CA2065181C - Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life - Google Patents
Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life Download PDFInfo
- Publication number
- CA2065181C CA2065181C CA002065181A CA2065181A CA2065181C CA 2065181 C CA2065181 C CA 2065181C CA 002065181 A CA002065181 A CA 002065181A CA 2065181 A CA2065181 A CA 2065181A CA 2065181 C CA2065181 C CA 2065181C
- Authority
- CA
- Canada
- Prior art keywords
- component
- mixture according
- phenyl
- unsubstituted
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 64
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 16
- 150000002367 halogens Chemical class 0.000 claims abstract description 14
- 125000003277 amino group Chemical group 0.000 claims abstract description 13
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 13
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003381 stabilizer Substances 0.000 claims abstract description 11
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 8
- 125000001424 substituent group Chemical group 0.000 claims abstract description 8
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims abstract description 5
- 125000001624 naphthyl group Chemical group 0.000 claims abstract description 4
- 125000000732 arylene group Chemical group 0.000 claims abstract description 3
- 125000004957 naphthylene group Chemical group 0.000 claims abstract description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 36
- -1 nitro, phenyl Chemical group 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 19
- 150000001412 amines Chemical class 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 7
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 6
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 claims description 6
- 229910052801 chlorine Inorganic materials 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 6
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 6
- 125000002252 acyl group Chemical group 0.000 claims description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 5
- WKBALTUBRZPIPZ-UHFFFAOYSA-N 2,6-di(propan-2-yl)aniline Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N WKBALTUBRZPIPZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000005001 aminoaryl group Chemical group 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 230000009969 flowable effect Effects 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000000229 (C1-C4)alkoxy group Chemical group 0.000 claims 5
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 claims 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 238000001723 curing Methods 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 150000002118 epoxides Chemical class 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- NWIVYGKSHSJHEF-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(CC)C=2)=C1 NWIVYGKSHSJHEF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- DEWLEGDTCGBNGU-UHFFFAOYSA-N 1,3-dichloropropan-2-ol Chemical compound ClCC(O)CCl DEWLEGDTCGBNGU-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- MMTOSBCMFDNOIY-UHFFFAOYSA-N 2-(chloromethyl)-3-methyloxirane Chemical compound CC1OC1CCl MMTOSBCMFDNOIY-UHFFFAOYSA-N 0.000 description 1
- SZCFDTYKNQJQKT-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCC1CO1 SZCFDTYKNQJQKT-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- XORJNZNCVGHBDZ-UHFFFAOYSA-N 2-[2-(6-oxabicyclo[3.1.0]hexan-2-yloxy)ethoxy]-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCCOC1C2OC2CC1 XORJNZNCVGHBDZ-UHFFFAOYSA-N 0.000 description 1
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- MITHMOYLTXMLRB-UHFFFAOYSA-N 4-(4-aminophenyl)sulfinylaniline Chemical compound C1=CC(N)=CC=C1S(=O)C1=CC=C(N)C=C1 MITHMOYLTXMLRB-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- FLNVGZMDLLIECD-UHFFFAOYSA-N 4-[(4-amino-3-methyl-5-propan-2-ylphenyl)methyl]-2-methyl-6-propan-2-ylaniline Chemical compound CC1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C)C=2)C(C)C)=C1 FLNVGZMDLLIECD-UHFFFAOYSA-N 0.000 description 1
- WXQZLPFNTPKVJM-UHFFFAOYSA-N 4-[(4-hydroxycyclohexyl)methyl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1CC1CCC(O)CC1 WXQZLPFNTPKVJM-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- KZTROCYBPMKGAW-UHFFFAOYSA-N 4-[[4-amino-3,5-di(propan-2-yl)phenyl]methyl]-2,6-di(propan-2-yl)aniline Chemical compound CC(C)C1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C(C)C)C=2)C(C)C)=C1 KZTROCYBPMKGAW-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 description 1
- 229940086681 4-aminobenzoate Drugs 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- YWVFNWVZBAWOOY-UHFFFAOYSA-N 4-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCC(C(O)=O)C(C(O)=O)C1 YWVFNWVZBAWOOY-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- SVLTVRFYVWMEQN-UHFFFAOYSA-N 5-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound CC1CC(C(O)=O)C(C(O)=O)C=C1 SVLTVRFYVWMEQN-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910017048 AsF6 Inorganic materials 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004146 Propane-1,2-diol Substances 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- YXEBFFWTZWGHEY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohex-3-en-1-yl]methanol Chemical compound OCC1(CO)CCC=CC1 YXEBFFWTZWGHEY-UHFFFAOYSA-N 0.000 description 1
- MSILJOYZYPRFDK-UHFFFAOYSA-N [4-[4-(sulfanylmethyl)phenoxy]phenyl]methanethiol Chemical compound C1=CC(CS)=CC=C1OC1=CC=C(CS)C=C1 MSILJOYZYPRFDK-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- WJSATVJYSKVUGV-UHFFFAOYSA-N hexane-1,3,5-triol Chemical compound CC(O)CC(O)CCO WJSATVJYSKVUGV-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920002755 poly(epichlorohydrin) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000003019 stabilising effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life Curable mixtures comprising (a) an epoxy resin, (b) a sulfonium salt of the formula (I), (II), (III) or (IV) (see formula I,II,III,IV) in which, in the formulae (I) to (IV), A is C1-C12alkyl, C3-C8cycloalkyl, C4-C10cycloalkylalkyl, or unsubstituted or substituted phenyl, Ar, Ar1 and Ar2, independently of one another, are each unsubstituted or substituted phenyl or naphthyl, arylene is in each case unsubstituted or substituted phenylene or naphthylene, and Q- is SbF6-, AsF6- or SbF5OH-, and (c) a stabiliser selected from certain aromatic amines having one to four NH2 groups with certain substituents in the ortho-position to each amino group, with the proviso that no amino group is substituted in both ortho-positions by halogen, or with a selected ortho- or para-substituent to each amino group, or selected from bipyridines, where 0.1-10% by weight of component (b) and 0.02-5% by weight of component (c), based on the epoxy resin (a), are present in the mixtures.
They are particularly suitable for the production of prepregs which have a long shelf life, are rapidly thermocurable and can be pressed to give laminates having excellent properties.
They are particularly suitable for the production of prepregs which have a long shelf life, are rapidly thermocurable and can be pressed to give laminates having excellent properties.
Description
Epox~resin mixtures, in yarticular for the production of prepregs with a long shelf life The invention relates to curable mixtures which comprise an epoxy resin, certain araliphatic sulfonium salts as initiators and certain amines as stabilisers, to prepregs and laminates obtainable using the mixtures, and to a process for the production of the laminates.
Epoxide-based laminates are generally produced using selected curing agent/acclerator combinations, for example the combination dicyandiamide/imidazole. The resin formulations must satisfy a number of requirements, some of which are difficult to combine with one another. Thus, for example, the prepreg should have a satisfactory shelf life and the matrix resin should cure rapidly in the compression mould.
Cationically curable mixtures containing sulfonium salts of the formulae (I) to (IV) mentioned below as initiators, and the use of the mixtures, inter alia, as impregnation, lamination and matrix resins are disclosed in EP-A-0 379 464. According to the teaching presented therein, the mixtures must not contain any amines so as to avoid interfering with the cationic curing with the sulfonium salts.
Although these mixtures enable rapid thermal curing of the matrix resin to give laminates having good properties, they do, however, have disadvantages. Thus, prepregs produced using solutions of these mixtures can only be dried at temperatures up to about 125°C if it is then desired to press the prepregs to give laminates. However, there is a risk at such low drying temperatures of any residual solvent which has not been removed from the prepreg material forming bubbles in the laminates during pressing and/or acting as a plasticises to lower the glass transition temperature (Tg) of the cured laminates in a disadvantageous manner. If, by contrast, the mixtures are applied without solvents at elevated temperature in the form of a melt, there is likewise a risk of such dense precrosslinking occurring that further processing to laminates of the prepregs produced in this way is no longer possible.
In addition, the shelf life of the matrix resin or of the prepregs produced using these resins may not be entirely satisfactory.
Epoxide-based laminates are generally produced using selected curing agent/acclerator combinations, for example the combination dicyandiamide/imidazole. The resin formulations must satisfy a number of requirements, some of which are difficult to combine with one another. Thus, for example, the prepreg should have a satisfactory shelf life and the matrix resin should cure rapidly in the compression mould.
Cationically curable mixtures containing sulfonium salts of the formulae (I) to (IV) mentioned below as initiators, and the use of the mixtures, inter alia, as impregnation, lamination and matrix resins are disclosed in EP-A-0 379 464. According to the teaching presented therein, the mixtures must not contain any amines so as to avoid interfering with the cationic curing with the sulfonium salts.
Although these mixtures enable rapid thermal curing of the matrix resin to give laminates having good properties, they do, however, have disadvantages. Thus, prepregs produced using solutions of these mixtures can only be dried at temperatures up to about 125°C if it is then desired to press the prepregs to give laminates. However, there is a risk at such low drying temperatures of any residual solvent which has not been removed from the prepreg material forming bubbles in the laminates during pressing and/or acting as a plasticises to lower the glass transition temperature (Tg) of the cured laminates in a disadvantageous manner. If, by contrast, the mixtures are applied without solvents at elevated temperature in the form of a melt, there is likewise a risk of such dense precrosslinking occurring that further processing to laminates of the prepregs produced in this way is no longer possible.
In addition, the shelf life of the matrix resin or of the prepregs produced using these resins may not be entirely satisfactory.
Surprisingly, it has now been found that the addition of small amounts of certain amines to the previously known epoxy resin mixtures has a stabilising action on the mixture, so that the temperature of the mixtures during the production of prepregs can be greatly increased.
The above-outlined disadvantages do not occur or only occur to an extremely small extent when the novel mixtures are used, and a rapid curing of the laminate material takes place during thermal pressing of the prepregs to give laminates. Furthermore, the addition improves the shelf life of the mixture and of prepregs produced therefrom.
The invention therefore relates to curable mixtures comprising (a) an epoxy resin, (b) a sulfonium salt of the formula (I), (II), (III) or (IV) Ar2 A
S ~ Q (I)~ , S~' Q~ (II)s CH2 CI-I2 CHZ ~ CHI
r r Ar Ir t Ar Ar Q (III) and A, S+- CH2 arylene CH2 S ~ A
The above-outlined disadvantages do not occur or only occur to an extremely small extent when the novel mixtures are used, and a rapid curing of the laminate material takes place during thermal pressing of the prepregs to give laminates. Furthermore, the addition improves the shelf life of the mixture and of prepregs produced therefrom.
The invention therefore relates to curable mixtures comprising (a) an epoxy resin, (b) a sulfonium salt of the formula (I), (II), (III) or (IV) Ar2 A
S ~ Q (I)~ , S~' Q~ (II)s CH2 CI-I2 CHZ ~ CHI
r r Ar Ir t Ar Ar Q (III) and A, S+- CH2 arylene CH2 S ~ A
Ar Ar CH2 S'~ CH2 arylene CHI- S'~' ~ 2 Q-Ar in which A is Gt-C~2alkyl, C3-Cgcycloalkyl, C4-Clpcycloalkylalkyl, phenyl which is unsubstituted or monosubsdtuted or polysubstituted by Cg-CBalkyl, Cl-C4alkoxy, halogen, hydroxyl, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the aIkoxy radical or acyl having 1-12 carbon atoms, Ar, Arl arid Ar2, independently of one another, are each phenyl or naphthyl which is unsubstituted ar monosubstituted or polysubstituted by Ct-C8alkyl, Ct-C4alkoxy, halogen, hydroxyl; vitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or aryl having 1-12 carbon atoms, arylene is in each case phenylene or naphthylene which is unsubstiW ted or monosubstituted or polysubstituted by Ct-CBalkyl; Cl-C4alkoxy, halogen, hydroxyl, vitro, phenyl;
phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or acyl having I-12 carbon atoms, and Q- is SbF~~, AsFs or SbF50H-, and (c) a stabiliser selected from the group comprising (c1) aromatic amines having a pKa value of 2-5 and having one to four NH2 groups with at least one substituent in the ortho-position to each amino group, the substituent being Ct-Ctpalkyl, Ct-Ctpalkoxy, CS-Cbcycloalkyl, C6-Ctparyl or halogen, with the proviso that the amine is not substituted in both ortho-positions to an amino group by halogen, or (c2) aromatic amines having a pKa value of 2-S and having 1 to ~1 NH2 groups with an ortho- or para-substituent to each amino group, the substituent being -COOH, -COOK, -COR, -S02R or -SOR where R is Ct-Ctpalkyl, CS-C6cycloalkyl, C6-Ctovyl, aminoaryl or -R'-OOC-C~H4-NH2 where R' is alkylene, or (c3) bipyridines, where 0.1-10% by weight of component (b) and 0.02-5% by weight of component (c), based on the epoxy resin (a); are present in the mixture.
The mixtures according to the invention are particularly suitable for the production of prepregs which have a long shelf life, are rapidly thermocurable and can be pressed to give laminates having excellent properties.
phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or acyl having I-12 carbon atoms, and Q- is SbF~~, AsFs or SbF50H-, and (c) a stabiliser selected from the group comprising (c1) aromatic amines having a pKa value of 2-5 and having one to four NH2 groups with at least one substituent in the ortho-position to each amino group, the substituent being Ct-Ctpalkyl, Ct-Ctpalkoxy, CS-Cbcycloalkyl, C6-Ctparyl or halogen, with the proviso that the amine is not substituted in both ortho-positions to an amino group by halogen, or (c2) aromatic amines having a pKa value of 2-S and having 1 to ~1 NH2 groups with an ortho- or para-substituent to each amino group, the substituent being -COOH, -COOK, -COR, -S02R or -SOR where R is Ct-Ctpalkyl, CS-C6cycloalkyl, C6-Ctovyl, aminoaryl or -R'-OOC-C~H4-NH2 where R' is alkylene, or (c3) bipyridines, where 0.1-10% by weight of component (b) and 0.02-5% by weight of component (c), based on the epoxy resin (a); are present in the mixture.
The mixtures according to the invention are particularly suitable for the production of prepregs which have a long shelf life, are rapidly thermocurable and can be pressed to give laminates having excellent properties.
The invention therefore also relates to prepregs comprising a fibrous support material and a mixture according to the invention, and to laminates obtained by thermal curing of the prepregs.
Suitable support materials are in principle all fibres which are able to form a composite with the epoxide matrix and reinforce the matrix material. Examples of fibre materials are natural polymers, such as cellulose; metals, such as steel, Ti, W, Ta and Mo;
organic fibre-forming polymers, in particular aromatic polyamides, such as Nomex or Kevlar;
carbon, such as materials prepared by carbonisation of cellulose, polyacrylonitrile or pitch, and in particular glass.
The fibre materials may be employed as supports in a wide variety of forms.
They can be used, for example, as continuous filaments (individual filaments or spun filaments), continuous yarn, parallel rovings, woven continuous yarn, spun rovings, woven roving material, short fibres, continuous mats, cut mats, nonwovens or felts (papers). Particularly preferred materials are woven glass materials and paper.
The contacting of the fibrous support material with the curable mixture varies depending on the fibre type and form and on the properties of the matrix material.
Examples of such processes are the impregnation of woven fabrics, nonwovens or continuous fibres with the liquid resin/curing agent mixture or with a solution of the mixture of a solid and/or liquid resin and the sulfonium salt curing agent in an inert solvent.
Layers containing short fibres can be produced, for example, by applying the curable mixture together with cut fibres to a woven material or a metal foil.
The contacting of the fibrous support material with the curable mixture is preferably effected by impregnation. To this end, woven webs of said support material are passed through, for example, a resin bath comprising the epoxy resin, the initiator, the stabiliser and, if desired, a solvent, are dried if necessary, and are subsequently wound onto a storage reel.
The invention also relates to a process for the production of a laminate, which comprises the steps i) production of a layer by contacting a fibrous support material with a curable mixture according to the invention in flowable form, *Trade-mark ii) production of a layer sequence comprising at least two layer materials to be bonded to one another, of which at least one is a layer obtainable in accordance with step i) and, if desired, this being stored in the interim, and in which the cuxable material is essentially in unmodified form, and iii) pressing said layer sequence at elevated temperature and under pressure.
If the mixture according to the invention employed in step i) contains a solvent, this must generally be removed at elevated temperature. This temperature is preferably sufficiently high that as much solvent as possible is removed from the material, for example to a solvent content of the material of less than 0.5% by weight. Temperatures of up to about 200°C are possible here.
In a specific embodiment of the above-described process, the fibrous support material in step i) is therefore contacted with a solution of the curable mixture according to the invention in order to produce the layer. The solvent is removed at a temperature of up to 200°C. This can be done, for example, in a drying oven or in a tunnel oven (speed, for example, 2 to 25 metres per minute). The heating time is preferably 1 to 10 minutes.
In step ii), individual layers of the previously obtained material are laid on one another in the desired number. The layers here may be idenrical or layers of Further materials may be present. Examples of layers of further materials are metal foils, such as copper foils or aluminium foils, or further reinforcing agents, such as mats or nonwovens of fibrous reinforcing material.
In step iii), the arrangement obtained in ii) is cured by pressing and heating. 'The process conditions in step ii) can be kept constant or varied. Thus, for example, the pressure and temperature in a first step can be prespecified so that essentially no curing takes place or the curing rate is so slow that the viscosity of the resin drops to the desired extent as a consequence of the increase in temperature. The pressure and/or temperature can subsequently be increased so that the desired rate of viscosity increase is achieved. These increases can be effected continuously or in steps. For example, the pressure can be increased in steps in accardance with the increase in viscosity, while the temperature is increased continuously.
However, the pressure and temperature can be fixed at the beginning of step iii) so that the crosslinking reaction commences virtually immediately.
_6_ Step iii) can be carried out batchwise in a mufti-daylight press or continuously in a twin-belt press, if desired under reduced pressure.
In a preferred embodiment of the process, steps ii) and iii) are carried out continuously. To this end, webs of the material obtainable in accordance with step t), if desired together with webs of further layered materials to be banded to one another, are simultaneously passed between heated twin-belt presses in the layer sequence desired in each case.
In this embodiment, step t) can be carried oat separately by contacting the fibrous support material with the curable mixture and winding the resultant webs onto storage reels.
However, step t) can also be carried out continuously together with steps ii) and iii) by, for example, passing webs of the fibrous support material through a resin bath immediately before step ii).
The pressing pressure in step iii) is generally 1-60 bar, preferably 10-50 bar; the curing temperature is generally 50-250°C, preferably 80-200°C, most preferably 100-200°C. The pressing duration, depending on the particular curable mixture, is generally 0.1-120 minutes, preferably 0.1-60 minutes, in particular 0.1-20 minutes.
The fibrous support material used in step t) is preferably woven glass material or paper.
T'he pressing pressure and temperature generally depend on the curable mixture used in each case. When selecting the experimental parameters, the reactivity and state of aggregation of the particular xesin/curing agent mixture, far example, are tlken into account.
The conditions necessary in the individual case can be selected and optimised by a parson skilled in the art depending on the abovementioned criteria.
The stabiliser component (c) suitable for the mixtures according to the invention are the above-defined aromatic amines (cl) and (c2), which contain 1 to 4 NH2 groups.
Such compounds containing 2, 3 or 4 NH2 groups can be prepared, for example, by condensation of an appropriately substituted aniline with an aldehyde or ketone, for example with formaldehyde [component (c1)], or by reaction of an amino acid with a _7_ compound containing 2-4 OH groups capable of ester condensation [component (c2)].
The aromatic amines used as components (c1) and (c2) may be monocyclic ox bicyclic.
The bicyclic compounds may contain both fused and unfused rings.
The alkyl substituents and the alkyl groups of the alkoxy substituents of component (c1}
may be straight-chain or branched. Examples of suitable alkyl groups are methyl, ethyl, n-and isopropyl, butyl, pentyl, hexyl, octyl and decyl. Examples of suitable alkoxy groups are the alkoxy radicals corresponding to these alkyl radicals. Examples of suitable cycloalkyl groups are cyclopentyl and cyclohexyl. Examples of suitable aryl groups are phenyl and naphthyl. Suitable halogen substituents are iodine, bromine and in particular chlorine.
Preferred components (c1) have one or two NH2 groups and a pK$ value of 3-4.5 and contain at least one alkyl substituent in the ortho-position to each amino group.
Particularly preferred components (c1) are 2,6-dialkylanilines and compounds of the formula (V) R,s R3 H2N ~ ~ CI-t2 ~ ~ NH2 (V), Fiq R4 in which R3 is chlorine or Ct-C3alkyl, and R4 is hydrogen or Ct-C3alkyl; in particular 2,6-diisopropylaniline and compounds of the formula (V) in which R3 and R4, independently of one another, are Ct-C3alkyl, preferably ethyl or isopropyl.
Examples of particularly suitable stabilisers (c1) are 2,6-diisopropylaniline, bis(4-amino-3,5-diethylphenyl)methane, bis(4-amino-3-methyl-5-isopropylphenyl)-methane, bis(4-amino-3,5-diisopropylphenyl}methane, bis(4-amino-3-ethyl-5-methylphenyl)methane, bis(4-amino-3,5-diethylphenyI)methane, bis(4-amino-3-methylphenyl)methane and bis(4-amino-3-chlorophenyl)methane.
The ortho- or para-substituents relative to the amino groups of stabiliser component (c2) are electron-withdrawing groups.
_g_ If the radical R in the definition of the amines (c2) is Ct-Ctpalkyl, Cs-C6cycloalkyl or C6-Ctoaryl, the comments made above for the corresponding substituents of component (c1) apply to this radical.
Aminoaryl R is preferably aminoaryl having 6 to 10 ring carbon atoms, for example aminonaphthyl or arninophenyl, such as 1-amino-4-naphthyl, 2-amino-6-naphthyl, 2-amino-7-naphthyl or 2-, 3- or, in particular, 4-aminophenyl.
If R is an -R'-OOC-C6H4NH2 group, R' is preferably C2-CtQalkylene and the amino group is preferably in the para-position on the phenyl ring.
Preferred components (c2) are compounds containing one or two NH2 groups and having a pKa value of 2-3.5. Examples of preferred compounds are anthranilic acid or compounds of the formula (VI) H2N ~ ~ T ~ ~ NH2 (VI), in which T is CO, SO or in particular S02 or -COO(CI-IZ)n()OC- where n = 2-6, preferably 2or3.
Examples of suitable components (c2) are 4-aminobenzoic acid, anthranilic acid, bis(4-aminophenyl) sulfone, bis(4-aminophenyl) sulfoxide, bis(4-aminophenyl) ketone and 1,3-propaneciiol bis(4-aminobenzoate).
Examples of suitable bipyridines used as component (c3) are 2,3'-, 2,4'-, 3,3'-, 4,4'- and in particular 2,2'-bipyridine. These components (c3) are less preferred as stabilisers than the above-described amine components (c1) and (c2).
The stabiliser components (c1) and (c2) may be present in the curable mixture as such or, if desired, can be partially or fully reacted with the epoxy resin (a) before addition of the sulfonium initiator (b). This prereaction is preferably carried out at elevated temperature, for example at 100-200°C. However, the preferred embodiment according to the invention involves employing components (c1) and (c2) without prereaction with the epoxy resin.
-c~-The amine is preferably present in an amount of from 0.~5 to 3% by weight, based on the epoxy resin.
As stated above, the stabilisers (c) significantly extend the shelf life of the mixtures according to the invention without impairing the thermal crosslinking reaction to be carried out after storage. The crosslinking is still carried out quickly and completely at elevated temperature and results in cured products having excellent properties.
Suitable epoxy resins (a) of the mixtures according to the invention are virtually all epoxy resins. Examples of these are:
I) Folyglyeidyl and poly((3-methylglycidyl) esters derived from compounds containing at least two carboxyl groups in the molecule, and epichlorohydrin or glycerol dichlorohydrin or ~3-methylepichlorohydrin.
The compounds containing at least two carboxyl groups in the molecule may be aliphatic polycarboxylic acids. Examples of these polycarboxylic acids are oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid and dimerised or trimerised linoleic acid.
I-Iowever, it is also possible to employ cycloaliphatic polycarboxylic acids, for example tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid and 4-methylhexahydrophthalic acid.
It is furthermore possible to use aromatic polycarboxylic acids, for example phthalic acid, isophthalic acid and terephthalic acid.
II) Polyglycidyl or poly((3-methylglycidyl) ethers derived from compounds captaining at least two free alcoholic hydroxyl groups and/or phenolie hydroxyl groups, and epichlorohydrin or (3-methylepichlorohydrin.
Examples of compounds c<3ntaining at least two alcoholic hydroxyl groups are acyclic alcohols, such as ethylene glycol, diethylene glycol and higher poly{oxyethylene) glycols, propane-1,2-diol and poly(oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, poly(oxytetramethylene) glycols, pentane-1,5-diol, hexane-1,6-diol, hexane-2,4,6-triol, glycerol, 1,1,1-trimethylolpropane, pentaerythritol, sorbitol and polyepichlorohydrins.
These ethers may also be derived from cycloaliphatic alcohols, such as from 1,3- or 1,4-dihydroxycyclohexane, bis(4-hydroxycyclohexyl)methane, 2,2-bis(4-hydroxycyclohexyl)pxopane or 1,1-bis(hydroxymethyl)cyclohex-3-ene.
The epoxide compounds may also be derived from rnonocyclic phenols, for example from resorcinol or hydroquinone; or they are based on polycyclic phenols, for example on bis(4-hydroxyphenyl)methane, 4,4'-dihydroxydiphenyl, bis(4-hydroxyphenyl) sulfone, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxyphenyI)propane, 2,2-bis-(3,5-dibromo-4-hydroxyphenyl)propane or on novolaks obtainable by condensation of aldehydes, for example formaldehyde, acetaldehyde, chloral or fiufuraldehyde, with phenols, such as phenol or with phenols which are substituted in the ring by chlorine atoms or Cl-C9alkyl groups, for example 4-chlorophenol, 2-methylphenol or 4-tert-butylphenol, or obtainable by condensation with bisphenois, as described above.
These epoxy resins also include higher-molecular-weight and higher-melting epoxy resins obtainable by preextension, ie. by reaction of relatively low-molecular-weight and low-melting or liquid epoxy resins with polyfunctional compounds. Examples of starting materials for such preextension reactions are low-molecular-weight diglycidyl ethers based on bisphenol, such as based on bisphenol A, which are reacted with an excess of a bisphenol, such as bisphenol A or tetrabromobisphenol A, in a manner known per se to give higher-molecular-weight compounds.
These reactions are known per se and are described, for example, in Kirk-Othmer "Encyclopedia of Chemical Technology", Volume 9, pp. 275-276 (J. Wiley ~c Sons, New Cork, 1980).
III) Poly(S-glycidyl) compounds, in particular di-S-glycidyl derivatives derived from dithiols, for example ethane-1,2-dithiol or bis(4-mercaptomethylphenyl) ether.
IV) Cycloaliphatic epoxy resins, such as bis(2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether and 1,2-bis(2,3-epoxycyclopentyloxy)ethane, and 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate.
However, it is also possible to use epoxy resins in which the 1,2-epoxide groups are bonded to different hetero atoms or functional groups; these compounds include, for example, the glycidyl ether glycidyl esters of salicylic acid.
If desired, a mixture of epoxy resins can be used in the curable mixtures.
The change in viscosity in step iii) of the process according to the invention can be controlled by employing a modified epoxy resin in step i) in order to achieve a relatively high initial viscosity and a faster increase in viscosity during the pressing step.
To this end, the epoxy resin can be modified, for example, by partial reaction with an epoxide curing agent which is effective at elevated temperature, for example with an anhydride curing agent; or the epoxy resin is combined with a small amount of a polyphenol, in particular a novolak.
The amount of modifier can be selected so that an increase in viscosity of the resin to be modified takes place, but this is not so great that an initial decrease in viscosity of the epoxy resin in step iii) is prevented.
In this embodiment, a polyglycidyl ether, in particular a diglycidyl ether based on bisphenol, which may also have been pre-extended, is preferably partially reacted with a cyclic anhydride of a polycarboxylic acid, in particular an anhydride of a cycloaliphatic dicarboxylic acid; in a further preferred embodiment of this variant, a polyglycidyl ether, in particular a diglycidyl ether based on bisphenol, which may, if desired, also have been pre-extended, is combined with a small amount of a novolak, in particular a phenol-formaldehyde novolak or a cresol-formaldehyde novolak.
The curing initiators of the formula (I) to (IV) are described in El'-A-0 379 464; disclosure thereof is intended to form part of the present description. The definitions given therein for the various radicals of the formulae (I) to (1V) also apply to the present invention.
Particularly suitable initiators for the mixtures according to the invention are sulfonium salts of the formula (I) or (II) in which A is Ct-Ct2alkyl, C3-Cgcycloalkyl or phenyl which is unsubstituted or substituted by halogen or Ct-C4alkyl, Ar, Arl and Ar2, independently of one another, are each phenyl which is unsubstituted or rnonosubstituted or polysubstituted by Ct-CBalkyl, Ct-C4alkoxy, Cl or Br, and Q~ is SbFb or SbF50H-, for example dibenzylethylsulfonium hexafluoroantimonate or dibenzylcyclohexylsulfonium hexafluoroantimonate.
The curable mixtures may also contain further additives.
These may be additives by means of which the end properties of the cured products and/or the processing properties of the mixture are modified.
Examples of such additives are fillers or extenders, such as chalk, talc, kaolin, mica, plaster, titanium dioxide, quartz sand; aluminium oxide, cellulose, clay, ground dolomite, woilastonite, silicious earth having a large specific surface area (obtainable under the tradename Aerosil), powdered polyvinyl chloride, polyolefins and metal powders, such as copper, silver, aluminium or iron powders, flameproofng agents, such as antimony trioxide; colorants, such as pigments or dyes; light stabilisers for improving the U~V
stability of the finished laminate; release agents for, for example, interim release of the individual layers produced in step i), such as release films, film-forming coatings or waxes; thixotropic agents, such as highly disperse silicic acid; reactive diluents, such as phenyl glycidyl ether, cresyl glycidyl ether, butanediol diglycidyl ether or diglycidyl hexahydrophthalate, or inert diluents for, for example, preparing impregnation solutions of high-viscosity or solid epoxy resin mixtures, such as chlorinated aliphatic or aromatic hydrocarbons, for example dichloromethane, trichloroethane, tetrachloroethane, chlorobenzene, or such as aromatic hydrocarbons, such as toluene or xylene, or such as aliphatic ketones, such as acetone or methyl ethyl ketone.
Particular preference is also given to mixtures according to the invention in which component (b) is a sulfonium salt of the formula (I) in which A is Cl-Cl2alkyl or C3-C8cycloalkyl, Ar and Art, independently of one another, are each phenyl which is unsubstituted or monosubstituted or polysubstituted by Cl-CBalkyl, C~-C4alkoxy, Cl or Br, and Q- is AsF6 or SbF6 , and component (c) is a compound of the formula (~) in which R3 and R4, independently of one another, are Ct-C3alkyl, in particular ethyl or isopropyl.
The laminates according to the invention can be employed, in particular, for the production of circuit boards and insulating materials.
Example 1: 571 g of a brorninated technical-grade diglycidyl ether based on bisphenol A
(epoxide content 1.85 equivalents/kg) dissolved in methyl ethyl ketone are mixed homogeneously with 4.0 g of tribenzylsulfoniurn hexafluoroantimonate (1°lo by weight, ~~~5~.8~.
based on solid epoxy resin) and 1.2 g of bis(4-amino-3,5-diethyIphenyl)methane (0.3°lo by weight, based on the solid resin). This solution is used to impregnate a woven glass material (200 g/m2 basis weight). The resin solution-impregnated material is dried for 3 minutes at 140°C in a drying oven, giving a tack-free, stackable prepreg. 8 layers of this prepreg (15 x 15 cm) are laid one on top of the other and pressed for 15 minutes at 170°C
to give a bubble-free laminate. Its glass transition temperature Tg, determined by differential scanning calorimetry (DSC), is 136°C ("Tg 1"). The same sample is then subjected to a further DSC measurement. This time a glass transition temperature of 138°C ("Tg 2") is obtained. 'The very small difference between Tg 1 and Tg 2 shows that in 15 minutes, a relatively short time, a cured laminate was obtained.
Example 2: An impregnating solution of 571 g of the epoxy resin solution used in Example l, 1.2 g of bis(4-amino-3,5-diethylphenyl)methane and 4.0 g of dibenzylethylsulfonium hexafluoroantimonate is prepared as in Example 1.
Prepregs are produced as in Example 1 by drying for 3 minutes at 145°C and pressed to give an 8-layer laminate. Tg 1 and T~ 2 are 146 and 148°C respectively, i.e. the laminates have cured after the short pressing time.
Without addition of the amine, drying can only be carried out at much lower temperatures and only for very short times; at higher temperatures, as used in the examples, the epoxide polymerisation has proceeded so far that only inadequate bonding of the individual pre.pregs to one another is achieved on the pressing. T~ 1 and Tg 2 are therefore about 20°C if a mixture without amine is used.
Example 3: An impregnating solution of 571 g of the epoxy resin solution used in Example 1, 1.2 g of bis(4-amino-3,5-diethylphenyl)methane and 4.0 g of dibenzylcyclohexylsulfonium hexafluoroantimonate is prepared as in Example 1.
Prepregs are produced as in Example 1 by drying for 3 minutes at 145°C arid are pressed to give an 8-layer laminate. T~ 1 and Tg 2 are 144 and 143°C respectively.
In addition, prepregs are tested for shelf life. To this end, the gelling time of the prepregs is measured at 130°C immediately after production of the prepregs and after storage for 30 days at room temperature. The following values are obtained:
~~~~~.8~.
_14_ Storage time [days) 0 30 Gelling time at 130°C [s) 270 245 The decrease in the gelling time after storage for 30 days is accordingly less than 10%.
Without addition of amine, the gelling time after 30 days is more than three times as long under otherwise identical conditions.
Examples 4-6: 3 impregnating solutions are prepared as in Example 1 in each case from 571 g of the epoxy resin solution used in Example 1. Sulfonium salts and amines are added to the solutions in accordance with the table below. Prepregs are produced as in Example 1 by drying the impregnated woven glass material for 3-4 minutes at 130-150°C.
In each case, 8 of the resultant prepregs are pressed for 15 minutes at 170°C to give laminates. The glass transition temperatures and the gelling times of the prepreg resins before and after storage for 30 days at room temperature are given in said table. It can be seen from the values that the laminates are fully cured and the prepregs have an adequate shelf life.
Sulfonium salt/ Tgl/T~2 Prepreg gelling time amine at 130 °C after 0 days 30 days f°~:1 f5) fs) 4.00 g Dibenzylcyclohexyl-sulfonium hexafluoroantimonate/
0.68 g Diaminodiphenyl sulfone 134/133 i04 86 4.00 g Tribenzylsulfonium hexafluoroantimonate/
0.78 g 2,6-Diisopropylaniline 140/139 145 140 ~~~~.8~.
3.00 g 1,4-Bis(benzylethyl-sulfoniummethyl)benzene bis-hexafluoroantimonate/
0.35 g Trimethyleneglycol di-p-aminobenzoate 130/132 165 15I
Suitable support materials are in principle all fibres which are able to form a composite with the epoxide matrix and reinforce the matrix material. Examples of fibre materials are natural polymers, such as cellulose; metals, such as steel, Ti, W, Ta and Mo;
organic fibre-forming polymers, in particular aromatic polyamides, such as Nomex or Kevlar;
carbon, such as materials prepared by carbonisation of cellulose, polyacrylonitrile or pitch, and in particular glass.
The fibre materials may be employed as supports in a wide variety of forms.
They can be used, for example, as continuous filaments (individual filaments or spun filaments), continuous yarn, parallel rovings, woven continuous yarn, spun rovings, woven roving material, short fibres, continuous mats, cut mats, nonwovens or felts (papers). Particularly preferred materials are woven glass materials and paper.
The contacting of the fibrous support material with the curable mixture varies depending on the fibre type and form and on the properties of the matrix material.
Examples of such processes are the impregnation of woven fabrics, nonwovens or continuous fibres with the liquid resin/curing agent mixture or with a solution of the mixture of a solid and/or liquid resin and the sulfonium salt curing agent in an inert solvent.
Layers containing short fibres can be produced, for example, by applying the curable mixture together with cut fibres to a woven material or a metal foil.
The contacting of the fibrous support material with the curable mixture is preferably effected by impregnation. To this end, woven webs of said support material are passed through, for example, a resin bath comprising the epoxy resin, the initiator, the stabiliser and, if desired, a solvent, are dried if necessary, and are subsequently wound onto a storage reel.
The invention also relates to a process for the production of a laminate, which comprises the steps i) production of a layer by contacting a fibrous support material with a curable mixture according to the invention in flowable form, *Trade-mark ii) production of a layer sequence comprising at least two layer materials to be bonded to one another, of which at least one is a layer obtainable in accordance with step i) and, if desired, this being stored in the interim, and in which the cuxable material is essentially in unmodified form, and iii) pressing said layer sequence at elevated temperature and under pressure.
If the mixture according to the invention employed in step i) contains a solvent, this must generally be removed at elevated temperature. This temperature is preferably sufficiently high that as much solvent as possible is removed from the material, for example to a solvent content of the material of less than 0.5% by weight. Temperatures of up to about 200°C are possible here.
In a specific embodiment of the above-described process, the fibrous support material in step i) is therefore contacted with a solution of the curable mixture according to the invention in order to produce the layer. The solvent is removed at a temperature of up to 200°C. This can be done, for example, in a drying oven or in a tunnel oven (speed, for example, 2 to 25 metres per minute). The heating time is preferably 1 to 10 minutes.
In step ii), individual layers of the previously obtained material are laid on one another in the desired number. The layers here may be idenrical or layers of Further materials may be present. Examples of layers of further materials are metal foils, such as copper foils or aluminium foils, or further reinforcing agents, such as mats or nonwovens of fibrous reinforcing material.
In step iii), the arrangement obtained in ii) is cured by pressing and heating. 'The process conditions in step ii) can be kept constant or varied. Thus, for example, the pressure and temperature in a first step can be prespecified so that essentially no curing takes place or the curing rate is so slow that the viscosity of the resin drops to the desired extent as a consequence of the increase in temperature. The pressure and/or temperature can subsequently be increased so that the desired rate of viscosity increase is achieved. These increases can be effected continuously or in steps. For example, the pressure can be increased in steps in accardance with the increase in viscosity, while the temperature is increased continuously.
However, the pressure and temperature can be fixed at the beginning of step iii) so that the crosslinking reaction commences virtually immediately.
_6_ Step iii) can be carried out batchwise in a mufti-daylight press or continuously in a twin-belt press, if desired under reduced pressure.
In a preferred embodiment of the process, steps ii) and iii) are carried out continuously. To this end, webs of the material obtainable in accordance with step t), if desired together with webs of further layered materials to be banded to one another, are simultaneously passed between heated twin-belt presses in the layer sequence desired in each case.
In this embodiment, step t) can be carried oat separately by contacting the fibrous support material with the curable mixture and winding the resultant webs onto storage reels.
However, step t) can also be carried out continuously together with steps ii) and iii) by, for example, passing webs of the fibrous support material through a resin bath immediately before step ii).
The pressing pressure in step iii) is generally 1-60 bar, preferably 10-50 bar; the curing temperature is generally 50-250°C, preferably 80-200°C, most preferably 100-200°C. The pressing duration, depending on the particular curable mixture, is generally 0.1-120 minutes, preferably 0.1-60 minutes, in particular 0.1-20 minutes.
The fibrous support material used in step t) is preferably woven glass material or paper.
T'he pressing pressure and temperature generally depend on the curable mixture used in each case. When selecting the experimental parameters, the reactivity and state of aggregation of the particular xesin/curing agent mixture, far example, are tlken into account.
The conditions necessary in the individual case can be selected and optimised by a parson skilled in the art depending on the abovementioned criteria.
The stabiliser component (c) suitable for the mixtures according to the invention are the above-defined aromatic amines (cl) and (c2), which contain 1 to 4 NH2 groups.
Such compounds containing 2, 3 or 4 NH2 groups can be prepared, for example, by condensation of an appropriately substituted aniline with an aldehyde or ketone, for example with formaldehyde [component (c1)], or by reaction of an amino acid with a _7_ compound containing 2-4 OH groups capable of ester condensation [component (c2)].
The aromatic amines used as components (c1) and (c2) may be monocyclic ox bicyclic.
The bicyclic compounds may contain both fused and unfused rings.
The alkyl substituents and the alkyl groups of the alkoxy substituents of component (c1}
may be straight-chain or branched. Examples of suitable alkyl groups are methyl, ethyl, n-and isopropyl, butyl, pentyl, hexyl, octyl and decyl. Examples of suitable alkoxy groups are the alkoxy radicals corresponding to these alkyl radicals. Examples of suitable cycloalkyl groups are cyclopentyl and cyclohexyl. Examples of suitable aryl groups are phenyl and naphthyl. Suitable halogen substituents are iodine, bromine and in particular chlorine.
Preferred components (c1) have one or two NH2 groups and a pK$ value of 3-4.5 and contain at least one alkyl substituent in the ortho-position to each amino group.
Particularly preferred components (c1) are 2,6-dialkylanilines and compounds of the formula (V) R,s R3 H2N ~ ~ CI-t2 ~ ~ NH2 (V), Fiq R4 in which R3 is chlorine or Ct-C3alkyl, and R4 is hydrogen or Ct-C3alkyl; in particular 2,6-diisopropylaniline and compounds of the formula (V) in which R3 and R4, independently of one another, are Ct-C3alkyl, preferably ethyl or isopropyl.
Examples of particularly suitable stabilisers (c1) are 2,6-diisopropylaniline, bis(4-amino-3,5-diethylphenyl)methane, bis(4-amino-3-methyl-5-isopropylphenyl)-methane, bis(4-amino-3,5-diisopropylphenyl}methane, bis(4-amino-3-ethyl-5-methylphenyl)methane, bis(4-amino-3,5-diethylphenyI)methane, bis(4-amino-3-methylphenyl)methane and bis(4-amino-3-chlorophenyl)methane.
The ortho- or para-substituents relative to the amino groups of stabiliser component (c2) are electron-withdrawing groups.
_g_ If the radical R in the definition of the amines (c2) is Ct-Ctpalkyl, Cs-C6cycloalkyl or C6-Ctoaryl, the comments made above for the corresponding substituents of component (c1) apply to this radical.
Aminoaryl R is preferably aminoaryl having 6 to 10 ring carbon atoms, for example aminonaphthyl or arninophenyl, such as 1-amino-4-naphthyl, 2-amino-6-naphthyl, 2-amino-7-naphthyl or 2-, 3- or, in particular, 4-aminophenyl.
If R is an -R'-OOC-C6H4NH2 group, R' is preferably C2-CtQalkylene and the amino group is preferably in the para-position on the phenyl ring.
Preferred components (c2) are compounds containing one or two NH2 groups and having a pKa value of 2-3.5. Examples of preferred compounds are anthranilic acid or compounds of the formula (VI) H2N ~ ~ T ~ ~ NH2 (VI), in which T is CO, SO or in particular S02 or -COO(CI-IZ)n()OC- where n = 2-6, preferably 2or3.
Examples of suitable components (c2) are 4-aminobenzoic acid, anthranilic acid, bis(4-aminophenyl) sulfone, bis(4-aminophenyl) sulfoxide, bis(4-aminophenyl) ketone and 1,3-propaneciiol bis(4-aminobenzoate).
Examples of suitable bipyridines used as component (c3) are 2,3'-, 2,4'-, 3,3'-, 4,4'- and in particular 2,2'-bipyridine. These components (c3) are less preferred as stabilisers than the above-described amine components (c1) and (c2).
The stabiliser components (c1) and (c2) may be present in the curable mixture as such or, if desired, can be partially or fully reacted with the epoxy resin (a) before addition of the sulfonium initiator (b). This prereaction is preferably carried out at elevated temperature, for example at 100-200°C. However, the preferred embodiment according to the invention involves employing components (c1) and (c2) without prereaction with the epoxy resin.
-c~-The amine is preferably present in an amount of from 0.~5 to 3% by weight, based on the epoxy resin.
As stated above, the stabilisers (c) significantly extend the shelf life of the mixtures according to the invention without impairing the thermal crosslinking reaction to be carried out after storage. The crosslinking is still carried out quickly and completely at elevated temperature and results in cured products having excellent properties.
Suitable epoxy resins (a) of the mixtures according to the invention are virtually all epoxy resins. Examples of these are:
I) Folyglyeidyl and poly((3-methylglycidyl) esters derived from compounds containing at least two carboxyl groups in the molecule, and epichlorohydrin or glycerol dichlorohydrin or ~3-methylepichlorohydrin.
The compounds containing at least two carboxyl groups in the molecule may be aliphatic polycarboxylic acids. Examples of these polycarboxylic acids are oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid and dimerised or trimerised linoleic acid.
I-Iowever, it is also possible to employ cycloaliphatic polycarboxylic acids, for example tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid and 4-methylhexahydrophthalic acid.
It is furthermore possible to use aromatic polycarboxylic acids, for example phthalic acid, isophthalic acid and terephthalic acid.
II) Polyglycidyl or poly((3-methylglycidyl) ethers derived from compounds captaining at least two free alcoholic hydroxyl groups and/or phenolie hydroxyl groups, and epichlorohydrin or (3-methylepichlorohydrin.
Examples of compounds c<3ntaining at least two alcoholic hydroxyl groups are acyclic alcohols, such as ethylene glycol, diethylene glycol and higher poly{oxyethylene) glycols, propane-1,2-diol and poly(oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, poly(oxytetramethylene) glycols, pentane-1,5-diol, hexane-1,6-diol, hexane-2,4,6-triol, glycerol, 1,1,1-trimethylolpropane, pentaerythritol, sorbitol and polyepichlorohydrins.
These ethers may also be derived from cycloaliphatic alcohols, such as from 1,3- or 1,4-dihydroxycyclohexane, bis(4-hydroxycyclohexyl)methane, 2,2-bis(4-hydroxycyclohexyl)pxopane or 1,1-bis(hydroxymethyl)cyclohex-3-ene.
The epoxide compounds may also be derived from rnonocyclic phenols, for example from resorcinol or hydroquinone; or they are based on polycyclic phenols, for example on bis(4-hydroxyphenyl)methane, 4,4'-dihydroxydiphenyl, bis(4-hydroxyphenyl) sulfone, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxyphenyI)propane, 2,2-bis-(3,5-dibromo-4-hydroxyphenyl)propane or on novolaks obtainable by condensation of aldehydes, for example formaldehyde, acetaldehyde, chloral or fiufuraldehyde, with phenols, such as phenol or with phenols which are substituted in the ring by chlorine atoms or Cl-C9alkyl groups, for example 4-chlorophenol, 2-methylphenol or 4-tert-butylphenol, or obtainable by condensation with bisphenois, as described above.
These epoxy resins also include higher-molecular-weight and higher-melting epoxy resins obtainable by preextension, ie. by reaction of relatively low-molecular-weight and low-melting or liquid epoxy resins with polyfunctional compounds. Examples of starting materials for such preextension reactions are low-molecular-weight diglycidyl ethers based on bisphenol, such as based on bisphenol A, which are reacted with an excess of a bisphenol, such as bisphenol A or tetrabromobisphenol A, in a manner known per se to give higher-molecular-weight compounds.
These reactions are known per se and are described, for example, in Kirk-Othmer "Encyclopedia of Chemical Technology", Volume 9, pp. 275-276 (J. Wiley ~c Sons, New Cork, 1980).
III) Poly(S-glycidyl) compounds, in particular di-S-glycidyl derivatives derived from dithiols, for example ethane-1,2-dithiol or bis(4-mercaptomethylphenyl) ether.
IV) Cycloaliphatic epoxy resins, such as bis(2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether and 1,2-bis(2,3-epoxycyclopentyloxy)ethane, and 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate.
However, it is also possible to use epoxy resins in which the 1,2-epoxide groups are bonded to different hetero atoms or functional groups; these compounds include, for example, the glycidyl ether glycidyl esters of salicylic acid.
If desired, a mixture of epoxy resins can be used in the curable mixtures.
The change in viscosity in step iii) of the process according to the invention can be controlled by employing a modified epoxy resin in step i) in order to achieve a relatively high initial viscosity and a faster increase in viscosity during the pressing step.
To this end, the epoxy resin can be modified, for example, by partial reaction with an epoxide curing agent which is effective at elevated temperature, for example with an anhydride curing agent; or the epoxy resin is combined with a small amount of a polyphenol, in particular a novolak.
The amount of modifier can be selected so that an increase in viscosity of the resin to be modified takes place, but this is not so great that an initial decrease in viscosity of the epoxy resin in step iii) is prevented.
In this embodiment, a polyglycidyl ether, in particular a diglycidyl ether based on bisphenol, which may also have been pre-extended, is preferably partially reacted with a cyclic anhydride of a polycarboxylic acid, in particular an anhydride of a cycloaliphatic dicarboxylic acid; in a further preferred embodiment of this variant, a polyglycidyl ether, in particular a diglycidyl ether based on bisphenol, which may, if desired, also have been pre-extended, is combined with a small amount of a novolak, in particular a phenol-formaldehyde novolak or a cresol-formaldehyde novolak.
The curing initiators of the formula (I) to (IV) are described in El'-A-0 379 464; disclosure thereof is intended to form part of the present description. The definitions given therein for the various radicals of the formulae (I) to (1V) also apply to the present invention.
Particularly suitable initiators for the mixtures according to the invention are sulfonium salts of the formula (I) or (II) in which A is Ct-Ct2alkyl, C3-Cgcycloalkyl or phenyl which is unsubstituted or substituted by halogen or Ct-C4alkyl, Ar, Arl and Ar2, independently of one another, are each phenyl which is unsubstituted or rnonosubstituted or polysubstituted by Ct-CBalkyl, Ct-C4alkoxy, Cl or Br, and Q~ is SbFb or SbF50H-, for example dibenzylethylsulfonium hexafluoroantimonate or dibenzylcyclohexylsulfonium hexafluoroantimonate.
The curable mixtures may also contain further additives.
These may be additives by means of which the end properties of the cured products and/or the processing properties of the mixture are modified.
Examples of such additives are fillers or extenders, such as chalk, talc, kaolin, mica, plaster, titanium dioxide, quartz sand; aluminium oxide, cellulose, clay, ground dolomite, woilastonite, silicious earth having a large specific surface area (obtainable under the tradename Aerosil), powdered polyvinyl chloride, polyolefins and metal powders, such as copper, silver, aluminium or iron powders, flameproofng agents, such as antimony trioxide; colorants, such as pigments or dyes; light stabilisers for improving the U~V
stability of the finished laminate; release agents for, for example, interim release of the individual layers produced in step i), such as release films, film-forming coatings or waxes; thixotropic agents, such as highly disperse silicic acid; reactive diluents, such as phenyl glycidyl ether, cresyl glycidyl ether, butanediol diglycidyl ether or diglycidyl hexahydrophthalate, or inert diluents for, for example, preparing impregnation solutions of high-viscosity or solid epoxy resin mixtures, such as chlorinated aliphatic or aromatic hydrocarbons, for example dichloromethane, trichloroethane, tetrachloroethane, chlorobenzene, or such as aromatic hydrocarbons, such as toluene or xylene, or such as aliphatic ketones, such as acetone or methyl ethyl ketone.
Particular preference is also given to mixtures according to the invention in which component (b) is a sulfonium salt of the formula (I) in which A is Cl-Cl2alkyl or C3-C8cycloalkyl, Ar and Art, independently of one another, are each phenyl which is unsubstituted or monosubstituted or polysubstituted by Cl-CBalkyl, C~-C4alkoxy, Cl or Br, and Q- is AsF6 or SbF6 , and component (c) is a compound of the formula (~) in which R3 and R4, independently of one another, are Ct-C3alkyl, in particular ethyl or isopropyl.
The laminates according to the invention can be employed, in particular, for the production of circuit boards and insulating materials.
Example 1: 571 g of a brorninated technical-grade diglycidyl ether based on bisphenol A
(epoxide content 1.85 equivalents/kg) dissolved in methyl ethyl ketone are mixed homogeneously with 4.0 g of tribenzylsulfoniurn hexafluoroantimonate (1°lo by weight, ~~~5~.8~.
based on solid epoxy resin) and 1.2 g of bis(4-amino-3,5-diethyIphenyl)methane (0.3°lo by weight, based on the solid resin). This solution is used to impregnate a woven glass material (200 g/m2 basis weight). The resin solution-impregnated material is dried for 3 minutes at 140°C in a drying oven, giving a tack-free, stackable prepreg. 8 layers of this prepreg (15 x 15 cm) are laid one on top of the other and pressed for 15 minutes at 170°C
to give a bubble-free laminate. Its glass transition temperature Tg, determined by differential scanning calorimetry (DSC), is 136°C ("Tg 1"). The same sample is then subjected to a further DSC measurement. This time a glass transition temperature of 138°C ("Tg 2") is obtained. 'The very small difference between Tg 1 and Tg 2 shows that in 15 minutes, a relatively short time, a cured laminate was obtained.
Example 2: An impregnating solution of 571 g of the epoxy resin solution used in Example l, 1.2 g of bis(4-amino-3,5-diethylphenyl)methane and 4.0 g of dibenzylethylsulfonium hexafluoroantimonate is prepared as in Example 1.
Prepregs are produced as in Example 1 by drying for 3 minutes at 145°C and pressed to give an 8-layer laminate. Tg 1 and T~ 2 are 146 and 148°C respectively, i.e. the laminates have cured after the short pressing time.
Without addition of the amine, drying can only be carried out at much lower temperatures and only for very short times; at higher temperatures, as used in the examples, the epoxide polymerisation has proceeded so far that only inadequate bonding of the individual pre.pregs to one another is achieved on the pressing. T~ 1 and Tg 2 are therefore about 20°C if a mixture without amine is used.
Example 3: An impregnating solution of 571 g of the epoxy resin solution used in Example 1, 1.2 g of bis(4-amino-3,5-diethylphenyl)methane and 4.0 g of dibenzylcyclohexylsulfonium hexafluoroantimonate is prepared as in Example 1.
Prepregs are produced as in Example 1 by drying for 3 minutes at 145°C arid are pressed to give an 8-layer laminate. T~ 1 and Tg 2 are 144 and 143°C respectively.
In addition, prepregs are tested for shelf life. To this end, the gelling time of the prepregs is measured at 130°C immediately after production of the prepregs and after storage for 30 days at room temperature. The following values are obtained:
~~~~~.8~.
_14_ Storage time [days) 0 30 Gelling time at 130°C [s) 270 245 The decrease in the gelling time after storage for 30 days is accordingly less than 10%.
Without addition of amine, the gelling time after 30 days is more than three times as long under otherwise identical conditions.
Examples 4-6: 3 impregnating solutions are prepared as in Example 1 in each case from 571 g of the epoxy resin solution used in Example 1. Sulfonium salts and amines are added to the solutions in accordance with the table below. Prepregs are produced as in Example 1 by drying the impregnated woven glass material for 3-4 minutes at 130-150°C.
In each case, 8 of the resultant prepregs are pressed for 15 minutes at 170°C to give laminates. The glass transition temperatures and the gelling times of the prepreg resins before and after storage for 30 days at room temperature are given in said table. It can be seen from the values that the laminates are fully cured and the prepregs have an adequate shelf life.
Sulfonium salt/ Tgl/T~2 Prepreg gelling time amine at 130 °C after 0 days 30 days f°~:1 f5) fs) 4.00 g Dibenzylcyclohexyl-sulfonium hexafluoroantimonate/
0.68 g Diaminodiphenyl sulfone 134/133 i04 86 4.00 g Tribenzylsulfonium hexafluoroantimonate/
0.78 g 2,6-Diisopropylaniline 140/139 145 140 ~~~~.8~.
3.00 g 1,4-Bis(benzylethyl-sulfoniummethyl)benzene bis-hexafluoroantimonate/
0.35 g Trimethyleneglycol di-p-aminobenzoate 130/132 165 15I
Claims (17)
1. A curable mixture comprising (a) an epoxy resin, (b) a sulfonium salt of the formula (I), (II), (III) or (IV) in which A is C1-C12alkyl, C3-C8cycloalkyl, C4-C10cycloalkylalkyl, phenyl which is unsubstituted or monosubstituted or polysubstituted by C1-C8alkyl, C1-C4alkoxy, halogen, hydroxyl, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or acyl having 1-12 carbon atoms, Ar, Ar1 and Ar2, independently of one another, are each phenyl or naphthyl which is unsubstituted or monosubstituted or polysubstituted by C1-C8alkyl, C1-C4alkoxy, halogen, hydroxyl, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or acyl having 1-12 carbon atoms, arylene is in each case phenylene or naphthylene which is unsubstituted or monosubstituted or polysubstituted by C1-C8alkyl, C1-C4alkoxy, halogen, hydroxyl, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 carbon atoms in the alkoxy radical or acyl having 1-12 carbon atoms, and Q- is SbF6-, AsF6- or SbF5OH-, and (c) a stabiliser selected from the group comprising (c1) aromatic amines having a pKa value of 2-5 and having one to four NH2 groups with at least one substituent in the ortho-position to each amino group, the substituent being C1-C10alkyl, C1-C10alkoxy, C5-C6cycloalkyl, C6-C10aryl or halogen, with the proviso that the amine is not substituted in both ortho-positions to an amino group by halogen, or (c2) aromatic amines having a pK a value of 2-5 and having 1 to 4 NH2 groups with an ortho- or para-substituent to each amino group, the substituent being -COOH, -COOR, -COR, -SO2R or -SOR where R is C1-C10alkyl, C5-C6cycloalkyl, C6-C10aryl, aminoaryl or -R1-OOC-C6H4-NH2 where R' is alkylene, or (c3) bipyridines, where 0.1-10% by weight of component (b) and 0.02-5% by weight of component (c), based on the epoxy resin (a), are present in the mixture.
2. A mixture according to claim 1, in which component (c1) has one or two NH2 groups and a pK a value of 3-4.5 and contains at least one alkyl group in the ortho-position to each amino group.
3. A mixture according to claim 1, in which component (c1) is a 2,6-dialkylaniline or a compound of the formula (V) in which R3 is chlorine or C1-C3alkyl, and R4 is hydrogen or C1-C3alkyl.
4. A mixture according to claim 3, in which component (c1) is 2,6-diisopropylaniline or a compound of the formula (V) in which R3 and R4, independently of one another, are C1-C3alkyl.
5. A mixture according to claim 4, wherein R3 and R4, independently of one another, are ethyl or isopropyl.
6. A mixture according to claim 1, in which component (c2) has one or two NH2 groups and a pK a value of 2-3.5.
7. A mixture according to claim 1, in which component (c2) is anthranilic acid or a compound of the formula (VI) in which T is CO, SO, SO2 or -COO(CH2)nOOC- where n=2-6.
8. A mixture according to claim 7, wherein T is SO2 or -COO (CH2) nOOC- where n is 2 or 3.
9. A mixture according to claim 1, in which component (c3) is 2,3'-, 2,4'-, 3,3'-, 4,4'- or 2,2'-bipyridine.
10. A mixture according to claim 9, wherein component (c3) is 2,2'-bipyridine.
11. A curable mixture according to claim 1, in which component (b) is a sulfonium salt of the formula (I) or (II) according to claim 1 in which A is C1-C12alkyl, C3-C8cycloalkyl or phenyl which is unsubstituted or substituted by halogen or C1-C4alkyl, Ar, Ar1 and Ar2, independently of one another, are each phenyl which is unsubstituted or monosubstituted or polysubstituted by C1-C8alkyl, C1-C4alkoxy, Cl or Br, and Q- is SbF6- or SbF5OH-.
12. A curable mixture according to claim 3, in which component (b) is a sulfonium salt of the formula (I) according to claim 1 in which A is C1-C12alkyl or C3-C8cycloalkyl, Ar and Ar1, independently of one another, are each phenyl which is unsubstituted or monosubstituted or polysubstituted by C1-C8alkyl, C1-C4alkoxy, C1 or Br, and Q-is AsF6- or SbF6- and component (c) is a compound of the formula (V) according to claim 3 in which R3 and R4, independently of one another, are C1-C3alkyl.
13. A curable mixture according to claim 12, wherein R3 and R4, independently of one another, are ethyl or isopropyl.
14. A prepreg comprising a fibrous support material and a mixture according to any one of claims 1 to 13.
15. A laminate obtainable by thermal curing of a prepreg according to claim 14.
16. A process for the production of a laminate, which comprises the steps i) production of a layer by contacting a fibrous support material with a curable mixture according to any one of claims 1 to 13 in flowable form, ii) production of a layer sequence comprising at least two layer materials to be bonded to one another, of which at least one is a layer obtainable in accordance with step i) and, if desired, this being stored in the interim, and in which the curable material is essentially in unmodified form, and iii) pressing said layer sequence at elevated temperature and under pressure.
17. A process according to claim 16, in which the fibrous support material is contacted in step i) with a solution of the curable mixture in order to produce the layer, and the solvent is removed at a temperature of up to 200°C.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CH102891 | 1991-04-08 | ||
CH1028/91-8 | 1991-04-08 |
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CA2065181A1 CA2065181A1 (en) | 1992-10-09 |
CA2065181C true CA2065181C (en) | 2002-12-03 |
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CA002065181A Expired - Fee Related CA2065181C (en) | 1991-04-08 | 1992-04-06 | Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life |
Country Status (6)
Country | Link |
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EP (1) | EP0508952B1 (en) |
JP (1) | JP3163387B2 (en) |
KR (1) | KR100218590B1 (en) |
CA (1) | CA2065181C (en) |
DE (1) | DE59205890D1 (en) |
ES (1) | ES2085605T3 (en) |
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JP5034263B2 (en) * | 2006-02-24 | 2012-09-26 | 東洋インキScホールディングス株式会社 | Energy-sensitive linear acid curable composition |
JP5685189B2 (en) * | 2008-08-12 | 2015-03-18 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Thermosetting composition |
KR101987305B1 (en) * | 2013-11-19 | 2019-06-10 | 삼성전기주식회사 | Insulating resin composition for printed circuit board and products having the same |
CN113667280A (en) * | 2021-08-28 | 2021-11-19 | 林州致远电子科技有限公司 | Resin composition with UV shielding effect and application thereof in copper-clad plate |
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US4554342A (en) * | 1984-07-30 | 1985-11-19 | Shell Oil Company | Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt |
EP0379464B1 (en) * | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatic sulfonium salts and their use |
-
1992
- 1992-03-31 EP EP92810238A patent/EP0508952B1/en not_active Expired - Lifetime
- 1992-03-31 ES ES92810238T patent/ES2085605T3/en not_active Expired - Lifetime
- 1992-03-31 DE DE59205890T patent/DE59205890D1/en not_active Expired - Fee Related
- 1992-04-06 CA CA002065181A patent/CA2065181C/en not_active Expired - Fee Related
- 1992-04-07 KR KR1019920005772A patent/KR100218590B1/en not_active Expired - Fee Related
- 1992-04-08 JP JP11543492A patent/JP3163387B2/en not_active Expired - Fee Related
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KR920019867A (en) | 1992-11-20 |
EP0508952A3 (en) | 1993-10-13 |
DE59205890D1 (en) | 1996-05-09 |
KR100218590B1 (en) | 1999-09-01 |
JP3163387B2 (en) | 2001-05-08 |
EP0508952A2 (en) | 1992-10-14 |
CA2065181A1 (en) | 1992-10-09 |
EP0508952B1 (en) | 1996-04-03 |
ES2085605T3 (en) | 1996-06-01 |
JPH06228283A (en) | 1994-08-16 |
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