CA2323259A1 - Atomically sharp edged cutting blades and methods for making same - Google Patents

Atomically sharp edged cutting blades and methods for making same Download PDF

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Publication number
CA2323259A1
CA2323259A1 CA002323259A CA2323259A CA2323259A1 CA 2323259 A1 CA2323259 A1 CA 2323259A1 CA 002323259 A CA002323259 A CA 002323259A CA 2323259 A CA2323259 A CA 2323259A CA 2323259 A1 CA2323259 A1 CA 2323259A1
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Canada
Prior art keywords
atomically sharp
sharp cutting
edge
cutting edge
set forth
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CA002323259A
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French (fr)
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CA2323259C (en
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Martin H. Hewman
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Individual
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Publication of CA2323259C publication Critical patent/CA2323259C/en
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Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00—Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54—Razor-blades
    • B26B21/56—Razor-blades characterised by the shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/46—Sputtering by ion beam produced by an external ion source
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/32—Surgical cutting instruments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00—Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54—Razor-blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00—Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54—Razor-blades
    • B26B21/58—Razor-blades characterised by the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B9/00—Blades for hand knives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B2017/00526—Methods of manufacturing
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B2017/00831—Material properties
    • A61B2017/0088—Material properties ceramic
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
    • A61F9/007—Methods or devices for eye surgery
    • A61F9/013—Instruments for compensation of ocular refraction ; Instruments for use in cornea removal, for reshaping or performing incisions in the cornea
    • A61F9/0133—Knives or scalpels specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3109—Cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3114—Machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Surgery (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Plasma & Fusion (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Knives (AREA)
  • Surgical Instruments (AREA)
  • Physical Vapour Deposition (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)

Abstract

An atomically sharpened cutting edge for a cutting instrument is described. Focused ion beam (FIB) milling provides the atomically sharp cutting edge. In one embodiment, a cutting edge blank is provided and milled by FIB to form an atomically sharp edge. In another embodiment, a metal cutting edge blank is provided, a layer of a harder material is provided on at least one side of the blank and it is milled by FIB to form an atomically sharp edge.

Claims (47)

1. An atomically sharp cutting blade for a cutting instrument, said blade comprising:
a cutting edge blank made of a metal material, said blank having a major surface and a tapered edge at one end of the major surface, a layer of a second material deposited on a portion of said major surface on at least one side of cutting edge blank at said tapered edge, said second material being harder than the metal, wherein the layer is milled at an acute angle to a plane parallel to said major surface by a focused ion beam that to provides said blank with a continuous, atomically sharp cutting edge.
2. The atomically sharp cutting blade as set forth in claim 1, further comprising a support substrate to which the metal blank is attached.
3. The atomically sharp cutting blade as set forth in claim 1, wherein the layer of second material is from about 100 to about 500 .ANG. thick.
4. The atomically sharp cutting blade as set forth in claim 1, wherein the coating layer is at least about 200 .ANG. thick.
5. The atomically sharp cutting blade as set forth in claim 1, wherein the second material comprises a material selected from a group consisting of silicon, ceramic, glass, Al2O3, AlTiN, TiN, SiC, SiN, MoS2, amorphous carbon, diamond-like carbon and zircon.
6. The atomically sharp cutting blade as set forth in claim 1, wherein the cutting edge has a radius of curvature that is less than is about 300 .ANG..
7. The atomically sharp cutting blade as set forth in claim 1, wherein the cutting edge has a radius of curvature that is less than is about 100 .ANG..
8. The atomically sharp cutting blade as set forth in claim 1, wherein the cutting edge has a radius of curvature that is less than is about 10 .ANG..
9. The atomically sharp cutting blade as set forth in claim 1, wherein the cutting edge has a single beveled edge.
10. The atomically sharp cutting blade as set forth in claim 1, wherein the cutting edge has a double-beveled edge.
11. An atomically sharp cutting blade for a cutting instrument, said blade comprising:
a blade blank having a major surface and an edge at one end thereof, wherein the edge is milled at an acute angle to a plane parallel to said major surface by a focused ion beam to provide said blank with a continuous, atomically sharp cutting edge.
12. The atomically sharp cutting blade as set forth in claim 11, wherein the blade blank is made from a wafer comprising a material selected from a group consisting of silicon, ceramic, glass, Al2O3, AlTiN, TiN, SiC, SiN, MoS2, amorphous carbon, diamond-like carbon and zircon.
13. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge of the blade blank has a blade edge of less than about 1 micron before sharpening.
14. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting instrument further comprises a support substrate for attaching thereto said blade blank with a continuous, atomically sharp cutting edge.
15. The atomically sharp cutting blade as set forth in claim 14, wherein the support substrate is selected from a group comprising metal, plastic, glass, or ceramic.
16. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge has a radius of curvature that is less than is about 300 .ANG..
17. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge has a radius of curvature that is less than is about 100 .ANG..
18. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge has a radius of curvature that is less than is about .ANG..
19. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge has a single beveled edge.
20. The atomically sharp cutting blade as set forth in claim 11, wherein the cutting edge has a double-beveled edge.
21. A method far making an atomically sharp cutting edge for a cutting instrument, said method comprising:
providing a blank made of a metal material and having a major surface and a tapered edge at one end of the major surface;
depositing on a portion of the major surface at the tapered edge a continuous layer of a second material that is harder than the metal; and milling the layer of the second material with a focussed ion beam to form an atomically sharp cutting edge.
22. A method for making an atomically sharp cutting instrument as in claim 21, wherein the layer of second material is deposited in a thickness from about 100 to about 500 .ANG..
23. A method for making an atomically sharp cutting instrument as in claim 21, wherein the layer of second material is deposited in a thickness at least about 200 .ANG..
24. A method for making an atomically sharp cutting instrument as in claim 21, wherein the second material is selected from a group consisting of silicon, ceramic, glass, Al2O3, AlTiN, TiN, SiC, SiN, MoS2, amorphous carbon, diamond-like carbon and zircon.
25. A method for malting an atomically sharp cutting instrument as in claim 21, wherein the cutting edge has a radius of curvature that is less than about 300 .ANG..
26. A method for making an atomically sharp cutting instrument as in claim 21, wherein the cutting edge has a radius of curvature that is less than about 100 .ANG..
27. A method for making an atomically sharp cutting instrument as in claim 21, wherein the cutting edge has a radius of curvature that is less than about 10 .ANG..
28. A method for making an atomically sharp cutting instrument as in claim 21, wherein the cutting edge has a single beveled edge.
29. A method for mating an atomically sharp cutting instrument as in claim 21, wherein the cutting edge has a double-beveled edge.
30. A method for making an atomically sharp cutting edge for a cutting instrument, said method comprising:
providing a blade blank having a major surface and an edge at one end thereof, milling said edge at an acute angle to a plane parallel to said major surface using a focused ion beam to provide said blank with a continuous, atomically sharp cutting edge.
31. A method for making an atomically sharp cutting edge as set forth in claim 30, wherein the blank is a wafer comprising a material selected from a group consisting of silicon, ceramic, glass, Al2O3, AlTiN, TiN, SiC, SiN, MoS2, amorphous carbon, diamond-like carbon and zircon.
32. A method for making an atomically sharp cutting edge as set forth in claim 30, wherein the blank has a thickness of from about 100 µm to about 1000 µm.
33. A method for making an atomically sharp cutting instrument as in claim 30, wherein the cutting edge has a radius of curvature that is less than about 300 .ANG..
34. A method for making an atomically sharp cutting instrument as in claim 30, wherein the cutting edge has a radius of curvature that is less than about 100 .ANG..
35. A method for making an atomically sharp cutting instrument as in claim 30, wherein the cutting edge has a radius of curvature that is less than about 10 .ANG..
36. A method for making an atomically sharp cutting instrument as in claim 30, wherein the cutting edge has a single beveled edge.
37. A method for making an atomically sharp cutting instrument as in claim 30, wherein the cutting edge has a double-beveled edge.
38. A method for producing an atomically sharp cutting edge for a cutting instrument, said method comprising the steps of:
providing a wafer of a material, suitable for forming a cutting edge;
cutting the wafer to produce at least one blade blank having a triangular shaped cross section, said blade blank having a plurality of edges;
positioning the blade blank in a vacuum chamber;
exhausting the vacuum chamber to a desired pressure; and milling an edge of the blade blank with a focused ion beam to provide an atomically sharp cutting edge on the blade blank.
39. A method for producing an atomically sharp cutting edge as set forth in claim 38, further comprising attaching the atomically sharpen blade blank to a cutting instrument substrate.
40. A method for producing an atomically sharp cutting edge as set forth in claim 38, wherein the wafer comprises a material selected from a group consisting of silicon, ceramic, glass, Al2O3, AlTiN, TiN, SiC, SiN, MoS2, amorphous carbon, diamond-like carbon and zircon.
41. A method for producing an atomically sharp cutting edge as set forth in claim 38, wherein the wafer is about 100 to about 1000 microns thick.
42. A method for producing an atomically sharp cutting edge as set forth in claim 38, comprising cutting the wafer an angle to the surface of the wafer ranging between about 5 and about 70 degrees.
43. A method for producing an atomically sharp cutting edge as set forth in claim 38, comprising providing the wafer with at least one atomically polished surface.
44. A method for producing an atomically sharp cutting edge as set forth in claim 38, comprising providing the focus ion beam with a diameter of nm.
45. A method for producing an atomically sharp cutting edge as set forth in claim 38, comprising providing the focus ion beam with a diameter of nm.
46. A method for malting an atomically sharp cutting instrument as in claim 38, wherein the cutting edge has a single beveled edge.
47. A method for malting an atomically sharp cutting instrument as in claim 38, wherein the cutting edge has a double-beveled edge.
CA002323259A 1999-10-15 2000-10-12 Atomically sharp edged cutting blades and methods for making same Expired - Fee Related CA2323259C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15967899P 1999-10-15 1999-10-15
US60/159,678 1999-10-15
US63590800A 2000-08-10 2000-08-10
US09/635,908 2000-08-10

Publications (2)

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CA2323259A1 true CA2323259A1 (en) 2001-04-15
CA2323259C CA2323259C (en) 2009-12-01

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US (2) US20050210684A1 (en)
EP (1) EP1092515B1 (en)
JP (1) JP3553482B2 (en)
KR (1) KR100755961B1 (en)
AR (1) AR042165A1 (en)
AT (1) ATE240821T1 (en)
AU (1) AU782041B2 (en)
BR (1) BR0004830A (en)
CA (1) CA2323259C (en)
DE (1) DE60002812T2 (en)
ES (1) ES2199111T3 (en)
IL (1) IL138710A0 (en)

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IL138710A0 (en) 2001-10-31
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AU782041B2 (en) 2005-06-30
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ATE240821T1 (en) 2003-06-15
US20050210684A1 (en) 2005-09-29

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