CA2283412A1 - High thermally conductive polymeric adhesive - Google Patents
High thermally conductive polymeric adhesive Download PDFInfo
- Publication number
- CA2283412A1 CA2283412A1 CA002283412A CA2283412A CA2283412A1 CA 2283412 A1 CA2283412 A1 CA 2283412A1 CA 002283412 A CA002283412 A CA 002283412A CA 2283412 A CA2283412 A CA 2283412A CA 2283412 A1 CA2283412 A1 CA 2283412A1
- Authority
- CA
- Canada
- Prior art keywords
- solvent
- adhesive
- thermosetting adhesive
- thermosetting
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 61
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 24
- 239000002904 solvent Substances 0.000 claims description 61
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 20
- 238000004132 cross linking Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 14
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 239000000654 additive Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000011231 conductive filler Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004849 latent hardener Substances 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 229920001249 ethyl cellulose Polymers 0.000 claims description 4
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims 2
- 239000002562 thickening agent Substances 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 239000011230 binding agent Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 230000000740 bleeding effect Effects 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000004848 polyfunctional curative Substances 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000011068 loading method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229940116411 terpineol Drugs 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910002012 Aerosil® Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- -1 halide ions Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100495411 Danio rerio celf3 gene Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 101100166799 Xenopus laevis tnrc4-a gene Proteins 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- UWNADWZGEHDQAB-UHFFFAOYSA-N i-Pr2C2H4i-Pr2 Natural products CC(C)CCC(C)C UWNADWZGEHDQAB-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/810,554 US6265471B1 (en) | 1997-03-03 | 1997-03-03 | High thermally conductive polymeric adhesive |
| US08/810,554 | 1997-03-03 | ||
| PCT/US1998/003721 WO1998039395A1 (en) | 1997-03-03 | 1998-02-25 | High thermally conductive polymeric adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2283412A1 true CA2283412A1 (en) | 1998-09-11 |
Family
ID=25204104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002283412A Abandoned CA2283412A1 (en) | 1997-03-03 | 1998-02-25 | High thermally conductive polymeric adhesive |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6265471B1 (https=) |
| JP (1) | JP2001513142A (https=) |
| CA (1) | CA2283412A1 (https=) |
| WO (1) | WO1998039395A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003206469A (ja) * | 2001-11-12 | 2003-07-22 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた半導体装置 |
| JP4507488B2 (ja) * | 2001-11-12 | 2010-07-21 | 日立化成工業株式会社 | 接合材料 |
| US6888257B2 (en) * | 2002-06-28 | 2005-05-03 | Lord Corporation | Interface adhesive |
| EP2298229A1 (en) | 2002-07-25 | 2011-03-23 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes for curing |
| US7160496B2 (en) * | 2002-11-01 | 2007-01-09 | Delphi Technologies, Inc. | Thermoplastic compositions containing metal material |
| US7550097B2 (en) * | 2003-09-03 | 2009-06-23 | Momentive Performance Materials, Inc. | Thermal conductive material utilizing electrically conductive nanoparticles |
| US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
| US20060275608A1 (en) * | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
| US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
| TWI380325B (en) * | 2006-09-26 | 2012-12-21 | Polytronics Technology Corp | Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same |
| US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
| CA2696985A1 (en) * | 2007-08-20 | 2009-02-26 | Diemat, Inc. | Adhesives with thermal conductivity enhanced by mixed silver fillers |
| EP2396375B1 (en) * | 2009-02-16 | 2017-05-17 | Cytec Technology Corp. | Conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials |
| TW201335350A (zh) * | 2012-02-29 | 2013-09-01 | Ritedia Corp | 熱傳導膏 |
| JP7624835B2 (ja) | 2017-12-27 | 2025-01-31 | スリーエム イノベイティブ プロパティズ カンパニー | 電子デバイスエンクロージャ、物品、及び方法に好適な硬化エポキシ樹脂組成物 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE237840C (https=) * | ||||
| BE510386A (https=) * | 1951-04-05 | 1900-01-01 | ||
| US3716489A (en) | 1970-10-02 | 1973-02-13 | American Cyanamid Co | Supersaturated solid solutions of photochromic materials in epoxies |
| JPS601221A (ja) * | 1983-06-17 | 1985-01-07 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペ−スト |
| US4469714A (en) * | 1983-09-02 | 1984-09-04 | Okuno Chemical Industry Co., Ltd. | Composition for bonding electroconductive metal coating to electrically nonconductive material |
| US4564563A (en) | 1983-09-30 | 1986-01-14 | Electro Materials Corp. Of America | Solderable conductor |
| US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
| DE3809331C1 (https=) | 1988-03-19 | 1989-04-27 | Degussa Ag, 6000 Frankfurt, De | |
| JP2688692B2 (ja) * | 1988-06-01 | 1997-12-10 | 旭化成工業株式会社 | 金属粉含有エポキシ樹脂組成物 |
| US4933030A (en) | 1989-06-21 | 1990-06-12 | Dietz Raymond L | Low temperature glass composition, paste and method of use |
| US5480957A (en) | 1991-05-28 | 1996-01-02 | W. R. Grace & Co.-Conn. | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| JPH0536738A (ja) * | 1991-07-26 | 1993-02-12 | Hitachi Chem Co Ltd | 導電性樹脂ペーストおよび半導体装置 |
| JPH05214214A (ja) * | 1992-02-06 | 1993-08-24 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| US5391604A (en) | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
| JP2915379B2 (ja) * | 1996-06-18 | 1999-07-05 | レイセオン・カンパニー | 落下衝撃に耐える導電接着剤 |
-
1997
- 1997-03-03 US US08/810,554 patent/US6265471B1/en not_active Expired - Lifetime
-
1998
- 1998-02-25 CA CA002283412A patent/CA2283412A1/en not_active Abandoned
- 1998-02-25 JP JP53859398A patent/JP2001513142A/ja active Pending
- 1998-02-25 WO PCT/US1998/003721 patent/WO1998039395A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US6265471B1 (en) | 2001-07-24 |
| WO1998039395A1 (en) | 1998-09-11 |
| JP2001513142A (ja) | 2001-08-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |