CA2227148A1 - An ic card module and also a method and a device for the production thereof - Google Patents
An ic card module and also a method and a device for the production thereof Download PDFInfo
- Publication number
- CA2227148A1 CA2227148A1 CA002227148A CA2227148A CA2227148A1 CA 2227148 A1 CA2227148 A1 CA 2227148A1 CA 002227148 A CA002227148 A CA 002227148A CA 2227148 A CA2227148 A CA 2227148A CA 2227148 A1 CA2227148 A1 CA 2227148A1
- Authority
- CA
- Canada
- Prior art keywords
- winding
- carrier
- coil
- layer
- carrier layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
Abstract
The invention concerns an integrated circuit card module (10) for producing an integrated circuit card with a carrier layer (11) and a coil (14) disposed thereon for forming a transponder unit. The invention also concerns a method and device for producing an integrated circuit card module in which the coil (14) is made from winding wire (13) and is at least partially embedded in the carrier layer (11).
Description
-AN IC CARD MODULE AND ALSO A METHOD AND A DEVICE FOR
THE PRODUCTION ~ EREOF
The present invention relates to a method for producing an IC card module according to the preamble of claim 1 and a device for producing an IC card module according to claim 4.
0 IC card~, which are used, for example, in ca~hless money trans~ers, generally consi~t of a so-called ~'IC
card module" having a carrier layer, which is for example ~ormed from a film carrier, and a transponder unit arranged thereon having a coil acting as an 15 antenna and at lea~t one IC, and al80 of protective laminate layers which are applied on both sides thereof and are used, for example, as advertisement carriers or even to identify the card holder by means of a photogxaph.
An IC card ~odule iB known from EP O 481 776 A2, which ~odule has, on a film carrier, a coil structure which in addition to being fitted with an IC i8 also fitted with further electronic components. Basically, the possibility exists of producing such a coil structure ~y mean~ of the application of a corre~pondingly formed metallic coating, for example electrogalvanically or by mean~ of an etching proce~s, or by mean~ o~ a winding coil, the winding wire turns of which are applied to the carrier layer. The fir~t-mentioned metal-coating methods certainly have the advantage that adhesion between the carrier layer and t~e coil structure resul~s as an inherent ~eature of the method, yet the known method~ are very expen~ive to carry out and require a corre~pondingly large outlay in terms of operating arrangeme~t~ to bring them about.
When u~ing a winding coil for the production o~ such an IC card module it ha~ proved to be di~advantageous that in addition to applying the coil to the carrier layer in a ~3eparate method step it i8 also neces~;ary to ensure that the coil i8 connected to the carrier layer in o~der to be able to utilize the I~ card module, which has the carrier layer and the coil, a~ a unit in the manu~acture of IC card~.
A method for producing an I~ card module i8 known from DE,A,44 10 732, in which the arrangement of a wire coil on a thermoplastic carrier layer is effected by laying the wire on the carrier layer with the wire being embedded in the carrier layer at le~st in place~.
A method for producing an IC card i~ known from WO,A,94/22 111, in which a winding coil is arranged between two layers o~ material and i~ completely embedded in the two layer3 of material.
The underlying object o~ the present invention is to propose an IC card moduLe and also a method and a device for the production thereo~, which method and/or device ~implify the production o~ an IC card module.
This object is achie~ed by means o~ a method for producing an IC card module having the features of claim 1 and al~o ~y means o~ a device for producing an IC card module ha~ing the feature~ o~ claim 4.
In the case o~ the method according to the invention for producing an IC card module according to claim 1, the coil, after having been produced on a winding tool, i~ pre~ed into the carrier layer by means of said winding tool under ~he influence of temperature ~o that it i~ not necessary to tran~fer the ready wound ~oil from the winding tool to a ~eparate application device for the purpose of applying the coil to the carrier layer, and direct transfer by the W; n~; ng tool to the carrier layer i8 possi~le.
The connection of the coil ~y means of the w;~; n~
tool can be carried out in a particularly ~imple manner if the coil, a~ter it ha~ been produced on the winding tool, is preq8ed into the carrier layer by means of a W; n~; ng-wire in~talling element o~ the winding tool tha~ i~ arranged so a~ to be parallel to the coil plane, and a restoring movement of a winding core, which receives the windi.ng-wire in8talling element, take~ place.
The restoring movement or the receding movement of the win~ing core .
/
/
20 / during the application of the coil to the carrier layer prevents da~age to or de~or~ation of the carrier layer by means o~ the winding core.
The re~torinq movement o~ the w;nAin~ core can be ef~ected by means of a corre~ponding advancing movement of the carrier layer.
The device according to the invention for producirg an IC card module ha~ a heatable winding tool, which ha~ a windin~ core and a winding-wire installing element arranged thereon; and al~o a carrier-layer pre~~.Ln~ -~evice that ha~ a receiving plane ~or the planar device of the carrier layer parali~l to the w.inding-wire installi~g element, with the carrier-layer preBsing device being movable toward~
the w;~ing-wire installing element or vice versa, and with the winding core being movable in relation to the w~n~;ng-wire in~talling element.
In order to avoid damage to the thermoplastic carrier layer particularly in the case where the restoring movement o~ the winding core is effected by means o~ the carrier layer or rather by mean~ of the carrier-layer pressing device arranged underneath, it 10 i8 possible for the winding core to be ~orrned at least in the region of its end face that faces the carrier-layer pressing device so as to be thermally insulating.
Such ~ub~tantially thermally occasioned damage to the carrier layer can al90 be avoided if the w; n~l; n~
core ha~ an end face which i~ reduced in size in relation to its cross-~ectional area. Thi~ can be achie~ed, for example, by ~orming the corre~ponding end o~ the winding core in a concave manner 80 that the end ~ace ~ubstantially con~ist~ of a ring-shaped area.
soth m~asures mentioned abo~e for thermally protecting the carrier layer can of course also be combined with each other~
It ha3 proved to be particularly advantageous if the carrier-layer pres~ing devlce is provided with a vacuum de~rice in order to effect adhesion of the carrier layex to the receiving plane Protection of the carrier layer against thermal o~erlo~ding can al~o be achieved by forming the carrier-layer pre~sing device from a material that has a high level of thermal conductivity.
Th~ pos~ibil~ty also exists o~ providing the wlnding ccre ~nd/or the carrier-layer pre~ing device with a cooling device.
The IC card module according to the invention as well as the me~hod according to the invention for producing an IC card module and a device according to the invention that can be used in this connection are explained in greater detail in the following with re~erence to the drawing~, in which:
Figure 1 shows an IC card module having a transponder unit which is arranged on a carrier layer and con~ists of a coil and an IC;
Figure 2 shows a representationr in partial section, of the IC card module which is represented in Figure 1 along the course o~ the line o~ intersection II-II;
Figure 3 shows the repre~entation of a ~ariant of the method for producing an IC card module wlth a winding too'. in a winding con~iguration;
Figure 4 shows the winding tool, which is represented in Figure 3, in an application confi~urati~n before trans~erring the wlnding coil to the carrier layer;
Figure 5 shows the winding tool during application of the w; ~A; n~ coil to the carrier layers Figure 6 shows a plan view of a winding-wire installing ~lement of the winding tool.
Figure 1 ~hows an IC card module 10 having a carrier layer 11 and a tran~ponder unit 12 arran~ed thereon. The tran~ponder unit 12, in the case of the exemplary embodiment represented here, con~ists of a winding coil 14, which i8 produced of wi n~; ng wire 13 and the w; n~; n~ wi~e end9 18, 19 o~ which are connected ~o terminal ~aces 16, 17 of an IC 15.
As Figure 2 show~, the surface of the carrier layer 11 i~ plastically deformed in the region of coil turns 21, with there ~eing adhesion between the coil 14 and the carrier layer ll which consist~ of a thermoplastic material, such as PVC or polycarbonate.
In this connection, the coil turns 21 are practically pressed into the surface of the carrier layer 11 and an adhe~ive effect i~ achieved.
A variant of the method for producing the IC card module 10, which i~ represented in Figures 1 and 2, by means of a device which can be u~ed in this connection is explained by way of example in the following with re~erence to Figures 3, 4 and S.
Fiqure 3~ in a greatly diagrammatic representation, shows a w;~; n~ tool 22 which has a winding core 23 with a winding-wire inst.~lling element 24 arranged thereon and a counter-holder 25. The winding core 23 thus together with the winding-wire installing element 24 and the counter-holder 25 form~ a winding ~.atrix which by means of rotation about a winding axis 26 in con~equence of a corresponding winding~up movement of the winding wire 13 renders possible the formation of the winding wire coil 14.
During the production of the winding coil 14 the ~ou.n~er-holder 25 i~ connec~ed to the winding core 23 in order to enable the coil turns 21 to be formed in an ordered ~anner as represented in Figure 3. During prod~.lction of a w~nding coil 14 of high frequency that CA 02227l48 l998-0l-l6 is wound out o~ winding wire of a comparatively large diameter (approximately 150 ~m) and which only ha8 a few coil turns 21, it is possible to dispense with the counter-holder 25 in particular whilst he~ting the 5 wi n~t n~ tool 22 or the winding wire 13 in order to attain adhesion between the baked ~n~mel surfaces of the coil turns 21.
Figure 6, in a plan view of the winding-wire installing element 24 of the winding tool 22, illu~trateR the formation of the winding coil 14 at the end of the winding process and the pos~ibility of utilizing the winding-wire installing element 24 for the purpo~e of producing the whole tran~ponder unit 12 in addition to and at the same time as using it to ~orm the w; n~lng COll 14.
For thi~ purpose, the winding-wire in6talling elem.ent 24, at its peripheral edge 27, i8 provided with two holding devices 28, 29 which are used to receive the winding wire ends 18, 19 in a clamping manner before and at the end o~ the actual winding process.
For this purpose, hefore the start o~ the w; n~l;ng process the winding wire end 18 is ~irst guided by mean~ of a suitable wire guide, which is not repre~ented further here, through the holding de~ice 28 and i~ clamped there. Sub~equently, the winding coil 14 i8 formed by rotating the windin~ tool 22 about the windlng axis 2~, with the winding wire 13 being guided Ollt ~f the wire guide. After the desired number of turns has been attained, finally the second winding wire end 19 is clamped by guiding the wire guide throllgh the ~econd holding device 29 so that the configur~tion which i~ represented in Figure 6 appear~.
_g_ In the winding-wire in~:talling element 24 there iR
a receiving device 30 for receiving the IC 15 in ~uch a way that the terminal faces 16, 17 o~ the IC 15 are located in a position o~ overlap with the winding wire ends 18, 19. The IC 15 can either be inserted into the winding-wire installing element 24 before the w; n~; n~
process or el~e after the windin~ process can be pushed ~rom behind through the receiving device 30, which i8 for example shaped as a through-opening, with its terminal face~ 16, 17 against the winding wire end~ 18 and 19 respectively. By means of a connecting tool, which i~ not repre~ented further, it i8 possible for the winding wire e~d~ 18, 19 to be ~onnected to the terminal face~ 16, 17 and also for the winding wire ends 18, 19 to be severed ~etween the terminal ~aces 16, 17 and the holding device~ 28, 29.
Accommodated in this way in the winding-wire in~talling element 24, the transponder unit 12, formed ~rom the winding coil 14 and the IC 15, as represented in Fi~ure 4, i. applicable a~ter removal o~ the counte~-holder 25, in the application con~iguration of ~he windirg tool 22 can then be applied to the carrier layer :L1 which is arranged on a receiving plane 31 o:E a carrier-layer pre~sing device 32.
For this purpose, the carrier layer 11, which can be formed as a continuous film running past the carrier-layer pressing device 32 or as a ~heet that has IC card ~;m~n~ions, i8 pressed by means o~ the carrie~-layer pre~sing device 32, as indicated by means of the arrow 33 n Figure 4, against the winding-wire installin~ element 24 with interposition o~ the winding coll 14 Qr the tran~ponder unit 12. Depending on the deformation characteristics of the thermoplastic carrier layer material, heating o~ the winding-wire installing element 24 or of the winding wire 13 may be effected in order to render po~sible plastic deformation of the surface of the carrier layer 11, as represented in Figure 2, under the influence of pres~ure and temperature.
Figure 5 also shows, in accordance with the representa~ion in Figure 2, how the coil ~urns 21 of the winding coil 14 in the ca~e of the coil application are pressed at least in part into the surface of the carrier layer 11. In order to prevent a situation from occurring where as a re~ult of the w; n~; n~ core ~3 cont~cting the carrier layer ll the latter is de~ormed or e~en de~troyed, with the pressing movement (arrow 33) of the carrier-layer pre3sing device 32 a re~toring movemen~ ~arrow 34) of the winding core 23, which can be moved in relation to the winding-wire installing element 24, takes place.
THE PRODUCTION ~ EREOF
The present invention relates to a method for producing an IC card module according to the preamble of claim 1 and a device for producing an IC card module according to claim 4.
0 IC card~, which are used, for example, in ca~hless money trans~ers, generally consi~t of a so-called ~'IC
card module" having a carrier layer, which is for example ~ormed from a film carrier, and a transponder unit arranged thereon having a coil acting as an 15 antenna and at lea~t one IC, and al80 of protective laminate layers which are applied on both sides thereof and are used, for example, as advertisement carriers or even to identify the card holder by means of a photogxaph.
An IC card ~odule iB known from EP O 481 776 A2, which ~odule has, on a film carrier, a coil structure which in addition to being fitted with an IC i8 also fitted with further electronic components. Basically, the possibility exists of producing such a coil structure ~y mean~ of the application of a corre~pondingly formed metallic coating, for example electrogalvanically or by mean~ of an etching proce~s, or by mean~ o~ a winding coil, the winding wire turns of which are applied to the carrier layer. The fir~t-mentioned metal-coating methods certainly have the advantage that adhesion between the carrier layer and t~e coil structure resul~s as an inherent ~eature of the method, yet the known method~ are very expen~ive to carry out and require a corre~pondingly large outlay in terms of operating arrangeme~t~ to bring them about.
When u~ing a winding coil for the production o~ such an IC card module it ha~ proved to be di~advantageous that in addition to applying the coil to the carrier layer in a ~3eparate method step it i8 also neces~;ary to ensure that the coil i8 connected to the carrier layer in o~der to be able to utilize the I~ card module, which has the carrier layer and the coil, a~ a unit in the manu~acture of IC card~.
A method for producing an I~ card module i8 known from DE,A,44 10 732, in which the arrangement of a wire coil on a thermoplastic carrier layer is effected by laying the wire on the carrier layer with the wire being embedded in the carrier layer at le~st in place~.
A method for producing an IC card i~ known from WO,A,94/22 111, in which a winding coil is arranged between two layers o~ material and i~ completely embedded in the two layer3 of material.
The underlying object o~ the present invention is to propose an IC card moduLe and also a method and a device for the production thereo~, which method and/or device ~implify the production o~ an IC card module.
This object is achie~ed by means o~ a method for producing an IC card module having the features of claim 1 and al~o ~y means o~ a device for producing an IC card module ha~ing the feature~ o~ claim 4.
In the case o~ the method according to the invention for producing an IC card module according to claim 1, the coil, after having been produced on a winding tool, i~ pre~ed into the carrier layer by means of said winding tool under ~he influence of temperature ~o that it i~ not necessary to tran~fer the ready wound ~oil from the winding tool to a ~eparate application device for the purpose of applying the coil to the carrier layer, and direct transfer by the W; n~; ng tool to the carrier layer i8 possi~le.
The connection of the coil ~y means of the w;~; n~
tool can be carried out in a particularly ~imple manner if the coil, a~ter it ha~ been produced on the winding tool, is preq8ed into the carrier layer by means of a W; n~; ng-wire in~talling element o~ the winding tool tha~ i~ arranged so a~ to be parallel to the coil plane, and a restoring movement of a winding core, which receives the windi.ng-wire in8talling element, take~ place.
The restoring movement or the receding movement of the win~ing core .
/
/
20 / during the application of the coil to the carrier layer prevents da~age to or de~or~ation of the carrier layer by means o~ the winding core.
The re~torinq movement o~ the w;nAin~ core can be ef~ected by means of a corre~ponding advancing movement of the carrier layer.
The device according to the invention for producirg an IC card module ha~ a heatable winding tool, which ha~ a windin~ core and a winding-wire installing element arranged thereon; and al~o a carrier-layer pre~~.Ln~ -~evice that ha~ a receiving plane ~or the planar device of the carrier layer parali~l to the w.inding-wire installi~g element, with the carrier-layer preBsing device being movable toward~
the w;~ing-wire installing element or vice versa, and with the winding core being movable in relation to the w~n~;ng-wire in~talling element.
In order to avoid damage to the thermoplastic carrier layer particularly in the case where the restoring movement o~ the winding core is effected by means o~ the carrier layer or rather by mean~ of the carrier-layer pressing device arranged underneath, it 10 i8 possible for the winding core to be ~orrned at least in the region of its end face that faces the carrier-layer pressing device so as to be thermally insulating.
Such ~ub~tantially thermally occasioned damage to the carrier layer can al90 be avoided if the w; n~l; n~
core ha~ an end face which i~ reduced in size in relation to its cross-~ectional area. Thi~ can be achie~ed, for example, by ~orming the corre~ponding end o~ the winding core in a concave manner 80 that the end ~ace ~ubstantially con~ist~ of a ring-shaped area.
soth m~asures mentioned abo~e for thermally protecting the carrier layer can of course also be combined with each other~
It ha3 proved to be particularly advantageous if the carrier-layer pres~ing devlce is provided with a vacuum de~rice in order to effect adhesion of the carrier layex to the receiving plane Protection of the carrier layer against thermal o~erlo~ding can al~o be achieved by forming the carrier-layer pre~sing device from a material that has a high level of thermal conductivity.
Th~ pos~ibil~ty also exists o~ providing the wlnding ccre ~nd/or the carrier-layer pre~ing device with a cooling device.
The IC card module according to the invention as well as the me~hod according to the invention for producing an IC card module and a device according to the invention that can be used in this connection are explained in greater detail in the following with re~erence to the drawing~, in which:
Figure 1 shows an IC card module having a transponder unit which is arranged on a carrier layer and con~ists of a coil and an IC;
Figure 2 shows a representationr in partial section, of the IC card module which is represented in Figure 1 along the course o~ the line o~ intersection II-II;
Figure 3 shows the repre~entation of a ~ariant of the method for producing an IC card module wlth a winding too'. in a winding con~iguration;
Figure 4 shows the winding tool, which is represented in Figure 3, in an application confi~urati~n before trans~erring the wlnding coil to the carrier layer;
Figure 5 shows the winding tool during application of the w; ~A; n~ coil to the carrier layers Figure 6 shows a plan view of a winding-wire installing ~lement of the winding tool.
Figure 1 ~hows an IC card module 10 having a carrier layer 11 and a tran~ponder unit 12 arran~ed thereon. The tran~ponder unit 12, in the case of the exemplary embodiment represented here, con~ists of a winding coil 14, which i8 produced of wi n~; ng wire 13 and the w; n~; n~ wi~e end9 18, 19 o~ which are connected ~o terminal ~aces 16, 17 of an IC 15.
As Figure 2 show~, the surface of the carrier layer 11 i~ plastically deformed in the region of coil turns 21, with there ~eing adhesion between the coil 14 and the carrier layer ll which consist~ of a thermoplastic material, such as PVC or polycarbonate.
In this connection, the coil turns 21 are practically pressed into the surface of the carrier layer 11 and an adhe~ive effect i~ achieved.
A variant of the method for producing the IC card module 10, which i~ represented in Figures 1 and 2, by means of a device which can be u~ed in this connection is explained by way of example in the following with re~erence to Figures 3, 4 and S.
Fiqure 3~ in a greatly diagrammatic representation, shows a w;~; n~ tool 22 which has a winding core 23 with a winding-wire inst.~lling element 24 arranged thereon and a counter-holder 25. The winding core 23 thus together with the winding-wire installing element 24 and the counter-holder 25 form~ a winding ~.atrix which by means of rotation about a winding axis 26 in con~equence of a corresponding winding~up movement of the winding wire 13 renders possible the formation of the winding wire coil 14.
During the production of the winding coil 14 the ~ou.n~er-holder 25 i~ connec~ed to the winding core 23 in order to enable the coil turns 21 to be formed in an ordered ~anner as represented in Figure 3. During prod~.lction of a w~nding coil 14 of high frequency that CA 02227l48 l998-0l-l6 is wound out o~ winding wire of a comparatively large diameter (approximately 150 ~m) and which only ha8 a few coil turns 21, it is possible to dispense with the counter-holder 25 in particular whilst he~ting the 5 wi n~t n~ tool 22 or the winding wire 13 in order to attain adhesion between the baked ~n~mel surfaces of the coil turns 21.
Figure 6, in a plan view of the winding-wire installing element 24 of the winding tool 22, illu~trateR the formation of the winding coil 14 at the end of the winding process and the pos~ibility of utilizing the winding-wire installing element 24 for the purpo~e of producing the whole tran~ponder unit 12 in addition to and at the same time as using it to ~orm the w; n~lng COll 14.
For thi~ purpose, the winding-wire in6talling elem.ent 24, at its peripheral edge 27, i8 provided with two holding devices 28, 29 which are used to receive the winding wire ends 18, 19 in a clamping manner before and at the end o~ the actual winding process.
For this purpose, hefore the start o~ the w; n~l;ng process the winding wire end 18 is ~irst guided by mean~ of a suitable wire guide, which is not repre~ented further here, through the holding de~ice 28 and i~ clamped there. Sub~equently, the winding coil 14 i8 formed by rotating the windin~ tool 22 about the windlng axis 2~, with the winding wire 13 being guided Ollt ~f the wire guide. After the desired number of turns has been attained, finally the second winding wire end 19 is clamped by guiding the wire guide throllgh the ~econd holding device 29 so that the configur~tion which i~ represented in Figure 6 appear~.
_g_ In the winding-wire in~:talling element 24 there iR
a receiving device 30 for receiving the IC 15 in ~uch a way that the terminal faces 16, 17 o~ the IC 15 are located in a position o~ overlap with the winding wire ends 18, 19. The IC 15 can either be inserted into the winding-wire installing element 24 before the w; n~; n~
process or el~e after the windin~ process can be pushed ~rom behind through the receiving device 30, which i8 for example shaped as a through-opening, with its terminal face~ 16, 17 against the winding wire end~ 18 and 19 respectively. By means of a connecting tool, which i~ not repre~ented further, it i8 possible for the winding wire e~d~ 18, 19 to be ~onnected to the terminal face~ 16, 17 and also for the winding wire ends 18, 19 to be severed ~etween the terminal ~aces 16, 17 and the holding device~ 28, 29.
Accommodated in this way in the winding-wire in~talling element 24, the transponder unit 12, formed ~rom the winding coil 14 and the IC 15, as represented in Fi~ure 4, i. applicable a~ter removal o~ the counte~-holder 25, in the application con~iguration of ~he windirg tool 22 can then be applied to the carrier layer :L1 which is arranged on a receiving plane 31 o:E a carrier-layer pre~sing device 32.
For this purpose, the carrier layer 11, which can be formed as a continuous film running past the carrier-layer pressing device 32 or as a ~heet that has IC card ~;m~n~ions, i8 pressed by means o~ the carrie~-layer pre~sing device 32, as indicated by means of the arrow 33 n Figure 4, against the winding-wire installin~ element 24 with interposition o~ the winding coll 14 Qr the tran~ponder unit 12. Depending on the deformation characteristics of the thermoplastic carrier layer material, heating o~ the winding-wire installing element 24 or of the winding wire 13 may be effected in order to render po~sible plastic deformation of the surface of the carrier layer 11, as represented in Figure 2, under the influence of pres~ure and temperature.
Figure 5 also shows, in accordance with the representa~ion in Figure 2, how the coil ~urns 21 of the winding coil 14 in the ca~e of the coil application are pressed at least in part into the surface of the carrier layer 11. In order to prevent a situation from occurring where as a re~ult of the w; n~; n~ core ~3 cont~cting the carrier layer ll the latter is de~ormed or e~en de~troyed, with the pressing movement (arrow 33) of the carrier-layer pre3sing device 32 a re~toring movemen~ ~arrow 34) of the winding core 23, which can be moved in relation to the winding-wire installing element 24, takes place.
Claims (9)
1. Method for producing an IC card module having a thermoplastic carrier layer and a coil arranged thereon, characterized in that the coil (14), after having been produced on a winding tool (22), is pressed under the influence of temperature by means of said winding tool at least in part into the carrier layer (11).
2. Method according to claim 1, characterised in that the coil (14) is pressed into the carrier layer (11) by means of a winding-wire installing element (24) of the winding tool (22) that is arranged so as to be parallel to the coil plane, with a restoring movement (34) of a winding core (23), which receives the winding-wire installing element (24), taking place.
3. Method according to claim 2, characterised in that the restoring movement (34) of the winding core (23) is effected by means of an advancing movement (33) of the carrier layer (11).
4. Device for producing an IC card module having a carrier layer and a coil arranged thereon, characterised by a heatable winding tool (22) having a winding core (23) and a winding-wire installing element (24) which is arranged thereon and also a carrier-layer pressing device (32) that has a receiving plane (31) for the planar arrangement of the carrier layer (11) parallel to the winding-wire installing element (24), with the carrier-layer pressing device (32) being movable towards the winding-wire installing element (24) or vice versa, and with the winding core (23) being movable in relation to the winding-wire installing element (24).
5. Device according to claim 4, characterised in that the winding core (23) is formed at least in the region of its end face that faces the carrier-layer pressing device (32) so as to be thermally insulating.
6. Device according to claim 4, characterised in that the winding core (23) has an end face which is reduced in size in relation to its cross-sectional area.
7. Device according to one or more of the claims 4 to 6, characterised in that the carrier-layer pressing arrangement (32) is provided with a vacuum arrangement for the purpose of holding the carrier layer (11).
8. Device according to one or more of the claims 4 to 7, characterised in that the carrier-layer pressing device (32) is formed from a material that has a high level of thermal conductivity.
9, Device according to one or more of the claims 4 to 8, characterised in that the winding core (23) and/or the carrier-layer pressing device (32) are/is provided with a cooling device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19525933.5 | 1995-07-17 | ||
| DE19525933A DE19525933C5 (en) | 1995-07-17 | 1995-07-17 | Method and device for embedding a coil in the carrier substrate of an IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2227148A1 true CA2227148A1 (en) | 1997-02-06 |
Family
ID=7766991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002227148A Abandoned CA2227148A1 (en) | 1995-07-17 | 1996-06-26 | An ic card module and also a method and a device for the production thereof |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0839360B1 (en) |
| JP (1) | JPH11515120A (en) |
| CN (1) | CN1098507C (en) |
| AT (1) | ATE247853T1 (en) |
| AU (1) | AU720773B2 (en) |
| CA (1) | CA2227148A1 (en) |
| DE (2) | DE19525933C5 (en) |
| ES (1) | ES2202451T3 (en) |
| WO (1) | WO1997004415A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19751043C2 (en) * | 1997-11-18 | 2001-11-08 | David Finn | Enclosed transponder arrangement |
| DE19811577A1 (en) * | 1998-03-17 | 1999-09-23 | Siemens Ag | Chip card with data processing circuit and transmitter receiver coil |
| DE19813165A1 (en) | 1998-03-25 | 1999-10-07 | Kopp Werkzeugmasch Gmbh | Method and device for machining non-circular inner and outer contours |
| DE19915765C2 (en) * | 1999-04-08 | 2001-06-21 | Cubit Electronics Gmbh | Contactless transponder and process for its manufacture |
| DE19920399C1 (en) * | 1999-05-04 | 2001-01-25 | Cubit Electronics Gmbh | Plastic card conductor wire formation method has conductor wires supported in required pattern in clamp frame before pressing into electrically insulating plastic card |
| DE19962221A1 (en) * | 1999-10-01 | 2001-05-23 | Glatt Process Technology Gmbh | Sustained-release medicament formulation, e.g. for parenteral or transdermal use, comprising drug and carrier system consisting of solid biodegradable blood plasma proteins obtained by fluidized bed drying |
| US6628240B2 (en) * | 2000-11-08 | 2003-09-30 | American Pacific Technology | Method and apparatus for rapid staking of antennae in smart card manufacture |
| ATE276642T1 (en) * | 2001-01-15 | 2004-10-15 | Cubit Electronics Gmbh | METHOD AND DEVICE FOR ATTACHING CONDUCTIVE WIRES ON OR IN A SUPPORT LAYER |
| FR2820548A1 (en) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME |
| DE10109030C2 (en) * | 2001-02-24 | 2003-11-13 | Cubit Electronics Gmbh | Contactless transponder |
| JP4755360B2 (en) * | 2001-05-16 | 2011-08-24 | 日立マクセル株式会社 | Coil winding device, IC chip-coil connection device, flexible IC module manufacturing device, and information carrier manufacturing device |
| DE10160390A1 (en) * | 2001-12-10 | 2003-06-18 | Cubit Electronics Gmbh | Coil arrangement and method for its manufacture |
| DE102004027787A1 (en) * | 2004-06-08 | 2006-01-05 | Infineon Technologies Ag | Semiconductor devices with plastic housing and method of making the same |
| DE102006030819A1 (en) | 2006-06-30 | 2008-01-03 | Smartrac Technology Ltd. | Chip card and method for producing a chip card |
| US7546671B2 (en) | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
| US8286332B2 (en) | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
| US7971339B2 (en) | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
| US8322624B2 (en) | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
| US8608080B2 (en) | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
| US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
| US7979975B2 (en) | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
| US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
| IL184260A0 (en) | 2007-06-27 | 2008-03-20 | On Track Innovations Ltd | Mobile telecommunications device having sim/antenna coil interface |
| ES2355682T3 (en) | 2007-09-18 | 2011-03-30 | Hid Global Ireland Teoranta | PROCEDURE FOR THE CONNECTION OF A CABLE DRIVER READY ON A SUBSTRATE. |
| US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
| US8613132B2 (en) | 2009-11-09 | 2013-12-24 | Feinics Amatech Teoranta | Transferring an antenna to an RFID inlay substrate |
| KR20130108068A (en) | 2010-05-04 | 2013-10-02 | 페이닉스 아마테크 테오란타 | Manufacturing rfid inlays |
| US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
| US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
| JP5672991B2 (en) * | 2010-11-09 | 2015-02-18 | 凸版印刷株式会社 | Non-contact communication medium manufacturing method |
| EP3086208B1 (en) | 2015-04-24 | 2019-03-06 | Nxp B.V. | Smart card with touch-based interface |
| CN105304320B (en) * | 2015-10-21 | 2018-04-13 | 深圳市有钢机电设备有限公司 | Coil winding machine, Wireless charging coil and its manufacture craft |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1183151B (en) * | 1961-08-24 | 1964-12-10 | Siemens Ag | Device for attaching bare conductor wires to thermoplastic substrates |
| JPH04152191A (en) * | 1990-10-17 | 1992-05-26 | Mitsubishi Electric Corp | Tab base and non-contact ic card using said tab base |
| FI89752C (en) * | 1992-04-01 | 1993-11-10 | Picopak Oy | Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card |
| NL9200835A (en) * | 1992-05-11 | 1993-12-01 | Nedap Nv | FLEXIBLE COIL CONSTRUCTION IN IDENTIFICATION CARD. |
| JPH06122297A (en) * | 1992-08-31 | 1994-05-06 | Sony Chem Corp | Ic card and manufacture thereof |
| CH688696A5 (en) * | 1993-03-17 | 1998-01-15 | François Droz | Card with electronic component and coil mfr. for use as bank card, access card |
| DE4311493C2 (en) * | 1993-04-07 | 2000-04-06 | Amatech Advanced Micromechanic | IC card module for producing an IC card |
| DE4325334C2 (en) * | 1993-05-28 | 1996-05-02 | Amatech Gmbh & Co Kg | Device and method for bonding with a winding head |
| DE4410732C2 (en) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit |
| DE4421607A1 (en) * | 1994-06-21 | 1996-01-04 | Giesecke & Devrient Gmbh | Process for the production of data carriers |
-
1995
- 1995-07-17 DE DE19525933A patent/DE19525933C5/en not_active Expired - Fee Related
-
1996
- 1996-06-26 EP EP96920698A patent/EP0839360B1/en not_active Expired - Lifetime
- 1996-06-26 AT AT96920698T patent/ATE247853T1/en not_active IP Right Cessation
- 1996-06-26 ES ES96920698T patent/ES2202451T3/en not_active Expired - Lifetime
- 1996-06-26 JP JP9506136A patent/JPH11515120A/en active Pending
- 1996-06-26 CN CN96195525A patent/CN1098507C/en not_active Expired - Lifetime
- 1996-06-26 CA CA002227148A patent/CA2227148A1/en not_active Abandoned
- 1996-06-26 DE DE59610675T patent/DE59610675D1/en not_active Expired - Lifetime
- 1996-06-26 AU AU61873/96A patent/AU720773B2/en not_active Ceased
- 1996-06-26 WO PCT/DE1996/001121 patent/WO1997004415A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| DE19525933C2 (en) | 1997-06-19 |
| EP0839360A1 (en) | 1998-05-06 |
| CN1098507C (en) | 2003-01-08 |
| AU720773B2 (en) | 2000-06-08 |
| DE59610675D1 (en) | 2003-09-25 |
| ATE247853T1 (en) | 2003-09-15 |
| ES2202451T3 (en) | 2004-04-01 |
| JPH11515120A (en) | 1999-12-21 |
| DE19525933C5 (en) | 2004-02-19 |
| WO1997004415A1 (en) | 1997-02-06 |
| AU6187396A (en) | 1997-02-18 |
| CN1191029A (en) | 1998-08-19 |
| EP0839360B1 (en) | 2003-08-20 |
| DE19525933A1 (en) | 1997-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |