CA2206097A1 - Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass - Google Patents
Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks passInfo
- Publication number
- CA2206097A1 CA2206097A1 CA002206097A CA2206097A CA2206097A1 CA 2206097 A1 CA2206097 A1 CA 2206097A1 CA 002206097 A CA002206097 A CA 002206097A CA 2206097 A CA2206097 A CA 2206097A CA 2206097 A1 CA2206097 A1 CA 2206097A1
- Authority
- CA
- Canada
- Prior art keywords
- housing
- synthetic material
- conductor tracks
- micromechanical components
- mpa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Materials For Medical Uses (AREA)
Abstract
The invention concerns a thermoplastic housing designed to hold electronic and/or micromechanical components and into which metal conductor tracks pass, the conductor tracks being injection moulded in one of the housing walls. The thermoplastic has a flexural strength of at least 200 MPa.
Description
Bc97s041 J~WlBelPCTlEPg5~0~461 7t26.05. 1997 Pl ASnC HOUS~NG DESIGNED ~O J~:COi~,MODATE EL~C'rR~NIC AN~JOR
MlC:ROlJ11~C;H~,Nl~At. I:~OMpoNENT5 ANl~ INTO WHI~I COND~ICl OF~
TRACKS PASS.
5 The invention c~ el ns ~ ousin~ rnade of a U ,~r"~o~ lasti~ synthelic mat~orial d~-signed to ~,n~nodate ele~roni~ andlor n~'cru~,ec~anic~l oo~ G~ ts and into which l~ad m~taTlic leads which for this purpose ~re ~n-hecl~ed in a wall of th~h~usin~ by in;ec~ion mouldin~. In certain applications such housin~s ha\~e lo beh~rn~ic ~lly sealed. The l~ ior, where the le3d~ t~ave~se a wall of the h~usin~
1û c~nstlt~e~ a criti~l locali~- For the se~lin~ of the housing. Oflen such leads are ~ormed by punchin~ of metallic strips t~ a latticc whicl~ i8 pos~tion~ in ~n inie~
tion rnold for moul~in~ a p~rt of the housing so that the lattic~ be~".~s partly ~m-bedded by i,; ~tion nlould;n~. l'h~ m~allic strip may consist o~ copper which is~ oated with alumini~. DifficulUes arise h~m the fact that rnetals and pla~ti~s dif~
15 fer, ~lo~rkably in their coefr;c ant of ~l~ermal exp~nsi~n. ~Ppper ~or ex~rnple h~as a ~en l of U)e""al e,~ ns;on of 17 x 10~1~Kwhereas the""op~d~lic synthetic rnater~als typi~ally ~a~ ~ a ~o~r;e;en~ of ll l~r",d~ ~x~ansion be~veen 20 x 1 0~1~K
an~ 30 x 1 ~JrK. Under he~t loa~s which may oc~ur not oniy under certain appli-c~tion conditions P~t already d~Jring the m~n~fa~t~re R~' th~ llousin~, particularly -rto ~ v~ al~e ~ MAK~ + AS~ 10 wltil~ adh~sives are being cured and whlie ~mpol~nts 3~e ~ n~;t~d by solder-in~ tQ leads ~rhich a~e en,b~d~cl ~y ini~ction mouldin3""ed~anical stress6s ~r~
~n~.ale~ in the pEastic "~ . Due to the thsrnlal lo~d the p7~tic n,~t~rial will slip along the nletallic l~ds. Partly this will result in a di~connection of the pla~tic 5 ~T~t~ l frorr th~ n~etel which i~ thc moo~ cec i~ not too b4d cin~ ~ho ~p ~hi~h is ~orn~ed b~ en the meS~llic surf~oe and 1he pla8tic matcrial i5 sul~i-cientiy nar~ to gua. ~nlee a wffici~nt sealing ~ffeçt. It ~n~y, hov~vor, happe that in th~ plastic ,nalerial fi~sures are formed ~ h e~ n~ cro~is~ or at riyht ~n~le~ to ~he ~etalli~ lea~s whereby ac~e~s~s to the g~p ~e~00n the lead and 10 ~h~ pl0~ m~l~l ial are form~d so that the housing will no lon~r b~ ti~ht.
It is well knawn in the 8rt to ke~p the differ~nce be~en the Ulerm~l ~xpan~ion c~o~,-c ~.,. 1~ of met~ls ~nd pl~stic n,~le~ as l~w as pwsib!o by 8ele~tin~ appr~-priats ~ate~ials and by sh~pin~ the lead~ so as to Ill;.".~li5~3 ~he ~Lf~3~s ~ r3G;~
th~ le~ds snd the s~Jrroundin3 pl2sti¢ fndlerial~ These measures proove, ho~1Evor~
15 rnerely partly ~ $sful; on the one hand the m~terials cannot ~e ~el~ctad ind~~en~ntly ~ince further uiteria h~ve to be met for e~ .,-pl~ wit~ r~ard ta electric con~uctivity, surf~ nditi.~-" .,~cchan~ and li.~ 1ll8l stability of ~h~pe, resis-tanOe ~;ns~ selvents, oil and ~resse, ~nd r~sis~ Palinst a3ein~; on the other hand U161~ iC~ t~ maker;als, Y~hi~h are filled wlth glass ~bers to20 irnprove their m~h~nic~l and U,~r..,al stsbiiity, mostly show~n allis~lu~ y Ule~ 11181 ~3A~13l ,~ion ooe~lcient ~vhid~ rn3kes it imposs,~la to sdapt their thermal ex-pansion ~e~ficient ~ ;lly tc that of the lead~.
In ~lew of thes~ Facts it is an obje~t of the ~r~R~I~t in~rention to di~close a po~sibil-ity how to i~ o~ the ti~yl ~ ss of8UCh h~usln~s.
Aco~rdi.)~ to the pres~nt inverttion this ~bje~ i~ acco.nplished by ~ houslng hav-ing the features included ir ~im 1. ~n such ~ housing, which is n~3de o~ a ~her-S mopld~tic synthetic ~--dt~rial ~nd d6si~l ~d to acc~m~)~odate ~ tr~l . C an~or mlcl ur ,e~l ~a~ lpOI l~r ~t~ and into ~hidl l~ad metallic leads which for this purpos~ sre ~mbed~e~ in a wall ~ the hou~ing b3~ cliot I mou~d~ng, th~ syn-th~tic .,lat~r i~l is sel~ d tO h a~e a fl~xural ~r~ h of at le~st 2~0 MPa. Pre-~errecl embodi~nts of th~ inYention ar~ tt~e ~ubjeot Of the ~epen~ent cl~in s.
10 S- ~prisin~ly it has bee~ found that the tel ~d~ to form fissures, which ext~nd crosswi~ ~o ~he ieads, is ~e~Jc~, if th~ ~hermoplastic synth~tic n~ ri~l, into which the le~ds are ~ Le~J~J by in,e ~ lion mouldingt is ~GI~_te~ to h~9Y~ a htgh f~exural ~ n~ "~r~f~r~bly as ttigh a~ possibl~. A~ ty it is ~3ught to select a ll IGI ",v,vla~l;c Sr~,th~lic ., Idt~l ial havin~ a flexural 3t~ t h of at least 20~ MPa, ~5 p,~.~Lly nlore lhan ~50 MPa. Parffcul3rly h~hiy ~ pffr~t~ro r~si~,rll thern~o-p~asti~ n~ 15 like PPS exl~ibit ~IJch hi~h flexural stren~tl~s. Thus hard thermo-pl~sti~ nnateri~ls on the ~asi~ ~f PPS ~re pr~ d. A PPS ~tlled with ~i~ss fibers has proven particularl~ us~fu~; SU~t (n~t~rial is distribut~d by P~ILLIPS under the b aJ~ a~ ~YTON R4XT. ~his matafial ~xhibi~ a flexural ~tf6n~ f 265 MP~ as 20 d~ ined accor~ y to ASTM D6~5S9 P~r~ ariy p~r~d ars ~lass fiber d synthe~ic ~,.c,l~r;~'s ,,n whi~h t~ ~ 9s flbers are d~str~buted isotropically o~
ne~rly i~ 'ly ~n or~r to ~void an anisollv,,s~,~l ooe~i;c ~ nt of lll~r.llal ~xpa~
sion and at the ssrne time t~ get a high flex~ral ~tt ~ ,811,.
It i~ an ~dv. rlt~;6 of the invent;on th~t is even unne~sss~ry to a~l3pt the U ,~ ~, r;ll 5 a~pal~slon ~efr~ciE ~t ~f t~ rnlheti~ pl~stic ,~,~5le~ t~ ~hat ~ the met~llic leads when s~le~ti.l~ a Uh~r,~ ti~ synthetic ~ t~ri~' with hi~h fle~wral st,e~,lyt~l, n~-erlhe~ss ti~htly en~h~d~d leads are abt~inable.
~h~ enc,ossd single dr~u~ shOW5 ~ s~ti~llalV~eW of a part o~ a w~tl o~ ~ ho~s-ing made of ~ ri~id pl~stic material in wni~ a lead in en ~e~d&~. The lead i~
p~rtiy covered witl~ a lay~r of S~K~ pla~ic " Iql~rial havin~ a thicknsss of merely 0.4 mm. Wh~n uslng a pla~Uc n~terial havin~ a flex~Jra~ s~r,gU~ of 19~ MPB
mi~o-fissu~0s have been foun~ In the n4 mm tl-i~l< p1astic l~yer a~ al~ro~
and~or "~ ~tldni~ 4n.~er~ents 1 ad been ~n~e~ed tc) th~ le~ds ~ ~lder-ing and ~Fter th~ housi~ h~d ~eQn sealed, said mic~o~ sures resulting in 3 k:)8s~5 ~f ~ ss. If, 1~; ~1Jol~, a glass fib~r ~l~led PPS pl~stic m~t~r;~l haYir~ 8neXU
~o~ of 265 MPa w~s ~sed ~uch mic~o-fissures cou~d n~ r b~ discov~
er~d l~e tests have be~n carri~d out with h~u5ings hlle~ ~vith an oil and d~
si~ned to ~ ~ceivc a rni~ o~ ani~R~ a~lwltiul 1 senson Not~: PPS rneans p~ o,~ e s~lphide
MlC:ROlJ11~C;H~,Nl~At. I:~OMpoNENT5 ANl~ INTO WHI~I COND~ICl OF~
TRACKS PASS.
5 The invention c~ el ns ~ ousin~ rnade of a U ,~r"~o~ lasti~ synthelic mat~orial d~-signed to ~,n~nodate ele~roni~ andlor n~'cru~,ec~anic~l oo~ G~ ts and into which l~ad m~taTlic leads which for this purpose ~re ~n-hecl~ed in a wall of th~h~usin~ by in;ec~ion mouldin~. In certain applications such housin~s ha\~e lo beh~rn~ic ~lly sealed. The l~ ior, where the le3d~ t~ave~se a wall of the h~usin~
1û c~nstlt~e~ a criti~l locali~- For the se~lin~ of the housing. Oflen such leads are ~ormed by punchin~ of metallic strips t~ a latticc whicl~ i8 pos~tion~ in ~n inie~
tion rnold for moul~in~ a p~rt of the housing so that the lattic~ be~".~s partly ~m-bedded by i,; ~tion nlould;n~. l'h~ m~allic strip may consist o~ copper which is~ oated with alumini~. DifficulUes arise h~m the fact that rnetals and pla~ti~s dif~
15 fer, ~lo~rkably in their coefr;c ant of ~l~ermal exp~nsi~n. ~Ppper ~or ex~rnple h~as a ~en l of U)e""al e,~ ns;on of 17 x 10~1~Kwhereas the""op~d~lic synthetic rnater~als typi~ally ~a~ ~ a ~o~r;e;en~ of ll l~r",d~ ~x~ansion be~veen 20 x 1 0~1~K
an~ 30 x 1 ~JrK. Under he~t loa~s which may oc~ur not oniy under certain appli-c~tion conditions P~t already d~Jring the m~n~fa~t~re R~' th~ llousin~, particularly -rto ~ v~ al~e ~ MAK~ + AS~ 10 wltil~ adh~sives are being cured and whlie ~mpol~nts 3~e ~ n~;t~d by solder-in~ tQ leads ~rhich a~e en,b~d~cl ~y ini~ction mouldin3""ed~anical stress6s ~r~
~n~.ale~ in the pEastic "~ . Due to the thsrnlal lo~d the p7~tic n,~t~rial will slip along the nletallic l~ds. Partly this will result in a di~connection of the pla~tic 5 ~T~t~ l frorr th~ n~etel which i~ thc moo~ cec i~ not too b4d cin~ ~ho ~p ~hi~h is ~orn~ed b~ en the meS~llic surf~oe and 1he pla8tic matcrial i5 sul~i-cientiy nar~ to gua. ~nlee a wffici~nt sealing ~ffeçt. It ~n~y, hov~vor, happe that in th~ plastic ,nalerial fi~sures are formed ~ h e~ n~ cro~is~ or at riyht ~n~le~ to ~he ~etalli~ lea~s whereby ac~e~s~s to the g~p ~e~00n the lead and 10 ~h~ pl0~ m~l~l ial are form~d so that the housing will no lon~r b~ ti~ht.
It is well knawn in the 8rt to ke~p the differ~nce be~en the Ulerm~l ~xpan~ion c~o~,-c ~.,. 1~ of met~ls ~nd pl~stic n,~le~ as l~w as pwsib!o by 8ele~tin~ appr~-priats ~ate~ials and by sh~pin~ the lead~ so as to Ill;.".~li5~3 ~he ~Lf~3~s ~ r3G;~
th~ le~ds snd the s~Jrroundin3 pl2sti¢ fndlerial~ These measures proove, ho~1Evor~
15 rnerely partly ~ $sful; on the one hand the m~terials cannot ~e ~el~ctad ind~~en~ntly ~ince further uiteria h~ve to be met for e~ .,-pl~ wit~ r~ard ta electric con~uctivity, surf~ nditi.~-" .,~cchan~ and li.~ 1ll8l stability of ~h~pe, resis-tanOe ~;ns~ selvents, oil and ~resse, ~nd r~sis~ Palinst a3ein~; on the other hand U161~ iC~ t~ maker;als, Y~hi~h are filled wlth glass ~bers to20 irnprove their m~h~nic~l and U,~r..,al stsbiiity, mostly show~n allis~lu~ y Ule~ 11181 ~3A~13l ,~ion ooe~lcient ~vhid~ rn3kes it imposs,~la to sdapt their thermal ex-pansion ~e~ficient ~ ;lly tc that of the lead~.
In ~lew of thes~ Facts it is an obje~t of the ~r~R~I~t in~rention to di~close a po~sibil-ity how to i~ o~ the ti~yl ~ ss of8UCh h~usln~s.
Aco~rdi.)~ to the pres~nt inverttion this ~bje~ i~ acco.nplished by ~ houslng hav-ing the features included ir ~im 1. ~n such ~ housing, which is n~3de o~ a ~her-S mopld~tic synthetic ~--dt~rial ~nd d6si~l ~d to acc~m~)~odate ~ tr~l . C an~or mlcl ur ,e~l ~a~ lpOI l~r ~t~ and into ~hidl l~ad metallic leads which for this purpos~ sre ~mbed~e~ in a wall ~ the hou~ing b3~ cliot I mou~d~ng, th~ syn-th~tic .,lat~r i~l is sel~ d tO h a~e a fl~xural ~r~ h of at le~st 2~0 MPa. Pre-~errecl embodi~nts of th~ inYention ar~ tt~e ~ubjeot Of the ~epen~ent cl~in s.
10 S- ~prisin~ly it has bee~ found that the tel ~d~ to form fissures, which ext~nd crosswi~ ~o ~he ieads, is ~e~Jc~, if th~ ~hermoplastic synth~tic n~ ri~l, into which the le~ds are ~ Le~J~J by in,e ~ lion mouldingt is ~GI~_te~ to h~9Y~ a htgh f~exural ~ n~ "~r~f~r~bly as ttigh a~ possibl~. A~ ty it is ~3ught to select a ll IGI ",v,vla~l;c Sr~,th~lic ., Idt~l ial havin~ a flexural 3t~ t h of at least 20~ MPa, ~5 p,~.~Lly nlore lhan ~50 MPa. Parffcul3rly h~hiy ~ pffr~t~ro r~si~,rll thern~o-p~asti~ n~ 15 like PPS exl~ibit ~IJch hi~h flexural stren~tl~s. Thus hard thermo-pl~sti~ nnateri~ls on the ~asi~ ~f PPS ~re pr~ d. A PPS ~tlled with ~i~ss fibers has proven particularl~ us~fu~; SU~t (n~t~rial is distribut~d by P~ILLIPS under the b aJ~ a~ ~YTON R4XT. ~his matafial ~xhibi~ a flexural ~tf6n~ f 265 MP~ as 20 d~ ined accor~ y to ASTM D6~5S9 P~r~ ariy p~r~d ars ~lass fiber d synthe~ic ~,.c,l~r;~'s ,,n whi~h t~ ~ 9s flbers are d~str~buted isotropically o~
ne~rly i~ 'ly ~n or~r to ~void an anisollv,,s~,~l ooe~i;c ~ nt of lll~r.llal ~xpa~
sion and at the ssrne time t~ get a high flex~ral ~tt ~ ,811,.
It i~ an ~dv. rlt~;6 of the invent;on th~t is even unne~sss~ry to a~l3pt the U ,~ ~, r;ll 5 a~pal~slon ~efr~ciE ~t ~f t~ rnlheti~ pl~stic ,~,~5le~ t~ ~hat ~ the met~llic leads when s~le~ti.l~ a Uh~r,~ ti~ synthetic ~ t~ri~' with hi~h fle~wral st,e~,lyt~l, n~-erlhe~ss ti~htly en~h~d~d leads are abt~inable.
~h~ enc,ossd single dr~u~ shOW5 ~ s~ti~llalV~eW of a part o~ a w~tl o~ ~ ho~s-ing made of ~ ri~id pl~stic material in wni~ a lead in en ~e~d&~. The lead i~
p~rtiy covered witl~ a lay~r of S~K~ pla~ic " Iql~rial havin~ a thicknsss of merely 0.4 mm. Wh~n uslng a pla~Uc n~terial havin~ a flex~Jra~ s~r,gU~ of 19~ MPB
mi~o-fissu~0s have been foun~ In the n4 mm tl-i~l< p1astic l~yer a~ al~ro~
and~or "~ ~tldni~ 4n.~er~ents 1 ad been ~n~e~ed tc) th~ le~ds ~ ~lder-ing and ~Fter th~ housi~ h~d ~eQn sealed, said mic~o~ sures resulting in 3 k:)8s~5 ~f ~ ss. If, 1~; ~1Jol~, a glass fib~r ~l~led PPS pl~stic m~t~r;~l haYir~ 8neXU
~o~ of 265 MPa w~s ~sed ~uch mic~o-fissures cou~d n~ r b~ discov~
er~d l~e tests have be~n carri~d out with h~u5ings hlle~ ~vith an oil and d~
si~ned to ~ ~ceivc a rni~ o~ ani~R~ a~lwltiul 1 senson Not~: PPS rneans p~ o,~ e s~lphide
Claims (6)
1. A housing which is made of a thermoplastic synthetic material and designed to accommodate electronic and/or micromechanical components and into which lead metallic leads which for this purpose embedded in a wall of the housing by injection moulding, characterised in that the thermoplastic synthetic material is selected to have aflexural strength of at least 200 MPa.
2. A housing according to claim 1 in which the synthetic material has a flexural strength of at least 250 MPa.
3. A housing as claimed in claim 1 or 2 in which the synthetic material is a PPS.
4. A housing as claimed in claim 3 in which the synthetic material is a glass fiber filled PPS.
5. A housing as claimed in claim 3 or 4 in which the PPS-based synthetic material exhibits a flexural strength of 265 MPa.
6. A housing as claimed in claim 4 in which the distribution of the glass fibers in the synthetic material is isotropic or does exhibit merely a slight anisotropy.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9418940 | 1994-11-25 | ||
| DEG9418940.4U | 1994-11-25 | ||
| DE9420980U DE9420980U1 (en) | 1994-11-25 | 1994-12-31 | Housing made of a hard plastic for accommodating electronic and / or micromechanical components, into which conductor tracks lead |
| DEG9420980.4U | 1994-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2206097A1 true CA2206097A1 (en) | 1996-06-06 |
Family
ID=25962676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002206097A Abandoned CA2206097A1 (en) | 1994-11-25 | 1995-11-23 | Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0793859B1 (en) |
| AT (1) | ATE224100T1 (en) |
| CA (1) | CA2206097A1 (en) |
| ES (1) | ES2183888T3 (en) |
| WO (1) | WO1996017383A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112441839B (en) * | 2019-08-27 | 2022-04-15 | Oppo广东移动通信有限公司 | Ceramic rear cover and manufacturing method thereof, shell and mobile terminal |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3557628A (en) * | 1967-12-27 | 1971-01-26 | Toyoda Chuo Kenkyusho Kk | Accelerometer |
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| US4406993A (en) * | 1981-08-28 | 1983-09-27 | Kulite Semiconductor Products, Inc. | Oil filled pressure transducers |
| US5152057A (en) * | 1987-11-17 | 1992-10-06 | Mold-Pac Corporation | Molded integrated circuit package |
| JPH04204264A (en) * | 1990-11-30 | 1992-07-24 | Mitsubishi Electric Corp | Semiconductor acceleration detecting device |
| DE4105913A1 (en) * | 1991-02-26 | 1992-08-27 | Bayer Ag | MIXTURES OF POLYARYL SULFIDES, GLASS FIBERS AND POLYMALEINIMIDES |
| NO911774D0 (en) * | 1991-05-06 | 1991-05-06 | Sensonor As | DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME. |
| FR2710810B1 (en) * | 1993-09-29 | 1995-12-01 | Sagem | Waterproof micro-component housing and method of encapsulation in such a housing. |
-
1995
- 1995-11-23 WO PCT/EP1995/004617 patent/WO1996017383A1/en active IP Right Grant
- 1995-11-23 ES ES95941003T patent/ES2183888T3/en not_active Expired - Lifetime
- 1995-11-23 EP EP95941003A patent/EP0793859B1/en not_active Expired - Lifetime
- 1995-11-23 CA CA002206097A patent/CA2206097A1/en not_active Abandoned
- 1995-11-23 AT AT95941003T patent/ATE224100T1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996017383A1 (en) | 1996-06-06 |
| ATE224100T1 (en) | 2002-09-15 |
| EP0793859B1 (en) | 2002-09-11 |
| ES2183888T3 (en) | 2003-04-01 |
| EP0793859A1 (en) | 1997-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |