CA2047625A1 - Injection molding process for platable plastic substrates - Google Patents
Injection molding process for platable plastic substratesInfo
- Publication number
- CA2047625A1 CA2047625A1 CA 2047625 CA2047625A CA2047625A1 CA 2047625 A1 CA2047625 A1 CA 2047625A1 CA 2047625 CA2047625 CA 2047625 CA 2047625 A CA2047625 A CA 2047625A CA 2047625 A1 CA2047625 A1 CA 2047625A1
- Authority
- CA
- Canada
- Prior art keywords
- resin
- injection molding
- molding process
- mold cavity
- product substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
INJECTION MOLDING PROCESS FOR
PLATABLE PLASTIC SUBSTRATES
Abstract A process for injection molding a platable plastic product substrate comprising injecting into a mold cavity for a product substrate, a first platable resin in an amount less than that required to fill the mold cavity. A second resin different from the first resin is then injected into the mold cavity in an amount, which in combination with the first resin, completely fills the mold cavity. The resulting product substrate has a skin layer of a first platable plastic resin and an underlying layer of the second resin.
PLATABLE PLASTIC SUBSTRATES
Abstract A process for injection molding a platable plastic product substrate comprising injecting into a mold cavity for a product substrate, a first platable resin in an amount less than that required to fill the mold cavity. A second resin different from the first resin is then injected into the mold cavity in an amount, which in combination with the first resin, completely fills the mold cavity. The resulting product substrate has a skin layer of a first platable plastic resin and an underlying layer of the second resin.
Description
7 ~ ~3, ~i - ~0355-199 21757~DAD -1-INJECTION MOLDING PROCESS FOR
PL~T~B~æ PLASTIC SUBSTR~TES
; This invention relates to the art of plating on plastics and, mor~ particularly, to an injection molding process for molding platable product substrates having a skin layer of a first platable resin and an underlying core o~ a second resin different from the first resin.
, .
In recent years, many plated products comprise a molded plastic substrate which is first electrolessly plated and then electrolytically pIated.
In conventional electroless plating processes, the product substrat~ is first etched with a stro~g oxidizing acid or base. The etched substrate is then immersed in a solution containing a noble metal catalyst, e.g., a tin-palladium catalyst. If required, the subst:rate is then immersed in an activator solution, e.g., e~osins the palladium of the tin-palladium catalyst. F~n~lly, the activated substrate is immersed in an autocatalytic electroless plating solution where an initi~l coating of a conductive metal, such as copper or nickel, is established on the substrate by chemical deposition.
In a conventional electrolytic plating process, the electrolessly plated plastic substrate is first immersed j 6~ ~
-;2-1 in cleaning solutions and 'then activated by immersion in a dilute acid solution, e.g., a dilute sulfuric acid solution. It is then immersed in one or more electroplating baths wherein metal is deposited on the sur~ace of the substrate electrolytically. In many applications, for example, layers of copper, nickel, and chromium are plated onto the substrate.
In the above electroless and electrolytic plating processes, unplated product substrates are typically mounted on plating racks. Conventional plating racks comprise a metal framework having metal contacts for holding the plastic substrates on the rack. ~ith electrolytic plating racks, the contacts also provide mPans for electrical communication between the racks and the plastic substrates. The plastic substrates are manually mounted on the contacts which hold the substrates firmly so that they do not fall off the rac~s in agitated plating solutions and, in the case of electrolytic plating racks, to provide uninterr~pted electrical contact with the substrates.
U.S. Patent NoO 4,714,535 assigned to Crown City Plating Co. provides a product substrate assembly in which product substrates are molded together with a rack-engaging framework or xunner system. The molded frameworX comprises supporting members to which product substrates are attached and clips or other means for releasably engaging the framework of a plating rack.
This obviates the need for individual rack contacts.
U.S. Patent No. 4,936,973 also assigned to Crown City Plating Co. discloses ~ product substrate assembly having an overflow assembly comprising support members and clips or other means for releasably engaging the framework of a plating rack.
The present invention provides a sec~enced injection molding process particularly useful in the 2 ~
1 production of product subst:rate assemblies described in the above-mentioned U.S. Patent Nos. 4,714,535 and 4,936,373.
Th~ injection molded process comprises first injecting into a mold cavity for a product substrate a first resin in an amount less than that requixed to fill the entire mold cavity. The amount is sufficient to cover at least a portion o~ the surface of the mold cavity and preferably to cov~r the entire surface of the mold cavity. A second resin different ~rom the first resin is then injected into the mold cavity in an amount which, in combination wlth the first resin is suff~cient to Sill the cavity. The second resin is compatible, i.e~, able to be molded with the first resin into an integral product substrate.
In the process, the first resin flows into the mold ~- cavity and forms a skin layer over the surface of the mold cavity. The second resin then flows into the mold cavity filling the remainder of the cavity and forming a second layer or core underlying the skin layer.
In a pref~rred embodiment of the invention, the first resin is a platable resin. The second rPsin may be platable, but need not be. The second resin may be a low cost resin and/or a resin providing particular physical properties, e.g. high strength, temperature resistance, heavyweight, etc. as desired.
In a particularly preferred embodiment of the invention there is provided a process ~or injection molding a product substrate assembly having at least one product substrate assembly attached to a runner system or overflow assembly. In such a process, the mold cavity c:omprises one or more product substrate cavities connected to a runner system or overflow assembly cavity. The process comprises injecting a first resin into the mold cavity for the product substrate in an amount sufficient to cover at least a portion and .
2 ~
1 preferably all of the surfac:e of the product substrata cavity, but less than that r.equired to fill the entire product substrate cavity. A second resin, different from the first resin is then injected into the product substrate cavity in an amount, which in combination with the first resin, is sufficient to fill the entire mold cavity, including the product substrate cavity and runner system or overflow assembly cavity.
; These and other faatures and advantages of the present invention will be bel:ter understood by reference to the following detailed cl~scriptio~ when considered 5in conjunction with the accompanying drawings wherein:
FIG. 1 is a side cross-sectional view of a product substrate of the product substrate assembly of FIG. 2;
FIG. 2 is a top view of the product substrate assembly;
10FIG. 3 is an end view of the product substrate assembly of FIG. 2;
FIG. 4 is a cross-sectional schematic view showing ; a prefarrPd injection molding process according to the present invention.
: 25 ~ ~ ~5 r~ ~ 2 ~
The injection molding process of the present invention is particularly applicable to the production of a plastic product substrate assembly which can be mounted on the framework of an electrolytic plating rack and on the framework of an electroless plating rack.
FIGS. 1-3 show such a product substrate assembly.
The product substrate assembly 20 is a one-piece injection molded unit and comprises a plurality of ; 10 product substrates 21 which, in the embodiment shown, are automobile window regulator handles. The product ~ substrates 21 are attached to an overflow assembly or ; rack-engaging framework 22. In the embodiment shown, the overflow assembly 22 comprises a pair of generally horizontal primary supports 23 and a plurality of secondary supports 24 which extend forwardly from the primary support 23 to the product substrates 21 and are attached to the back side of the product substrates 21 at gate 25. The overflow assembly 22 further comprises a pair of end clips 26 for releasably attaching the ~ product substrate assembly 20 to the side rails of the - framework of the electroplating rack.
In the embodiment shown, the overflow assembly 22 also comprises robbers 30 adjacent the product substrates 21 to reduce the current density at high current density locations, e.g., the sharp edges around the rounded base of the window regulator handle. Rather than, or in addition to robbers, the product substrate assembly may comprise nonplatable shields to control the current dlensity at different locations on the product substrates.
The present invention provides a unique injection molding process for preparing product substrate assemhlies as described above. With reference to FIG.
4, there is shown schematically a particularly preferred injection molding process. In this particular 2 ~ 2 ~
l embodiment, the process involves a two-shot molding process with sequenced injec1:ion during the second shot.
In the first shot, a high strength insert 41 is formed out of a suitable high strength resin which may be a platable or nonplatable resin. The insert 4l is the portion of the window regulator handle which engages the rotatable shaft of the window regulator assembly of an automobile. A presently preferred resin for forming such an insert is polyetherimide. It is understood, however, that any desired resin may be used. In fact, rather than a two-shot molding process, a single shot process may be used wherein a premolded insert is positioned within the product substrate mold cavity.
In such a process, the premolded insert could be made of any material including metal. It is also understood that the presence of a high strength insert, while desireable for this particular application, is not required for the practice of the invention or even for the manufacture of automobile window regulator handles.
In the two shot molding process, following the first shot, the cavity for the remainder of the window regulator handle and overflow assembly is moved into place. A first platable resin 42 is introduced into the product substrate cavity through runner 43 and gate 44.
The volume of the first platable resin 42 is controlled and is less than that required to ~ill the entire product substrate cavity of the mold. The first plata~le resin 42 is followed by injection of a second resin 45 in an amount which, combined with the first resin, is sufficient to fill the entire mold cavity.
In the above process, the first platable resin 42 flows into the product substrate cavity and forms skin layer 46. A portion of the first resin will also likely flow into the mold cavities for the overflow assembly 48 and fo~m a skin layer over at least a portion of the overflow runners. The second resin 45 flows into and fills the remainder of the product substrate cavity ~7~
1 forming an underlying layer 47 and also flows into and fills the cavity for the overflow assembly 48.
In this arrangement, the product substrate will have a skin layer of the first platable resin over its surface. Underlying the skin layer in at least the thicker sections of the product substrate will be the second resin. ~oreover, the overflow assembly 48 well may be formed primarily with the second resin.
The first resin is a thermoplastic resin which has a viscosity that is variable with temperature. In the practice of this process, the first resin is injected into the mold cavity at a first temperature. Upon contact with the surface of the mold cavity, the first resin cools and the viscosity increases. This slows or stops the flow of the resin contacting the mold surface.
The underlying resin, however, continues to flow until it reaches other areas of the mold surface. Resins ; having a viscosity which is variable with shear velocity may also be used for the first resin.
The amount of first resin used is sufficient to form a sXin layer over at least the critical or Class A surfaces of the product substrate, i.e~, those surfaces which are clearly visible during use. For window regulator handles as shown above, such critical areas include the front surface of the handle which i5 visible during use. If the product substrate is to be plated and if the second resin is a nonplatable resin, the amount of first resin must be selected to assure the formation of sufficient platable skin layer over non-critical surfaces to assure electrical communication between the electroplating rack and the critical areas of the product substrate after electroless plating.
The second resin must be "compatiblel' with the first resin. This means that the second resin must be able to-combine with the first resin to form an integral molded unit. To be compatible, second resins generally exhibit a mold shrinkage comparable to or less than khat 2 ~ 3.~ ~
1 of the first resin. The second resin may be a thermoplastic or thermosetting resin. Examples of compatible first and second resins are platable grade ABS as the first resin and non-platable grade ABS, polypropylene or high impact styrene as the second resin.
The second resin is selected depending on the goals to be achieved. For example, if low cost is a goal, an inexpensive resin may be used as the second resin.
; 10 Alternatively, the second resin may be selected to control one or more physical properties such as strength, weight, temperature resistance, impact resistance, conductivity, permeability to gases, moisture absorption and the like. The second resin may contain fillers that the ~irst resin cannot due to the detrimental effect of the fillers on the decorative appearance of the first resin. 5uch fillers include particles or fibers, for example, carbon, glass, metals or minerals. Fillers, such as temperature-activated blowing agent~ to provide weight reduction and to control shrinkage of heavy section areas may be present in the second resin. Other fillers and the physical properties imparted by their presence are well known in the art.
It is also understood, however, that the first resin need not be platable. For example, the first resin may be selected to provide a nonplated decorative finish, if desired.
The present invention does not require the use of double shot molding as described in the embodiment above. However, such techniques may be used, not only to provide inserts as described above, but may, for example, be used to form the shields shown in FIG. 2 above out of a nonplatable plastic to obviate the need for electrically isolating the shields after electroless plating.
2 ~ 2 ~
1 The preceding descripti.on has been presented with reference to the presently preferred embodiments of the invention which are shown in the accompanying drawings.
Workers skilled in the art and technologv to which this invention pertains will appreciate that other alterations or changes in the described structures can be practiced without meaningfully departing from the principles, spirit and scope of this invention.
Accordingly, the foregoing description should not be read as pertaining only to the precise structures described, but rather should be read consistent with and as support for the following claims which are to have their fullest fair scope.
25.
PL~T~B~æ PLASTIC SUBSTR~TES
; This invention relates to the art of plating on plastics and, mor~ particularly, to an injection molding process for molding platable product substrates having a skin layer of a first platable resin and an underlying core o~ a second resin different from the first resin.
, .
In recent years, many plated products comprise a molded plastic substrate which is first electrolessly plated and then electrolytically pIated.
In conventional electroless plating processes, the product substrat~ is first etched with a stro~g oxidizing acid or base. The etched substrate is then immersed in a solution containing a noble metal catalyst, e.g., a tin-palladium catalyst. If required, the subst:rate is then immersed in an activator solution, e.g., e~osins the palladium of the tin-palladium catalyst. F~n~lly, the activated substrate is immersed in an autocatalytic electroless plating solution where an initi~l coating of a conductive metal, such as copper or nickel, is established on the substrate by chemical deposition.
In a conventional electrolytic plating process, the electrolessly plated plastic substrate is first immersed j 6~ ~
-;2-1 in cleaning solutions and 'then activated by immersion in a dilute acid solution, e.g., a dilute sulfuric acid solution. It is then immersed in one or more electroplating baths wherein metal is deposited on the sur~ace of the substrate electrolytically. In many applications, for example, layers of copper, nickel, and chromium are plated onto the substrate.
In the above electroless and electrolytic plating processes, unplated product substrates are typically mounted on plating racks. Conventional plating racks comprise a metal framework having metal contacts for holding the plastic substrates on the rack. ~ith electrolytic plating racks, the contacts also provide mPans for electrical communication between the racks and the plastic substrates. The plastic substrates are manually mounted on the contacts which hold the substrates firmly so that they do not fall off the rac~s in agitated plating solutions and, in the case of electrolytic plating racks, to provide uninterr~pted electrical contact with the substrates.
U.S. Patent NoO 4,714,535 assigned to Crown City Plating Co. provides a product substrate assembly in which product substrates are molded together with a rack-engaging framework or xunner system. The molded frameworX comprises supporting members to which product substrates are attached and clips or other means for releasably engaging the framework of a plating rack.
This obviates the need for individual rack contacts.
U.S. Patent No. 4,936,973 also assigned to Crown City Plating Co. discloses ~ product substrate assembly having an overflow assembly comprising support members and clips or other means for releasably engaging the framework of a plating rack.
The present invention provides a sec~enced injection molding process particularly useful in the 2 ~
1 production of product subst:rate assemblies described in the above-mentioned U.S. Patent Nos. 4,714,535 and 4,936,373.
Th~ injection molded process comprises first injecting into a mold cavity for a product substrate a first resin in an amount less than that requixed to fill the entire mold cavity. The amount is sufficient to cover at least a portion o~ the surface of the mold cavity and preferably to cov~r the entire surface of the mold cavity. A second resin different ~rom the first resin is then injected into the mold cavity in an amount which, in combination wlth the first resin is suff~cient to Sill the cavity. The second resin is compatible, i.e~, able to be molded with the first resin into an integral product substrate.
In the process, the first resin flows into the mold ~- cavity and forms a skin layer over the surface of the mold cavity. The second resin then flows into the mold cavity filling the remainder of the cavity and forming a second layer or core underlying the skin layer.
In a pref~rred embodiment of the invention, the first resin is a platable resin. The second rPsin may be platable, but need not be. The second resin may be a low cost resin and/or a resin providing particular physical properties, e.g. high strength, temperature resistance, heavyweight, etc. as desired.
In a particularly preferred embodiment of the invention there is provided a process ~or injection molding a product substrate assembly having at least one product substrate assembly attached to a runner system or overflow assembly. In such a process, the mold cavity c:omprises one or more product substrate cavities connected to a runner system or overflow assembly cavity. The process comprises injecting a first resin into the mold cavity for the product substrate in an amount sufficient to cover at least a portion and .
2 ~
1 preferably all of the surfac:e of the product substrata cavity, but less than that r.equired to fill the entire product substrate cavity. A second resin, different from the first resin is then injected into the product substrate cavity in an amount, which in combination with the first resin, is sufficient to fill the entire mold cavity, including the product substrate cavity and runner system or overflow assembly cavity.
; These and other faatures and advantages of the present invention will be bel:ter understood by reference to the following detailed cl~scriptio~ when considered 5in conjunction with the accompanying drawings wherein:
FIG. 1 is a side cross-sectional view of a product substrate of the product substrate assembly of FIG. 2;
FIG. 2 is a top view of the product substrate assembly;
10FIG. 3 is an end view of the product substrate assembly of FIG. 2;
FIG. 4 is a cross-sectional schematic view showing ; a prefarrPd injection molding process according to the present invention.
: 25 ~ ~ ~5 r~ ~ 2 ~
The injection molding process of the present invention is particularly applicable to the production of a plastic product substrate assembly which can be mounted on the framework of an electrolytic plating rack and on the framework of an electroless plating rack.
FIGS. 1-3 show such a product substrate assembly.
The product substrate assembly 20 is a one-piece injection molded unit and comprises a plurality of ; 10 product substrates 21 which, in the embodiment shown, are automobile window regulator handles. The product ~ substrates 21 are attached to an overflow assembly or ; rack-engaging framework 22. In the embodiment shown, the overflow assembly 22 comprises a pair of generally horizontal primary supports 23 and a plurality of secondary supports 24 which extend forwardly from the primary support 23 to the product substrates 21 and are attached to the back side of the product substrates 21 at gate 25. The overflow assembly 22 further comprises a pair of end clips 26 for releasably attaching the ~ product substrate assembly 20 to the side rails of the - framework of the electroplating rack.
In the embodiment shown, the overflow assembly 22 also comprises robbers 30 adjacent the product substrates 21 to reduce the current density at high current density locations, e.g., the sharp edges around the rounded base of the window regulator handle. Rather than, or in addition to robbers, the product substrate assembly may comprise nonplatable shields to control the current dlensity at different locations on the product substrates.
The present invention provides a unique injection molding process for preparing product substrate assemhlies as described above. With reference to FIG.
4, there is shown schematically a particularly preferred injection molding process. In this particular 2 ~ 2 ~
l embodiment, the process involves a two-shot molding process with sequenced injec1:ion during the second shot.
In the first shot, a high strength insert 41 is formed out of a suitable high strength resin which may be a platable or nonplatable resin. The insert 4l is the portion of the window regulator handle which engages the rotatable shaft of the window regulator assembly of an automobile. A presently preferred resin for forming such an insert is polyetherimide. It is understood, however, that any desired resin may be used. In fact, rather than a two-shot molding process, a single shot process may be used wherein a premolded insert is positioned within the product substrate mold cavity.
In such a process, the premolded insert could be made of any material including metal. It is also understood that the presence of a high strength insert, while desireable for this particular application, is not required for the practice of the invention or even for the manufacture of automobile window regulator handles.
In the two shot molding process, following the first shot, the cavity for the remainder of the window regulator handle and overflow assembly is moved into place. A first platable resin 42 is introduced into the product substrate cavity through runner 43 and gate 44.
The volume of the first platable resin 42 is controlled and is less than that required to ~ill the entire product substrate cavity of the mold. The first plata~le resin 42 is followed by injection of a second resin 45 in an amount which, combined with the first resin, is sufficient to fill the entire mold cavity.
In the above process, the first platable resin 42 flows into the product substrate cavity and forms skin layer 46. A portion of the first resin will also likely flow into the mold cavities for the overflow assembly 48 and fo~m a skin layer over at least a portion of the overflow runners. The second resin 45 flows into and fills the remainder of the product substrate cavity ~7~
1 forming an underlying layer 47 and also flows into and fills the cavity for the overflow assembly 48.
In this arrangement, the product substrate will have a skin layer of the first platable resin over its surface. Underlying the skin layer in at least the thicker sections of the product substrate will be the second resin. ~oreover, the overflow assembly 48 well may be formed primarily with the second resin.
The first resin is a thermoplastic resin which has a viscosity that is variable with temperature. In the practice of this process, the first resin is injected into the mold cavity at a first temperature. Upon contact with the surface of the mold cavity, the first resin cools and the viscosity increases. This slows or stops the flow of the resin contacting the mold surface.
The underlying resin, however, continues to flow until it reaches other areas of the mold surface. Resins ; having a viscosity which is variable with shear velocity may also be used for the first resin.
The amount of first resin used is sufficient to form a sXin layer over at least the critical or Class A surfaces of the product substrate, i.e~, those surfaces which are clearly visible during use. For window regulator handles as shown above, such critical areas include the front surface of the handle which i5 visible during use. If the product substrate is to be plated and if the second resin is a nonplatable resin, the amount of first resin must be selected to assure the formation of sufficient platable skin layer over non-critical surfaces to assure electrical communication between the electroplating rack and the critical areas of the product substrate after electroless plating.
The second resin must be "compatiblel' with the first resin. This means that the second resin must be able to-combine with the first resin to form an integral molded unit. To be compatible, second resins generally exhibit a mold shrinkage comparable to or less than khat 2 ~ 3.~ ~
1 of the first resin. The second resin may be a thermoplastic or thermosetting resin. Examples of compatible first and second resins are platable grade ABS as the first resin and non-platable grade ABS, polypropylene or high impact styrene as the second resin.
The second resin is selected depending on the goals to be achieved. For example, if low cost is a goal, an inexpensive resin may be used as the second resin.
; 10 Alternatively, the second resin may be selected to control one or more physical properties such as strength, weight, temperature resistance, impact resistance, conductivity, permeability to gases, moisture absorption and the like. The second resin may contain fillers that the ~irst resin cannot due to the detrimental effect of the fillers on the decorative appearance of the first resin. 5uch fillers include particles or fibers, for example, carbon, glass, metals or minerals. Fillers, such as temperature-activated blowing agent~ to provide weight reduction and to control shrinkage of heavy section areas may be present in the second resin. Other fillers and the physical properties imparted by their presence are well known in the art.
It is also understood, however, that the first resin need not be platable. For example, the first resin may be selected to provide a nonplated decorative finish, if desired.
The present invention does not require the use of double shot molding as described in the embodiment above. However, such techniques may be used, not only to provide inserts as described above, but may, for example, be used to form the shields shown in FIG. 2 above out of a nonplatable plastic to obviate the need for electrically isolating the shields after electroless plating.
2 ~ 2 ~
1 The preceding descripti.on has been presented with reference to the presently preferred embodiments of the invention which are shown in the accompanying drawings.
Workers skilled in the art and technologv to which this invention pertains will appreciate that other alterations or changes in the described structures can be practiced without meaningfully departing from the principles, spirit and scope of this invention.
Accordingly, the foregoing description should not be read as pertaining only to the precise structures described, but rather should be read consistent with and as support for the following claims which are to have their fullest fair scope.
25.
Claims (10)
1. A sequenced injection molding process comprising:
injecting into a mold cavity through a runner, a first resin in an amount less than that required to fill the entire mold cavity; and then injecting into the mold cavity through the runner, a second resin different from the first resin, in an amount which, in combination with the first resin, is sufficient to fill the entire mold cavity.
injecting into a mold cavity through a runner, a first resin in an amount less than that required to fill the entire mold cavity; and then injecting into the mold cavity through the runner, a second resin different from the first resin, in an amount which, in combination with the first resin, is sufficient to fill the entire mold cavity.
2. A sequenced injection molding process as claimed in claim l wherein the first resin is platable.
3. A sequenced injection molding process as claimed in claim 2 wherein the second resin is nonplatable.
4. A sequenced injection molding process as claimed in claim l wherein the second resin comprises a filler selected from the group consisting of fibers and particles of carbon, glass, metal, or minerals.
5. A sequenced injection molding process as claimed in claim l wherein the second resin comprises a temperature-activated blowing agent.
6. An injection molding process fox manufacturing a product substrate assembly which comprises at least one product substrate and at least one overflow assembly, said process comprising:
providing a mold cavity having at least one product substrate cavity section and at least one overflow assembly cavity section;
injecting into the product substrate cavity section of the mold cavity through a runner, a first resin in an amount less than that required to fill the product substrate cavity section mold cavity; and then injecting into the product substrate cavity section of the mold cavity, through the runner, a second resin different from the first resin, in an amount which, in combination with the first resin, is sufficient to fill the entire mold cavity.
providing a mold cavity having at least one product substrate cavity section and at least one overflow assembly cavity section;
injecting into the product substrate cavity section of the mold cavity through a runner, a first resin in an amount less than that required to fill the product substrate cavity section mold cavity; and then injecting into the product substrate cavity section of the mold cavity, through the runner, a second resin different from the first resin, in an amount which, in combination with the first resin, is sufficient to fill the entire mold cavity.
7. An injection molding process as claimed in claim 6 wherein the first resin is platable.
8. An injection molding process as claimed in claim 7 wherein the second resin is nonplatable.
9. An injection molding process as claimed in claim 6 wherein the second resin comprises a filler selected from the group consisting of fibers and particles of carbon, glass, metal, or minerals.
10. An injection molding process as claimed in claim 6 wherein the second resin comprises a temperature-activated blowing agent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55816090A | 1990-07-24 | 1990-07-24 | |
| US07/558,160 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2047625A1 true CA2047625A1 (en) | 1992-01-25 |
Family
ID=24228451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2047625 Abandoned CA2047625A1 (en) | 1990-07-24 | 1991-07-23 | Injection molding process for platable plastic substrates |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2047625A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016191014A1 (en) | 2015-05-28 | 2016-12-01 | Fca Us Llc | Vehicle door handle apparatus and two-shot injection molding process for producing components with a metallic surface finish |
| US10737530B2 (en) * | 2015-05-14 | 2020-08-11 | Lacks Enterprises, Inc. | Two-shot molding for selectively metalizing parts |
-
1991
- 1991-07-23 CA CA 2047625 patent/CA2047625A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10737530B2 (en) * | 2015-05-14 | 2020-08-11 | Lacks Enterprises, Inc. | Two-shot molding for selectively metalizing parts |
| WO2016191014A1 (en) | 2015-05-28 | 2016-12-01 | Fca Us Llc | Vehicle door handle apparatus and two-shot injection molding process for producing components with a metallic surface finish |
| US9945163B2 (en) | 2015-05-28 | 2018-04-17 | Fca Us Llc | Vehicle door handle apparatus and two-shot injection molding process for producing components with a metallic surface finish |
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