CA2277460A1 - Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille - Google Patents

Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille Download PDF

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Publication number
CA2277460A1
CA2277460A1 CA 2277460 CA2277460A CA2277460A1 CA 2277460 A1 CA2277460 A1 CA 2277460A1 CA 2277460 CA2277460 CA 2277460 CA 2277460 A CA2277460 A CA 2277460A CA 2277460 A1 CA2277460 A1 CA 2277460A1
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CA
Canada
Prior art keywords
saft
laser
aperture
frequency
small defects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 2277460
Other languages
English (en)
Other versions
CA2277460C (fr
Inventor
Daniel Levesque
Alain Blouin
Christian Neron
Jean-Pierre Monchalin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
Original Assignee
National Research Council of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada filed Critical National Research Council of Canada
Priority to CA 2277460 priority Critical patent/CA2277460C/fr
Publication of CA2277460A1 publication Critical patent/CA2277460A1/fr
Application granted granted Critical
Publication of CA2277460C publication Critical patent/CA2277460C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4436—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a reference signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8993—Three dimensional imaging systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8997—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using synthetic aperture techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0427—Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CA 2277460 1999-07-13 1999-07-13 Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille Expired - Lifetime CA2277460C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA 2277460 CA2277460C (fr) 1999-07-13 1999-07-13 Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2277460 CA2277460C (fr) 1999-07-13 1999-07-13 Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille

Publications (2)

Publication Number Publication Date
CA2277460A1 true CA2277460A1 (fr) 2001-01-13
CA2277460C CA2277460C (fr) 2003-02-18

Family

ID=4163741

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2277460 Expired - Lifetime CA2277460C (fr) 1999-07-13 1999-07-13 Methode et systeme d'imagerie ultrasonique haute resolution de defauts ou d'anomalies de petite taille

Country Status (1)

Country Link
CA (1) CA2277460C (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157896B2 (en) 2010-03-25 2015-10-13 Kabushiki Kaisha Toshiba Ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method
CN111307945A (zh) * 2020-04-09 2020-06-19 上海工程技术大学 一种基于超声阵列检测无砟轨道近表面缺陷的成像方法及装置
CN111323485A (zh) * 2020-04-09 2020-06-23 上海工程技术大学 一种用于轨道板内部缺陷检测的成像方法及装置
CN112114045A (zh) * 2020-08-03 2020-12-22 中国科学院大学 一种面向超声显微镜的分辨率增强方法
CN112485336A (zh) * 2020-11-23 2021-03-12 西南交通大学 一种基于差分技术的激光超声合成孔径成像方法
CN113533526A (zh) * 2021-06-02 2021-10-22 中北大学 超声相控阵界面脱粘缺陷全聚焦c扫描成像方法及系统
CN114295731A (zh) * 2021-12-28 2022-04-08 杭州电子科技大学 一种基于激光激励纵波测量亚表面缺陷深度的方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157896B2 (en) 2010-03-25 2015-10-13 Kabushiki Kaisha Toshiba Ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method
CN111307945A (zh) * 2020-04-09 2020-06-19 上海工程技术大学 一种基于超声阵列检测无砟轨道近表面缺陷的成像方法及装置
CN111323485A (zh) * 2020-04-09 2020-06-23 上海工程技术大学 一种用于轨道板内部缺陷检测的成像方法及装置
CN112114045A (zh) * 2020-08-03 2020-12-22 中国科学院大学 一种面向超声显微镜的分辨率增强方法
CN112114045B (zh) * 2020-08-03 2023-09-19 中国科学院大学 一种面向超声显微镜的分辨率增强方法
CN112485336A (zh) * 2020-11-23 2021-03-12 西南交通大学 一种基于差分技术的激光超声合成孔径成像方法
CN113533526A (zh) * 2021-06-02 2021-10-22 中北大学 超声相控阵界面脱粘缺陷全聚焦c扫描成像方法及系统
CN113533526B (zh) * 2021-06-02 2022-10-11 中北大学 超声相控阵界面脱粘缺陷全聚焦c扫描成像方法及系统
CN114295731A (zh) * 2021-12-28 2022-04-08 杭州电子科技大学 一种基于激光激励纵波测量亚表面缺陷深度的方法

Also Published As

Publication number Publication date
CA2277460C (fr) 2003-02-18

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