CA1296781C - Arrangement for removable connection between substrates - Google Patents
Arrangement for removable connection between substratesInfo
- Publication number
- CA1296781C CA1296781C CA000587471A CA587471A CA1296781C CA 1296781 C CA1296781 C CA 1296781C CA 000587471 A CA000587471 A CA 000587471A CA 587471 A CA587471 A CA 587471A CA 1296781 C CA1296781 C CA 1296781C
- Authority
- CA
- Canada
- Prior art keywords
- contact
- connector
- power supply
- substrate
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Installation Of Bus-Bars (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
ABSTRACT
First and second substrates each carrying electronic components are interconnected by means of first and second connectors for connecting signal lines and a third connector for supplying power. The first connector is mounted on the first substrate and the second connector is mounted on an edge portion of the second substrate and adapted to be engaged with the first connector. The third connector is mounted on the first substrate and has a first and a second contact. A first power supply voltage is connected to the first contact and a second power supply voltage higher than the first source voltage is connected to the second contact. The third connector has a third contact provided in the vicinity of the edge portion of the second substrate and adapted to contact the first contact of the third connector during an initial stage of an engaging process between the first and the second connectors and to contact the second contact of the third connector after the initial period.
The invention eliminates the occurrence of sparks from the power supply contacts on connection or disconnection.
First and second substrates each carrying electronic components are interconnected by means of first and second connectors for connecting signal lines and a third connector for supplying power. The first connector is mounted on the first substrate and the second connector is mounted on an edge portion of the second substrate and adapted to be engaged with the first connector. The third connector is mounted on the first substrate and has a first and a second contact. A first power supply voltage is connected to the first contact and a second power supply voltage higher than the first source voltage is connected to the second contact. The third connector has a third contact provided in the vicinity of the edge portion of the second substrate and adapted to contact the first contact of the third connector during an initial stage of an engaging process between the first and the second connectors and to contact the second contact of the third connector after the initial period.
The invention eliminates the occurrence of sparks from the power supply contacts on connection or disconnection.
Description
ARRANGEMENT FOR REMOVABLE CONNECTION
BETWEEN SUBSTRATES
B~CKGROUND OF THE INVENTION
The present invention relates to an arrangement for removable connection between substrates each mounting electronic circuits thereon.
In a conventional apparatus, a package with electronic circuits mounted on a substrate is connected to a mother board mounting electronic circuits. Such a connection is made by a coupling between a connector or connectors attached to one surface of the mother board and a connector or connectors provided on an edge portion of the substrate of the package. The connector mounted on the one surface of the mother board has a plurality of signal pins and at least one power supply pin. The connector provided on the edge portion of the substrate of the package comprises signal sockets into which the signal pins of the mother board connector are inserted, and a power supply socket lnto which the power supply pin of the mother board connector is inserted.
There is a recent tendency of electronic apparatus such as a computer that'it is powered continuously for a continuous operation thereof. In order to realize such a continuous operation of the electronic apparatus, it has been usual that the power supply pin o~ the .
~Q,I~
package connector is made longer than the signal pins, so that connection or disconnection of the signal pins to or from the signal sockets can be made after a power supply to the respective circuits of the package has been started or before the power supply is terminated.
Thus, an undesirable signal which might be produced in the circuits of the package by a connection or disconnection of the power supply to or from the circuits of the package is prevented from being transmitted to the circuits on the mother board and thus an abnormal operation of the electronic apparatus can be prevented.
~ lowever, with the recent tendency of increased power consumption per package due to increased circuit density of packages of conventional electronic apparatus, a spark may be produced between the power supply pin and the power supply socket when the connectors are connected to each other or disconnected from each other. The result'ing spark causes a power supply voltage variation on the circuits on -the mother board.
SUMMARY OF THE INVENTION
According to an aspect of the invention, there is provided an arrangement for removable connection ;between substrates which comprises: a first and a ~25 second substrate; a first connector mounted on the ,7~3~
first substrate, a second connector mounted on an edge portion of the second substrate and adapted to be engaged with the first connector, a third connector mounted on the first substrate and having a first and a second contact; and a third contact provided on the second substrate in the vicinity of the edge portion thereof and adapted to contact the first contact of the third connector during an initial stage of an engaging process between the first and the second connectors and to contact the second contact of the third connector aEter -the initial stage.
BRIEF DESCRIPTION OF THE DRAWINGS
Other features and advantages of -the invention will become apparent from the following description when taken in conjunction with accompanying drawings, in which:
Fig. 1 is a perspective view of an embodiment of the invention;
Fig. 2 shows a side view of the embodiment in which a package is completely separated from a mother board;
Fig. 3 shows a cross-sectional view taken along a li~e A-A in Fig. 2;
Fig. 4 is a side view of the embodiment in an initial stage of engagement of the package with the mother board;
i7~
Fig. 5 is a cross-sectional view taken along a line B-B in Fig. 4;
Fig. 6 shows a side view of the embodiment in which the package is completely engaged with the mother board;
and Fig. 7 shows a cross-sectional view taken along a line C-C in Fig. 6.
In the drawings, the same reference numerals represent the same structural elements.
DET~ILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to Fig. 1, an e~lbodimen-t oE the invention comprises a signal plug connector 3 mounted on a mo-ther board 1 and including a plurality of signal pins, a signal socket connector 4 mounted on a package 2 and including sockets adapted to be engaged in a one-to-one correspondence with the pins of the connector 3, a power source socket connector 5 mounted on the board 1, and a male contact 7 provided on the package 2 and adapted to be connected mechanically and electrically to the connector 5.
The connector 5 contains ~emale contacts 6a and 6b arranged in parallel to each other. The contacts 6a and 6b are connected to an auxiliary power supply source and a main power supply source, respectively.
The supply voltage of the auxiliary power supply source i7~L
is set so as to be lower than that of the main power supply source.
On the other hand, the contact 7 takes a steped pattern as shown in Fig. 1. The height of the step of the contact 7 is set as substantially equal to the distance between the contaets 6a and 6b.
Description will next be made on eonnection and disconnection of the package 2 to and from the board 1 while circuits on the package 2 are kept active.
Fig. 2 shows the paekage 2 and the boarcl 1 whieh are not engaged with each other as yet, ancl E'ig. 3 is a cross-seetional view taken along a line A-A in ~i~. 2.
The contacts 6a and 6b of the connector 5 are in electrical connection with the auxiliary power supply source and the main power supply source, respectively, as mentioned above. In Fig. 2, points depicted by D and E are contact points of the contacts 6a and 6b to which the contact 7 is to be connected.
; As the paekage 2 is moved toward the board 1, an upper portion o~ the contact 7 first comes in contact with the contaet 6a at the contact point D, so that the circuits on the package 2 are supplied through the contaet 6a with the auxiliary supply voltage and are ready to operate, as shown in Figs. 4 and 5. In Fig. 4, the conneetion between the signal pins and the sockets is not established as yet. Due to the X~8~
~ 6 --lower supply voltage of the auxiliary power supply source, a spark hardly occurs between the contac-t 6a and the contact 7.
With a further movement of the package 2 toward -the board 1, the contact of the contact 6a with the contact 7 is broken and a lower step portion of the contact 7 is brought in contact with the contact 6b electrically connected to the main power supply source, at the contact point E, as shown in Figs. 6 and 7~ In Fig. 6, the signal pins of the connector 3 are in contact wit:h the sockets oE the connector ~, so that the circuits on the package 2 is brought in a normal operation.
It should be noted that, in an intermediate state between those shown in Figs. 4 and 6, both of the contacts 6a and 6b are in contact wi-th the contact 7.
Therefore, the switching from the auxiliary power supply source to the main power supply source is performed without electrical disconnection.
In a case where the package 2 is to be disconnected from the board 1, a reverse operation to that mentioned above is performed. That is, in an initial stage of disconnection, the lower step portion of the contact 7 is separated from the contact 6b, and the signal pins of the connector 3 are separated from the sockets of the connector 4. Then, the upper step portion of the contact 7 is separated from the contact 6a without producing a spark therebetween.
:
, . .
While this invention has thus far been described in conjunction with the preferred embodiment thereof, it will now readily be possible for those skilled in the art to put this invention into practice in various other manners.
BETWEEN SUBSTRATES
B~CKGROUND OF THE INVENTION
The present invention relates to an arrangement for removable connection between substrates each mounting electronic circuits thereon.
In a conventional apparatus, a package with electronic circuits mounted on a substrate is connected to a mother board mounting electronic circuits. Such a connection is made by a coupling between a connector or connectors attached to one surface of the mother board and a connector or connectors provided on an edge portion of the substrate of the package. The connector mounted on the one surface of the mother board has a plurality of signal pins and at least one power supply pin. The connector provided on the edge portion of the substrate of the package comprises signal sockets into which the signal pins of the mother board connector are inserted, and a power supply socket lnto which the power supply pin of the mother board connector is inserted.
There is a recent tendency of electronic apparatus such as a computer that'it is powered continuously for a continuous operation thereof. In order to realize such a continuous operation of the electronic apparatus, it has been usual that the power supply pin o~ the .
~Q,I~
package connector is made longer than the signal pins, so that connection or disconnection of the signal pins to or from the signal sockets can be made after a power supply to the respective circuits of the package has been started or before the power supply is terminated.
Thus, an undesirable signal which might be produced in the circuits of the package by a connection or disconnection of the power supply to or from the circuits of the package is prevented from being transmitted to the circuits on the mother board and thus an abnormal operation of the electronic apparatus can be prevented.
~ lowever, with the recent tendency of increased power consumption per package due to increased circuit density of packages of conventional electronic apparatus, a spark may be produced between the power supply pin and the power supply socket when the connectors are connected to each other or disconnected from each other. The result'ing spark causes a power supply voltage variation on the circuits on -the mother board.
SUMMARY OF THE INVENTION
According to an aspect of the invention, there is provided an arrangement for removable connection ;between substrates which comprises: a first and a ~25 second substrate; a first connector mounted on the ,7~3~
first substrate, a second connector mounted on an edge portion of the second substrate and adapted to be engaged with the first connector, a third connector mounted on the first substrate and having a first and a second contact; and a third contact provided on the second substrate in the vicinity of the edge portion thereof and adapted to contact the first contact of the third connector during an initial stage of an engaging process between the first and the second connectors and to contact the second contact of the third connector aEter -the initial stage.
BRIEF DESCRIPTION OF THE DRAWINGS
Other features and advantages of -the invention will become apparent from the following description when taken in conjunction with accompanying drawings, in which:
Fig. 1 is a perspective view of an embodiment of the invention;
Fig. 2 shows a side view of the embodiment in which a package is completely separated from a mother board;
Fig. 3 shows a cross-sectional view taken along a li~e A-A in Fig. 2;
Fig. 4 is a side view of the embodiment in an initial stage of engagement of the package with the mother board;
i7~
Fig. 5 is a cross-sectional view taken along a line B-B in Fig. 4;
Fig. 6 shows a side view of the embodiment in which the package is completely engaged with the mother board;
and Fig. 7 shows a cross-sectional view taken along a line C-C in Fig. 6.
In the drawings, the same reference numerals represent the same structural elements.
DET~ILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to Fig. 1, an e~lbodimen-t oE the invention comprises a signal plug connector 3 mounted on a mo-ther board 1 and including a plurality of signal pins, a signal socket connector 4 mounted on a package 2 and including sockets adapted to be engaged in a one-to-one correspondence with the pins of the connector 3, a power source socket connector 5 mounted on the board 1, and a male contact 7 provided on the package 2 and adapted to be connected mechanically and electrically to the connector 5.
The connector 5 contains ~emale contacts 6a and 6b arranged in parallel to each other. The contacts 6a and 6b are connected to an auxiliary power supply source and a main power supply source, respectively.
The supply voltage of the auxiliary power supply source i7~L
is set so as to be lower than that of the main power supply source.
On the other hand, the contact 7 takes a steped pattern as shown in Fig. 1. The height of the step of the contact 7 is set as substantially equal to the distance between the contaets 6a and 6b.
Description will next be made on eonnection and disconnection of the package 2 to and from the board 1 while circuits on the package 2 are kept active.
Fig. 2 shows the paekage 2 and the boarcl 1 whieh are not engaged with each other as yet, ancl E'ig. 3 is a cross-seetional view taken along a line A-A in ~i~. 2.
The contacts 6a and 6b of the connector 5 are in electrical connection with the auxiliary power supply source and the main power supply source, respectively, as mentioned above. In Fig. 2, points depicted by D and E are contact points of the contacts 6a and 6b to which the contact 7 is to be connected.
; As the paekage 2 is moved toward the board 1, an upper portion o~ the contact 7 first comes in contact with the contaet 6a at the contact point D, so that the circuits on the package 2 are supplied through the contaet 6a with the auxiliary supply voltage and are ready to operate, as shown in Figs. 4 and 5. In Fig. 4, the conneetion between the signal pins and the sockets is not established as yet. Due to the X~8~
~ 6 --lower supply voltage of the auxiliary power supply source, a spark hardly occurs between the contac-t 6a and the contact 7.
With a further movement of the package 2 toward -the board 1, the contact of the contact 6a with the contact 7 is broken and a lower step portion of the contact 7 is brought in contact with the contact 6b electrically connected to the main power supply source, at the contact point E, as shown in Figs. 6 and 7~ In Fig. 6, the signal pins of the connector 3 are in contact wit:h the sockets oE the connector ~, so that the circuits on the package 2 is brought in a normal operation.
It should be noted that, in an intermediate state between those shown in Figs. 4 and 6, both of the contacts 6a and 6b are in contact wi-th the contact 7.
Therefore, the switching from the auxiliary power supply source to the main power supply source is performed without electrical disconnection.
In a case where the package 2 is to be disconnected from the board 1, a reverse operation to that mentioned above is performed. That is, in an initial stage of disconnection, the lower step portion of the contact 7 is separated from the contact 6b, and the signal pins of the connector 3 are separated from the sockets of the connector 4. Then, the upper step portion of the contact 7 is separated from the contact 6a without producing a spark therebetween.
:
, . .
While this invention has thus far been described in conjunction with the preferred embodiment thereof, it will now readily be possible for those skilled in the art to put this invention into practice in various other manners.
Claims (2)
1. An arrangement for removable connection between substrates comprising: a first and a second substrate;
a first connector mounted on said first substrate; a second connector mounted on an edge portion of said second substrate and adapted to be engaged with said first connector; a third connector mounted on said first substrate and having a first and a second contact;
and a third contact provided in the vicinity of said edge portion of said second substrate and adapted to contact said first contact of said third connector during an initial stage of an engaging process between said first and said second connectors and to contact said second contact of said third connector after said initial period.
a first connector mounted on said first substrate; a second connector mounted on an edge portion of said second substrate and adapted to be engaged with said first connector; a third connector mounted on said first substrate and having a first and a second contact;
and a third contact provided in the vicinity of said edge portion of said second substrate and adapted to contact said first contact of said third connector during an initial stage of an engaging process between said first and said second connectors and to contact said second contact of said third connector after said initial period.
2. An arrangement as claimed in claim 1, wherein a first power supply voltage is applied to said first contact and a second power supply voltage higher than said first source voltage is applied to said second contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988A JP2603978B2 (en) | 1988-01-04 | 1988-01-04 | Insulation spacer |
| JP188/1988 | 1988-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1296781C true CA1296781C (en) | 1992-03-03 |
Family
ID=11462695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000587471A Expired - Fee Related CA1296781C (en) | 1988-01-04 | 1989-01-04 | Arrangement for removable connection between substrates |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2603978B2 (en) |
| CA (1) | CA1296781C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0845844B1 (en) * | 1996-11-29 | 2003-05-02 | Siemens Aktiengesellschaft | Gas-insulated busway with an axially fixed, disc-shaped supporting insulator |
-
1988
- 1988-01-04 JP JP1988A patent/JP2603978B2/en not_active Expired - Lifetime
-
1989
- 1989-01-04 CA CA000587471A patent/CA1296781C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01177814A (en) | 1989-07-14 |
| JP2603978B2 (en) | 1997-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |