CA1293825C - Silicon grid as a reference and calibration standard in a particle beam lithography system - Google Patents
Silicon grid as a reference and calibration standard in a particle beam lithography systemInfo
- Publication number
- CA1293825C CA1293825C CA000593630A CA593630A CA1293825C CA 1293825 C CA1293825 C CA 1293825C CA 000593630 A CA000593630 A CA 000593630A CA 593630 A CA593630 A CA 593630A CA 1293825 C CA1293825 C CA 1293825C
- Authority
- CA
- Canada
- Prior art keywords
- grid
- particle beam
- stage
- die
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 23
- 239000010703 silicon Substances 0.000 title claims abstract description 23
- 238000002039 particle-beam lithography Methods 0.000 title claims abstract description 13
- 239000002245 particle Substances 0.000 claims abstract description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 238000002050 diffraction method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000001459 lithography Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 2
- 241001508687 Mustela erminea Species 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30433—System calibration
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electron Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US167,601 | 1988-03-14 | ||
| US07/167,601 US4885472A (en) | 1988-03-14 | 1988-03-14 | Silicon grid as a reference and calibration standard in a particle beam lithography system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1293825C true CA1293825C (en) | 1991-12-31 |
Family
ID=22608021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000593630A Expired - Lifetime CA1293825C (en) | 1988-03-14 | 1989-03-14 | Silicon grid as a reference and calibration standard in a particle beam lithography system |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4885472A (de) |
| EP (1) | EP0333098B1 (de) |
| JP (1) | JP2738558B2 (de) |
| CA (1) | CA1293825C (de) |
| DE (1) | DE68919247T2 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231708A (ja) * | 1989-03-06 | 1990-09-13 | Fujitsu Ltd | 半導体装置の位置合わせマーク検出方法及び装置 |
| US5043586A (en) * | 1990-10-25 | 1991-08-27 | International Business Machines Corporation | Planarized, reusable calibration grids |
| US5155359A (en) * | 1991-04-05 | 1992-10-13 | Metrologix, Inc. | Atomic scale calibration system |
| US5920067A (en) * | 1992-03-13 | 1999-07-06 | The United States Of America As Represented By The Secretary Of Commerce | Monocrystalline test and reference structures, and use for calibrating instruments |
| US5345085A (en) * | 1993-03-26 | 1994-09-06 | Etec Systems, Inc. | Method and structure for electronically measuring beam parameters |
| US5416821A (en) * | 1993-05-10 | 1995-05-16 | Trw Inc. | Grid formed with a silicon substrate |
| US5703373A (en) * | 1995-11-03 | 1997-12-30 | The United States Of America As Represented By The Secretary Of The Navy | Alignment fiducial for improving patterning placement accuracy in e-beam masks for x-ray lithography |
| US5747802A (en) * | 1996-03-29 | 1998-05-05 | Siemens Aktiengesellschaft | Automated non-visual method of locating periodically arranged sub-micron objects |
| KR100191347B1 (ko) * | 1996-08-09 | 1999-06-15 | 윤종용 | 반도체 공정의 주사전자현미경 관리용 미세선폭 관리시료 |
| GB2324650A (en) * | 1997-04-25 | 1998-10-28 | Leica Lithography Systems Ltd | Pattern-writing machine |
| US6246053B1 (en) * | 1999-03-22 | 2001-06-12 | International Business Machines Corporation | Non-contact autofocus height detector for lithography systems |
| JP2005116731A (ja) * | 2003-10-07 | 2005-04-28 | Hitachi High-Technologies Corp | 電子ビーム描画装置及び電子ビーム描画方法 |
| CN101248505B (zh) * | 2005-07-08 | 2010-12-15 | 耐克斯金思美控股公司 | 受控粒子束制造用的设备和方法 |
| WO2008140585A1 (en) | 2006-11-22 | 2008-11-20 | Nexgen Semi Holding, Inc. | Apparatus and method for conformal mask manufacturing |
| JP5361137B2 (ja) * | 2007-02-28 | 2013-12-04 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビーム測長装置 |
| EP2003526A1 (de) * | 2007-06-13 | 2008-12-17 | Carl Zeiss SMT Limited | Verfahren und Vorrichtung zur Steuerung und Überwachung einer Position eines Halteelements |
| US10991545B2 (en) | 2008-06-30 | 2021-04-27 | Nexgen Semi Holding, Inc. | Method and device for spatial charged particle bunching |
| US10566169B1 (en) | 2008-06-30 | 2020-02-18 | Nexgen Semi Holding, Inc. | Method and device for spatial charged particle bunching |
| JP5461878B2 (ja) * | 2009-04-28 | 2014-04-02 | 株式会社ニューフレアテクノロジー | ドリフト測定方法、荷電粒子ビーム描画方法および荷電粒子ビーム描画装置 |
| US10807187B2 (en) * | 2015-09-24 | 2020-10-20 | Arcam Ab | X-ray calibration standard object |
| US12493005B1 (en) | 2022-06-07 | 2025-12-09 | Nexgen Semi Holding, Inc. | Extended range active illumination imager |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4517465A (en) * | 1983-03-29 | 1985-05-14 | Veeco/Ai, Inc. | Ion implantation control system |
| DE3410885A1 (de) * | 1984-03-24 | 1985-10-03 | Ibm Deutschland Gmbh, 7000 Stuttgart | Fehlerkorrigierte korpuskularstrahllithographie |
| US4587433A (en) * | 1984-06-27 | 1986-05-06 | Eaton Corporation | Dose control apparatus |
-
1988
- 1988-03-14 US US07/167,601 patent/US4885472A/en not_active Expired - Lifetime
-
1989
- 1989-03-13 DE DE68919247T patent/DE68919247T2/de not_active Expired - Fee Related
- 1989-03-13 EP EP89104398A patent/EP0333098B1/de not_active Expired - Lifetime
- 1989-03-14 JP JP1059876A patent/JP2738558B2/ja not_active Expired - Fee Related
- 1989-03-14 CA CA000593630A patent/CA1293825C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE68919247T2 (de) | 1995-03-16 |
| EP0333098A2 (de) | 1989-09-20 |
| US4885472A (en) | 1989-12-05 |
| JP2738558B2 (ja) | 1998-04-08 |
| DE68919247D1 (de) | 1994-12-15 |
| EP0333098A3 (en) | 1990-11-07 |
| JPH0249341A (ja) | 1990-02-19 |
| EP0333098B1 (de) | 1994-11-09 |
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| JPH0234144B2 (de) | ||
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed | ||
| MKLA | Lapsed |
Effective date: 20021231 |