishimura
Renesas Technology Corp.
Nec Electronics Corporation
Renesas Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34681197Aexternal-prioritypatent/JP3622462B2/en
An electronic device comprising a substrate and a semiconductor device both of which are connected with each other by means of a Pb-free solder. The Pb-free solder comprises Bi. The semiconductor device has a lead thereon. The lead has an Sn-Bi alloy layer comprising 1 to 20 wt%. The lead may be composed of Cu or a Cu alloy, or an Fe-Ni alloy.
Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board