CA2000431A1 - A method of preparing thin layers of conductive polymers - Google Patents

A method of preparing thin layers of conductive polymers

Info

Publication number
CA2000431A1
CA2000431A1 CA2000431A CA2000431A CA2000431A1 CA 2000431 A1 CA2000431 A1 CA 2000431A1 CA 2000431 A CA2000431 A CA 2000431A CA 2000431 A CA2000431 A CA 2000431A CA 2000431 A1 CA2000431 A1 CA 2000431A1
Authority
CA
Canada
Prior art keywords
conductive
dispersion
conductive polymers
thin layers
polymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2000431A
Other languages
French (fr)
Other versions
CA2000431C (en
Inventor
Bernhard Wessling
Holger Merkle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zipperling Kessler GmbH and Co
Original Assignee
Bernhard Wessling
Holger Merkle
Zipperling Kessler & Co. (G.M.B.H. & Co.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3834526A external-priority patent/DE3834526A1/en
Application filed by Bernhard Wessling, Holger Merkle, Zipperling Kessler & Co. (G.M.B.H. & Co.) filed Critical Bernhard Wessling
Publication of CA2000431A1 publication Critical patent/CA2000431A1/en
Application granted granted Critical
Publication of CA2000431C publication Critical patent/CA2000431C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28537—Deposition of Schottky electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28581—Deposition of Schottky electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0263—After-treatment with IR heaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/029—After-treatment with microwaves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/52—Two layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more

Abstract

Process for producing preforms of intrinsically conductive polymers used as conductive laminated components, with a specific conductivity > 1 10<-2>S/cm, and which can contain other materials as substrate. In said process, the conductive component is built up by separation from a metastable dispersion of the intrinsically conductive polymers. Preferably, the conductive component is separated without current from the dispersion as a layer on the substrate. For implementing the process, a dispersion of insoluble organic polymers, which are given an electrically conductive form by oxidation agents or by acids, in an aqueous or organic medium with a solubility parameter >/= 8.6 [cal/cm<3>]<1/2>, which can be filtered without decoloration through a press filter with a pore width of 250 nm, is suitable.
CA002000431A 1988-10-11 1989-10-11 A method of preparing thin layers of conductive polymers Expired - Fee Related CA2000431C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE3834526A DE3834526A1 (en) 1988-10-11 1988-10-11 Process for the production of thin layers of conductive polymers, and the use of the coated substrates
DEP3834526.9 1988-10-11
DE3903200 1989-02-03
DEP3903200.0 1989-02-03
DEP3907603.2 1989-03-09
DE3907603 1989-03-09

Publications (2)

Publication Number Publication Date
CA2000431A1 true CA2000431A1 (en) 1990-04-11
CA2000431C CA2000431C (en) 2000-01-25

Family

ID=27198349

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002000431A Expired - Fee Related CA2000431C (en) 1988-10-11 1989-10-11 A method of preparing thin layers of conductive polymers

Country Status (7)

Country Link
EP (1) EP0407492B1 (en)
JP (1) JP2519551B2 (en)
KR (1) KR960001314B1 (en)
AT (1) ATE156295T1 (en)
CA (1) CA2000431C (en)
DE (1) DE58909810D1 (en)
WO (1) WO1990004256A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658649A (en) * 1992-03-13 1997-08-19 The Regents Of The University Of California Office Of Technology Transfer Corrosion resistant coating
US5824371A (en) * 1995-02-03 1998-10-20 Ohio State University Research Foundation Corrosion resistant metal article coated with emeraldine base polyaniline
US5928795A (en) * 1995-02-03 1999-07-27 Polymer Alloys Llc Corrosion resistant aluminum article coated with emeraldine base polyaniline
US7396596B2 (en) * 2004-06-23 2008-07-08 Ormecon Gmbh Article with a coating of electrically conductive polymer
US7547479B2 (en) 2004-06-25 2009-06-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
US7947199B2 (en) 2005-03-02 2011-05-24 Ormecon Gmbh Conductive polymers consisting of anisotropic morphology particles
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW278096B (en) * 1992-09-24 1996-06-11 Dsm Nv
EP0817557A3 (en) * 1996-07-03 1998-05-06 Nisshinbo Industries, Inc. Electromagnetic radiation shield material and method of producing the same
DE19627071A1 (en) 1996-07-05 1998-01-08 Bayer Ag Electroluminescent devices
US6593690B1 (en) 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
US6890868B2 (en) * 2002-10-17 2005-05-10 Xerox Corporation Process for depositing gelable composition that includes dissolving gelable composition in liquid with agitating to disrupt gelling
US6803262B2 (en) * 2002-10-17 2004-10-12 Xerox Corporation Process using self-organizable polymer
DE102006043811B4 (en) * 2006-09-13 2010-05-06 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious / semiprecious metal and process for their preparation
DE102007040065A1 (en) * 2007-08-24 2009-02-26 Ormecon Gmbh Article with a nanoscopic coating of precious / semi-precious metal and process for its preparation
EP2371909A1 (en) 2010-03-31 2011-10-05 Nissan Motor Co., Ltd. Corrosion-protective wax composition containing polyaniline in a doped form and a liquid paraffin
DE202015008773U1 (en) 2015-12-22 2016-01-28 Continental Automotive Gmbh Plug contact with organic coating and printed circuit board arrangement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH659908A5 (en) * 1982-05-26 1987-02-27 Bbc Brown Boveri & Cie METHOD FOR INCREASING THE ELECTRICAL SURFACE CONDUCTIVITY OF A BODY.
DE3422316C2 (en) * 1984-06-15 1986-11-20 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Process for the production of deformable polymer blends from electrically conductive organic polymers and / or organic conductors, device for carrying out the process and use of the polymer blends
FR2616790A1 (en) * 1987-06-22 1988-12-23 Rhone Poulenc Chimie Dispersions of composite particles based on an electrically conductive polymer and process for their preparation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658649A (en) * 1992-03-13 1997-08-19 The Regents Of The University Of California Office Of Technology Transfer Corrosion resistant coating
US5824371A (en) * 1995-02-03 1998-10-20 Ohio State University Research Foundation Corrosion resistant metal article coated with emeraldine base polyaniline
US5928795A (en) * 1995-02-03 1999-07-27 Polymer Alloys Llc Corrosion resistant aluminum article coated with emeraldine base polyaniline
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers
US7396596B2 (en) * 2004-06-23 2008-07-08 Ormecon Gmbh Article with a coating of electrically conductive polymer
US7547479B2 (en) 2004-06-25 2009-06-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
US7947199B2 (en) 2005-03-02 2011-05-24 Ormecon Gmbh Conductive polymers consisting of anisotropic morphology particles
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof

Also Published As

Publication number Publication date
ATE156295T1 (en) 1997-08-15
CA2000431C (en) 2000-01-25
KR960001314B1 (en) 1996-01-25
JPH02503660A (en) 1990-11-01
DE58909810D1 (en) 1997-09-04
EP0407492B1 (en) 1997-07-30
WO1990004256A1 (en) 1990-04-19
JP2519551B2 (en) 1996-07-31
EP0407492A1 (en) 1991-01-16
KR900702540A (en) 1990-12-07

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