CA2039828C - Partially fluorinated ether solvent for cleaning articles - Google Patents
Partially fluorinated ether solvent for cleaning articles Download PDFInfo
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- CA2039828C CA2039828C CA002039828A CA2039828A CA2039828C CA 2039828 C CA2039828 C CA 2039828C CA 002039828 A CA002039828 A CA 002039828A CA 2039828 A CA2039828 A CA 2039828A CA 2039828 C CA2039828 C CA 2039828C
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- ether
- solvent
- process according
- fluorinated ether
- tetrafluoroethyl
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5018—Halogenated solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5036—Azeotropic mixtures containing halogenated solvents
- C11D7/504—Azeotropic mixtures containing halogenated solvents all solvents being halogenated hydrocarbons
- C11D7/5063—Halogenated hydrocarbons containing heteroatoms, e.g. fluoro alcohols
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
Abstract
Low molecular weight, fluorine-containing ethers of boiling point 20°C to 120°C are used in solvent cleaning applications.
Description
- 1 ~ ~~~~(~~~
~M 35692 SOLVENT CLEANING OF' ARTICLES
This invention relates to solvent cleaning applications in which contaminated articles such as, for example, metals, textiles, glass, plastics, electronic components and printed circuit boards are cleaned using a solvent or solvent vapour and more particularly to the use of low molecular weight ethers as solvents in solvent cleaning applications.
Solvent cleaning applications wherein contaminated articles are immersed in or washed with halogenated hydrocarbon solvents and/or the vapours thereof are well known and are in common use. Applications involving several stages of immersion, rinsing and drying are common and it is well known to use the solvent at ambient temperature (often accompanied by ultrasonic agitation) or at an elevated temperature up to the boiling point of the solvent. Examples of solvents used in these cleaning processes are 1,1,2-trichloro-1,2,2-trifluoroethane, 1,1,1-trichloroethane, trichloroethylene, perchloroethylene and methylene chloride. These solvents are used alone or in mixtures with cosolvents such as aliphatic alcohols or other low molecular weight, polar additives and depending to some extent upon the articles to be cleaned are often stabilised against degradation induced by light, heat and the presence of metals.
In the known common solvent cleaning applications and especially in those applications where the solvent is used at an elevated temperature, there is a tendency for solvent vapour to be lost from the cleaning system into the atmosphere. Further losses may occur in loading and unloading the solvents into cleaning plant and in recovering used solvent by distillation. Whilst care is usually exercised to minimize losses of solvent into the atmosphere, for instance by improved plant design and vapour recovery systems, the expense of totally preventing lasses is exhorbitant and most practical cleaning applications result in some loss of solvent vapour into the atmosphere.
Until recently, the use of the common cleaning solvents has been regarded as safe practice in that the solvents are stable, of low toxicity, non-flammable materials believed to be environmentally benign.
However recent evidence suggests that some at least of the common solvents may have a long-term deleterious effect on the stratosphere, the so-called ozone layer, so that a replacement solvent is seen to be desirable.
According to the invention there is provided the use in solvent cleaning applications of solvents comprising low molecular weight fluorine-containing ethers of boiling point in the range of about 20°C to about 12. 0 ° C .
The ether has a boiling point in the range 20°C to 120°C, preferably from 25°C to 85°C, such that it may be used in conventional and existing cleaning equipment.
For any particular cleaning application, an ether may be selected having a boiling point close to that of the solvent the ether is replacing.
The ethers can be obtained by reaction of a halogenated aliphatic olefin with an optionally halogenated aliphatic alcohol in known manner and thus contain at least three carbon atoms in the molecule.
Usually the ether will contain not more than five carbon atoms although it may contain six or more carbon atoms providing its boiling point is below about 120°C.
The ether contains at least one and will usually contain two or more fluorine atoms but will not generally be perfluorinated. In addition to fluorine atoms, the ether may contain chlorine atoms, bromine 3 _ ~~~:~~~~c~
atoms and hydrogen atoms. Ethers containing chlorine and/or hydrogen may contain one or two chlorine atoms and/or one or two hydrogen atoms.
Examples of alcohols which may be used to produce the ethers are methanol, ethanol, propanol and butanol and halogenated derivatives thereof. Alkenes which may be used include tetrafluoroethylene, hexafluoropropene, chlorotrifluoroethylene and the chlorofluoropropenes and hydrogen-containing analogues of these compounds for example trifluoroethylene and chlorodifluoroethylene.
Examples of ethers which may be used, and their boiling points, inc7.ude the following:-Boiling Point (°C) 1,1-difluoroethyl methyl ether 47 1,1,2,2-tetrafluoroethyl methyl ether 36.5 1-chloro-1,2,2-trifluoroethyl methyl ether 70.6 1-1-dichloro-2,2-difluoroethyl methyl ether 104.8 1-chloro-2,2-difluoroethyl methyl ether 27.5 1 1,1.1,2,3,3-hexafluoropropyl methyl ether 54.5 1,1-difluoroethyl ethyl.ether 65 1,1,2,2-tetrafluoroethyl ethyl ether 56 1-chloro-1,2,2-trifluoroethyl ethyl ether 82 1,1,1,2,3,3-hexafluoropropyl ethyl ether 64.5 1,1,2,2-tetrafluoroethyl n-propyl ether 71.7 3 1-chloro-1,2,2-trifluoroethyl n-propyl ether 109 1,1,1,2,3,3-hexafluoropropyl n-propyl ether 92 1-chloro-1,2,2-trifluoroethyl isopropyl ether 100 1-chloro-2,2-difluoroethyl isopropyl ether 53 1,1,1,2,3,3-hexafluoropropyl isopropyl ether 76 1,1,2,2-tetrafluoroethyl n-butyl ether 49 1,1,1,2,3,3-hexafluoropropyl n-butyl ether 108 1,2,2-trifluoroethyl 1,1,1-trifluoroethyl ether 75 1,1,2,2-tetrafluoroethyl 1,1-difluoroethyl ether 77 di(1,1-difluoroethyl) ether 103 ~~e~~~~~
~M 35692 SOLVENT CLEANING OF' ARTICLES
This invention relates to solvent cleaning applications in which contaminated articles such as, for example, metals, textiles, glass, plastics, electronic components and printed circuit boards are cleaned using a solvent or solvent vapour and more particularly to the use of low molecular weight ethers as solvents in solvent cleaning applications.
Solvent cleaning applications wherein contaminated articles are immersed in or washed with halogenated hydrocarbon solvents and/or the vapours thereof are well known and are in common use. Applications involving several stages of immersion, rinsing and drying are common and it is well known to use the solvent at ambient temperature (often accompanied by ultrasonic agitation) or at an elevated temperature up to the boiling point of the solvent. Examples of solvents used in these cleaning processes are 1,1,2-trichloro-1,2,2-trifluoroethane, 1,1,1-trichloroethane, trichloroethylene, perchloroethylene and methylene chloride. These solvents are used alone or in mixtures with cosolvents such as aliphatic alcohols or other low molecular weight, polar additives and depending to some extent upon the articles to be cleaned are often stabilised against degradation induced by light, heat and the presence of metals.
In the known common solvent cleaning applications and especially in those applications where the solvent is used at an elevated temperature, there is a tendency for solvent vapour to be lost from the cleaning system into the atmosphere. Further losses may occur in loading and unloading the solvents into cleaning plant and in recovering used solvent by distillation. Whilst care is usually exercised to minimize losses of solvent into the atmosphere, for instance by improved plant design and vapour recovery systems, the expense of totally preventing lasses is exhorbitant and most practical cleaning applications result in some loss of solvent vapour into the atmosphere.
Until recently, the use of the common cleaning solvents has been regarded as safe practice in that the solvents are stable, of low toxicity, non-flammable materials believed to be environmentally benign.
However recent evidence suggests that some at least of the common solvents may have a long-term deleterious effect on the stratosphere, the so-called ozone layer, so that a replacement solvent is seen to be desirable.
According to the invention there is provided the use in solvent cleaning applications of solvents comprising low molecular weight fluorine-containing ethers of boiling point in the range of about 20°C to about 12. 0 ° C .
The ether has a boiling point in the range 20°C to 120°C, preferably from 25°C to 85°C, such that it may be used in conventional and existing cleaning equipment.
For any particular cleaning application, an ether may be selected having a boiling point close to that of the solvent the ether is replacing.
The ethers can be obtained by reaction of a halogenated aliphatic olefin with an optionally halogenated aliphatic alcohol in known manner and thus contain at least three carbon atoms in the molecule.
Usually the ether will contain not more than five carbon atoms although it may contain six or more carbon atoms providing its boiling point is below about 120°C.
The ether contains at least one and will usually contain two or more fluorine atoms but will not generally be perfluorinated. In addition to fluorine atoms, the ether may contain chlorine atoms, bromine 3 _ ~~~:~~~~c~
atoms and hydrogen atoms. Ethers containing chlorine and/or hydrogen may contain one or two chlorine atoms and/or one or two hydrogen atoms.
Examples of alcohols which may be used to produce the ethers are methanol, ethanol, propanol and butanol and halogenated derivatives thereof. Alkenes which may be used include tetrafluoroethylene, hexafluoropropene, chlorotrifluoroethylene and the chlorofluoropropenes and hydrogen-containing analogues of these compounds for example trifluoroethylene and chlorodifluoroethylene.
Examples of ethers which may be used, and their boiling points, inc7.ude the following:-Boiling Point (°C) 1,1-difluoroethyl methyl ether 47 1,1,2,2-tetrafluoroethyl methyl ether 36.5 1-chloro-1,2,2-trifluoroethyl methyl ether 70.6 1-1-dichloro-2,2-difluoroethyl methyl ether 104.8 1-chloro-2,2-difluoroethyl methyl ether 27.5 1 1,1.1,2,3,3-hexafluoropropyl methyl ether 54.5 1,1-difluoroethyl ethyl.ether 65 1,1,2,2-tetrafluoroethyl ethyl ether 56 1-chloro-1,2,2-trifluoroethyl ethyl ether 82 1,1,1,2,3,3-hexafluoropropyl ethyl ether 64.5 1,1,2,2-tetrafluoroethyl n-propyl ether 71.7 3 1-chloro-1,2,2-trifluoroethyl n-propyl ether 109 1,1,1,2,3,3-hexafluoropropyl n-propyl ether 92 1-chloro-1,2,2-trifluoroethyl isopropyl ether 100 1-chloro-2,2-difluoroethyl isopropyl ether 53 1,1,1,2,3,3-hexafluoropropyl isopropyl ether 76 1,1,2,2-tetrafluoroethyl n-butyl ether 49 1,1,1,2,3,3-hexafluoropropyl n-butyl ether 108 1,2,2-trifluoroethyl 1,1,1-trifluoroethyl ether 75 1,1,2,2-tetrafluoroethyl 1,1-difluoroethyl ether 77 di(1,1-difluoroethyl) ether 103 ~~e~~~~~
1-chloro-1,2,2-trifluoroethyl 1,1-difluoroethyl ether 102 1,1,2,2-tetrafluoroethyl 1,1-di(trifluoromethyl)methyl ethex 85 At 130 mm Hg At 630 mm Hg At 62'7 mm Hg At 121 mm Hg IO 5 At 113 mm Hg Mixtures of ethers, including azeotropic mixtures, may be used if desired as may mixtures of an ether with one or more cosolvents. The same cosolvents may be used as are used with the principal solvents in known cleaning applications and in particular polar compounds such as alcohols are preferred cosolvents.
Cleaning compositions comprising the ether and a cosolvent, notably a lower alkanol cosolvent, are , provided according to another feature of the invention.
Azeotropic mixtures of ethers and alcohols represent preferred embodiments of the invention. Lower aliphatic alcohols containing 1 to ~ carbon atoms are useful in such mixtures.
The ethers used according to the invention tend to be more stable than 'the commonly-used solvents and generally will not require stabilisation against degradation. However, stabilisers may be added if desired or if required for particularly onerous cleaning applications and the stabilisers used in the common solvents may be employed, notably nitroalkanes and epoxides.
The ethers may be used as replacements for the solvents) used in any of the known cleaning applications and have the advantage of being generally more stable towards aluminium than the solvents they replace. The ethers may be used to replace part of the solvents) used in known cleaning applications.
The invention is illustrated by the following examples.
L~YAMt~T D 1 This Example illustrates the use of 2-chloro-1,1,2-trifluoroethyl methyl ether in cleaning flux residues from copper-coated boards.
A known weight of solder cream was applied to i~test boards (5 cm x 7 cm) cut from copper-coated FR4 (epoxy/glass fibre laminate) board and the cream was reflowed in a MICRO VPS~'soldering unit. The solder cream used was a 62% tin/38~ lead solder available as Multicore'~PRAB 3.
2-chloro-1,1,2-trifluoroethyl methyl ether (boiling point 65°C at 630mm Hg) was boiled in a beaker fitted with an upper cooling coil through which cold water was circulated to create a boiling liquid phase and a vapour phase and the contaminated board was dipped into the boiling liquid for 60 seconds and then held in the vapour for 30 seconds.
Residual ionic contamination of the test board, expressed as mg sodium chloride per square centimetre was determined using a Protonique'~Contaminometer. The ionic contamination of an unwashed test~board was determined and the ~ removal of ionic contamination was calculated. 61~ of the ionic flux residues were removed fr«rn the test boards.
The ether was heated to 190°C and the vapour pressures above the ether were determined over the range 50 - 190°C. A slight increase in vapour pressure was observed at approximately 120°C but there was no visible evi_cience of solvent breakdown at this temperature.
* 'Trade-mark In a Comparative Test, using 1,1,2-trichloro-1,2,2-trifluoroethane as the solvent, 45% of the ionic flux residues were removed.
These Examples illustrate the use of mixtures of 2-chloro-1,1,2-trifluoroethyl methyl ether and methanol far cleaning flux residues from copper coated printed circuit boards.
In Example 2, a mixture of 2-chloro-1,1,2-trifluoroethyl methyl ether and methanol was boiled until a constant boiling mixture was obtained. This azeotrope contained 18.5% by weight of methanol and boiled at 56.8°C at normal pressure.
The azeotropic mixture was used to remove ionic residues from the test boards as described in Example 1.
66.9% of the ionic resudes were removed.
In Example 3, the procedure of Example 2 was repeated except that a mixture of the ether (95% by weight) and methanol (5% by weight) was used instead of the azeotropic mixture. 65.1% of the ionic residues were removed.
This Example demonstrates the stability of 2-chloro-1,1,2- trifluoroethyl methyl ether in the presence of aluminium.
The ether was refluxed in contact with aluminium for 48 hours. The aluminium test piece was partly immersed in the liquid and partly in the vapour above the liquid.
In the test, no increase in chloride ion or fluoride ion was observed in the liquid phase and the GC
trace of the solvent after the test showed no change.
There was no significant weight change in the metal test piece which emerged from the test clean and bright with no evidence of corrosion.
Cleaning compositions comprising the ether and a cosolvent, notably a lower alkanol cosolvent, are , provided according to another feature of the invention.
Azeotropic mixtures of ethers and alcohols represent preferred embodiments of the invention. Lower aliphatic alcohols containing 1 to ~ carbon atoms are useful in such mixtures.
The ethers used according to the invention tend to be more stable than 'the commonly-used solvents and generally will not require stabilisation against degradation. However, stabilisers may be added if desired or if required for particularly onerous cleaning applications and the stabilisers used in the common solvents may be employed, notably nitroalkanes and epoxides.
The ethers may be used as replacements for the solvents) used in any of the known cleaning applications and have the advantage of being generally more stable towards aluminium than the solvents they replace. The ethers may be used to replace part of the solvents) used in known cleaning applications.
The invention is illustrated by the following examples.
L~YAMt~T D 1 This Example illustrates the use of 2-chloro-1,1,2-trifluoroethyl methyl ether in cleaning flux residues from copper-coated boards.
A known weight of solder cream was applied to i~test boards (5 cm x 7 cm) cut from copper-coated FR4 (epoxy/glass fibre laminate) board and the cream was reflowed in a MICRO VPS~'soldering unit. The solder cream used was a 62% tin/38~ lead solder available as Multicore'~PRAB 3.
2-chloro-1,1,2-trifluoroethyl methyl ether (boiling point 65°C at 630mm Hg) was boiled in a beaker fitted with an upper cooling coil through which cold water was circulated to create a boiling liquid phase and a vapour phase and the contaminated board was dipped into the boiling liquid for 60 seconds and then held in the vapour for 30 seconds.
Residual ionic contamination of the test board, expressed as mg sodium chloride per square centimetre was determined using a Protonique'~Contaminometer. The ionic contamination of an unwashed test~board was determined and the ~ removal of ionic contamination was calculated. 61~ of the ionic flux residues were removed fr«rn the test boards.
The ether was heated to 190°C and the vapour pressures above the ether were determined over the range 50 - 190°C. A slight increase in vapour pressure was observed at approximately 120°C but there was no visible evi_cience of solvent breakdown at this temperature.
* 'Trade-mark In a Comparative Test, using 1,1,2-trichloro-1,2,2-trifluoroethane as the solvent, 45% of the ionic flux residues were removed.
These Examples illustrate the use of mixtures of 2-chloro-1,1,2-trifluoroethyl methyl ether and methanol far cleaning flux residues from copper coated printed circuit boards.
In Example 2, a mixture of 2-chloro-1,1,2-trifluoroethyl methyl ether and methanol was boiled until a constant boiling mixture was obtained. This azeotrope contained 18.5% by weight of methanol and boiled at 56.8°C at normal pressure.
The azeotropic mixture was used to remove ionic residues from the test boards as described in Example 1.
66.9% of the ionic resudes were removed.
In Example 3, the procedure of Example 2 was repeated except that a mixture of the ether (95% by weight) and methanol (5% by weight) was used instead of the azeotropic mixture. 65.1% of the ionic residues were removed.
This Example demonstrates the stability of 2-chloro-1,1,2- trifluoroethyl methyl ether in the presence of aluminium.
The ether was refluxed in contact with aluminium for 48 hours. The aluminium test piece was partly immersed in the liquid and partly in the vapour above the liquid.
In the test, no increase in chloride ion or fluoride ion was observed in the liquid phase and the GC
trace of the solvent after the test showed no change.
There was no significant weight change in the metal test piece which emerged from the test clean and bright with no evidence of corrosion.
The results demonstrate that the ether has high stability in the presence of aluminium and is suitable for use in aluminium cleaning applications. Stabilisers may be added to inhibit the build up of acidity in the ether when it is used to clean metals.
This Example illustrates the use of tetrafluoroethyl methyl ether in cleaning flux residues from copper-coated boards.
Tetrafluoroethyl methyl ether, boiling point 33-35°C (630 mm Hg) and density (25°C) 1.28g/ml, was used to clean flux residues from copper coated boards as described in Example 1. 62% of the ionic flux residues were removed.
These Examples illustrate certain azeotropic mixtures suitable for use in the process according to the present invention.
Tetrafluoroethyl methyl ether forms an azeotrope , with methanol containing 4% by weight methanol and boiling at 34.5°C.
The ether forms an azeotrope with 1,1,2-trichloro-1,2,2 -trifluoroethane containing 39.5% by weight of the haloethane and boiling at about 34.9°C.
The ether forms a ternary azeotrope with 1,1,2-trichloro- 1,2,2-trifluoroethane and methanol containing 41% by weight of the haloethane and 3% by weight of methanol and boiling at about 34.5°C.
This Example illustrates the use of a ternary azeotropic mixture in the process according to the present invention.
The ternary azeotropic mixture of tetrafluoroethyl methyl ether, 1,1,2-trichloro-1,2,2-trifluoroethane and methanol prepared in Example 8 was used to remove solder flux ~~~t~~~~~~
_8_ residues from circuit boards by the procedure described in Example 1. 48.2 of the ionic flux residues were removed.
These Examples illustrate further azeotropic mixtures for use in the process according to the present invention.
Tetrafluoroethyl ethyl ether, boiling point 56°C
and density 1.21 g/ml, forms an azeotrope with methanol containing 10.6 by weight of methanol and boiling at 48.6°C.
The ether forms an azeotrope with ethanol containing 38.5 by weight of 1,1,2-trichloro-1,2,2-trifluoroethane and boiling at 46.3°C.
This Example illustrates the use of tetrafluoroethyl methyl ether in cleaning flux residues from copper-coated boards.
Tetrafluoroethyl methyl ether, boiling point 33-35°C (630 mm Hg) and density (25°C) 1.28g/ml, was used to clean flux residues from copper coated boards as described in Example 1. 62% of the ionic flux residues were removed.
These Examples illustrate certain azeotropic mixtures suitable for use in the process according to the present invention.
Tetrafluoroethyl methyl ether forms an azeotrope , with methanol containing 4% by weight methanol and boiling at 34.5°C.
The ether forms an azeotrope with 1,1,2-trichloro-1,2,2 -trifluoroethane containing 39.5% by weight of the haloethane and boiling at about 34.9°C.
The ether forms a ternary azeotrope with 1,1,2-trichloro- 1,2,2-trifluoroethane and methanol containing 41% by weight of the haloethane and 3% by weight of methanol and boiling at about 34.5°C.
This Example illustrates the use of a ternary azeotropic mixture in the process according to the present invention.
The ternary azeotropic mixture of tetrafluoroethyl methyl ether, 1,1,2-trichloro-1,2,2-trifluoroethane and methanol prepared in Example 8 was used to remove solder flux ~~~t~~~~~~
_8_ residues from circuit boards by the procedure described in Example 1. 48.2 of the ionic flux residues were removed.
These Examples illustrate further azeotropic mixtures for use in the process according to the present invention.
Tetrafluoroethyl ethyl ether, boiling point 56°C
and density 1.21 g/ml, forms an azeotrope with methanol containing 10.6 by weight of methanol and boiling at 48.6°C.
The ether forms an azeotrope with ethanol containing 38.5 by weight of 1,1,2-trichloro-1,2,2-trifluoroethane and boiling at 46.3°C.
Claims (17)
1. A process for cleaning articles which comprises contacting the articles with a solvent comprising a fluorinated ether having a boiling point in the range of 20°C to 120°C and containing at least 3 carbon atoms and further containing one or more hydrogen atoms, or the vapour thereof or both.
2. A process according to claim 1, wherein the solvent further comprises a co-solvent.
3. A process according to claim 2, wherein the co-solvent is an alcohol.
4. A process according to claim 3, wherein the alcohol is an aliphatic alkanol having up to 4 carbon atoms.
5, A process according to claim 3 or 4, wherein the solvent is an azeotropic mixture of the fluorinated ether and the alcohol.
6, A process according to claim 1, wherein the solvent is a ternary azeotropic mixture containing the fluorinated ether.
7. A process according to any one of claims 1 to 6, wherein the fluorinated ether has a boiling point in the range of from 25°C to 80°C.
8. A process according to any one of claims 1 to 7, wherein the fluorinated ether further contains one or more chlorine atoms.
9. A process according to any one of claims 1 to 7, wherein the fluorinated ether or at least one of the fluorinated ethers when a mixture of them is employed is 2-chloro-1,1,2-trifluoroethyl methyl ether, tetrafluoroethyl methyl ether or tetrafluoroethyl ethyl ether.
10. A process according to any one of claims 1 to 9, wherein the articles to be cleaned are made of a metal, plastics or both.
11. A process according to any one of claims 1 to 9, wherein the articles to be cleaned are copper coated printed circuit boards.
12. A process according to any one of claims 1 to 11, carried out at an elevated temperature.
13. A solvent composition comprising (i) a fluorinated ether having a boiling point in the range of 20°C to 120°C and containing at least 3 carbon atoms and further containing one or more hydrogen atoms and (ii) a polar compound as a cosolvent.
14. The solvent composition according to claim 13, wherein the polar compound is an alcohol.
15. The solvent composition according to claim 14, wherein the alcohol is an aliphatic alkanol having 1 to 4 carbon atoms.
16. The solvent composition according to any one of claims 13 to 15, wherein the fluorinated ether is at least one member selected from the group consisting of 2-chloro-1,1,2-trifluoroethyl methyl ether, tetrafluoroethyl methyl ether and tetrafluoroethyl ethyl ether.
17. The solvent composition according to any one of claims 13 to 16, which is for cleaning printed circuit boards.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB909007645A GB9007645D0 (en) | 1990-04-04 | 1990-04-04 | Solvent cleaning of articles |
| GB9007645.6 | 1990-04-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2039828A1 CA2039828A1 (en) | 1991-10-05 |
| CA2039828C true CA2039828C (en) | 2001-01-23 |
Family
ID=10673894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002039828A Expired - Fee Related CA2039828C (en) | 1990-04-04 | 1991-04-04 | Partially fluorinated ether solvent for cleaning articles |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP0450855B1 (en) |
| JP (1) | JP2961924B2 (en) |
| KR (1) | KR100205296B1 (en) |
| AT (1) | ATE186071T1 (en) |
| AU (1) | AU640760B2 (en) |
| CA (1) | CA2039828C (en) |
| DE (1) | DE69131737T2 (en) |
| ES (1) | ES2140382T3 (en) |
| GB (1) | GB9007645D0 (en) |
| IE (1) | IE911028A1 (en) |
| NZ (1) | NZ237628A (en) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1005181A3 (en) * | 1991-08-19 | 1993-05-18 | Solvay | Composition containing a fluorinated ether and use thereof. |
| US5273592A (en) * | 1991-11-01 | 1993-12-28 | Alliesignal Inc. | Method of cleaning using partially fluorinated ethers having a tertiary structure |
| US6355113B1 (en) | 1991-12-02 | 2002-03-12 | 3M Innovative Properties Company | Multiple solvent cleaning system |
| DE69231725T2 (en) * | 1991-12-03 | 2001-10-31 | Us Environmental Prot Agency W | REFRIGERANT COMPOSITION AND METHOD FOR USE THEREOF |
| US5888418A (en) * | 1992-03-20 | 1999-03-30 | The United States Of America As Represented By The Secretary Of Commerce | Azeotropic refrigerant comprising bis-(difluoromethyl)ether and 1,1,2-trifluoroethane |
| US5278342A (en) * | 1992-03-25 | 1994-01-11 | Hampshire Chemical Corp. | Vapor phase chlorination of difluoromethyl methyl ether |
| US5605882A (en) * | 1992-05-28 | 1997-02-25 | E. I. Du Pont De Nemours And Company | Azeotrope(like) compositions of pentafluorodimethyl ether and difluoromethane |
| BE1006433A3 (en) * | 1992-12-03 | 1994-08-23 | Solvay | Composition containing fluorinated ether and use thereof. |
| US5484546A (en) * | 1993-05-19 | 1996-01-16 | E. I. Du Pont De Nemours And Company | Refrigerant compositions including an acylic fluoroether |
| US5658962A (en) | 1994-05-20 | 1997-08-19 | Minnesota Mining And Manufacturing Company | Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| US5562854A (en) * | 1994-09-29 | 1996-10-08 | E. I. Du Pont De Nemours And Company | Octafluorobutane compositions |
| US5718293A (en) * | 1995-01-20 | 1998-02-17 | Minnesota Mining And Manufacturing Company | Fire extinguishing process and composition |
| US6548471B2 (en) | 1995-01-20 | 2003-04-15 | 3M Innovative Properties Company | Alkoxy-substituted perfluorocompounds |
| US6506459B2 (en) | 1995-01-20 | 2003-01-14 | 3M Innovative Properties Company | Coating compositions containing alkoxy substituted perfluoro compounds |
| US5925611A (en) * | 1995-01-20 | 1999-07-20 | Minnesota Mining And Manufacturing Company | Cleaning process and composition |
| JP2870577B2 (en) * | 1995-03-28 | 1999-03-17 | 工業技術院長 | Solvent composition |
| CN1192088C (en) * | 1995-05-16 | 2005-03-09 | 美国3M公司 | Azeotrope-like compositions and their use |
| US6008179A (en) | 1995-05-16 | 1999-12-28 | 3M Innovative Properties Company | Azeotrope-like compositions and their use |
| KR100427737B1 (en) | 1995-05-16 | 2004-07-31 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | Azeotropic Mixture Compositions and Their Uses |
| US5543055A (en) * | 1995-06-06 | 1996-08-06 | Hampshire Chemical Corp. | Purifications of flourinated dimethyl ethers |
| JP3783047B2 (en) | 1995-12-15 | 2006-06-07 | スリーエム カンパニー | Cleaning method and composition |
| US6030934A (en) * | 1997-02-19 | 2000-02-29 | 3M Innovative Properties Company | Azeotropic compositions of methoxy-perfluoropropane and their use |
| US6552090B1 (en) | 1997-09-15 | 2003-04-22 | 3M Innovative Properties Company | Perfluoroalkyl haloalkyl ethers and compositions and applications thereof |
| US6022842A (en) * | 1998-02-11 | 2000-02-08 | 3M Innovative Properties Company | Azeotrope-like compositions including perfluorobutyl methyl ether, 1- bromopropane and alcohol |
| US6159917A (en) * | 1998-12-16 | 2000-12-12 | 3M Innovative Properties Company | Dry cleaning compositions containing hydrofluoroether |
| US6127430A (en) * | 1998-12-16 | 2000-10-03 | 3M Innovative Properties Company | Microemulsions containing water and hydrofluroethers |
| GB0203315D0 (en) * | 2002-02-13 | 2002-03-27 | Henly Stephen R | Method of sterilising an article |
| DE602004013154T2 (en) * | 2003-06-27 | 2009-05-14 | Asahi Glass Co., Ltd. | CLEANING / rinsing |
| JP5109556B2 (en) | 2006-11-01 | 2012-12-26 | セントラル硝子株式会社 | Azeotropic and azeotrope-like compositions comprising 1,1,2,2-tetrafluoro-1-methoxyethane |
| CN108026488B (en) * | 2015-07-27 | 2020-11-06 | Ａｇｃ株式会社 | Solvent composition, cleaning method, method for forming coating film, heat transfer medium, and heat cycle system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3957672A (en) * | 1973-11-23 | 1976-05-18 | The United States Of America As Represented By The Secretary Of The Navy | Displacement of organic liquid films from solid surfaces by non aqueous systems |
| IT1213537B (en) * | 1986-11-21 | 1989-12-20 | Ausimont Spa | PROCEDURE FOR THE PREPARATION OF PERFLUOROETERS BY FLUORURATION WITH ELEMENTARY FLUORINE. |
| US4948526A (en) * | 1989-09-26 | 1990-08-14 | Allied-Signal Inc. | Azeotrope-like compositions of pentafluorodimethyl ether and monochlorodifluoromethane |
-
1990
- 1990-04-04 GB GB909007645A patent/GB9007645D0/en active Pending
-
1991
- 1991-03-27 DE DE69131737T patent/DE69131737T2/en not_active Expired - Fee Related
- 1991-03-27 AT AT91302698T patent/ATE186071T1/en not_active IP Right Cessation
- 1991-03-27 IE IE102891A patent/IE911028A1/en unknown
- 1991-03-27 EP EP91302698A patent/EP0450855B1/en not_active Expired - Lifetime
- 1991-03-27 ES ES91302698T patent/ES2140382T3/en not_active Expired - Lifetime
- 1991-03-28 AU AU73913/91A patent/AU640760B2/en not_active Ceased
- 1991-03-28 NZ NZ23762891A patent/NZ237628A/en unknown
- 1991-04-04 KR KR1019910005446A patent/KR100205296B1/en not_active IP Right Cessation
- 1991-04-04 CA CA002039828A patent/CA2039828C/en not_active Expired - Fee Related
- 1991-04-04 JP JP3071406A patent/JP2961924B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2039828A1 (en) | 1991-10-05 |
| KR100205296B1 (en) | 1999-07-01 |
| JPH05271692A (en) | 1993-10-19 |
| KR910018532A (en) | 1991-11-30 |
| ATE186071T1 (en) | 1999-11-15 |
| AU640760B2 (en) | 1993-09-02 |
| AU7391391A (en) | 1991-10-10 |
| EP0450855A2 (en) | 1991-10-09 |
| ES2140382T3 (en) | 2000-03-01 |
| EP0450855A3 (en) | 1992-01-15 |
| JP2961924B2 (en) | 1999-10-12 |
| NZ237628A (en) | 1994-07-26 |
| EP0450855B1 (en) | 1999-10-27 |
| GB9007645D0 (en) | 1990-05-30 |
| IE911028A1 (en) | 1991-10-09 |
| DE69131737D1 (en) | 1999-12-02 |
| DE69131737T2 (en) | 2000-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |