CA2069813A1 - Optical processing apparatus - Google Patents
Optical processing apparatusInfo
- Publication number
- CA2069813A1 CA2069813A1 CA2069813A CA2069813A CA2069813A1 CA 2069813 A1 CA2069813 A1 CA 2069813A1 CA 2069813 A CA2069813 A CA 2069813A CA 2069813 A CA2069813 A CA 2069813A CA 2069813 A1 CA2069813 A1 CA 2069813A1
- Authority
- CA
- Canada
- Prior art keywords
- light beam
- mask
- reflector
- angle
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
Abstract
An optical processing apparatus utilizing multiple reflections of a light beam between a mask and a reflector has improved uniformity in the distribution of the light beam over a surface of the mask. In one form, the reflector is disposed in a face-to-face relation with respect to the mask with an angle of inclination relative thereto. In another form, the reflector has a flat or curved taper surface for decreasing an angle of reflection of the light beam at the mask surface at an initial stage, and a flat surface disposed in parallel with the mask surface. In a further form, the reflector is curved in a direction of transmission of the light beam. In a yet further form, an angle of incidence of the light beam is properly adjusted such that a portion of the light beam, which is first reflected from the mask and escapes outwardly from the reflector, is minimized.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12743391 | 1991-05-30 | ||
JP30175291 | 1991-11-18 | ||
JP3-127433 | 1991-11-18 | ||
JP3-301752 | 1991-11-18 | ||
JP6588692A JP2953179B2 (en) | 1991-05-30 | 1992-03-24 | Light processing equipment |
JP4-065886 | 1992-03-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2069813A1 true CA2069813A1 (en) | 1992-12-01 |
CA2069813C CA2069813C (en) | 1996-06-18 |
Family
ID=27298963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002069813A Expired - Fee Related CA2069813C (en) | 1991-05-30 | 1992-05-28 | Optical processing apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US5355194A (en) |
JP (1) | JP2953179B2 (en) |
CA (1) | CA2069813C (en) |
DE (1) | DE4217811C2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310986A (en) * | 1992-04-28 | 1994-05-10 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus |
JP3553116B2 (en) * | 1994-02-25 | 2004-08-11 | 三菱電機株式会社 | Light processing equipment |
US5715040A (en) * | 1995-10-12 | 1998-02-03 | Kabushiki Kaisha Toshiba | Illumination aperture of low intensity loss |
DE19724061C2 (en) * | 1997-06-07 | 2001-11-22 | Univ Stuttgart Strahlwerkzeuge | Device for laser machining a workpiece |
JP4522882B2 (en) * | 2005-02-15 | 2010-08-11 | 浜松ホトニクス株式会社 | Absorption measuring device |
US20070000887A1 (en) * | 2005-06-29 | 2007-01-04 | Scott Caldwell | Method for scan welding or marking through a waveguide and waveguide therefor |
CN104816060A (en) * | 2015-04-04 | 2015-08-05 | 华中科技大学 | Laser welding equipment based on gradient energy band splicing |
EP4137255A1 (en) * | 2015-10-30 | 2023-02-22 | Seurat Technologies, Inc. | Part manipulation using printed manipulation points |
CN107442934A (en) * | 2017-07-14 | 2017-12-08 | 华中科技大学 | A kind of laser welding apparatus based on energy band splicing |
CN114888458B (en) * | 2021-08-17 | 2023-12-15 | 武汉华工激光工程有限责任公司 | Parallel rotary cutting machining device and method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63220991A (en) * | 1987-03-06 | 1988-09-14 | Semiconductor Energy Lab Co Ltd | Laser beam machining method |
US5040882A (en) * | 1988-11-07 | 1991-08-20 | General Signal Corporation | Unit magnification optical system with improved reflective reticle |
US5223693A (en) * | 1990-04-28 | 1993-06-29 | Mitsubishi Denki Kabushiki Kaisha | Optical machining apparatus |
-
1992
- 1992-03-24 JP JP6588692A patent/JP2953179B2/en not_active Expired - Fee Related
- 1992-05-27 US US07/888,782 patent/US5355194A/en not_active Expired - Fee Related
- 1992-05-28 CA CA002069813A patent/CA2069813C/en not_active Expired - Fee Related
- 1992-05-29 DE DE4217811A patent/DE4217811C2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4217811A1 (en) | 1992-12-24 |
CA2069813C (en) | 1996-06-18 |
US5355194A (en) | 1994-10-11 |
JP2953179B2 (en) | 1999-09-27 |
DE4217811C2 (en) | 1996-01-25 |
JPH05197157A (en) | 1993-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |