CA2028628A1 - Solder alloy for dental and jewellery components - Google Patents
Solder alloy for dental and jewellery componentsInfo
- Publication number
- CA2028628A1 CA2028628A1 CA002028628A CA2028628A CA2028628A1 CA 2028628 A1 CA2028628 A1 CA 2028628A1 CA 002028628 A CA002028628 A CA 002028628A CA 2028628 A CA2028628 A CA 2028628A CA 2028628 A1 CA2028628 A1 CA 2028628A1
- Authority
- CA
- Canada
- Prior art keywords
- weight
- gold
- germanium
- indium
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 30
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 28
- 239000000956 alloy Substances 0.000 title claims abstract description 28
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010931 gold Substances 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 12
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 12
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 12
- 239000011701 zinc Substances 0.000 claims abstract description 12
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 7
- 239000010941 cobalt Substances 0.000 claims abstract description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 6
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 4
- 239000010953 base metal Substances 0.000 claims description 9
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000002844 melting Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 206010020751 Hypersensitivity Diseases 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 235000019646 color tone Nutrition 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000003564 dental alloy Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- RQFBBPNVEJATBH-UHFFFAOYSA-N [Cr].[Cd] Chemical compound [Cr].[Cd] RQFBBPNVEJATBH-UHFFFAOYSA-N 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000005180 public health Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000701 toxic element Toxicity 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000010938 white gold Substances 0.000 description 1
- 229910000832 white gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
- A61K6/844—Noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Animal Behavior & Ethology (AREA)
- Epidemiology (AREA)
- Materials Engineering (AREA)
- Plastic & Reconstructive Surgery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dental Preparations (AREA)
- Adornments (AREA)
- Dental Prosthetics (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
White solder alloys for dental and jewellery components with operating temperating temperature of approximately 1000°C
contain 38 to 70% by weight of gold, 6 to 20% by weight of palladium, 8 to 40% by weight of silver, 1 to 6% by weight of iron and/or cobalt, o to 10% by weight of copper, 0 to 5% by weight of each of indium, zinc and tin, and 0 to 4% by weight of each of gallium and germanium, ruthenium and/or rhenium. The sum of the contents of tin, zinc, indium, gallium and germanium lies between 1 and 5% by weight, of the total.
White solder alloys for dental and jewellery components with operating temperating temperature of approximately 1000°C
contain 38 to 70% by weight of gold, 6 to 20% by weight of palladium, 8 to 40% by weight of silver, 1 to 6% by weight of iron and/or cobalt, o to 10% by weight of copper, 0 to 5% by weight of each of indium, zinc and tin, and 0 to 4% by weight of each of gallium and germanium, ruthenium and/or rhenium. The sum of the contents of tin, zinc, indium, gallium and germanium lies between 1 and 5% by weight, of the total.
Description
$
The present invention relates to a solder alloy for dental and ~ewellery components an the basis of gold-palladlum-silver with additional base metal components.
The measures taken to reduce the costs of public health care in the Federal Republic of Germany in the past few years have resulted in an increased application of gold-reduced palladium-based alloys in dentistry. Unlike many alloys having high gold contents, such gold-reduced and palladium-based alloys have a white colour. The colour of the solders used ln dentistry heretoforP frequently is not optionally adapted to these new alloys since they usually have a yellow or yellowish colour.
Nickel is frequently use as a brightening agent.
However, it is known that nickel can cause allergies in human beings. Therefore, if possible, the use of nickel in dentistry should be avoided. This also applies to other toxic elements, as for example, cadmium, which is often added to solders in order to reduce the melting range. For example, a corresponding solder is described in the German Patent 732318.
Dental solder alloys must satisfy a number o requirements. They must be mouth-resistant and must have good wetting and flow characteristics; in colour and in their operating temperature they must be adapted to the alloys to be soldered. The soldered ~oint must have a high degree of strength.
For dental components that are to be provided with a ceramic coating, the soldered joint must have adequate strengths at baking temperatures of 950 to 980C in order to avoid changes in dimension of soldered parts. Since the production of metallic prostheses is carried out in several steps, it is expedient to have available a so-called second solder in addition to the first solder, the operating ternperature of the second solder being ~2~2~
lower to such an extent that subsequent soldering can be carried out without having to loosen the first solder.
In the region of the model cast with hase metal alloys (for example, cadmium-chromium alloys) nickel~containing solders are frequently used. When ~oining base metal parts and noble metal parts the base metal is first treated with a nickel-containing solder and then soldered wlth a lower-melting solder.
Since the base-metal alloys have a white colour, a white solder alloy is also favourable in this case. An operating temperature higher than 1000C is also required in this case when the base metal dental prosthesis is to be faced ceramically.
In order to reduce the melting range as compared with the dental alloys having fundamentally similar composition low-melting elements, such as zinc, tin, indium, gallium or germanium, are alloyed with the solder alloys. Two corresponding gold-based alloy types are described in the German Patent 2638837 and in the US Patent 3892564. The two solder types have operating temperatures ranging from 590C to maximally 850 C.
Therefore, they are not suitable for parts that are sub~ected to baking of ceramics.
In the jewellery industry alloys there also is a demand for solders which, in their colour, correspond as exactly as possible to the parts to be alloyed and yield high strength values of the soldered joints.
Since in the ~ewellery sec$or toxic and allergy-causing elements are avoided if possible, its is favourable when the solder contains no corresponding alloying constituents.
Partlcularly in the case of nickel-free white gold, it is of advantage when a white nickel-free solder also is available.
Therefore, it is an ob~ect of the present invention to provide a solder alloy for dental and jew~llery components that ~28~12~
is based on gold-palladium-silver with additiona] base metal components, i.e., a solder alloy which, in its colour, comes close to both the white gold-palladium alloys and the gold-based alloys in dentistry, which is free from health-hazardous components and whose resistance to high temperatures allows soldering prior to the baking of ceramics. Furthermore, it should be applicable to base metal dental alloys and to ~ewellery components.
According to the present invention the solder alloy contains 38 to 70% by weight of gold, 6 to 20% by weight of palladium, 6 to 40% by weight of silver, 1 to 6% by weight of iron, and/or cobalt, 0 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5% by weight of zinc, 0 to 5% by weight of indium, 0 to 4% by weight of galladium, 0 to 4% by weight of germanium, 0 to 1~ by weight of tungsten and 0 to 1% by weight of iridium, ruthernium and/or rhenium, the sum of the contents of tin, zinc, indium, gallium and germanium being at least 1% by weight and not more than 5% by weight of the total composition.
Alloys containing 50 to 70% by weight of gold, 8 to 20%
by weight of palladium, 14 to 20~ by weight of palladium, 14 to 20% by weight of silver, 1 to 6% by weight of iron and/or cobalt, 1 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5%
by weight of zinc, 0 to 5% by weight o* indium, 0 to 4% by weight of gallium, 0 to 4% by weight o~ germanium, 0 to 1% by weight of tungst~n and 0 to 1% by weight of lridium, ruthenium and for rhenium are preferably used. The sum of the content5 of tin, zinc, indium, gallium and germanium must be between 1 and 5% by weight.
For dental and jewellery components having an almost pure white colour tone a solder alloy containing 55 to 70% by weight of gold and 12 to 16% by weight of palladium in addition to the other constituents should be used.
3 ~ ~ ~
The addition oE l to 6% by weight of iron and/or cobalt to gold-silver alloys surprisingly results in an increase of the tensile strength of the alloys at room -temperature and at 900C.
At room temperature tensile strength values of up to 500 MPa are attained. Because of their intensely decolorizing action, iron and cobalt additionally have a favourable effect on the white colour of the alloy. For this reason it is possible to keep the proportion of the brightening agent palladium relatively low since the increase of the palladium content results in an undesirable increase in the operating temperature. Therefore, for white burn-on alloys and white base metal alloys solder alloys containing 55 to 70% by weight of gold and 12 to 16% by weight of palladium are particularly suitable since, in their colour tone, they are very simllar to the white alloys.
The elements zinc, tin, indium, galllum and germanium are useful for reducing the meltlng range and for improving the fluidity. However, their total proportion is restricted to approximately 5~ in the sum since a larger proportion r~sults in an embrittlement of the material, whereby the production of the solder in the custornary form as tape or bar material is rendered very difficult.
The operating temperature can be adjusted within wide limits by the variation of the copper content without substantially impairing the ductility. The white colour of the solder is practically not influenced if the increase of the copper content ls compensated by a reduction of the gold content.
The addition of up to 1% by weight of tungsten results in improved flow and we-tting characteristics and thus in more reliable soldered joints. Iridium, ruthenium and rhenium can be added in order to improve the fineness o~ grain.
~2~2~
The melting range, the operating temperature and the tensile strength of a number of solder alloys according to the present invention have been assembled in the Table hereafter.
Table Alloy ~u Pd Ag Others 1 GG ].~ 19 2,8 Co 1,4 In 1,~ Zll 0,2 Ir 2 59,9 l.9 ].4 7,0 Cu 2,9 Ee 2,0 In 0,5 Wo 0,2 Ir 3 58,4 8 20 7,0 Cu 2,0 Fe 3,0 In 1,0 Sn 0,5 lY 0,1 lr 4 38,9 8 40 7,0 C~.3 2,0 Fe ~,0 In 0,1 Ir Melting Range [C] Operating Tensile Strength [Mpa]
Tempera-ture [~ ~ _ 110~32 - 1141 1120 552 26 3914 - 975 960 598 n~b.
9850 - 937 950 n.b. n.b.
n.b.= not determined
The present invention relates to a solder alloy for dental and ~ewellery components an the basis of gold-palladlum-silver with additional base metal components.
The measures taken to reduce the costs of public health care in the Federal Republic of Germany in the past few years have resulted in an increased application of gold-reduced palladium-based alloys in dentistry. Unlike many alloys having high gold contents, such gold-reduced and palladium-based alloys have a white colour. The colour of the solders used ln dentistry heretoforP frequently is not optionally adapted to these new alloys since they usually have a yellow or yellowish colour.
Nickel is frequently use as a brightening agent.
However, it is known that nickel can cause allergies in human beings. Therefore, if possible, the use of nickel in dentistry should be avoided. This also applies to other toxic elements, as for example, cadmium, which is often added to solders in order to reduce the melting range. For example, a corresponding solder is described in the German Patent 732318.
Dental solder alloys must satisfy a number o requirements. They must be mouth-resistant and must have good wetting and flow characteristics; in colour and in their operating temperature they must be adapted to the alloys to be soldered. The soldered ~oint must have a high degree of strength.
For dental components that are to be provided with a ceramic coating, the soldered joint must have adequate strengths at baking temperatures of 950 to 980C in order to avoid changes in dimension of soldered parts. Since the production of metallic prostheses is carried out in several steps, it is expedient to have available a so-called second solder in addition to the first solder, the operating ternperature of the second solder being ~2~2~
lower to such an extent that subsequent soldering can be carried out without having to loosen the first solder.
In the region of the model cast with hase metal alloys (for example, cadmium-chromium alloys) nickel~containing solders are frequently used. When ~oining base metal parts and noble metal parts the base metal is first treated with a nickel-containing solder and then soldered wlth a lower-melting solder.
Since the base-metal alloys have a white colour, a white solder alloy is also favourable in this case. An operating temperature higher than 1000C is also required in this case when the base metal dental prosthesis is to be faced ceramically.
In order to reduce the melting range as compared with the dental alloys having fundamentally similar composition low-melting elements, such as zinc, tin, indium, gallium or germanium, are alloyed with the solder alloys. Two corresponding gold-based alloy types are described in the German Patent 2638837 and in the US Patent 3892564. The two solder types have operating temperatures ranging from 590C to maximally 850 C.
Therefore, they are not suitable for parts that are sub~ected to baking of ceramics.
In the jewellery industry alloys there also is a demand for solders which, in their colour, correspond as exactly as possible to the parts to be alloyed and yield high strength values of the soldered joints.
Since in the ~ewellery sec$or toxic and allergy-causing elements are avoided if possible, its is favourable when the solder contains no corresponding alloying constituents.
Partlcularly in the case of nickel-free white gold, it is of advantage when a white nickel-free solder also is available.
Therefore, it is an ob~ect of the present invention to provide a solder alloy for dental and jew~llery components that ~28~12~
is based on gold-palladium-silver with additiona] base metal components, i.e., a solder alloy which, in its colour, comes close to both the white gold-palladium alloys and the gold-based alloys in dentistry, which is free from health-hazardous components and whose resistance to high temperatures allows soldering prior to the baking of ceramics. Furthermore, it should be applicable to base metal dental alloys and to ~ewellery components.
According to the present invention the solder alloy contains 38 to 70% by weight of gold, 6 to 20% by weight of palladium, 6 to 40% by weight of silver, 1 to 6% by weight of iron, and/or cobalt, 0 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5% by weight of zinc, 0 to 5% by weight of indium, 0 to 4% by weight of galladium, 0 to 4% by weight of germanium, 0 to 1~ by weight of tungsten and 0 to 1% by weight of iridium, ruthernium and/or rhenium, the sum of the contents of tin, zinc, indium, gallium and germanium being at least 1% by weight and not more than 5% by weight of the total composition.
Alloys containing 50 to 70% by weight of gold, 8 to 20%
by weight of palladium, 14 to 20~ by weight of palladium, 14 to 20% by weight of silver, 1 to 6% by weight of iron and/or cobalt, 1 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5%
by weight of zinc, 0 to 5% by weight o* indium, 0 to 4% by weight of gallium, 0 to 4% by weight o~ germanium, 0 to 1% by weight of tungst~n and 0 to 1% by weight of lridium, ruthenium and for rhenium are preferably used. The sum of the content5 of tin, zinc, indium, gallium and germanium must be between 1 and 5% by weight.
For dental and jewellery components having an almost pure white colour tone a solder alloy containing 55 to 70% by weight of gold and 12 to 16% by weight of palladium in addition to the other constituents should be used.
3 ~ ~ ~
The addition oE l to 6% by weight of iron and/or cobalt to gold-silver alloys surprisingly results in an increase of the tensile strength of the alloys at room -temperature and at 900C.
At room temperature tensile strength values of up to 500 MPa are attained. Because of their intensely decolorizing action, iron and cobalt additionally have a favourable effect on the white colour of the alloy. For this reason it is possible to keep the proportion of the brightening agent palladium relatively low since the increase of the palladium content results in an undesirable increase in the operating temperature. Therefore, for white burn-on alloys and white base metal alloys solder alloys containing 55 to 70% by weight of gold and 12 to 16% by weight of palladium are particularly suitable since, in their colour tone, they are very simllar to the white alloys.
The elements zinc, tin, indium, galllum and germanium are useful for reducing the meltlng range and for improving the fluidity. However, their total proportion is restricted to approximately 5~ in the sum since a larger proportion r~sults in an embrittlement of the material, whereby the production of the solder in the custornary form as tape or bar material is rendered very difficult.
The operating temperature can be adjusted within wide limits by the variation of the copper content without substantially impairing the ductility. The white colour of the solder is practically not influenced if the increase of the copper content ls compensated by a reduction of the gold content.
The addition of up to 1% by weight of tungsten results in improved flow and we-tting characteristics and thus in more reliable soldered joints. Iridium, ruthenium and rhenium can be added in order to improve the fineness o~ grain.
~2~2~
The melting range, the operating temperature and the tensile strength of a number of solder alloys according to the present invention have been assembled in the Table hereafter.
Table Alloy ~u Pd Ag Others 1 GG ].~ 19 2,8 Co 1,4 In 1,~ Zll 0,2 Ir 2 59,9 l.9 ].4 7,0 Cu 2,9 Ee 2,0 In 0,5 Wo 0,2 Ir 3 58,4 8 20 7,0 Cu 2,0 Fe 3,0 In 1,0 Sn 0,5 lY 0,1 lr 4 38,9 8 40 7,0 C~.3 2,0 Fe ~,0 In 0,1 Ir Melting Range [C] Operating Tensile Strength [Mpa]
Tempera-ture [~ ~ _ 110~32 - 1141 1120 552 26 3914 - 975 960 598 n~b.
9850 - 937 950 n.b. n.b.
n.b.= not determined
Claims (2)
OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A solder alloy for dental and jewellery components based on gold-palladium-silver with additional base metal components, containing 38 to 70% by weight of gold, 6 to 20% of palladium, 8 to 40% of silver, 1 to 6% by weight of iron and for cobalt, 0 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5% by weight of zinc, 0 to 5% by weight of indium, 0 to 4% by weight of gallium, 0 to 4% by weight of germanium, 0 to 1% by weight of tungsten and 0 to 1% by weight of iridium, ruthenium and/or rhenium, and the sum of the contents of tin, zinc, indium, gallium and germanium being at least 1% by weight and not more than, 5% by weight of the total components.
2. A solder alloy as claimed in claim 1, containing 50 to 70% by weight of gold, 8 to 20% by weight of palladium, 14 to 20% by weight of silver 1 to 6% by weight of iron and/or cobalt, 1 to 10% by weight of copper, 0 to 5% by weight of tin, 0 to 5%
by weight of zinc, 0 to 5% by weight of indium, 0 to 4% by weight of gallium, 0 to 4% by weight of germanium, 0 to 1% by weight of tungsten and 0 to 1% by weight of iridium, ruthernium and/or rhenium, and the sum of the contents of tin, zinc, indium, gallium and germanium lying between ]. and 5% by weight of the total components.
by weight of zinc, 0 to 5% by weight of indium, 0 to 4% by weight of gallium, 0 to 4% by weight of germanium, 0 to 1% by weight of tungsten and 0 to 1% by weight of iridium, ruthernium and/or rhenium, and the sum of the contents of tin, zinc, indium, gallium and germanium lying between ]. and 5% by weight of the total components.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3935813A DE3935813A1 (en) | 1989-10-27 | 1989-10-27 | SOLDER ALLOY FOR DENTAL AND JEWELRY PARTS |
| DEP3935813.5 | 1989-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2028628A1 true CA2028628A1 (en) | 1991-04-28 |
Family
ID=6392360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002028628A Abandoned CA2028628A1 (en) | 1989-10-27 | 1990-10-26 | Solder alloy for dental and jewellery components |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0424775B1 (en) |
| JP (1) | JPH03165997A (en) |
| AT (1) | ATE108112T1 (en) |
| AU (1) | AU633644B2 (en) |
| CA (1) | CA2028628A1 (en) |
| DE (2) | DE3935813A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9108512U1 (en) * | 1991-07-10 | 1991-12-05 | Dr. Bernhard Braun GmbH, 4047 Dormagen | Device for holding gemstones |
| GB9314292D0 (en) * | 1993-07-10 | 1993-08-25 | Johnson Matthey Plc | Gold alloy |
| DE4410873A1 (en) * | 1994-03-29 | 1995-10-19 | Viktor H J Kosturik Fa | Profile for widening ring width of jewelry rings |
| DE19607104C1 (en) * | 1996-02-24 | 1997-03-06 | Degussa | Gold-tin dental soldering alloy |
| RU2135618C1 (en) * | 1998-08-10 | 1999-08-27 | Открытое акционерное общество "Екатеринбургский завод по обработке цветных металлов" | White-gold alloy |
| CN100408256C (en) * | 2006-11-26 | 2008-08-06 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| ITVR20070134A1 (en) * | 2007-09-27 | 2009-03-28 | Legor Group S R L | ALLOY FOR GOLDSMITH FOR THE REALIZATION OF OBJECTS-FREE WHITE GOLD OBJECTS |
| RU2361942C1 (en) * | 2008-03-27 | 2009-07-20 | Юлия Алексеевна Щепочкина | Alloy on basis of aurum |
| RU2365654C1 (en) * | 2008-08-15 | 2009-08-27 | Юлия Алексеевна Щепочкина | Gold-base alloy |
| CN103643102B (en) * | 2013-11-20 | 2015-12-09 | 北海鑫利坤金属材料科技开发有限公司 | A kind of Silver alloy auxiliary alloy material and preparation method thereof |
| EP3783124B1 (en) * | 2019-08-23 | 2024-08-07 | Omega SA | Gold timepiece, ornament or jewellery |
| JP7726575B1 (en) * | 2025-03-13 | 2025-08-20 | 株式会社トップジュエリー | Alloy for jewelry and its manufacturing method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE584549C (en) * | 1929-09-05 | 1933-09-21 | Siebert G M B H G | Payable gold alloys |
| DE684186C (en) * | 1937-05-13 | 1939-11-23 | Degussa | Use of palladium alloys for dental purposes |
| DE732318C (en) * | 1938-10-27 | 1943-02-27 | Degussa | Gold solder |
| NL277271A (en) * | 1961-04-17 | |||
| DE2139331C3 (en) * | 1971-08-06 | 1979-08-16 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Copper-free dental gold alloys |
| GB1444350A (en) * | 1972-10-03 | 1976-07-28 | Johnson Matthey Co Ltd | Dental alloys |
| DE2636039C3 (en) * | 1976-08-11 | 1980-12-11 | Degussa Ag, 6000 Frankfurt | Copper and cadmium-free dental gold solders |
| DE2638837C3 (en) * | 1976-08-28 | 1979-06-07 | W.C. Heraeus Gmbh, 6450 Hanau | Gold-based dental solder alloy |
| DE2741277C3 (en) * | 1977-09-14 | 1980-03-27 | Fa. Dr. Th. Wieland, 7530 Pforzheim | Copper-free gold casting alloy for dental purposes |
| DE2828304C2 (en) * | 1978-06-28 | 1979-09-27 | Fa. Dr. Th. Wieland, 7530 Pforzheim | Dental precious metal alloy for firing porcelain |
| DE3146794C2 (en) * | 1981-11-26 | 1985-07-04 | Degussa Ag, 6000 Frankfurt | Precious metal alloy for firing dental porcelain |
| CA1330169C (en) * | 1987-05-13 | 1994-06-14 | Asami Tanaka | Metal foil for metal-porcelain dental restorations |
| DE3819904C1 (en) * | 1988-06-11 | 1989-11-02 | Degussa Ag, 6000 Frankfurt, De |
-
1989
- 1989-10-27 DE DE3935813A patent/DE3935813A1/en active Granted
-
1990
- 1990-10-15 EP EP90119723A patent/EP0424775B1/en not_active Expired - Lifetime
- 1990-10-15 DE DE59006356T patent/DE59006356D1/en not_active Expired - Fee Related
- 1990-10-15 AT AT90119723T patent/ATE108112T1/en not_active IP Right Cessation
- 1990-10-25 AU AU65507/90A patent/AU633644B2/en not_active Ceased
- 1990-10-26 CA CA002028628A patent/CA2028628A1/en not_active Abandoned
- 1990-10-26 JP JP2287359A patent/JPH03165997A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU633644B2 (en) | 1993-02-04 |
| DE59006356D1 (en) | 1994-08-11 |
| JPH03165997A (en) | 1991-07-17 |
| ATE108112T1 (en) | 1994-07-15 |
| DE3935813C2 (en) | 1991-09-19 |
| EP0424775A1 (en) | 1991-05-02 |
| AU6550790A (en) | 1991-05-02 |
| EP0424775B1 (en) | 1994-07-06 |
| DE3935813A1 (en) | 1991-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued | ||
| FZDE | Discontinued |
Effective date: 19950426 |
|
| FZDE | Discontinued |
Effective date: 19950426 |