CA2372551A1 - Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates - Google Patents
Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates Download PDFInfo
- Publication number
- CA2372551A1 CA2372551A1 CA 2372551 CA2372551A CA2372551A1 CA 2372551 A1 CA2372551 A1 CA 2372551A1 CA 2372551 CA2372551 CA 2372551 CA 2372551 A CA2372551 A CA 2372551A CA 2372551 A1 CA2372551 A1 CA 2372551A1
- Authority
- CA
- Canada
- Prior art keywords
- die
- substrate
- ball
- integrated circuit
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Wire Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to methods and structures for facilitating the removal of integrated circuit devices, microelectronic devices or die from substrates and/or for testing the integrity of the bonding between such devices and the substrate, and preferably where the integrated circuit device is a flip chip. The invention provides. in one embodiment a microelectronic device or die having a ball and stud connector attached to a surface of the device opposite to the surface which is intended to be connected to a substrate. In other embodiments, the invention provides for methods and apparatus for removing one or more die attached to a substrate, or assessing the integrity of the bond between each die and the substrate. Each die having a ball and stud connector attached thereto is positioned or secured in a holder. A mechanism clamped to the ball and stud connector applies a tensile force to the die such that the tensile force is exerted essentially perpendicular to the surface of the substrate to which the die is attached and this results from the interaction of the mechanism and the ball and stud connector.
This results in removal of the die from the substrate without significant damage to the die or the substrate or for assessing the integrity of the bond between the die and the substrate by attaching a ball and stud connector to the die. No application of heat is required.
This results in removal of the die from the substrate without significant damage to the die or the substrate or for assessing the integrity of the bond between the die and the substrate by attaching a ball and stud connector to the die. No application of heat is required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2372551 CA2372551C (en) | 2002-02-18 | 2002-02-18 | Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2372551 CA2372551C (en) | 2002-02-18 | 2002-02-18 | Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2372551A1 true CA2372551A1 (en) | 2003-08-18 |
| CA2372551C CA2372551C (en) | 2006-07-04 |
Family
ID=27792745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2372551 Expired - Fee Related CA2372551C (en) | 2002-02-18 | 2002-02-18 | Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2372551C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008003948A1 (en) * | 2006-07-03 | 2008-01-10 | Dage Precision Industries Ltd. | Tensile test device and method for testing deposits on electronic substrates |
| CN111323293A (en) * | 2020-03-23 | 2020-06-23 | 天津大学 | Microelectronic device lead bonding strength test fixture under temperature environment |
-
2002
- 2002-02-18 CA CA 2372551 patent/CA2372551C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008003948A1 (en) * | 2006-07-03 | 2008-01-10 | Dage Precision Industries Ltd. | Tensile test device and method for testing deposits on electronic substrates |
| JP2009543034A (en) * | 2006-07-03 | 2009-12-03 | デイジ プレシジョン インダストリーズ リミテッド | Tensile test apparatus and deposit testing method on electronic substrate |
| US8100021B2 (en) | 2006-07-03 | 2012-01-24 | Nordson Corporation | Tensile test device and method for testing deposits on electronic substrates |
| JP2012168201A (en) * | 2006-07-03 | 2012-09-06 | Digi Precision Ind Ltd | Method for measuring tensile stress |
| US8646337B2 (en) | 2006-07-03 | 2014-02-11 | Nordson Corporation | Tensile test device and method for testing deposits on electronic substrates |
| CN111323293A (en) * | 2020-03-23 | 2020-06-23 | 天津大学 | Microelectronic device lead bonding strength test fixture under temperature environment |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2372551C (en) | 2006-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |