CA2493351A1 - Pb-free solder-connected structure and electronic device - Google Patents

Pb-free solder-connected structure and electronic device Download PDF

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Publication number
CA2493351A1
CA2493351A1 CA002493351A CA2493351A CA2493351A1 CA 2493351 A1 CA2493351 A1 CA 2493351A1 CA 002493351 A CA002493351 A CA 002493351A CA 2493351 A CA2493351 A CA 2493351A CA 2493351 A1 CA2493351 A1 CA 2493351A1
Authority
CA
Canada
Prior art keywords
free solder
electronic device
connected structure
lead
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002493351A
Other languages
French (fr)
Other versions
CA2493351C (en
Inventor
Hanae Shimokawa
Tasao Soga
Hiroaki Okudaira
Toshiharu Ishida
Tetsuya Nakatsuka
Yoshiharu Inaba
Asao Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Hitachi, Ltd.
Hanae Shimokawa
Tasao Soga
Hiroaki Okudaira
Toshiharu Ishida
Tetsuya Nakatsuka
Yoshiharu Inaba
Asao Nishimura
Renesas Technology Corp.
Nec Electronics Corporation
Renesas Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34681197A external-priority patent/JP3622462B2/en
Application filed by Hitachi, Ltd., Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura, Renesas Technology Corp., Nec Electronics Corporation, Renesas Electronics Corporation filed Critical Hitachi, Ltd.
Publication of CA2493351A1 publication Critical patent/CA2493351A1/en
Application granted granted Critical
Publication of CA2493351C publication Critical patent/CA2493351C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

An electronic device comprising a substrate and a semiconductor device both of which are connected with each other by means of a Pb-free solder. The Pb-free solder comprises Bi. The semiconductor device has a lead thereon. The lead has an Sn-Bi alloy layer comprising 1 to 20 wt%. The lead may be composed of Cu or a Cu alloy, or an Fe-Ni alloy.
CA002493351A 1997-12-16 1998-12-09 Pb-free solder-connected structure and electronic device Expired - Fee Related CA2493351C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9/346811 1997-12-16
JP34681197A JP3622462B2 (en) 1997-12-16 1997-12-16 Semiconductor device
CA002314116A CA2314116C (en) 1997-12-16 1998-12-09 Pb-free solder-connected structure and electronic device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA002314116A Division CA2314116C (en) 1997-12-16 1998-12-09 Pb-free solder-connected structure and electronic device

Publications (2)

Publication Number Publication Date
CA2493351A1 true CA2493351A1 (en) 1999-06-24
CA2493351C CA2493351C (en) 2009-05-26

Family

ID=34394947

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002493351A Expired - Fee Related CA2493351C (en) 1997-12-16 1998-12-09 Pb-free solder-connected structure and electronic device

Country Status (1)

Country Link
CA (1) CA2493351C (en)

Also Published As

Publication number Publication date
CA2493351C (en) 2009-05-26

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MKLA Lapsed

Effective date: 20171211