CA1280897C - Abrasive member with deposits carrying particles - Google Patents
Abrasive member with deposits carrying particlesInfo
- Publication number
- CA1280897C CA1280897C CA000531996A CA531996A CA1280897C CA 1280897 C CA1280897 C CA 1280897C CA 000531996 A CA000531996 A CA 000531996A CA 531996 A CA531996 A CA 531996A CA 1280897 C CA1280897 C CA 1280897C
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- Canada
- Prior art keywords
- metal
- sheet
- abrasive
- mask
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
ABSTRACT OF THE DISCLOSURE
The present invention provides a method of forming an abrasive member which comprises fixedly attaching to one surface of a sheet an electrically conductive metal film applying to the exposed surface of the metal film a mask having a multitude of discrete openings therein which mask is made of a non-electri-cally conductive plating resistant material and electrically depositing metal onto said discrete openings and onto said metal film in the presence of particulate abrasive material so that the material adheres directly to said metal film and the abrasive becomes embedded in the metal deposit.
The present invention provides a method of forming an abrasive member which comprises fixedly attaching to one surface of a sheet an electrically conductive metal film applying to the exposed surface of the metal film a mask having a multitude of discrete openings therein which mask is made of a non-electri-cally conductive plating resistant material and electrically depositing metal onto said discrete openings and onto said metal film in the presence of particulate abrasive material so that the material adheres directly to said metal film and the abrasive becomes embedded in the metal deposit.
Description
1~0897 The present invention relates to an abrasive member incorporating abrasive particles, particularly diamond particles which are useful in grinding, smoothing and other operations on glass and other materials. Abrasive members may be used for grinding lenses of both male and female curvature torical plane and made of glass or plastics material. Deposable abrasive pads for lens grinding in order to obviate the use of an abrasive slurry are known. Such pads have a short life and they have insufficient flexability to conform accurately to the curvature of the cast-iron laps to which they are applied. U.S. Patent No.
4,256,467 issued August 17, 1981, to Ian Gorsuch discloses a flexible abrasive member comprising a flexible non-electrically conductive mesh material and a layer of electrodeposited metal adhering directly to and extending through the mesh material so that the mesh material is embedded in the metal layer. Abrasive material such as diamond is embedded in the metal layer.
According to the U.S. Patent, thls flexible abrasive member is manuEactured by first laying a length of flexible non-electrically conductive mesh material onto a smooth electricallyconductive surface so that the mesh material is in immovable relationship with the conductive surface. A layer of metal is then electrodeposited onto the smooth surface through the mesh material in the presence oE abras.lve material so that the abra-sive material becomes embedded in the metal layer and the metallayer adheres to the mesh. Finally, the mesh and the associated metal layer with the embedded abrasive material are stripped from the electrically conductive surface to constitute the abrasive member. There are, however, a number of disadvantages associated with the process which requires substantial capital equipment and in particular, the preparation of the cylinder used in the pro-cess is expensive and complex. The process is also slow in oper-ation and can only operate on a batch basis because of a length of flexible mesh material of specific size must be attached to the cylinder, applied under tension and to be immovable relative thereto. The whole process will produce only a single flexible abrasive member.
In co~pending Canadian applicatlon NO. 518,201 filed September 15, l9B6, there is provided a method which overcomes the problems of the U.S. patent which comprises providing a flex-ible mass of non-electrically conductive material having a multi-tude of discrete openings therein, :Laminating said mask to one surface of a length of flexible mesh material, placing the lami-nated mesh material in a metal deposition bath and depositing metal directly into said discrete opening onto said flexible material in the presence of particulate abrasive material such as diamond so that the metal adheres directly to the mesh and the abrasive material becomes embedded in the metal deposits. The deposition is preferably electrodeposition. The co-pending application also discloses a flexible abrasive member produced by the process comprising a length of flexible mesh material having laminated to one surface thereof an electrically non-conductive masked layer having a multitude of discrete openings therein and deposited metal adhering to and extending -through said mesh mate-rial in each of the openings such that the mesh material isembedded in the metal and said deposited metal having the abra-sive material embedded therein.
The present invention provides a process for producing an abrasive member which process ls much faster to operate than the one set forth ln co-pendlng Canadlan appllcation No. 518, 201 and is further more economlcal to opera-te and lends itself read-ily to automation. Further, the invention provides by such a process, abrasive members such as pad, disk or belt which oper-ates at a hlgher abraiding speed and presents an abraiding sur-face which is clean, having clearly defined spaces between metal protubrances therein and thus has a more efficient abraiding operation and does not use as much metal or abrasive and as dia-mond in its formation and thus is cheaper to produce. At the same time, the process desirably may produce directly an abraid-ing member which may be used directly per se and does not subse-1~80897 quently have to be laminated to a backing material for its use.Again, the present invention provldes by the process a braiding member which dissipates heat very efficiently and thus has a longer life.
According to the present invention there is provided a method of forming an abrasive member which comprises fixedly attaching to one surface of a sheet, desirably a non-electrically conductive sheet, an electrically conductive metal film applying to the exposed surface of the metal film, a mask having a multi-tude of discrete openings therein which mask is made of an non-electrically conductive plating resistant material and electrode-positing metal directly into said discrete openings onto said metal film in the presence of a particulate abrasive material so that the metal adheres directly to said metal fllm and the abra-sive becomes embedded in the metal deposits.
The abraslve member so produced by this process is use-ful per se. However, in order to reduce the heat buildup in the member during its use and thus increase its efficiency and life expectancy in a preferred embodiment of the present invention after electro deposition of the metal, the mask is strlpped from the substrate to expose the metal film and the metal film between the discrete metal electrodeposits is etched away to expose the sheet.
In a preferred embodiment of the present invention, the mask is applied to the metal film by coating with a layer of a photopolymer and the photopolymer is exposed to light irradiation through a screen having discrete opening to decompose the polymer which coating is then developed, preferably by treatment with an alkali which is sodium hydroxide. Desirably, the photopolymer,is a dry film photopolymer or a liquid film photopolymer, suc~ as a ~
dry film photopolymer supplied under the name Riston~by Dupon~ oJr a laminar dry film resist supplied by Dynachem or the dry film resist supplied by Herculestic. The liquid resisters are suit-1'~808~37 ably though supplied by Kodak, GAF, Dynachem, Dupont and Fujifilm. The photopolymer is desirably exposed to ultra-violet light irradiation. However, any other type of radiation which degrades the polymer such that it can be developed is suitable in the method of the present invention.
Thus in a further aspect of the present invention there is provided a method of forming an abrasive member which comprises applying to an electrically conductive metal surface of a sheet, preferably a non-conductive sheet a coating of a pho-topolymer, exposing the photopolymer to light irradiation through a screen having discrete openings to decompose said polymer developing the coating to provide a mask having a multitude of discrete openings therein, and electrodepositing metal directly into said discrete opening onto said metal surface in the pres-ence of a particulate abrasive material so that the metal adheres directly to said metal surface and the abrasive becomes embedded in the metal deposits. As before, in this method it is desirable after electrodeposition of the metal to strip the mask from the sheet to expose the metal surface and etch the metal surface between the electrodeposits to expose the sheet. Suitably, the sheet is a non-electrically conductive sheet.
It is only necessary for the process of the present invention in a broad aspect to have a plating resist non-conduc-tive mask. This may be formed by any means, the photopolymer development being a particularly preferred means. ~Iowever, the mask may be applied by screening the plating resist and in par-ticular silk screening the plating resist in whlch case the mask may be made of W light curable or thermally curable inks such as infra-red heat curable inks. Such curable plating resists and etching resists may be supplied by McDermid Inc., Dynachem and M&T Chemicals.
The sheet forming the abrasive member of the present invention is desirably a non-electrically conductive sheet, but 1~80~397 it may be a rigid sheet when it is clesired to make abrasive pads and disks or it may be flexible when it is desired to make abra-sive belts when it is desired to make a rigid abrasive member, the sheet is desirably formed from a fibreglas epoxy laminate such as a copper clad fibreglas epoxy laminate for printed cir-cuit board applications supplied by WestinghouSe and GE. Alter-natively, the sheet may be formed of a phenolic resin, such as a phenol formaldehyde resin or it may be a polyester fibreglas lam-inate also supplied for printed circuit board applications. Such sheets suitably have an overall thickness of about 8 to 12 mils.
For forming a flexible abrasive member suitable for example as an abrasive belt, a copper clad, fibre free resin sys-tem such as that supplied under the trademark Kapton (by Dupont) which used for flexible pointed circuits may be used. However, in a particularly desirable embodiment of the present invention, the sheet is formed of a woven strong fabric on which the metal film is deposited, a particular suitable strong fabric being made of p-poly (phenyllene) terephithalimide such as that supplied un-der the trademark Kevlar. Thus for forming flexible abrasivemembers such as belts, the sheet should be a flexible sheet such as a flexible woven sheet.
The metal film is fixedly attached to the surface of the sheet and is suitably laminated as a film or deposited by electroless plating, vapour deposition or electro chemical depo-sition, such as electro platlng. The metal may be any electri-cally conductive metal such as copper, alumlnlum, nickel, steel, rhodlum or gold, but is preferably copper. Suitably the metal film has a thickness from 3/20 to 14 thousanths of an inch preferably 7/10 to 2.8 thousanths of an inch.
The abrasive material is a conventional abrasive such as diamond or cubic boronnitride and in particular industrial diamond. The metal can be any metal which can be deposited from a suitable bath by electrodepositing or electroless deposition 1~0897 and is preferably nickel or copper, more preferably nickel. In a preferred embodiment of the present method of the present inven-tion, the sheet with the metal film attached thereto is contlnu-ously passed through an electrolytic bath to form a cathode, the anodes of which are formed by the metal whereby the metal is con-tinuously deposited in discrete opening and the particulate abra-sive during said electrodeposition is released into the bath. In order to ensure that the sheet is present in the bath as a cath-ode, it is connected to a source of negative potential. The sheet is preferably in contact with a smooth non-conductive sur-face such as a plastic surface in the bath which is suitably a nickel sulphamate bath. The mask which is ln the form of a very thin sheet suitably a few thousanths, e.g., 3 to 4 thousanths of an inch thick defines a lattice with a large number of opening for example 1/16 of an inch diameter. The electrodeposition is thus suitably effected by the method disclosed in co-pending Canadian application No. 518,210, the subsequent method of which is incorporated herein by reference.
In the process of the present invention a copper clad fibreglas epoxy laminate sold for printed circuit board applica-tion by Westinghouse or GE having a thickness of 8 mils to 12 mils has the copper surface mechanica.lly cleaned with a scrubber.
A dry film photopolymer supplled by Dynachem is laminated to the copper surface at about 220~ and then exposed to UV light with a Scanex exposure unit. ~he exposed film is then developed using potassium hydroxide solution. The so obtalned product ls then treated in a electolytic bath which is co~nercial n~ckel sulpha-mate bath supplled under the trademark SNR 24 by Hansening oper-ated at 170 amps and 9 volts DC under a temperature of 140C.
The heat is passed through the bath at a rate of 2 inches per minute. This is in accordance with the Example set forth in the aforesaid co-pending Canadian application 514,210. The flexible abrasive member so produced may be used as such but is preferably 3 ~ treated to a Chemalex(strip w~)a Chemalex stripper to strip the dry photofilm therefrom and then is etched with alkaline ~ ~ ~O ~7 based copper etching solution supplied by Hunt Chemicals suitably by spray etching. The abrasive member obtalned has a clear translucent asthetically pleasing appearance with well defined protubrances containing the diamond abrasive with clearly defined spaces therebetween and no intermediate diamond containing metal between the protubrances. This is in contrast to the product obtained according to co-pending Canadian application No. 518,210 which product displayed a much more untidy appearance and had metal and diamond particles between the protubrances and thus had an unclean look. The clean appearance of the abrasive member of the present invention has great consumer appeal particularly in the do-it-yourself market and also provides a much more efficient abraiding grading member and at the same time is cheaper to make as there is no waste of metal and diamond abrasive. In the pro-cess of the co-pending application, it would appear that the plas-tisol forming the mask has pores which results in its untidy appearance and its thus lower efficiency and greater expense.
Thus in another aspect of the present invention there is provided an abrasive member comprising a sheet, preferably a non-conductive sheet, having fixedly attached to one surface thereof a layer of electrically conductive metal and attached to the surface of the metal a layer of non-electrically conductive plating resistant material having a plurality of discrete open-ings therein and deposlted metal in each of said openings adheredto the metal layer said deposited metal having abrasive material embedded therein.
In a preferred embodiment of the present invention there is provided an abrasive member comprising a sheet, prefer-ably a non-conductive sheet, having a multitude of discrete metal protubrances fixedly attached to one surface thereof, each of the protubrances comprising a lower thin layer of a first metal and upper electro deposited layer of the second metal having abrasive material deposited therein. Suitably, the first and second met-als are different and preferably the first metal is copper and ~ _ 7 _ 1~0897 the second metal is nickel. It is found that the presence of the copper layer, i.e. the lower metal layer has a number of advan-tages in that the copper layer or lower metal layer forms part of the protubrance and therefore the length of the electrodeposition is shortened due to the presence of this layer to achieve the same height of protubrance. Further copper accepts the layer faster than other metals and thus is found that the time of elec-trodeposition is substantially cut and is usually halved to achieve the same diamond containing protubrance. While the pre-sent invention has been described with reference to the elec-trodeposition of the metal in the discrete openings of the mask, electroless depositions or other forms of deposition would also be suitable.
4,256,467 issued August 17, 1981, to Ian Gorsuch discloses a flexible abrasive member comprising a flexible non-electrically conductive mesh material and a layer of electrodeposited metal adhering directly to and extending through the mesh material so that the mesh material is embedded in the metal layer. Abrasive material such as diamond is embedded in the metal layer.
According to the U.S. Patent, thls flexible abrasive member is manuEactured by first laying a length of flexible non-electrically conductive mesh material onto a smooth electricallyconductive surface so that the mesh material is in immovable relationship with the conductive surface. A layer of metal is then electrodeposited onto the smooth surface through the mesh material in the presence oE abras.lve material so that the abra-sive material becomes embedded in the metal layer and the metallayer adheres to the mesh. Finally, the mesh and the associated metal layer with the embedded abrasive material are stripped from the electrically conductive surface to constitute the abrasive member. There are, however, a number of disadvantages associated with the process which requires substantial capital equipment and in particular, the preparation of the cylinder used in the pro-cess is expensive and complex. The process is also slow in oper-ation and can only operate on a batch basis because of a length of flexible mesh material of specific size must be attached to the cylinder, applied under tension and to be immovable relative thereto. The whole process will produce only a single flexible abrasive member.
In co~pending Canadian applicatlon NO. 518,201 filed September 15, l9B6, there is provided a method which overcomes the problems of the U.S. patent which comprises providing a flex-ible mass of non-electrically conductive material having a multi-tude of discrete openings therein, :Laminating said mask to one surface of a length of flexible mesh material, placing the lami-nated mesh material in a metal deposition bath and depositing metal directly into said discrete opening onto said flexible material in the presence of particulate abrasive material such as diamond so that the metal adheres directly to the mesh and the abrasive material becomes embedded in the metal deposits. The deposition is preferably electrodeposition. The co-pending application also discloses a flexible abrasive member produced by the process comprising a length of flexible mesh material having laminated to one surface thereof an electrically non-conductive masked layer having a multitude of discrete openings therein and deposited metal adhering to and extending -through said mesh mate-rial in each of the openings such that the mesh material isembedded in the metal and said deposited metal having the abra-sive material embedded therein.
The present invention provides a process for producing an abrasive member which process ls much faster to operate than the one set forth ln co-pendlng Canadlan appllcation No. 518, 201 and is further more economlcal to opera-te and lends itself read-ily to automation. Further, the invention provides by such a process, abrasive members such as pad, disk or belt which oper-ates at a hlgher abraiding speed and presents an abraiding sur-face which is clean, having clearly defined spaces between metal protubrances therein and thus has a more efficient abraiding operation and does not use as much metal or abrasive and as dia-mond in its formation and thus is cheaper to produce. At the same time, the process desirably may produce directly an abraid-ing member which may be used directly per se and does not subse-1~80897 quently have to be laminated to a backing material for its use.Again, the present invention provldes by the process a braiding member which dissipates heat very efficiently and thus has a longer life.
According to the present invention there is provided a method of forming an abrasive member which comprises fixedly attaching to one surface of a sheet, desirably a non-electrically conductive sheet, an electrically conductive metal film applying to the exposed surface of the metal film, a mask having a multi-tude of discrete openings therein which mask is made of an non-electrically conductive plating resistant material and electrode-positing metal directly into said discrete openings onto said metal film in the presence of a particulate abrasive material so that the metal adheres directly to said metal fllm and the abra-sive becomes embedded in the metal deposits.
The abraslve member so produced by this process is use-ful per se. However, in order to reduce the heat buildup in the member during its use and thus increase its efficiency and life expectancy in a preferred embodiment of the present invention after electro deposition of the metal, the mask is strlpped from the substrate to expose the metal film and the metal film between the discrete metal electrodeposits is etched away to expose the sheet.
In a preferred embodiment of the present invention, the mask is applied to the metal film by coating with a layer of a photopolymer and the photopolymer is exposed to light irradiation through a screen having discrete opening to decompose the polymer which coating is then developed, preferably by treatment with an alkali which is sodium hydroxide. Desirably, the photopolymer,is a dry film photopolymer or a liquid film photopolymer, suc~ as a ~
dry film photopolymer supplied under the name Riston~by Dupon~ oJr a laminar dry film resist supplied by Dynachem or the dry film resist supplied by Herculestic. The liquid resisters are suit-1'~808~37 ably though supplied by Kodak, GAF, Dynachem, Dupont and Fujifilm. The photopolymer is desirably exposed to ultra-violet light irradiation. However, any other type of radiation which degrades the polymer such that it can be developed is suitable in the method of the present invention.
Thus in a further aspect of the present invention there is provided a method of forming an abrasive member which comprises applying to an electrically conductive metal surface of a sheet, preferably a non-conductive sheet a coating of a pho-topolymer, exposing the photopolymer to light irradiation through a screen having discrete openings to decompose said polymer developing the coating to provide a mask having a multitude of discrete openings therein, and electrodepositing metal directly into said discrete opening onto said metal surface in the pres-ence of a particulate abrasive material so that the metal adheres directly to said metal surface and the abrasive becomes embedded in the metal deposits. As before, in this method it is desirable after electrodeposition of the metal to strip the mask from the sheet to expose the metal surface and etch the metal surface between the electrodeposits to expose the sheet. Suitably, the sheet is a non-electrically conductive sheet.
It is only necessary for the process of the present invention in a broad aspect to have a plating resist non-conduc-tive mask. This may be formed by any means, the photopolymer development being a particularly preferred means. ~Iowever, the mask may be applied by screening the plating resist and in par-ticular silk screening the plating resist in whlch case the mask may be made of W light curable or thermally curable inks such as infra-red heat curable inks. Such curable plating resists and etching resists may be supplied by McDermid Inc., Dynachem and M&T Chemicals.
The sheet forming the abrasive member of the present invention is desirably a non-electrically conductive sheet, but 1~80~397 it may be a rigid sheet when it is clesired to make abrasive pads and disks or it may be flexible when it is desired to make abra-sive belts when it is desired to make a rigid abrasive member, the sheet is desirably formed from a fibreglas epoxy laminate such as a copper clad fibreglas epoxy laminate for printed cir-cuit board applications supplied by WestinghouSe and GE. Alter-natively, the sheet may be formed of a phenolic resin, such as a phenol formaldehyde resin or it may be a polyester fibreglas lam-inate also supplied for printed circuit board applications. Such sheets suitably have an overall thickness of about 8 to 12 mils.
For forming a flexible abrasive member suitable for example as an abrasive belt, a copper clad, fibre free resin sys-tem such as that supplied under the trademark Kapton (by Dupont) which used for flexible pointed circuits may be used. However, in a particularly desirable embodiment of the present invention, the sheet is formed of a woven strong fabric on which the metal film is deposited, a particular suitable strong fabric being made of p-poly (phenyllene) terephithalimide such as that supplied un-der the trademark Kevlar. Thus for forming flexible abrasivemembers such as belts, the sheet should be a flexible sheet such as a flexible woven sheet.
The metal film is fixedly attached to the surface of the sheet and is suitably laminated as a film or deposited by electroless plating, vapour deposition or electro chemical depo-sition, such as electro platlng. The metal may be any electri-cally conductive metal such as copper, alumlnlum, nickel, steel, rhodlum or gold, but is preferably copper. Suitably the metal film has a thickness from 3/20 to 14 thousanths of an inch preferably 7/10 to 2.8 thousanths of an inch.
The abrasive material is a conventional abrasive such as diamond or cubic boronnitride and in particular industrial diamond. The metal can be any metal which can be deposited from a suitable bath by electrodepositing or electroless deposition 1~0897 and is preferably nickel or copper, more preferably nickel. In a preferred embodiment of the present method of the present inven-tion, the sheet with the metal film attached thereto is contlnu-ously passed through an electrolytic bath to form a cathode, the anodes of which are formed by the metal whereby the metal is con-tinuously deposited in discrete opening and the particulate abra-sive during said electrodeposition is released into the bath. In order to ensure that the sheet is present in the bath as a cath-ode, it is connected to a source of negative potential. The sheet is preferably in contact with a smooth non-conductive sur-face such as a plastic surface in the bath which is suitably a nickel sulphamate bath. The mask which is ln the form of a very thin sheet suitably a few thousanths, e.g., 3 to 4 thousanths of an inch thick defines a lattice with a large number of opening for example 1/16 of an inch diameter. The electrodeposition is thus suitably effected by the method disclosed in co-pending Canadian application No. 518,210, the subsequent method of which is incorporated herein by reference.
In the process of the present invention a copper clad fibreglas epoxy laminate sold for printed circuit board applica-tion by Westinghouse or GE having a thickness of 8 mils to 12 mils has the copper surface mechanica.lly cleaned with a scrubber.
A dry film photopolymer supplled by Dynachem is laminated to the copper surface at about 220~ and then exposed to UV light with a Scanex exposure unit. ~he exposed film is then developed using potassium hydroxide solution. The so obtalned product ls then treated in a electolytic bath which is co~nercial n~ckel sulpha-mate bath supplled under the trademark SNR 24 by Hansening oper-ated at 170 amps and 9 volts DC under a temperature of 140C.
The heat is passed through the bath at a rate of 2 inches per minute. This is in accordance with the Example set forth in the aforesaid co-pending Canadian application 514,210. The flexible abrasive member so produced may be used as such but is preferably 3 ~ treated to a Chemalex(strip w~)a Chemalex stripper to strip the dry photofilm therefrom and then is etched with alkaline ~ ~ ~O ~7 based copper etching solution supplied by Hunt Chemicals suitably by spray etching. The abrasive member obtalned has a clear translucent asthetically pleasing appearance with well defined protubrances containing the diamond abrasive with clearly defined spaces therebetween and no intermediate diamond containing metal between the protubrances. This is in contrast to the product obtained according to co-pending Canadian application No. 518,210 which product displayed a much more untidy appearance and had metal and diamond particles between the protubrances and thus had an unclean look. The clean appearance of the abrasive member of the present invention has great consumer appeal particularly in the do-it-yourself market and also provides a much more efficient abraiding grading member and at the same time is cheaper to make as there is no waste of metal and diamond abrasive. In the pro-cess of the co-pending application, it would appear that the plas-tisol forming the mask has pores which results in its untidy appearance and its thus lower efficiency and greater expense.
Thus in another aspect of the present invention there is provided an abrasive member comprising a sheet, preferably a non-conductive sheet, having fixedly attached to one surface thereof a layer of electrically conductive metal and attached to the surface of the metal a layer of non-electrically conductive plating resistant material having a plurality of discrete open-ings therein and deposlted metal in each of said openings adheredto the metal layer said deposited metal having abrasive material embedded therein.
In a preferred embodiment of the present invention there is provided an abrasive member comprising a sheet, prefer-ably a non-conductive sheet, having a multitude of discrete metal protubrances fixedly attached to one surface thereof, each of the protubrances comprising a lower thin layer of a first metal and upper electro deposited layer of the second metal having abrasive material deposited therein. Suitably, the first and second met-als are different and preferably the first metal is copper and ~ _ 7 _ 1~0897 the second metal is nickel. It is found that the presence of the copper layer, i.e. the lower metal layer has a number of advan-tages in that the copper layer or lower metal layer forms part of the protubrance and therefore the length of the electrodeposition is shortened due to the presence of this layer to achieve the same height of protubrance. Further copper accepts the layer faster than other metals and thus is found that the time of elec-trodeposition is substantially cut and is usually halved to achieve the same diamond containing protubrance. While the pre-sent invention has been described with reference to the elec-trodeposition of the metal in the discrete openings of the mask, electroless depositions or other forms of deposition would also be suitable.
Claims (43)
1. A method of forming an abrasive member which com-prises fixedly attaching to one surface of a sheet an electri-cally conductive metal film applying to the exposed surface of the metal film a mask having a multitude of discrete openings therein which mask is made of a non-electrically conductive plat-ing resistant material and electrically depositing metal onto said discrete openings and onto said metal film in the presence of particulate abrasive material so that the material adheres directly to said metal film and the abrasive becomes embedded in the metal deposit.
2. A method as claimed in claim 1 in which after elec-trodeposition of metal, the mask is stripped from the sheet to expose the metal film and the metal film between the discrete metal electrodeposits is etched away to expose the sheet.
3. A method as claimed in claim 2 in which the mask is applied to the metal film by coating with a layer of a photopoly-mer and the photopolymer is exposed to light irradiation through a screen having discrete openings to decompose said polymer, which coating is then developed.
4. A method as claimed in claim 3 in which the pho-topolymer is a dry film photopolymer.
5. A method as claimed in claim 4 in which the pho-topolymer is a liquid film photopolymer.
6. A method as claimed in claim 4 or 5 in which the photopolymer is subjected to UV radiation.
7. A method as claimed in claim 2 in which the mask is applied by screening through a mesh.
8. A method as claimed in claim 7 in which the screen-ing is silk screening.
9. A method as claimed in claim 7 or 8 in which the mask is made of a UV light curable or thermally curable ink.
10. A method as claimed in claim 1, 2 or 3 in which the sheet is a rigid sheet.
11. A method as claimed in claim 1, 2 or 3 in which the sheet is a rigid sheet formed from a fiberglas epoxy lami-nate.
12. A method as claimed in claim 1, 2 or 3 in which the sheet is a rigid sheet formed from a phenolic resin.
13. A method as claimed in claim 1, 2 or 3 in which the sheet is a rigid sheet formed from a polyester glass lami-nate.
14. A method as claimed in claim 11, 12 or 13 in which the thickness of the sheet is from 8 to 12 mils.
15. A method as claimed in claim 1, 2 or 3 in which the metal film is a copper film.
16. A method as claimed in claim 1, 2 or 3 in which the sheet is a copper clad fibre-free resin system.
17. A method as claimed in claim 1, 2 or 3 in which the metal film thickness is from 3/20 to 14 thousanths of an inch.
18. A method as claimed in claim 1, 2 or 3 in which the metal film thickness is from 7/10 to 2.8 thousanths of an inch.
19. A method as claimed in claim 1, 2 or 3 in which the metal film is laminated onto the sheet.
20. A method as claimed in claim 1, 2 or 3 in which the metal film is deposited by electroless plating vapour deposi-tion or electrochemical deposition onto the sheet.
21. A method as claimed in claim 1, 2 or 3 in which the sheet is a flexible sheet.
22. A method as claimed in claim 1, 2 or 3 in which the sheet is a flexible woven sheet.
23. A method as claimed in claim 1, 2 or 3 in which the sheet is made of p-poly (phenylene terephithalimide.)
24. A method as claimed in claim 1, 2 or 3 in which the sheet is non-electrically conductive.
25. A method as claimed in claim 1 in which the sheet is non-electrically conducting and is in immovable contact during electrodeposition with an electrically conductive member treated to prevent adhesion of the electrically deposited metal thereto.
26. A method as claimed in claim 25 in which the elec-trically conductive member is a rotatable cylinder.
27. A method as claimed in claim 1, 2 or 3 in which the sheet is continuously passed through an electrolytic bath and forms the cathode thereof and the anodes of the bath are formed of said metal to be electrodeposited whereby the metal is contin-uously deposited in the discrete openings and the abrasive during said electrodeposition is released in said bath to be embedded in said deposited metal.
28. A method as claimed in claim 1, 2 or 3 in which the electrodeposited metal is nickel.
29. A method as claimed in claim 1, 2 or 3 in which the abrasive is diamond.
30. A method of forming an abrasive member which com-prises applying to an electrically conductive metal surface of a sheet, a coating of a photopolymer exposing the photopolymer to light irradiation through a screen having discrete openings to decompose said polymer, developing the coating to provide a mask having a multitude of discrete openings therein which mask is made of an non-electrically conductive plating resistance mate-rial and electrodepositing directly into said discrete openings onto said metal surface in the presence of a particulate abrasive material so that the metal adheres directly to said metal surface and the abrasive becomes embedded in the metal deposits.
31. A method as claimed in claim 30 in which the sheet has a metal film attached thereto.
32. A method as claimed in claim 30 in which after electrodeposition of metal, the mask is stripped from the sheet to expose the metal surface and the metal surface between the discrete metal electrodeposits is etched away to expose the sheet.
33. An abrasive member comprising an sheet having a multitude of discrete metal protubrances fixedly attached to one surface thereof, each of the protubrances comprising a lower thin layer of the first metal and an upper electrodeposited layer of the second metal having abrasive material deposited thereon.
34. An abrasive member as claimed in claim 33 in which the sheet is non-conductive.
35. An abrasive member as claimed in claim 34 in which the first and second metals are different.
36. An abrasive member as claimed in claim 34 in which the first metal is copper and the second metal is nickel.
37. An abrasive member as claimed in claim 33, 34 or 35 in which the abrasive is diamond.
38. An abrasive member as claimed in claim 33, 34 or 35 in which the sheet is a rigid sheet.
39. An abrasive member as claimed in claim 33, 34 and 35 in which the sheet is a rigid sheet formed from a fibreglas epoxy laminate.
40. An abrasive member as claimed in claim 33, 34 or 35 in which the sheet is a polyester glass laminate.
41. An abrasive member as claimed in claim 33, 34 or 35 in which the sheet is formed from a phenolic resin.
42. An abrasive member comprising a non-conductive sheet having fixedly attached to one surface thereof a layer of electrically conductive metal and attached to the surface of the metal a layer of non-electrically conductive and plating resis-tant material having a plurality of discrete openings therein and deposited metal in each of said openings and adhered to the metal layer, the deposited metal having abrasive material embedded therein.
43. An abrasive member comprising a sheet having on one surface thereof a layer of electrically conductive metal and attached to the surface of the metal, a layer of non-electrically conductive and plating resistant material having a plurality of discrete openings therein and deposited metal in each of said openings and adhered to the metal layer, said deposited metal having abrasive material embedded therein.
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000531996A CA1280897C (en) | 1987-03-13 | 1987-03-13 | Abrasive member with deposits carrying particles |
| AU12157/88A AU1215788A (en) | 1987-02-27 | 1988-02-24 | Flexible abrasives |
| DK099288A DK99288A (en) | 1987-02-27 | 1988-02-25 | GRINDING TOPIC |
| FI880894A FI880894A (en) | 1987-02-27 | 1988-02-25 | BOEJLIGA SLIPMEDEL. |
| JP63044072A JPS6458480A (en) | 1987-02-27 | 1988-02-26 | Abrasive member and manufacture thereof |
| DE3883403T DE3883403T3 (en) | 1987-02-27 | 1988-02-26 | Flexible abrasives. |
| AU12356/88A AU613895B2 (en) | 1987-02-27 | 1988-02-26 | Flexible abrasives |
| BR888800891A BR8800891A (en) | 1987-02-27 | 1988-02-26 | METHOD OF MAKING A FLEXIBLE ABRASIVE ELEMENT AND FLEXIBLE ABRASIVE ELEMENT |
| EP88810118A EP0280657B2 (en) | 1987-02-27 | 1988-02-26 | Flexible abrasives |
| AT88810118T ATE93438T1 (en) | 1987-02-27 | 1988-02-26 | FLEXIBLE ABRASIVES. |
| CN88101108A CN88101108A (en) | 1986-09-15 | 1988-02-27 | Flexible abrasives |
| KR1019880002114A KR880009734A (en) | 1987-02-27 | 1988-02-27 | Flexible abrasive member, abrasive and molding method |
| NO880876A NO880876L (en) | 1987-02-27 | 1988-02-29 | FLEXIBLE GRINDING ELEMENT AND PROCEDURE FOR MANUFACTURING A GRINDING ELEMENT. |
| US07/161,940 US4874478A (en) | 1987-02-27 | 1988-02-29 | Method of forming a flexible abrasive |
| US07/398,335 US5066312A (en) | 1987-02-27 | 1989-08-25 | Flexible abrasives |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000531996A CA1280897C (en) | 1987-03-13 | 1987-03-13 | Abrasive member with deposits carrying particles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1280897C true CA1280897C (en) | 1991-03-05 |
Family
ID=4135175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000531996A Expired - Lifetime CA1280897C (en) | 1986-09-15 | 1987-03-13 | Abrasive member with deposits carrying particles |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1280897C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114540901A (en) * | 2022-01-27 | 2022-05-27 | 隆基绿能科技股份有限公司 | Diamond wire and preparation method thereof |
-
1987
- 1987-03-13 CA CA000531996A patent/CA1280897C/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114540901A (en) * | 2022-01-27 | 2022-05-27 | 隆基绿能科技股份有限公司 | Diamond wire and preparation method thereof |
| CN114540901B (en) * | 2022-01-27 | 2023-09-26 | 隆基绿能科技股份有限公司 | Diamond wire and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed | ||
| MKEC | Expiry (correction) |
Effective date: 20121205 |