CA1286740C - Ic package extracting mechanism used in ic socket - Google Patents

Abstract

ABSTRACT OF THE DISCLOSURE
An IC package extracting mechanism used in an IC socket is disclosed. The socket has a socket substrate including an IC package accommodating section, and a contact for a contacting terminal or the IC package which is accommodated in the IC package accommodating section. The socket includes a seesaw lever for pushing up the IC package. The seesaw lever is formed at its one end with an IC package push-up lever portion disposed below the IC package accommodated in the IC package accommodating section and at its other end with a push-down lever portion. The IC
package push-up lever portion and the push-down lever portion are able to move up and down in turn like a seesaw motion balancing on a support disposed at the center between both levers. The socket substrate is provided with push-down means for rendering a push-down force to the push-down lever portion. The push-down means pushes down the push-down lever portion to spring up the IC package push-up lever portion, so that the IC package will be pushed up.

Description

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TITLE OF THE Ii~VE-I~TIOM
IC ~ACXAGr EXTRACTING .~ECHA~ISM ~SED I~ IC SOCK~T
BAC~GROUND OF THE INVENTION
This invention relates to an IC package extracting mechanism used in an IC socket in which an IC package can be easily removed from the IC socket.
There has been ~nown the so-called zero insertion socket in whicn an IC soc~et is provided r~Jith a discontacting mrechanism for a contact which contacts with a contacting element or terminal of an IC package. However, in the case tne IC package is minute and flat, it is difficult to remove tne IC package from the IC socket even when the contact resistance ~ecomes zero because it has fe~7 portion which can be grasped. If a pincette or tne like is used for the rernoval, tnere is a possibility that the contact is damayed by mistake. Besides, adoption of a pincette or the like badly spoils the efficiency of tAe removiny work.
As for tne above-descriDed conventional IC packaye removin~ device, for example, a socket is provided with a sink-and-float table for mountiny thereon an IC package held by a spriny so that the IC package will be pushed up.
Howe~er, since a pushing-up force is normally applied to the IC package oy the spring, the IC package tends to be floated evën if it is pressed by a pressure cover and thus unstable.
In addition, since the pushiny-up amount is limited, a large pusniny-up amount is difficult to obtain and ~esigning of the (i~

~28~

spring s-tren~th, expanding amount, or the like is difricult to obtain.
There has been also known another IC package removin5 device in which a cover for pressing an IC package is providea with a suction cup member so that the attachment of the the suction cup to the upper sur~ace of the IC pac.;age enables to open the cover and to extract the IC package.
IIo~7ever, it taices much time and labor to remove the IC
pac'cage from the suction cup. On tne contrary, if the suction force is too small, the IC package tends to come off.
In addition, there is such an inconvenience as that the suction cup becornes deteriorated and unaole to be firmly attached to tne IC pac3cage.
The present invention was accomplished in orcier to eliminate the above-described inconveniences inherent in the conventional devices.
SU~ lARY OF THE INVENTION
It is therefore a general object of the present invention to provide an IC ~ackage extracting mechanism used in an IC socicet in whicn an IC package can be always easily and surely pushed up and a suitable amount of pushing-up work is obtaina~le to fascilitate the extraction of the IC
pac'cage without invitation of the above-described problems.
As means for achieving the above object, a substrate forming an IC soc,~et is provided with a seesaw lever, an IC

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package is supported by a push-up lever portion which per~orms a seesaw motion at one end of the seesaw lever, the push-up lever portion being sprung up by rendering force for pushing down a push-down lever portion which per~orms a seesaw motion at the other end of the seesaw lever to push up the IC package from a contacting position to a discontacted position thereabove so that the IC package can be easily removed.
Accordingly there is provided a socket substrate which has an IC package accommodating section for receiving an IC package in an accommodating position when it is moved from a position outside the accommodation section into the accommodation section. Contacts are provided which contact the terminals of an IC package when the package is in the accommodating position. The IC package is pushable out of the accommodating position by a lever pivotally disposed within the socket substrate and pivotable around a pivot point intermediate the ends of the lever. The lever has a push-up portion and a push-down portion, which portions are movable alternately up and down around the pivot point as a fulcrum.
The push-up portion extends into the accommodation section for being pushed into a lowermost position by an IC package in the accommodating position therein. Push-down means is provided on the socket substrate which is movable from an upper position to a lower position. When the push-down means is pushed down to the lower position, it engages the push-down portion of the lever down, thereby moving the push-up portion o~ the lever to an uppermost position by the pivoting movement of the lever and urging an IC package to a position outside the accommodation ~ ;~86~

section. When an IC package is placed in the position outside the accommodating position and is supported thereat by the push-up portion of the lever, and the IC package is pushed down into the accommodating position, the lever pivots to move the push-down portion of the lever and the push-down means up.
When the push-down means is pushed down, the lever is pivoted to cause the push-up portion of the lever to push the IC
package up to the position outside the accommodation section.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages of the present invention will become apparent from the following detailed description of a preferred embodiment of the invention with reference to the accompanying drawings, in which:
Fig. 1 is a plan view of an IC socket according to one embodiment of the present invention;
Fig. 2 (A) is a sectional view taken along the line A-A of Fig. 1 showing a pushed-up state of an IC package;
Fig. 2 (B) is a sectional view likewise taken along the line A-A of Fig. 1 showing a pushed-down state of the IC
package;
Fig. 2 (C) is a sectional view taken along the line B-B of Fig. 1 sXowing a pushed-up state of an IC package accommodating framework;
Fig. 2 (D) is a sectional view likewise taken along the line B-B of Fig. 1 showing a pushed-down state of the IC

3a lZ~3~;7~0 yackage accommodating framework;
Fig. 3 is plan view of a socket subs-trate according to one embodiment of the present invention;
Fig. 4 is a sectional view taken on tne line C-C of Fig.
3;
Fig. 5 is a sectional view taken on the line D-D of Fis.
3;
Fig. 6 is a plan view of the IC package accommodating framework;
Fig. 7 is a side view thereof;
Fig. ~ is a sectional view taken along the line E-E of Fig. 6;
Fig. 9 is a rear view thereof;
Fis. 1~ is an exploded perspective view of an IC package mounting taDle and a seesaw leveri Fig. 11 is a perspective view thereof but when the~ are assem~led;
Fig. 12 (A) is a sectional view oE a socket showing a pusned-up state of the IC package;
Fig. 12 (B) is a sectional view of the socket showing a pushed-down state of the IC package;
Fig. 13 (A) is a sectional view of a socket showing a pushed-up state oi an~IC package according to second em~odiment of the present invention;
Fig. 13 (B~) is likewise a sectional view of the socket 128~i740 showin~ d pusned-down state of the IC pac.~age;
Fig. 14 (A) is a sectional view of a socket showing a pushed-up state of an IC paclcage according to a third `embodiment of the present inventioni and Fig. 1~ (B) is likewise a sectional vie~,1 of the soc~et snowins a pushed-down state of the IC packase.
DETAILED DESCRIPTION OF TH~ EMBODIMENT
One preferred embodiment of the present invention will ~e described hereinafter with reference to the accompan~ing ~rawings .
Figs. 1 through 12 illustrate a first embodiment, Fig.
13 illustrates à second embodiment, and Fis. 14 illustrates a third emDodiment.
Referring first to Fiys. 1 through 12, 1 denotes a socket substrate, 2 denotes a framework, 3 denotes a seesaw lever, and 4 denotes an IC packa~e mounting table.
Fl~s. 3 through 5 show the structure of the soc.~et substrate 1, Fiss. 6 through 9 show the structure of the IC
package accomlnodating framework 2, and Figs. 10 and 11 show t;ne structures of the seesaw lever 3 and the IC package mountin~ table 4. Figs. 1 and 2 show the assemblies of the above-mentioned various component elements.
The socket substrate 1 is provided at -the central .
portion thereof with a generally square-sha2ed IC pac.~age accommoaating section la and around the entire periphery or along the two sides of the IC package accommodatlng section . .

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~286~74C~

la with a plurallty of contacts lb which are to be contacted witn a plurallty of terminals (5a) of an IC pac~age (5).
The socKet substrate 1 is also provided with the seesaw lever 3 for seesaw movement at every corner of the IC package accommodating section la where the rows of the contacts lb are not formed.
The seesaw lever 3 includes an IC pac~age push-up lever portion 3b extending inside the IC pac~age accommodating section la along the sides forming the corner thereof, and a push-down lever portion 3c extending outside of the IC
pac.~age accommodating section la from the corner. The seesaw lever 3 is provided on the central portion thereof with a projection 3a which is to be snugly engaged into an engdging sroove lc which is formed in the corner portion of the IC pac~age accommodating section la, so that the ~ush-up lever portion 3b and~the push-down iever portion 3c are moved up and down in turn balancing on the snussing portion as the support thereof.
The corner portion of the IC pac.'~age accommodating section la provided with the seesaw lever 3 is formed with a , seesaw lever guiding sroove ld directins outside of the corner alon~ the genera~lly diagonal line thereof. The bottom surrace of the yuiding groove ld is inclined downwards in the external~dlrectlon from the en~aging groove lc serving as the supp^rt, so that -tae push-down lever 3c is permitted . .

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to be pushed down when tile pUsn-aown lever ~c is engaged in the gulding groove l~.
A pair of seesaw levers 3 are disposed on each corner on one diagonal line of the IC package accommodatincJ section la.
The IC pac.cage accommodating section la is provided on its bottom surface with a partition wall li for partitioning both tAe seesaw levers 3 in order to prevent tne respective seesaw levers from playing within the IC pac~age accommodating section la.
-~ithin the IC package accommodating section la with the sees`aw levers 3 disposed as described, the IC pac~age inounting -table 4 of a generally sal~e shape as the IC pac~age accommodating section la is contained, and the corner portions of the mounting ta~le (4) are super~osed on the upper surfaces of the lever portions 3b. By this, one seesaw lever 3 supports on tne push-up lever portion 3o the area along one side forming the corner of the IC package mounting table ~, while~the other seesaw lever 3 supports the area aion~ the otner side forming the corner of the IC
package mountinc; table 4. The seesaw motion of -the seesaw lever 3 causes the IC package mounting table 4 to move up and down. I~10re specificaliy, tne pUsil-Up lever portion 3b is sprung up by~pushing ~own the push-down lever portion 3c of tlle~seesaw lever~3~thereby to push up both ends of the IC
pac'~age mounting~table 4 and an IC pac~age 5 mounted thereon to brinq them r the disconta~t rq po9ition (9ee ~ig- 12 .

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3L2~36~0 (A)), and, on the contrary, the IC package mounting table 4 is lowered by pushing down the IC package 5 thereby to turn the push-up lever portion 3b downwards to spring U? the push-down lever portion 3c to bring it to the contacting position (see ~ig. 12 (B)).
In ordèr to have the IC packase mounting table perform the vertical movement smoothly, a guiding piece 4a projecting ~sidewards from a pair of angle portions on the dia~onal line of the IC package mounting table 4 is snugly engaged in a yuiding groove le formed in the external direction from the corner portions on the diagonal line of the IC package accommoàating section la.
A plurallty of legs 4b are erected downwards from the IC
package mounting table L~ and the legs 4b are inserted along the inner wall of a window lf formed in the central portion of the IC pdc.~aye accommodating section la, so that when the IC package mounting table 4 is lifted up, a hook 4c formed on the front ends of the legs 4b are engaged with the peripheral portion of the wall defining the window lf to regulate the lifting amount thereof;and to prevent the same from coming off.
The framewor.~ 2 15 provided on the soc.~et substrate 1 wnich is Eormed such as described above.
The framework 2 has an opening 2a directly a~ove the IC
package accommodating section la oE the socket substrate 1.

lZ867~

The opening 2a are formed at four sides or two si~es thereof witn a plurality of contact accommodatins grooves 2b. By placing the framework 2 on tne socket substrate 1, the IC
2ac~age accommodating section la and the opening 2a are `orought to positions vertically corresponding to each other, and the contact lb are inserted in the contact accommodating 5roove 2~.
In order to form the corresponding state of the framework 2, the guiding piece 2c is formed 'oy the side wall of the framewor'~ 2, and the guiding piece 2c is snugly engased in a guiding groove ly formed in tne side wall of the soc.cet substrate 1 to set the position where the framework 2 is providec', and the vertical movernent is obtained by serving t~is as a yuide.
~ urtAermore, a plurality of legs 2d are erected ~ownwards from the fraraework 2, the legs 2 are inserted into a guiding hole lh formed in the socket substrate 1 for use of a c3uide for vertical movement, and a hook 2e formed on the front end of each leg 2d is engaged with a hole wall when lirtin5 to set the lifting position~
Furtnermore, as means for rendering a push~down force to the pus.~-down lever port~ion of the seesar" lever 3, a push-down fincJer 2f are erected downwards from the fralnewor~ 2 to bring it into ;abut cont~act witb the upper surface of the end portion of the push-down lever portion 3c.
As is shown ln Fiy. 12 (A), when the IC packase (5) is ~: ... .
' .

~;~15 67~0 loadea or removed, the framework 2 is in a pusned-down state.
As a result, the push-down finger 2f pushes and turns the push-down lever portion 3c to spring up the pusA-up lever portion 3b, thereby to hold the IC pac~age mounting table 4 in its lifted position.
In the above-mentioned state, the IC package 5 is mounted on the IC package mounting table ~ thereby to render the latter a push-do~n force. As a result, as is shown in Fig. 12 (B), the IC package mounting table 4 turns the pusA-up lever portion 3b of the seesaw lever 3 do.~nwards, and springs up the pusA-down lever portion 3c by tAe reaction t.hereof, and, at the same time, pushes up the push-down finger 2f of tne framewor.k 2 to bring the frame-~ork 2 in the pushed-u~ ~osition.
In the above-mentioned state, terminals 5a arranged on each siae~of the IC package 5 are resiliently caught from both sides thereof and contacted under pressure by tAe contacts 1D~ That is, they are brougAt to be contacted with each other.
When the framework 2 is pushed down from the contacting state, the seesa~ lever 3 performs the seesaw motion as de~cribed. ~ As a result, tAe IC pac,cage mounting table 4 and the IC package 5 mounted thereon are pushed up again in the lirted-position shown ln Fiy. 12 (A) to cancel the contacted state. In tne foregoing sta-te, the IC package 5 can be ~2~3674~

easily removed from and mounted on the IC package mountiny table 4.
~ eferring now to Fi5. 13, a second embodiment or the present invention will be described. In the illustrated ernbodiMent, there is no provision of the IC package mounting table 4 which is used in the first embodiment, and the IC
pac~age 5 is directly supported by the push-up lever portion 3b of the seesaw lever 3. By seesaw motion of the seesaw lever 3, tne lower contacting position shown in Fig. 13 (A) an~ the IC pac~age ?ushed-up position shown in Fig. 13 (B) are o~taine~.
~ eferring to Fig. 14, a third embodiment of the present invention will be described. In the illustrated embodiment, tnere is no provision OL the frarnework 2~,7hich is usea in the first embodiment, and a push-down finser 2f' is vertically operatably mounted on the soc~ket substrate 1. The front end of the push-down finger 2f' is abutted against and pushed down the push-down lever portion 3c of the seesaw lever 3.
T~e pushing down of the push-down portion 3c of the seesaw lever 3 causes the IC pac!age push-up lever portion or the seesaw lever 3 to spring up to the IC package pushed-up po~ition snown in Fig. 14 (A). On the contrar~, the pushing down of tne LC pdc.cage causes the push-do"n Einger 2f' to the pusned-u~ ~osition shown in Fig. 14 (~).
In the a~ove-aescribea embodiment, the IC yackage mountin~ table a may of course be used. Furtnermore, the . .

~28~7~

pusii-down flnger 2f' and tne end portion of the push-do~,1n lever portion 3c of the seesaw lever 3 are brought to be contacted with each otner as described. In the above-descriDed ernbodiments, the push-down finger (25) or (25') and the seesar" lever (3) may be linked with each other by a shaft.
As described in tAe foregoing, a socKet substrate is provided with a seesaw lever, an IC package is supported by a ;~ush-up lever portion which performs a seesaw motion at one enà of the seesaw lever, the push-up lever portion being spruns up by rendering force for pushing cown a push-Zown lever portion whicn performs a seesaw motion at the other end or the seesaw lever to push up the IC package. ~ccorZinyly, tne IC package is alwa~s easily and surely pusned up in association with the seesaw motion of the seesaw lever and pushed up to a high position by a predetermined amount, tnereby to fascilitate the removal of the IC packase.
Furthermore, the IC package pushing up amount can be optionally set oy setting the seesaw motion amount of the seesaw lever. Besides, tne setting can be easily and satisfactorlly performed. Accordingly, it is very easy to manufac-ture.
From the foreyoing description on the preferred e~-nbodiments of the present invention with reference to the accompanying ~rawinys, various modification and chan~es in .

~Z867~() construction T.~ill easily occur to those having ordinally ~nowled~e in the art and furthermore, the present invention may be embodie~ in su~stantially similar rnodes ThThich fulfill substantially the same object and attain substantially the same effec-ts as those described in connection ~ith the preferred embodiments.

Claims (4)

1. An IC socket having a mechanism for extracting an IC package therefrom, comprising:
a socket substrate having an IC package accommodation section for receiving an IC package in an accomodating position when moved from a position outside said accommodation section into said accommodation section, and contact means for contacting terminal means of an IC package when said IC package is in the accommodating postion;
lever means comprising a lever pivotally disposed within said socket substrate and pivotable on said socket substrate around a pivot point intermediate the ends of said lever for pushing an IC package out of said accommodating postion, said lever having a push-up lever portion and a push-down lever portion, said lever portions being movable alternately up and down around said pivot point as a fulcrum, and said push-up portion extending into said accommodation section for being pushed to a lowermost position by an IC
package in the accommodating position therein; and push-down means on said socket substrate and movable from an upper position to a lower position and engaging the push-down lever portion of said lever for pushing the push-down portion of said lever down when said push-down means is pushed down to the lower position, said push-up portion of said lever being moved to an uppermost position by pivoting movement of said lever in which it urges an IC package to a position outside said accommodation section, whereby when an IC package is placed in the position outside said accommodating position and is supported thereat by said push-up portion of said lever, and said IC package is pushed down into the accommodating position, said lever pivots to move said push-down portion up and move said push-down means up, and when said push-down means is pushed down, said lever is pivoted to cause said push-up portion to push the IC package up to the position outside said accommodation section.

2. An IC socket as claimed in claim 1 further comprising an IC package mounting table movable in the vertical direction in and out of said accommodating position while carrying an IC package thereon, said push-up lever portion engaging said IC package mounting table.

3. The invention as claimed in claim 1 wherein said lever is in one side of said accommodation section, and a further lever is provided on a diametrically opposite side of said accommodation section.

4. The invention as claimed in claim 1 further comprising a framework on said socket substrate, said push-down means being movable in said framework.