CA2314305A1 - Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches - Google Patents

Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches Download PDF

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Publication number
CA2314305A1
CA2314305A1 CA 2314305 CA2314305A CA2314305A1 CA 2314305 A1 CA2314305 A1 CA 2314305A1 CA 2314305 CA2314305 CA 2314305 CA 2314305 A CA2314305 A CA 2314305A CA 2314305 A1 CA2314305 A1 CA 2314305A1
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CA
Canada
Prior art keywords
multilayer structure
resonance frequencies
mathematical model
layers
properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2314305
Other languages
English (en)
Inventor
Daniel Levesque
Marc Choquet
Maroun Massabki
Christian Neron
Jean-Pierre Monchalin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
Original Assignee
National Research Council of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada filed Critical National Research Council of Canada
Priority to CA 2314305 priority Critical patent/CA2314305A1/fr
Publication of CA2314305A1 publication Critical patent/CA2314305A1/fr
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/52—Processing the detected response signal, e.g. electronic circuits specially adapted therefor using inversion methods other that spectral analysis, e.g. conjugated gradient inversion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4472—Mathematical theories or simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/01—Indexing codes associated with the measuring variable
    • G01N2291/014—Resonance or resonant frequency
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02854—Length, thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0421—Longitudinal waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Algebra (AREA)
  • Mathematical Optimization (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CA 2314305 2000-07-21 2000-07-21 Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches Abandoned CA2314305A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA 2314305 CA2314305A1 (fr) 2000-07-21 2000-07-21 Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2314305 CA2314305A1 (fr) 2000-07-21 2000-07-21 Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches

Publications (1)

Publication Number Publication Date
CA2314305A1 true CA2314305A1 (fr) 2002-01-21

Family

ID=4166752

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2314305 Abandoned CA2314305A1 (fr) 2000-07-21 2000-07-21 Appareil et methode de spectroscopie par ultrasons permettant de determiner l'epaisseur et d'autres proprietes de structures multicouches

Country Status (1)

Country Link
CA (1) CA2314305A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1481301A2 (fr) * 2002-03-04 2004-12-01 The Trustees of Princeton University Appareils en boucle fermee pour identification de systemes non lineaires par commande optimale
WO2012062343A1 (fr) 2010-11-12 2012-05-18 Ev Group E. Thallner Gmbh Équipement de mesure et procédé de mesure d'épaisseurs de couches et de défauts d'un empilement de plaquettes
AT513852A4 (de) * 2013-04-04 2014-08-15 Constantia Teich Gmbh Verfahren zur Ermittlung der Schichtdicke einer Verbindungsschicht zwischen zwei Verpackungsschichten
CN107478728A (zh) * 2017-08-15 2017-12-15 重庆大学 一种复合绝缘子的无损检测方法
US10345267B2 (en) 2015-12-21 2019-07-09 The Boeing Company Composite inspection
EP4365545A1 (fr) * 2022-11-07 2024-05-08 Tata Consultancy Services Limited Estimation non destructive de l'épaisseur de couche de revêtement sur la base d'une technique d'onde guidee photo-acoustique à fréquence de balayage

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1481301A4 (fr) * 2002-03-04 2005-08-24 Univ Princeton Appareils en boucle fermee pour identification de systemes non lineaires par commande optimale
EP1481301A2 (fr) * 2002-03-04 2004-12-01 The Trustees of Princeton University Appareils en boucle fermee pour identification de systemes non lineaires par commande optimale
US10008424B2 (en) 2010-11-12 2018-06-26 Ev Group E. Thallner Gmbh Measuring device and method for measuring layer thicknesses and defects in a wafer stack
WO2012062343A1 (fr) 2010-11-12 2012-05-18 Ev Group E. Thallner Gmbh Équipement de mesure et procédé de mesure d'épaisseurs de couches et de défauts d'un empilement de plaquettes
CN103221813A (zh) * 2010-11-12 2013-07-24 Ev集团E·索尔纳有限责任公司 用于测量晶片堆叠的层厚度和晶格缺陷的测量装置和方法
EP3514529A1 (fr) * 2010-11-12 2019-07-24 EV Group E. Thallner GmbH Dispositif de mesure et procédé de mesure d'epaisseurs de couche et d'endroits défectueux d'un empilement de tranches
EP3035047A1 (fr) 2010-11-12 2016-06-22 EV Group E. Thallner GmbH Dispositif de mesure et procede de mesure d'epaisseurs de couche et d'endroits defectueux d'un empilement de wafers
CN103221813B (zh) * 2010-11-12 2017-05-17 Ev 集团 E·索尔纳有限责任公司 用于测量晶片堆叠的层厚度和晶格缺陷的测量装置和方法
US10109538B2 (en) 2010-11-12 2018-10-23 EV Group E.Thallner GmbH Measuring device and method for measuring layer thicknesses and defects in a wafer stack
AT513852A4 (de) * 2013-04-04 2014-08-15 Constantia Teich Gmbh Verfahren zur Ermittlung der Schichtdicke einer Verbindungsschicht zwischen zwei Verpackungsschichten
AT513852B1 (de) * 2013-04-04 2014-08-15 Constantia Teich Gmbh Verfahren zur Ermittlung der Schichtdicke einer Verbindungsschicht zwischen zwei Verpackungsschichten
US10401160B2 (en) 2013-04-04 2019-09-03 Constantia Teich Gmbh Method for determining the layer thickness of a connecting layer between two packaging layers
US10345267B2 (en) 2015-12-21 2019-07-09 The Boeing Company Composite inspection
CN107478728A (zh) * 2017-08-15 2017-12-15 重庆大学 一种复合绝缘子的无损检测方法
CN107478728B (zh) * 2017-08-15 2021-02-12 重庆大学 一种复合绝缘子的无损检测方法
EP4365545A1 (fr) * 2022-11-07 2024-05-08 Tata Consultancy Services Limited Estimation non destructive de l'épaisseur de couche de revêtement sur la base d'une technique d'onde guidee photo-acoustique à fréquence de balayage

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