CA1262494A - Routing fixture for producing a wired circuit board - Google Patents
Routing fixture for producing a wired circuit boardInfo
- Publication number
- CA1262494A CA1262494A CA000578900A CA578900A CA1262494A CA 1262494 A CA1262494 A CA 1262494A CA 000578900 A CA000578900 A CA 000578900A CA 578900 A CA578900 A CA 578900A CA 1262494 A CA1262494 A CA 1262494A
- Authority
- CA
- Canada
- Prior art keywords
- wire
- pins
- circuit board
- pin
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A routing fixture including a base plate; a plurality of first guide pins having a first diameter, projecting through the base plate in rows and columns, the pins having a specified inter-pin row spacing and an inter-pin column spacing.
A plurality of second guide pins is provided having a second diameter, the second guide pins projecting through the base plate in columns disposed between alternating adjacent columns of first guide pins and being disposed in column pairs a specified distance above and below a line passing through each of the first guide pin rows.
A routing fixture including a base plate; a plurality of first guide pins having a first diameter, projecting through the base plate in rows and columns, the pins having a specified inter-pin row spacing and an inter-pin column spacing.
A plurality of second guide pins is provided having a second diameter, the second guide pins projecting through the base plate in columns disposed between alternating adjacent columns of first guide pins and being disposed in column pairs a specified distance above and below a line passing through each of the first guide pin rows.
Description
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According to the present invention there is provided for use in a method for producing a wired circuit board, a routing fixture comprising a base plate; a plurality of first guide pins having a first diameter, projecting through said base plate in rows and columns, said pins having a specified inter-pin row spacing and an inter-pin column spacing; and a plurality of second guide pins having a second diameter, said second guide pins projecting through said base plate in columns disposed between alternating adjacent columns of first guide pins, said second guide pins disposed in column pairs a specified distance above and below a line passing through each of said first guide pin rows.
~1 - After registration and mating of ~he second thermoplastic adhesive layer to
According to the present invention there is provided for use in a method for producing a wired circuit board, a routing fixture comprising a base plate; a plurality of first guide pins having a first diameter, projecting through said base plate in rows and columns, said pins having a specified inter-pin row spacing and an inter-pin column spacing; and a plurality of second guide pins having a second diameter, said second guide pins projecting through said base plate in columns disposed between alternating adjacent columns of first guide pins, said second guide pins disposed in column pairs a specified distance above and below a line passing through each of said first guide pin rows.
~1 - After registration and mating of ~he second thermoplastic adhesive layer to
2 1I the circuit board, the circuit board is precisely Pligned above the wiring fi~ture and
3 1l compressive pressure is applied to the circuit bd to urge the circuit board and
4 second sdhesive layer into adhesive confronting relation with the first adhesive
5 ¦¦ layer, thereby fixably locating the wire nets on the circ~it board~ Registration and
6 'I mati~g of the wire nets to the circuit board in the above described manner ass~lres
7 11 that selected points of wire nets confront selected conductive pads on the surface
8 ~1 Of the circwt board.
9 il The circuit bd and adhered wire mat are removed from the i~ture plate,
10 ¦ a low durometer rubber sheet is overlaid on ~e first adhesive layer, and the c~rc~it board and mat with overl~id rubber sheet are subjected to compressive pressure~
12 ¦ This step causes the adhesive layers to conformall~ coat the ~nres and the circuit 13 bd. The circ~lit bd w~th wires snd adhesive sdhered thereto is inserted into 14 I an oven and the thermoplastic adhesive materi~l is cured at an elevated 15 I temperature. A s~lder ~us is nea~t applied to the circuit board and the board is 16 i traDsferred to an oven for a brief period of time to increase the viscosity of the 17 ~c Wires confronting selected conductive pads on the circuit board are solde!ed 18 il to the pads to complete interconnection of the c~rcwt boar~ The circwt board is 19 ¦ ~maIly cleaned na an ult~asonic cleaning proc~;.
¦A wire mat produced in ac~rdanc~ w~th the present disc~osure may be 21 j pro~rided on one or bcth surfaces of the circuit bosrd IlBRIEF DESCR~r~ON OF THE DR.~WIN&S
.1 22 1lEmbodiments of the invention will now be described 23 1i with reference to the accompanying drawings in which:-24 ',1 FIG. lA is a partial top view of a wiring fixture plate 1 in accordance with one embodiment of the present invention;
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FIG. lB is a sectional side view of the wiring fixture plste of ~IG. lA;
2 FIG. 2A is a side elevstion view of a delete pin sLideably receivable in 3 ` selected spertures of the wiring fixture plate;
4 ij FIG. 2B ~s a side eleva~ion Yiew of a guide pin slideably receivable in ., selected spertures of the wiring fixture plste;
6 ll ~IG. 3 is a c~taway perspective view illustrating guide and delete pins 7 ,l loaded in respective apertures of the wiring fi~ture plate;
8 ; j FIG. 4 is a sectional elevation view showing the fi ~ture plate inverted and a g 1~ bcttom pl~te employed to retain the guide and delete pins within respective lD ,¦ ap~rtures;
PIG. s is a partial top view i~lustrating a pin retaining plate;
13 !11 FIG. 6 is a partiPl top view illus~ating a ciearance plate;
EIG. 7 is a sectional elevation view illustrating the pin retaining plate 16 disposed over guide and delete pins to friction~ly maintain the pins in a normPI1y 17 i' verticQl orientation;
18 ll EIG. 8 is a se~tional elevation view ill~ctrating the c~eqrance plate lg ! substituted for the bottom plate;
21~ 1l EIG. 9 is a partial top view of the cutter backing p~te employed in 21 . practic~ an embcdiment;
22 FIG. 10 is a sectional side ~riew showing the cutter backing plate disposed 23 . over guide and delete pins and in confronting relation with the pin retaining pLate;
24 FIG. llA is a top view of a first multilayered sheet comprising an adhesive layer and outer rPlease layers, 26 1 FIG. llB is a perspec~ive view of the multilayeled sheet of Fig. llA rrith 2~ ~' release and adhesive l~yers partially peeled away;
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_ 5 _ " i26X ~4 FIG. 12 is a sectional side view illustrating the addition of release and . . . 2 , I adhesive layers, to the fixture plate;
3 l, ~IG. 13 is a sectional side view jllustrating flattening of the adhesive and 4 i, release layers into confronting relation with the cutter bacld~g plate;
S jli FIG. 14 is a perspective view of a wiring head employed in accordance with 6 11 an embodiment;
7 ~IGS. 15~-15D ~re sclt,ematic views illustrating wiring conventions in 8 ~ccordanc~ unt~ embodiments of the present lnvention;
9 FIG. 16A is a top schematic view illustrating routing of the continuous wire 10 1 on the wiring fisture plate along a predetermined psth through s~lected guide and
12 ¦ This step causes the adhesive layers to conformall~ coat the ~nres and the circuit 13 bd. The circ~lit bd w~th wires snd adhesive sdhered thereto is inserted into 14 I an oven and the thermoplastic adhesive materi~l is cured at an elevated 15 I temperature. A s~lder ~us is nea~t applied to the circuit board and the board is 16 i traDsferred to an oven for a brief period of time to increase the viscosity of the 17 ~c Wires confronting selected conductive pads on the circuit board are solde!ed 18 il to the pads to complete interconnection of the c~rcwt boar~ The circwt board is 19 ¦ ~maIly cleaned na an ult~asonic cleaning proc~;.
¦A wire mat produced in ac~rdanc~ w~th the present disc~osure may be 21 j pro~rided on one or bcth surfaces of the circuit bosrd IlBRIEF DESCR~r~ON OF THE DR.~WIN&S
.1 22 1lEmbodiments of the invention will now be described 23 1i with reference to the accompanying drawings in which:-24 ',1 FIG. lA is a partial top view of a wiring fixture plate 1 in accordance with one embodiment of the present invention;
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FIG. lB is a sectional side view of the wiring fixture plste of ~IG. lA;
2 FIG. 2A is a side elevstion view of a delete pin sLideably receivable in 3 ` selected spertures of the wiring fixture plate;
4 ij FIG. 2B ~s a side eleva~ion Yiew of a guide pin slideably receivable in ., selected spertures of the wiring fixture plste;
6 ll ~IG. 3 is a c~taway perspective view illustrating guide and delete pins 7 ,l loaded in respective apertures of the wiring fi~ture plate;
8 ; j FIG. 4 is a sectional elevation view showing the fi ~ture plate inverted and a g 1~ bcttom pl~te employed to retain the guide and delete pins within respective lD ,¦ ap~rtures;
PIG. s is a partial top view i~lustrating a pin retaining plate;
13 !11 FIG. 6 is a partiPl top view illus~ating a ciearance plate;
EIG. 7 is a sectional elevation view illustrating the pin retaining plate 16 disposed over guide and delete pins to friction~ly maintain the pins in a normPI1y 17 i' verticQl orientation;
18 ll EIG. 8 is a se~tional elevation view ill~ctrating the c~eqrance plate lg ! substituted for the bottom plate;
21~ 1l EIG. 9 is a partial top view of the cutter backing p~te employed in 21 . practic~ an embcdiment;
22 FIG. 10 is a sectional side ~riew showing the cutter backing plate disposed 23 . over guide and delete pins and in confronting relation with the pin retaining pLate;
24 FIG. llA is a top view of a first multilayered sheet comprising an adhesive layer and outer rPlease layers, 26 1 FIG. llB is a perspec~ive view of the multilayeled sheet of Fig. llA rrith 2~ ~' release and adhesive l~yers partially peeled away;
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_ 5 _ " i26X ~4 FIG. 12 is a sectional side view illustrating the addition of release and . . . 2 , I adhesive layers, to the fixture plate;
3 l, ~IG. 13 is a sectional side view jllustrating flattening of the adhesive and 4 i, release layers into confronting relation with the cutter bacld~g plate;
S jli FIG. 14 is a perspective view of a wiring head employed in accordance with 6 11 an embodiment;
7 ~IGS. 15~-15D ~re sclt,ematic views illustrating wiring conventions in 8 ~ccordanc~ unt~ embodiments of the present lnvention;
9 FIG. 16A is a top schematic view illustrating routing of the continuous wire 10 1 on the wiring fisture plate along a predetermined psth through s~lected guide and
11 1 delete pins;
12 ¦ ~?IG. 16B is a cu*away perspecti~e view i31ustrating routing of the con~uous
13 ¦ wire;
14 1l ~IG. 17 is a sectionsl side view illl~trsting the addition of a release layer
15 li over the continuous routed wire;
16 1, FIG. 18 is a partiPl top view of a pressure plate employed in practiciry~
17 Ij an embodiment of the present invention;
18 ii PIG. 19 is a sectional side view l~lustrating the application of compressi~re
19 ¦¦ pressure to the continuous wire and underlying a~,esive layes to adhere the wire to 2û ¦¦ the ~ayer;
21 1¦ PIG. 20 is a cutaway perspective view of a cutting head in ac~ordance with 22 ;j an embodiment of the present invention;
23 ~I FIG.21is a top schernatic view ~lustrating wire nets fol~o~nng se~erance OI
24 the continuous wire with the cutting head of FIG. 20;
25 1I FIG. 22 L~ a sectional side ~iew i~l~strating depression of delete pins 2S ! res~llting from application of the pressure plate and peelable removal of the upper 27 rele~se Layer, .
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PIG. 23 iS a perspectwe view of a second multilsyered sheet employed in 2 ,` accordance with an embodiment;
3 1! FIG. 24 i a partial top view of a circuit board used;
4 1!
5 1 PIG. 25 is a perspective view i~ rqting the sdhesion of the adhesive layer 6 !1 of the second multllsyered sheet to the circuit board of ~ i. 24;
7 1FIG. 26 is a sectional side view illustrating the registration of the printed 8 circu;t bo~r~ of Fig, 24 over the guide pins and wiring fixture- p7qte;
9 ~IG. 27 is a ses!tioDal side view illust~ating mating of the printed circ~it bcard with the underlying wire mat after appli~tion of compressive pressure to 11 ¦ the circ~it bd and mat;
12 1~IG. 2~i ic a sectional side view ~lustrating conform~l coating of the circuit 13 I board and wire nets by application of compressive pressure to the wired surface 14 ll through a rubber pad;
15 'l ~IC;. 29A is a schematic view of a soldering tip in accordance with 16 1~ ~n embodiment of the present invention disposed above an intend-17 j, ed location of interconnection; and 18 ll l FIG. 29B is a schematic view of the sol~ering tip o~ ~ig.
29A engaging a selected wire net point and underlying conductive pad.
DETAILED DESCRIP~ION
, !~In accordance with the present invention a method is disclosed in which a
21 1¦ PIG. 20 is a cutaway perspective view of a cutting head in ac~ordance with 22 ;j an embodiment of the present invention;
23 ~I FIG.21is a top schernatic view ~lustrating wire nets fol~o~nng se~erance OI
24 the continuous wire with the cutting head of FIG. 20;
25 1I FIG. 22 L~ a sectional side ~iew i~l~strating depression of delete pins 2S ! res~llting from application of the pressure plate and peelable removal of the upper 27 rele~se Layer, .
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PIG. 23 iS a perspectwe view of a second multilsyered sheet employed in 2 ,` accordance with an embodiment;
3 1! FIG. 24 i a partial top view of a circuit board used;
4 1!
5 1 PIG. 25 is a perspective view i~ rqting the sdhesion of the adhesive layer 6 !1 of the second multllsyered sheet to the circuit board of ~ i. 24;
7 1FIG. 26 is a sectional side view illustrating the registration of the printed 8 circu;t bo~r~ of Fig, 24 over the guide pins and wiring fixture- p7qte;
9 ~IG. 27 is a ses!tioDal side view illust~ating mating of the printed circ~it bcard with the underlying wire mat after appli~tion of compressive pressure to 11 ¦ the circ~it bd and mat;
12 1~IG. 2~i ic a sectional side view ~lustrating conform~l coating of the circuit 13 I board and wire nets by application of compressive pressure to the wired surface 14 ll through a rubber pad;
15 'l ~IC;. 29A is a schematic view of a soldering tip in accordance with 16 1~ ~n embodiment of the present invention disposed above an intend-17 j, ed location of interconnection; and 18 ll l FIG. 29B is a schematic view of the sol~ering tip o~ ~ig.
29A engaging a selected wire net point and underlying conductive pad.
DETAILED DESCRIP~ION
, !~In accordance with the present invention a method is disclosed in which a
20 l' wire mat having a plur lity of wire nets disposed on the rnat in a predetermined
21 rout~ng pattern is produced and then mated with a circuit board having a defined
22 1 conductive etch Layout intended for use with the present method. This nove~23 1 method for pr~ducing 8 wired circuit board comprises three major ope~ations 24 1 i including a w~re routing operation, a wire severing operation and a ma :ing 25 1 operatio~L The wire mat ic produced by laylng an adhesiYe lsye~ over a ~l~tUre 26 1I plate ha~ting upwar~y projectiIlg pins e~tending therethrough snd then routing a l! -., ,, !~ .
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1 '; continuous ins llated wire along a predetermined path through upwardly projecting 2 pins. The continuous insulated wire is adhered to the underlying adhesive layer by 3 , I application of compressive pressure. The continuous wire ~s then severed at 4 ' selected locations in a cutting operstion to produce a plurality of wire nets fixed in 5 I position by the adhesive sheet. A second adhesive layer is adhered to a circuit 6 ¦ board having a defined conductive pad layout and apert~res in a pattern 7 ! corresponding to the location of guide pins in the fixt~re. Apertures in the circuit 8 I bd ~Lrs plated throug~ and s~zed to recsive integrated cir~uit or other ping ll socke~. Conductive pads provided on the ~ircuit board are located sdjacent each 10 ! pin sockst aperturs snd are electrica~ly connscted thereto.
11 1 The printed crrcuit board ic prscisely registersd over the wiring fi~t~2re 12 ¦ pLate such that csnters of guide pins coasially align with centers of integrated 13 l, cir~uit pin socket receiving apertures. The circuit board and fi~ure are su~jected 14 ~, to compressive pressure thereby forcing the adhesive layer adhesed to the circuit 15 j' board into confronting sdhesive contact with the wire net and underlying adhesive 16 i1 layer. As a conse~uence of w~ring in accordance with presently disclosed wiring 17 11 conventions, selected points of wire nets confront selected conductive pads. The 18 11, circuit board and wire mat are removed from the fi~cture and the adhesive layers 19 ¦¦ are cured by subjecting the adhesi~e layers to sn eleq1ated temperat~e for a 20 ll defined period of time. Wires con~ron'dng conductive pads are then soldered to the 21 pads in a solder reflow operation to interconnect selected one~s of t};ie integrated 22 ,~ circuit pin socket receiving apertures, thereby completi~g inter~onnection of the
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1 '; continuous ins llated wire along a predetermined path through upwardly projecting 2 pins. The continuous insulated wire is adhered to the underlying adhesive layer by 3 , I application of compressive pressure. The continuous wire ~s then severed at 4 ' selected locations in a cutting operstion to produce a plurality of wire nets fixed in 5 I position by the adhesive sheet. A second adhesive layer is adhered to a circuit 6 ¦ board having a defined conductive pad layout and apert~res in a pattern 7 ! corresponding to the location of guide pins in the fixt~re. Apertures in the circuit 8 I bd ~Lrs plated throug~ and s~zed to recsive integrated cir~uit or other ping ll socke~. Conductive pads provided on the ~ircuit board are located sdjacent each 10 ! pin sockst aperturs snd are electrica~ly connscted thereto.
11 1 The printed crrcuit board ic prscisely registersd over the wiring fi~t~2re 12 ¦ pLate such that csnters of guide pins coasially align with centers of integrated 13 l, cir~uit pin socket receiving apertures. The circuit board and fi~ure are su~jected 14 ~, to compressive pressure thereby forcing the adhesive layer adhesed to the circuit 15 j' board into confronting sdhesive contact with the wire net and underlying adhesive 16 i1 layer. As a conse~uence of w~ring in accordance with presently disclosed wiring 17 11 conventions, selected points of wire nets confront selected conductive pads. The 18 11, circuit board and wire mat are removed from the fi~cture and the adhesive layers 19 ¦¦ are cured by subjecting the adhesi~e layers to sn eleq1ated temperat~e for a 20 ll defined period of time. Wires con~ron'dng conductive pads are then soldered to the 21 pads in a solder reflow operation to interconnect selected one~s of t};ie integrated 22 ,~ circuit pin socket receiving apertures, thereby completi~g inter~onnection of the
23 ~ circ~lit board.
24 li The circ~t board presently disclosed has an identical ~onductive pad pattern 2~ ,1 on both sides of the board thereby permittng single sided or dou~le sided wire mat 26 circuit boards to bc prodcced in accoroance with this mcthod ,1 Il .
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Referring to Figs. lA through 29B, the continuous insulsted w~re is routed 2 on a fixture of the type illustrated in Figs. lA and lB. Typically, a plurPlity of 3 . identical fixtures of the t~?e shown are mounted on an g-Y a~as table, ~nd a 4 1I routing head feeds a continuous wire through corresponding pins of each fisture S ¦¦ with 2-Y s~s table movement numerica~ly contro~ed. By ganging Iï~b~reS on a 6 ¦¦ single ~:-Y a~s table, sever 1 identical wire mats msy be simultsneously produced 7 1 thereby improving oversll process efficiency and reducing the cos~ of cir~uit board 8 ¦ production.
9 ¦The wiring fixture plate 10 employed, 10 ~ includes apertures 12 sized to slide~ly receive delete puls 14, ml~strated in Pig.
11 ¦2A, and apertures 16 sized to s~ide~bly re~eive guide pins 18 i~lus~ated in ~i~, 2B.
12 ¦ Guide pin apertl~res 16 are disposed in rows. and columns in a repetiti~re pattern of 13 I desired size, As shown in ~ig. lA, apertures for guide pins 18 are disposed in 14 l¦ columns A, C, D, P, G . . . and have a fixed inter-column spacing, In a preferTed 15 .. embodiment of the invention the inte~column spacing is .150 inch Guide pin 16 ~i apestures 1~ of the wiring fisture pLate 10 have a fixed inter-row s~pacing which in 1~ ¦1 a preferred embodiment of the invention is .1 inch on centers, correspondi~ to the 18 jI inter- pin ~acing of typical dual i~line integrated circuit devic~s. Deiete pin 19 ¦ apertures 12 are disposed between adjacent columns of guide pin Ipe~es, 2û ! however, delete pin &pertures 12 are loc~ted only between alten~ating adja~ent 21 ¦ guide pin columns. Thus, ~c seen in ~ig. lA, delete pin apertures 12 in cs~lum~
22 , are disposed between adjacent guide pin apertures 16 of columns A and C, and 23 1 l, delete pin apertures 12 of column E are disposed between adjacent guide pin 24 1 apertures 16 of colums D and F. Delete ph apertures ~ 2 are disposed e~ distant
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Referring to Figs. lA through 29B, the continuous insulsted w~re is routed 2 on a fixture of the type illustrated in Figs. lA and lB. Typically, a plurPlity of 3 . identical fixtures of the t~?e shown are mounted on an g-Y a~as table, ~nd a 4 1I routing head feeds a continuous wire through corresponding pins of each fisture S ¦¦ with 2-Y s~s table movement numerica~ly contro~ed. By ganging Iï~b~reS on a 6 ¦¦ single ~:-Y a~s table, sever 1 identical wire mats msy be simultsneously produced 7 1 thereby improving oversll process efficiency and reducing the cos~ of cir~uit board 8 ¦ production.
9 ¦The wiring fixture plate 10 employed, 10 ~ includes apertures 12 sized to slide~ly receive delete puls 14, ml~strated in Pig.
11 ¦2A, and apertures 16 sized to s~ide~bly re~eive guide pins 18 i~lus~ated in ~i~, 2B.
12 ¦ Guide pin apertl~res 16 are disposed in rows. and columns in a repetiti~re pattern of 13 I desired size, As shown in ~ig. lA, apertures for guide pins 18 are disposed in 14 l¦ columns A, C, D, P, G . . . and have a fixed inter-column spacing, In a preferTed 15 .. embodiment of the invention the inte~column spacing is .150 inch Guide pin 16 ~i apestures 1~ of the wiring fisture pLate 10 have a fixed inter-row s~pacing which in 1~ ¦1 a preferred embodiment of the invention is .1 inch on centers, correspondi~ to the 18 jI inter- pin ~acing of typical dual i~line integrated circuit devic~s. Deiete pin 19 ¦ apertures 12 are disposed between adjacent columns of guide pin Ipe~es, 2û ! however, delete pin &pertures 12 are loc~ted only between alten~ating adja~ent 21 ¦ guide pin columns. Thus, ~c seen in ~ig. lA, delete pin apertures 12 in cs~lum~
22 , are disposed between adjacent guide pin apertures 16 of columns A and C, and 23 1 l, delete pin apertures 12 of column E are disposed between adjacent guide pin 24 1 apertures 16 of colums D and F. Delete ph apertures ~ 2 are disposed e~ distant
25 ll above arld below row center lines 1, 2, 3 .... In a preferred embodiment of the
26 ¦I hvention, the delete pin aperttrres 12 are disposed midway between rows, as
27 ,pre~nously indicated, and one delete pin aperture 12 is lo~ted .025 inch a~o~re e~ch Il .
g _ i 4~
~ i ' row center line, and another delete pin sperture 12 is disposed .02S inch below each 2 , row center ~ne. Thus in the embodiment having inter-row spacings of .1 inch on 3 ~, centers, delete pin apertures have a fixed inte~pin spacing of .OS0 inch In the 4 li illustrated embodiment, guide pin spertures 16 have a diameter of .076 inches and 5 ¦¦ delete pin apertures 12 have a diameter of .036 inches. The wirislg fixture pLste is 6 I typi- qlly fsbricated of a hard flat material such as met 1, epoxy, or plastir or any 7 ¦ other suitab~e materisl, and is presently i~lustrated ~c hsving a thickness of 8 1 sppro~mately .062 inch 9 ~¦ Delete pins 14 hsve a head portion 20 of a first diameter, a shoulder portion 10 ¦ 22 of a second diameter le~s than the first di~Lmeter and a shank portion 24 of 11 ¦ diasneter less than the shoulder 22~ The o~erall length of the delete pin 14 is .323 12 ! inch with the head portion of length .û30 inc~ the shoulder portion of length .057 13 ~ inch, and the shank 24 portion of length .238 inch in a preferred embodiment. In 14 i this preferred embodiment, the diameter of the head portion 20 of the delete pin . 14 is .038 inch, the diameter of the shoulder portion 22 is .083 inch, and the 16 diameter of the shank portion 24 LS .018 inch The delete pin 14 shoulder portion 22 17 , is thus slideably receivable in wiring fisture plate 10 apertures 12.
18 ¦ The guide pin 18 shown in Pig 2B, includes a head portio~l 2S of a.first 19 I di~neter, a shoulder portion 28 of a second diameter less than the first diasneter 20 ¦ and a shank por~:ion 30 of a third diameter less than the shoulder 28 diameter. As 21 ~ lustrated~ ends 32 of the guide pins 18 are pro~ided with a chamfer for reasos 22 ~ which will subsequently be appreciated. In the illustrated embodiment, the hePd 23 i portion 26 of guide pins 18 has a .078 inch diameter, the shoulder p~ortion 26 has a 24 1 .073 inch diameter and the shank p~rtion 30 has a .065 inch diameter. The overall 25 11 length of the ~ide pins is .353 inch; the head portion 26 being .030 inch in length~
2~ 1! the shoulder portion 28 being .055 inch in length and the shank being .268 inch in !! -Il - 10 -~., !
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i! length. The shoulder portion 28 of the guide pin 18 is sized to be slideably received 2 1I within guide pin apertl~res 16 of the wiring fixture plate }Q
3 l~ As illustrated in ~ig. 3, delete pins 14 and guide pins 18 are slideably 4 11l disposed within respective delete pin apertures 12 and guide pin apert~es 16 of the 5 l', fixture plate 10 such that shanlcs of the respective piJls project from a wiring 6 ~¦ surface 34 of the fi~ture plate 10. ~ead portions 2~ and 26 of respective delete 7 1l and guide piIls 14 and 18 are of dismeters larger than t~e respective pin receiving 8 11 apertt~res of the fixture plate 10 and thereby maintain the pins Ul fi~ed norma~y 9 !! vertical orientation following insertion in respective p~n apertures. The fi~e 10 il plate 10 may be populated wnth delete pins 14 and ~ride pins 18 by manuPlly inserting pins into appropriate receiving apertures of the plate or alternati~ely via 12 ~l an~ suitable automated loading techni~ue. Ir~one such t~hnique, a mask is placed 13 li over guide pin apertures 16, delete pins are disposed over the mask, and the fi~ture 14 plate is vibrated causing delete pins to populate delete pin apertures. Delete pins , are muntained in position by Q vacuum source applied to the ~ g surface 34 of 16.il the ~ixture plate 10. The mask is removed, and guide pilss re disposed above the 17 ¦~ fi~e p.ate 10, and the fisture plate is vibrated to po~ate guide pin apertures 18 ¦ 16. Any appropriate technique for populating the fisture plate 1~ with guide piDs 19 ¦ 18 and delete pins 14 may be employed to accomplish th~s pin loading step ¦ In a fisb~e plate inverting step, a bottom plate 36 is applied over the head 21 . portions of guide pins 18 and delete pins 14 to capture the head po~tions of the pins 22 1l between the bottom pl~te 36 and the fi~ture plate 10, and the f~t~e plate 10 is 23 ~I inverted to assu~Ile the orientation i~ustrated in Fig. 4. The bottom plate may be 24 ,, any suitably sized material havi~lg 8 flat head confronting surface. Such materials 25 11 aS one quarter inch G10 eposy or metal may be suita~r employed for fabrication 26 ~ of the bottom plate 36.
27 ¦¦ A pin ~etaining plate 38 ha~nng apertures with centers correspondingly
g _ i 4~
~ i ' row center line, and another delete pin sperture 12 is disposed .02S inch below each 2 , row center ~ne. Thus in the embodiment having inter-row spacings of .1 inch on 3 ~, centers, delete pin apertures have a fixed inte~pin spacing of .OS0 inch In the 4 li illustrated embodiment, guide pin spertures 16 have a diameter of .076 inches and 5 ¦¦ delete pin apertures 12 have a diameter of .036 inches. The wirislg fixture pLste is 6 I typi- qlly fsbricated of a hard flat material such as met 1, epoxy, or plastir or any 7 ¦ other suitab~e materisl, and is presently i~lustrated ~c hsving a thickness of 8 1 sppro~mately .062 inch 9 ~¦ Delete pins 14 hsve a head portion 20 of a first diameter, a shoulder portion 10 ¦ 22 of a second diameter le~s than the first di~Lmeter and a shank portion 24 of 11 ¦ diasneter less than the shoulder 22~ The o~erall length of the delete pin 14 is .323 12 ! inch with the head portion of length .û30 inc~ the shoulder portion of length .057 13 ~ inch, and the shank 24 portion of length .238 inch in a preferred embodiment. In 14 i this preferred embodiment, the diameter of the head portion 20 of the delete pin . 14 is .038 inch, the diameter of the shoulder portion 22 is .083 inch, and the 16 diameter of the shank portion 24 LS .018 inch The delete pin 14 shoulder portion 22 17 , is thus slideably receivable in wiring fisture plate 10 apertures 12.
18 ¦ The guide pin 18 shown in Pig 2B, includes a head portio~l 2S of a.first 19 I di~neter, a shoulder portion 28 of a second diameter less than the first diasneter 20 ¦ and a shank por~:ion 30 of a third diameter less than the shoulder 28 diameter. As 21 ~ lustrated~ ends 32 of the guide pins 18 are pro~ided with a chamfer for reasos 22 ~ which will subsequently be appreciated. In the illustrated embodiment, the hePd 23 i portion 26 of guide pins 18 has a .078 inch diameter, the shoulder p~ortion 26 has a 24 1 .073 inch diameter and the shank p~rtion 30 has a .065 inch diameter. The overall 25 11 length of the ~ide pins is .353 inch; the head portion 26 being .030 inch in length~
2~ 1! the shoulder portion 28 being .055 inch in length and the shank being .268 inch in !! -Il - 10 -~., !
'I lZ~
i! length. The shoulder portion 28 of the guide pin 18 is sized to be slideably received 2 1I within guide pin apertl~res 16 of the wiring fixture plate }Q
3 l~ As illustrated in ~ig. 3, delete pins 14 and guide pins 18 are slideably 4 11l disposed within respective delete pin apertures 12 and guide pin apert~es 16 of the 5 l', fixture plate 10 such that shanlcs of the respective piJls project from a wiring 6 ~¦ surface 34 of the fi~ture plate 10. ~ead portions 2~ and 26 of respective delete 7 1l and guide piIls 14 and 18 are of dismeters larger than t~e respective pin receiving 8 11 apertt~res of the fixture plate 10 and thereby maintain the pins Ul fi~ed norma~y 9 !! vertical orientation following insertion in respective p~n apertures. The fi~e 10 il plate 10 may be populated wnth delete pins 14 and ~ride pins 18 by manuPlly inserting pins into appropriate receiving apertures of the plate or alternati~ely via 12 ~l an~ suitable automated loading techni~ue. Ir~one such t~hnique, a mask is placed 13 li over guide pin apertures 16, delete pins are disposed over the mask, and the fi~ture 14 plate is vibrated causing delete pins to populate delete pin apertures. Delete pins , are muntained in position by Q vacuum source applied to the ~ g surface 34 of 16.il the ~ixture plate 10. The mask is removed, and guide pilss re disposed above the 17 ¦~ fi~e p.ate 10, and the fisture plate is vibrated to po~ate guide pin apertures 18 ¦ 16. Any appropriate technique for populating the fisture plate 1~ with guide piDs 19 ¦ 18 and delete pins 14 may be employed to accomplish th~s pin loading step ¦ In a fisb~e plate inverting step, a bottom plate 36 is applied over the head 21 . portions of guide pins 18 and delete pins 14 to capture the head po~tions of the pins 22 1l between the bottom pl~te 36 and the fi~ture plate 10, and the f~t~e plate 10 is 23 ~I inverted to assu~Ile the orientation i~ustrated in Fig. 4. The bottom plate may be 24 ,, any suitably sized material havi~lg 8 flat head confronting surface. Such materials 25 11 aS one quarter inch G10 eposy or metal may be suita~r employed for fabrication 26 ~ of the bottom plate 36.
27 ¦¦ A pin ~etaining plate 38 ha~nng apertures with centers correspondingly
28 , located with the apertures of the wiring fi2ture plate $0 is dis~sed over shanl¢ of
29 1I de}ete pins 14 and guide pins 18 to maint~in the plns in fi~ed verffcal position il 1, ,1, . i , _ _ . . . ..
,1 12~
I within the wiring fixture E~la~e 10. The pln retain~ng pl~te 3~ h~c guide pin 2 1 apertures 40 and delete pin apertures 4~ sized for interference fit with the shanks 3 ¦ 30 of guide pins 18 and shanks ~4 of delete pins 14, respe~tively. The pin retaining 4 1I plate 38 is registered over the fi cture p~ate 10 such that guide pin apertures 40 and S ¦i delete pin apertures 4~ coaxiplly align with ~he shanks of the respective guide and 6 ~¦ delete pins. In the present embodiment, guide pin apertl~res 40 of the pin ret~inirlg 7 1 I plate 38 have a diameter of .062 inch and delete pin apertures 42 of the pin 8 ¦ retai~ing plate 38 ha~re a diameter of .~16 inch The pin retaining pl~te LS
9 fsbricated ol~ a resilient material, such as chipboard and is presen'dy shown to be 13 appro~imately .030 ~nch h thic~ess.
11 A clearance Filate 44, such s that i~lustrated i~ ~ig. 6, ha~ apertures 12 ¦, with centers ~orrespondingly located ~ith the centers of apertures of the wiring 13 'I fisture plate 10 has guide pin apertures 46 and delete pin aperblres 48 siz~d for 14 ,' clearance fit over respectively guide pin 18 shanks 30 and delete pin 14 shanks 24.
15 I, The clearance plate is fabricated of a hard material having flat surfaces such as 16 ll metal or G-10 epo2cy and in the present embodiment is shown to be appro~amately 17 .250 inch in thickness. Guide pin aperttlres 46 in the i~st~ated embodiment are 18 .085 inch in d`iameter and delete pin apertures 48 are .045 inch in duLmeter.
19 AS mustrated in Pig. ~, the pin retaining plate 38 is ~oa~ally aligned wit~
guide pin and delete pin apertures over respective guide pin and delete pin sh~ks, 21 , and the clearance plate 44 is correspondingly positioned sbove the pin ret~ining 22 1I plate 38. A compressive pressure is applied to the cle~rance plate 44 to ~ge the 23 l, pin retaining plate 38 into confrontislg relation with the fi:~t~re plate 10. Since the 24 ¦1 ~ide pin apertures 40 and delete pin apertures 42 of the pin reta~n~ng plate 3~ are !¦ of diauneters sm a~er than the shanks of respective guide pins 18 and delete pins 14, 26 I the pin retainLng plate 38 aperture ~Pl15 frictiona~y erygage the shallks of the 27 I respective pins ard maiDtain the pins iD a fisqd verticel crientqticn within t~e I!
I I ;
I, - 12 -l' ~2~jz4~3~
fixture plate. Since the clearance pla~e 44 has guide pin apertures 46 and delete 2 il pin apertures 48 of diameters greater than respective guide pins 18 and delete pins 3 l, 14, upon applicstion of compressive pressure to the clearance plate 44, the plate 44 4 ~! slides freely downward over the respective shan~ under compressive pressure, and 11 is re~dily removed once the pin retaining plate 38 is in confronting relation with 6 I the wiring fixb~re plate 10.
7 I In a nest operation t)~e bottom plate 36 is removed from confronting 8 I relation with the hePds of delete pins 14 and heads of g~de pins 18, and the 9 , clearsnce plate 44 is disp~ed below the fixtute plate 10 such that guide pin apertures 46 and delëte pin apertures 48 of the clearan~e plate 44 are in coaacial 11 . alignment with respective guide pin apertures 16 and delete pin a~es 12 of the 12 I wiring fisture plate lû. Since the he ds 26 of guide pins 18 and the hesds 2~ Of 13 ,I delete pins 14 are of diameters less than respective apertures of the clesrance 14 li plate 4~, the heads of guide pins 18 end delete pins 14 are slidesbly received within ,' respective ~pertures of the ~learance plate 44, as illus~ated in Fig. 8. Friction~l 16 ¦¦ engagement of guide pin aperture w~llc 50 and delete pin ~aperture walls 52 of the 1~ ¦ pin retai~ ng plate 38 with respecti~re guide and delete pin shan~i ret~ C the pins 18 ¦ in the fisture plate 10 after substit~tion of the clearan~e plate 44 for the bot~om 19 plate 36 su~jacent the wiring fisture plate 10. A cutte~ backing plste 54 having ¦ guide pin apertures 56 and delete pin apOEtures 58 with centers eolTesp~ndingly 21 !1 loc8ted with the centers of guide pin apertures 16 and delete pin apertures 12 of 22 I the wiring fixtllre plate 10 is slideably disp~sed over gu;ide pins. 18 and delete pins 23 il 14 and in confronting relation with the pin retaining plate 38, as illustrated in Fig.
24 ~¦ 10. Guide pin apertures 56 and delete pin apertures 58 of the clitter bac~dng plate 1¦ 54 are slzed for <~earance fit over guide pin shanks 30 and delete pin shar~s 40 of 26 ¦ the respective pinsIn the pre~ent embodiment, the diameter of the guide pin27 1 apertures 56 is .û72 inch and the diameter of delete pin apertures 58 is .a2~ inch 1,~
t 1, L~3 il !~1 In a ne2ct operation, a first multilayered sheet 6~ comprising an adhesive 2 ii layer 6Z, an upper release iayer 64 snd a lower release layer 66 Pre sldeably 3 ¦I disposed on the fixture in ~orlfronting relation with the cutter backing plate 54 4 ~¦ after peelably resnoving the upper layer 64 from the adhesive layer 6a The 51l adhesive layer 62 comprises a thermoplsstic adhesive material such as nitrite 6 1¦ pheno}ic or any other suitable thermoplastic adhesive materiaL Prior to ¦1 application of the first mult1ayered sheet 60 to the fxture, the s~eet s pre-dr~led I; as illustrated in Figs. llA and llB. The upper release layer 64 and the lower layer 9 i 66 of the multilsyered sheet 6~ are typicPlly fabricated of a rele se paper 10 1 impregnated with a was like material to permit peelable removal of the respecffve 11 ¦ layers from the a~esive hyer 62. The upper rele~ce layer 64 is treated with a l2 ¦ release agent which reduces adhesion of the lPyer 64 to the adhes~ve 62. Since the 13 ;1 lower release layer 68 is not ~eated with a rele_se agent, upon peeling, the upper l4relesse layer 64 resdily separates from the adhesiYe layer 62 lea.~ing the adhesive l5layer 62 and the lower release layer 66 in adhesive contact. Typically, a plurality ~6 '11 of first multil~yered sheet~ 60 are pre-drilled in stacked relatioDship to improve 17 i over~ll process efficienc~.
18 ¦¦The first multilayered sheet 60 includes guide pin apertures 68 and dele~e 19 pin ~pertures 70, with delete pin ap~tures 70 disposed bet~een alternatillg 2~ adjacent c~lumns of guide pins aper~res 68. The inter-column spac~ between 21 guide pin apertures 68 and intermediate deiete pin apertllres 7~, such as the 22 , spacing between columns A and C or D and F is .12û inch in the illustrated 23 Il, embodiment. The on center inter-column spacing of other adiacent guide pin 24 ll apertures 62, such as between columns C and D or F and ~ is .l80 inch as presently 251I showD. Delete pin apertures 70 are illustrated as being .~21 inch in diameter a~d 251l ~re 10cated on centers corresponding to center loc3hons of delete pin apertures 12 L'94 1l of the wiring fixture plate 10. Guide pin apertures 68 of the ~lrst multilayered 2 li sheet 60 sre .090 ineh in diameter. Th~, the lateral distance 72 between outer 3 11 extremities of guide pin aperture 68 pairs in columns A and C, D and F, etc. is .210 4 inch The laterPl distance 74 between the outer e2~remities of corresponding guide pins 18 is .215 inch~ As i31ustr~ted in Pig. 12, after peelable removal of the upper 6 rele~se layer 64 from the adhesive layer 62 of the first multilayered sheet 60, the 7 lower release layer 66 and the adhesi~e layer 62 are slideably disposed over the 8 shanks of guide pins 18 and delete pins 14 such ~hat the lowes reIe~e layes 66 ,s in 9 confronting relation with ~e cutte~ back~ng plate 54. Since ~e dis~ance 72 is less than the distance 74,.~ 3nterference o~ urs between the multilayered sheet 60 and 11 guide pins 18 as the lower release layer 66 and the ad~esi~ré }ayer 62 sre slideably 12 disposed over. the~ guide pin shar~c 30 and delete pin shanlc 24. The pliable nature of 13 t~e rele~Lse layer 66 ant adhesive layer 62 permit these layers to be urged into 14 I confronting relation with the cutter backing plate 54 as iilustrated in Fig. 13. To 15 ! assure that the rele~se layer 66 and adhesive layer 62 are in planar confronting 16 I relation with the cutter backing pLate 54~ a clearance plate 76 having a release 17 ¦ layer 78 bonded to the adhesive confronting surface of the plate 76 is slideably 18 ¦ disposet over the shanloe of delete pins 14 and guide pins 18 and a light compressive 19 I pressure is appJied. The pres~ce of the rele~se layer 78 permits removal of the 2û c~earance plate 7B from the fisture after this pressure application step without 21 adhesion of the adhesive layer 62 to the plate 76. After removal of the clearance 22 i plate 76 and the relesse layer ~8 bonded thereto, the fi~ture is appropriately 23 1 configured for rou'dng of the continuous wire in ac~ordance with the prese~rt 24 ~l inventiorL
2s ll A continous wire 80 is route~ along a predetermined path under tension and 26 ¦ in confronting relation with selected guide pins 18 and delete pins 14 employing a 27 rout ~ng head 82 of the type illustrated in l~ig. 14. A routing head 82 oii the type I!
,, l~ f~
-shown is provided for each fixture to have a continuous wire 80 routed. The 2 routing head 82 is cspable of ~ a~as movement only, and routing of the continuous 3 insulated wire 80 oc~urs as an X-Y a~cis table supporting one or more fixtures 4 I I moves subjacent the routing hesd 82 under numerical controL Any equi~alent S , means to achieve the above~escribed relative head and fi2cture movement mày be 6 I j substituted for the illustrated technique.
7 l'The routing head 82 includes ~ bushing 84 having a bore sized to receive 8 `, tubular steel member 86. The illustrated head includes a tubular member 86 with 9 ' !an outer diameter of ~pprosimately .020 inch and an im~er diameter of 1approsimately .010 inch, permitting free passage of the continuous wire 8Q through the member 86. A nesible tubul~r member 88 is concentric~lly affi~ced to the 2 ~b~ar mernber 86 as i~lus~ated in Fig. 14. The fle~ible tubul~r member 88 13 ,, permits routing of the continuous wire 80 just above the adhesive layer 6214 ' and allows fle2~ure in the event the member 88 traverses a previously routed 15 I segment of the continuous wire 80.
16 llRou'dng of the continuous wire 80 is performed in accordance with defined 17 li routing conventions illustrated schematically in Pigs. 15A through 15D, and in 18 i!~ esamples shown in Pigs. 16A and 16B. The routing conventions assure that 19 ¦~e wire 80, after rotrting and mating with a circuit board in accordance with t~is ¦method~ wm confront selected conductive pads provided on the circuit boa.-d 21 Shanks of guide pins 18 and delete pins 14 serve designated f~mctions in the routing 22 ~ proce~i and in combination define intended locations of interconnectior~ intended 23 locations of w~re severance, and permissible wire routing channels.
24 Intended interconnection locations are defined by wire routing paths in which the continuous wire 80 passes diagonaJly between a guide pin 18 and a delete 26 l ¦ pin 14 as i~ustrated in Figs. 15~ and lSR. Alternatively, an intended 27 ' interconnec~ion location is defined by wire 80 ~avel around an ar~ of the guide pin ' ' , i . -.
.
, .
z~ 34 18 adjacent delete pins 14, as shown in Fig. 15D. Wire 80 routing between a 2 1! pair of delete pins 14 disposed above and below a row centerline 90 in the manner 3 li i31ustrated in Fig. 15C defines an intended location of wire 80 severance between 4 j¦ the r~spective delete pins 14. The wire 80 msy be routed freely without 11 interconnection or severance between vertical channels 92 or horizont 1 rows 94, 6 j illustrated in Fig. 16A. The continuous wire may be routed only once through each 7 ¦ intended interconnection location.
8 !I These routing conventiorls will be further understood by reference to the 9 ¦¦ purely illustrative esample provided below.
l . .
~LO~IlNG EgAMPLE
1 Referring to Fig. 16A, routing of the continuous wire 80 is initiated after anchoring the wire 80 at the edge of the fisture. A continuous ~re 80 is routed 12 jl through vertical channel 96 in confronting relation with guide pin 98 and then 13 ! through horizontal row 100 to guide pin 102. The wire 80 pssses diagonally 14 i between delete pins 104 and 106 defining a first location of wir~e severance 108 between delete pins 104 and 106. l~e wire 80 is then routed d~agon lly betwe~n 16 delete pin 106 and guide pin 110 defining an intenàed first p<~int of inter~onnection 17 112 adjacent guide pin 110. The wire 80 is then routed in confront~g relation with 18 guide pin 112 through horizontal row 114, vertical channel 116 and in comronling 1~ il relation with guide pin 118. The w~re 80 is then routed diagona~y between guide ! pin 118 and delete pin 120 defini~ a second point of interconnection 122 adjacent 21 , guide pin 118 in this first wire net. The wire 80 is then routed around guide pin 122 22 11¦ and guide pin 124 defining a third intended location of interconne~tion 126 adjacent 23 jl guide pin 124. A fourth intended location of interconne-~tion 126 is define~d by 24 ¦~ routing of the wire 80 in confronting relation with guide pin 128 and diagonally :
';
_~ between guide pin 12~ and delete pin 130. The wire is routed diagonally between - 2 I delete pins 130 and 132 thereby defining an intended location of wire severance 3 ll completing points of intended interconnection in this first wire net. The wire 80 is 4 I then routed around guide pin 134, guide pin 136 and disgon~lly betwe~en delete pin l 138 and 140 defining an intended locstion of wire severance. The wire is ne~t 6 l~ routed adjacent pin 134 defining a first point of intended wire interconnection in a 7 1¦ second wire net sdjacent to guide pin 134. A second point of intended wire 8 jj interconnection is obtained by routing the wire 80 around guide pin 138 slong the 9 1I portion of the guide pin circ~lmference adjacent delete pins 14~ and 142. A third lD l point of wire inter~onnection is achieved by routing the wire 80 diagonally between 11 1 dele~e pin 144 a~d guide pin 146, snd a finsl point of w~re 80 inter~onnection ~n this 12 ¦ second wire net 3s achieved by routing the wire 80 in confron'dng relation ~rith i3 1I guide pin 148 and diagonally to delete pin 150. The wire is routed between delete 14 . pins lS0 and 152 def~ an intended location of wire severence between these 15 1I delete pins and finally the wire 80 is routed to the perimeter o~ ~e f~t~re where 16 ¦¦ it is anchored.
1~ 1! After routing o~ the continuous wire 80 along a predetermined path in 18 ¦ acs~ordance with defined wiring conventions, the upper release ~yer 64 which w~c 19 I previously peel~bly resno~red from t`he adhesive layer 62 of the tirst multilayered ¦ sheet is slideably disposed over shanks of respective guide pin~s and delete pins and 21 1 in confronting relation with the continuous routed wLre 8~, as i~l~ated in Pi~. 17.
22 ~ ~ pres~2re plate 154 illustrated in Fig. 18 and having guide pin apertures 156 on 23 1l centers corresponding to centers of guide pin apertures 16 o~ ~e wir~ng fixture 24 ' plste 10 is disposed above the guide pi~ such that guide pin apertures 156 coaxiallv !, ~lign with shan3cs of guide pins lR. It is noted that the pressure plate ~54 includes 26 1 no co~TespondLng apertures for the delete pins 14. After co~cial alignment of the 2? ~ pressure plate 154 over the fistllre plate 10, a compressive pressure is applied to 28 1 the fi~t~e pLate 10 and pressure plate 154 thereby adhe~ ~e continuous wire 80 29 1 to the underlying adhesive layer 62 while slideably ~ging delete pins 14 downward l -18-into delete pin apertures 48 of the clearance plate 44 disposed below the fi~ture - 2 il plate 10. The pressure plate 44 is thereupon removed prep ratory to the severing 3 i l operation.
4 ¦¦ The continuous wire ao is ne~ct severed to form a plur litg of wire nets using S ¦ a cutting head 158 of the type illustrated in Fig. 20. The cutting head 158 has a 6 1 tubular b~rel 160 tapered at an end 162 and defining a ~rc~lar cutting edge 164.
¦ The cut~ g edge 164 in the presently illustrated embodiment is of .035 inch 8 1¦ diameter. A pheumaticslly operated stripper pin 165 is lo~qted within the bore of 9 ¦! tubuhr barrel 16û
10 1 I The cuttin~ head 158 is ~ertically disposed with respect to the wir~ ~ture plate 10 and is a~ted for ;~ ~s movement. Pl~ral c~r~ting heads 158 may be 12 ! ¦ disposed above a numb~r of wir~ fixture pl~tes 10 thereby permit~ing 13 ¦¦ simultaneous severance of the w~res 30 in each of 2 p~ra~ of fi~tures. The Il 14 i l wiring ~isture p~te 10 is disposed on an X-Y sxis ta~le which moves under 15 ,l automated numerical control to position the fi~h~re plate 10 such that an intended 16 'il location of wire 8û severance is precisely aligned subjace~t the c~tting edge 164 of 17 il the cutting head 158. The cutting head 158 is actuated ~or downward movement 18 ~¦ and the cutting edge 164 of the barrel 160 impacts the layers disposed on the 19 fisture, stamping out a circl~lar sectian of release paper 64, ~re 80, adhesi~e 62, relesse paper 68, and a plug from t~e cutter baclcing plate ~4. After seversn~e of 21 the wire 80, the cutting head 158 retracts vertically to a position above the 22 i i severed wire 80 locatiorL The stripper pin 166 is thereupon actuated for a~l 23 ll movement in the bore of the b r.rel 160 to eject waste material disposed in ~e 24 ' I bore as a consequence of the severing operatiorL Typic ny, a source of vacuum i 25 I disposed adjacent the cutting head 158 for removPl of ~he waste material after 26 I ejection from the bore of the balTel 16û by stripper pin 16~. The wire 80 is severed 2~ ~ in the above manner at ~n intended location of wire se~erance thereby forming a '.
Il - 19 -~ 1 ; wire mat comprising a plurslity of wire nets. The continuous wire 80 illustrated in 2 the wiring example of Fig. 16A is shown following the severing operation in Fig. 21.
3 ~ Following the severing operation, the release layer 64 is peelably removed 4 from the adhesive layer 62 as shown in ~ig~ 22.
5 I In sccordance with the present method, 8 second multilayer sheet 168 61I comprising an upper release layer 170, an adhesive layer 172 and a lower release ~¦ layer 17~ is precisely egistered above a cirel~it bo~rd in accordance with the 8 1l present invention, and the adhesive layer 17~ is adhered to the cir~uit bo~rd ~76 9 ,¦ ~ollowing pee~e removal of the lower releqce layer 174 of the sheet 168. T)le 10 1I second multil~yer sheet incl~lde~ guide pu~ apertures haviDg center locqtiolls and 11 il diameters identical to those of the first multilayered sheet 60. It is nated that the 12 1,¦ second multil lyer sheet include no delete pin apertures.
The circuit board 176 employed in practicing the present invention has _ 14 ' plurqlity of pin socket receiving spertures 178. Each aperture is plated through 15 !1 during the board fabrication process, and conductive material on the aperture wa31 161 1 electricqlly communicate with a conductive pad 180 adjacent each aperture 17 Conductive pads Pre .025 inch in width and .050 inch in length 18!i The second multilayer sheet 168, sfter removal of the lo~qer release layer 19~ 174, is applied to the circuit bo~rd 176 such th~t the adllesive layer 172 confronts 23~ the circwt board 176 surface. Precise alignment of the sheet 168 with the circuit 21! board 176 csuses conductive pads 180 to be e~posed through apertures of the 22' multilayer sheet 160.
23 The spertures 178 of the circuit board 176 are .040 inch in diameter and ~re 24 disposed in rows and columns corresponding in center locations to the center 25 I locations of guide pin apertures 16 of the wiring fisture plate 10.
26 I The sdhesive layer 172 is a~hered to the printed circuit board 176 under 2~ l, slight sompressive pressure, and fo31owing adheren~e of the adhe~Ye layer 172 the 28il upper release layer 1~0 of the multilayer sheet 168 is peelably removed from ~e 2g1 adhesive layer 172. The printed circuit bo~rd 176 and adhered adhesive layer 172 !
.
., 4~
are coaxiPlly aligned above respective guide pins 18, as illustrated in Fig. 26. The printed circuit board 176 is disposed such that the adhesive lsyer 172 confronts the 3 plurality of wire nets and the underlying a~hesive layer 62.
4 l~ The socket pin receiving a~>erb~res 178 of the circuit board 176 are of 5 , dia~meter smaller than the diameter of the shank 30 of the guide pin 18, as 6 1l previously indicated. The diameter of the socket pin receiving apertures 178 is 7 11 .040 inch, snd the diameter of the shank 30 of dele~e pin 18 is .065 inch The 81 chamfered end 32 of . ~uide pin 18 precisely align with apertures 178 upon 9', applica~on of compressive pressure to the fixture 10 and circuit ~oard 178.
10~ a mating operation, the plurality of wire nets are adhered to the circ~nt b~d 176. Continued application of comprecsive pressure to the circ~t board 176 12. and the fi2cture lQ urges the guide pu~s 18 downward thraugh the fi2~ture plate 10 131! and into the clearance plate 44, as illus~ated in Fig. 27. Adhesive l~yers 1~2 and 14, 78 achieve adhesive cont ct under compressive pressure thereby precisely locating 15wire nets of the wire 80 on the circtlit bd 1~6. By re con of ~e regis~ration of 16 I~ the wire nets ~nth the circuit board 176 achieved in accordance wi~ this invention, 17 ~I selected points of wire nets confront selected conductive pads 180 after mating of 18 ¦I the wire mat with the circ~it board 176, as ~lustrated in ~ig. 27. The circt2it jl board 176 with adhesi~lre layers 172 snd 62, wire nets embedded t~erein and releace 2S~ qyer 66 are the removed from the fist~lre. After removal of t~e circuit board 21 176 and adhered wire mat from the fi~ture, the release layer 66 is peelably 22 ~ removed from the adhesive Layer 62. A low durometer rubber pad 182 is applied in 23 confronting relation to ~e adhesive l~yer 62, and compressive pressure is applied 24 to the circuit board 176 and r~ber psd 182 to conforma31y coat the wire net 83 and circuit board 176 with adhesive materiaL
, ' .
1~ .
;
., ~LZ~4,~4 Following this conformal coating step, the circuit board 176 is placed in an . . .
2 ~ oven and heated at elevated tempera~ure to cure the thermoplastic adhesive layer.
3 Typic lly~ the adheshe is cured for three (3) hours at a temperture of 260 ~.
4 1l The circuit board 176 is ne~t coated with a solder ~ux by spraying, brushing, 5 j or any other suitable technique and the costed board is subjected to elevated 6 li temperature briefly to increase the viscosity of the fl~. The b~ard 176 is then 7 il loaded onto an ~-Y a~s table, having positioned thereovOE a solderi~g head 182 of 8 ,I the type illus~ated in Pigs. 29~ Emd 2sB. The table ~s c~ntroi~ed to dis~ose a g I i conducti~re pad 180 ha~ a wire confronting ~he pad, direc'dy beneath the 10 ~ soldersng head 182. ~he sold~ head 182, upon actuadon, moves downw~rd from the position illustrated in ~ig. 29A to the position illustrated in ~ig. 29B, urg~ng the 12 !! insulated wire into contact with the pad 180 snd caus~ the wire insul~tion to 13 ~i vaporize in the vicinity of a pad 180. The pad 180 and confron'dng wire are heated, 14 . and solder on the respective pad reflows around the wire to comple~e the 15 ' ' interconnection of the ~rire with the selected pad. The ~-Y axis table and 16 soldering he~d 182 are automatically cycled until a~l ~nres confro~ting conductive 17 .' pads 180 have been soldered to the respective pads. Upon completion of the solde~g operation, the circuit board 176 is fully inter~oMected in acc.orda;nce 19 1¦ with a pre-defined cir~uit wiring patterIL
20¦1~he wired c~rcuit board produced in accordance wi~ the present i~e~ion is 21 1 ultrasonically cleaned preparatory to insertion of pin receiving so~cets, integ.rated 22 circuits and other electric~l components. The circuit bo~rd 176 in accordance with 23 ~, the present invention is adapted to accommodate ~11 commonly avail~ble dual i~
24 i line components. Integrated circ~its having .4 inch or .S Lnch inte~row spacing are 25 , accommodated by slight deformation of integrated circwt lea~; to fit between 2f; ', selected columns of integrated circuit pin sockets ~isposed within pin soc~cet 27 Il. receiving apertures locsted on .45 inch spacing.
'i..
I
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~1, The above deseribed invention is ill--~trative of a novel method and circuit 2 board which permits improved~production efficiencies and overcomes significant3 ¦ disadvantages of-~ior wiring method. Other modifications, embodiments and 4 ~I departllres from the present disclosure are possible without departing from the 5 j inventive concep~ contained herein. Consequently, the invention is to be viewed ~s 6 ! embracing each and every novel feature and novel combination of features present 7 li in or posse~ed b~ the tech~ique and ~rticles herein disclosed and are limited solely 8 ~I by the scope and spirit of the appended ~ ;ms.
il .. .
' l i ~ - 23 -i .
. ' ;;
,1 12~
I within the wiring fixture E~la~e 10. The pln retain~ng pl~te 3~ h~c guide pin 2 1 apertures 40 and delete pin apertures 4~ sized for interference fit with the shanks 3 ¦ 30 of guide pins 18 and shanks ~4 of delete pins 14, respe~tively. The pin retaining 4 1I plate 38 is registered over the fi cture p~ate 10 such that guide pin apertures 40 and S ¦i delete pin apertures 4~ coaxiplly align with ~he shanks of the respective guide and 6 ~¦ delete pins. In the present embodiment, guide pin apertl~res 40 of the pin ret~inirlg 7 1 I plate 38 have a diameter of .062 inch and delete pin apertures 42 of the pin 8 ¦ retai~ing plate 38 ha~re a diameter of .~16 inch The pin retaining pl~te LS
9 fsbricated ol~ a resilient material, such as chipboard and is presen'dy shown to be 13 appro~imately .030 ~nch h thic~ess.
11 A clearance Filate 44, such s that i~lustrated i~ ~ig. 6, ha~ apertures 12 ¦, with centers ~orrespondingly located ~ith the centers of apertures of the wiring 13 'I fisture plate 10 has guide pin apertures 46 and delete pin aperblres 48 siz~d for 14 ,' clearance fit over respectively guide pin 18 shanks 30 and delete pin 14 shanks 24.
15 I, The clearance plate is fabricated of a hard material having flat surfaces such as 16 ll metal or G-10 epo2cy and in the present embodiment is shown to be appro~amately 17 .250 inch in thickness. Guide pin aperttlres 46 in the i~st~ated embodiment are 18 .085 inch in d`iameter and delete pin apertures 48 are .045 inch in duLmeter.
19 AS mustrated in Pig. ~, the pin retaining plate 38 is ~oa~ally aligned wit~
guide pin and delete pin apertures over respective guide pin and delete pin sh~ks, 21 , and the clearance plate 44 is correspondingly positioned sbove the pin ret~ining 22 1I plate 38. A compressive pressure is applied to the cle~rance plate 44 to ~ge the 23 l, pin retaining plate 38 into confrontislg relation with the fi:~t~re plate 10. Since the 24 ¦1 ~ide pin apertures 40 and delete pin apertures 42 of the pin reta~n~ng plate 3~ are !¦ of diauneters sm a~er than the shanks of respective guide pins 18 and delete pins 14, 26 I the pin retainLng plate 38 aperture ~Pl15 frictiona~y erygage the shallks of the 27 I respective pins ard maiDtain the pins iD a fisqd verticel crientqticn within t~e I!
I I ;
I, - 12 -l' ~2~jz4~3~
fixture plate. Since the clearance pla~e 44 has guide pin apertures 46 and delete 2 il pin apertures 48 of diameters greater than respective guide pins 18 and delete pins 3 l, 14, upon applicstion of compressive pressure to the clearance plate 44, the plate 44 4 ~! slides freely downward over the respective shan~ under compressive pressure, and 11 is re~dily removed once the pin retaining plate 38 is in confronting relation with 6 I the wiring fixb~re plate 10.
7 I In a nest operation t)~e bottom plate 36 is removed from confronting 8 I relation with the hePds of delete pins 14 and heads of g~de pins 18, and the 9 , clearsnce plate 44 is disp~ed below the fixtute plate 10 such that guide pin apertures 46 and delëte pin apertures 48 of the clearan~e plate 44 are in coaacial 11 . alignment with respective guide pin apertures 16 and delete pin a~es 12 of the 12 I wiring fisture plate lû. Since the he ds 26 of guide pins 18 and the hesds 2~ Of 13 ,I delete pins 14 are of diameters less than respective apertures of the clesrance 14 li plate 4~, the heads of guide pins 18 end delete pins 14 are slidesbly received within ,' respective ~pertures of the ~learance plate 44, as illus~ated in Fig. 8. Friction~l 16 ¦¦ engagement of guide pin aperture w~llc 50 and delete pin ~aperture walls 52 of the 1~ ¦ pin retai~ ng plate 38 with respecti~re guide and delete pin shan~i ret~ C the pins 18 ¦ in the fisture plate 10 after substit~tion of the clearan~e plate 44 for the bot~om 19 plate 36 su~jacent the wiring fisture plate 10. A cutte~ backing plste 54 having ¦ guide pin apertures 56 and delete pin apOEtures 58 with centers eolTesp~ndingly 21 !1 loc8ted with the centers of guide pin apertures 16 and delete pin apertures 12 of 22 I the wiring fixtllre plate 10 is slideably disp~sed over gu;ide pins. 18 and delete pins 23 il 14 and in confronting relation with the pin retaining plate 38, as illustrated in Fig.
24 ~¦ 10. Guide pin apertures 56 and delete pin apertures 58 of the clitter bac~dng plate 1¦ 54 are slzed for <~earance fit over guide pin shanks 30 and delete pin shar~s 40 of 26 ¦ the respective pinsIn the pre~ent embodiment, the diameter of the guide pin27 1 apertures 56 is .û72 inch and the diameter of delete pin apertures 58 is .a2~ inch 1,~
t 1, L~3 il !~1 In a ne2ct operation, a first multilayered sheet 6~ comprising an adhesive 2 ii layer 6Z, an upper release iayer 64 snd a lower release layer 66 Pre sldeably 3 ¦I disposed on the fixture in ~orlfronting relation with the cutter backing plate 54 4 ~¦ after peelably resnoving the upper layer 64 from the adhesive layer 6a The 51l adhesive layer 62 comprises a thermoplsstic adhesive material such as nitrite 6 1¦ pheno}ic or any other suitable thermoplastic adhesive materiaL Prior to ¦1 application of the first mult1ayered sheet 60 to the fxture, the s~eet s pre-dr~led I; as illustrated in Figs. llA and llB. The upper release layer 64 and the lower layer 9 i 66 of the multilsyered sheet 6~ are typicPlly fabricated of a rele se paper 10 1 impregnated with a was like material to permit peelable removal of the respecffve 11 ¦ layers from the a~esive hyer 62. The upper rele~ce layer 64 is treated with a l2 ¦ release agent which reduces adhesion of the lPyer 64 to the adhes~ve 62. Since the 13 ;1 lower release layer 68 is not ~eated with a rele_se agent, upon peeling, the upper l4relesse layer 64 resdily separates from the adhesiYe layer 62 lea.~ing the adhesive l5layer 62 and the lower release layer 66 in adhesive contact. Typically, a plurality ~6 '11 of first multil~yered sheet~ 60 are pre-drilled in stacked relatioDship to improve 17 i over~ll process efficienc~.
18 ¦¦The first multilayered sheet 60 includes guide pin apertures 68 and dele~e 19 pin ~pertures 70, with delete pin ap~tures 70 disposed bet~een alternatillg 2~ adjacent c~lumns of guide pins aper~res 68. The inter-column spac~ between 21 guide pin apertures 68 and intermediate deiete pin apertllres 7~, such as the 22 , spacing between columns A and C or D and F is .12û inch in the illustrated 23 Il, embodiment. The on center inter-column spacing of other adiacent guide pin 24 ll apertures 62, such as between columns C and D or F and ~ is .l80 inch as presently 251I showD. Delete pin apertures 70 are illustrated as being .~21 inch in diameter a~d 251l ~re 10cated on centers corresponding to center loc3hons of delete pin apertures 12 L'94 1l of the wiring fixture plate 10. Guide pin apertures 68 of the ~lrst multilayered 2 li sheet 60 sre .090 ineh in diameter. Th~, the lateral distance 72 between outer 3 11 extremities of guide pin aperture 68 pairs in columns A and C, D and F, etc. is .210 4 inch The laterPl distance 74 between the outer e2~remities of corresponding guide pins 18 is .215 inch~ As i31ustr~ted in Pig. 12, after peelable removal of the upper 6 rele~se layer 64 from the adhesive layer 62 of the first multilayered sheet 60, the 7 lower release layer 66 and the adhesi~e layer 62 are slideably disposed over the 8 shanks of guide pins 18 and delete pins 14 such ~hat the lowes reIe~e layes 66 ,s in 9 confronting relation with ~e cutte~ back~ng plate 54. Since ~e dis~ance 72 is less than the distance 74,.~ 3nterference o~ urs between the multilayered sheet 60 and 11 guide pins 18 as the lower release layer 66 and the ad~esi~ré }ayer 62 sre slideably 12 disposed over. the~ guide pin shar~c 30 and delete pin shanlc 24. The pliable nature of 13 t~e rele~Lse layer 66 ant adhesive layer 62 permit these layers to be urged into 14 I confronting relation with the cutter backing plate 54 as iilustrated in Fig. 13. To 15 ! assure that the rele~se layer 66 and adhesive layer 62 are in planar confronting 16 I relation with the cutter backing pLate 54~ a clearance plate 76 having a release 17 ¦ layer 78 bonded to the adhesive confronting surface of the plate 76 is slideably 18 ¦ disposet over the shanloe of delete pins 14 and guide pins 18 and a light compressive 19 I pressure is appJied. The pres~ce of the rele~se layer 78 permits removal of the 2û c~earance plate 7B from the fisture after this pressure application step without 21 adhesion of the adhesive layer 62 to the plate 76. After removal of the clearance 22 i plate 76 and the relesse layer ~8 bonded thereto, the fi~ture is appropriately 23 1 configured for rou'dng of the continuous wire in ac~ordance with the prese~rt 24 ~l inventiorL
2s ll A continous wire 80 is route~ along a predetermined path under tension and 26 ¦ in confronting relation with selected guide pins 18 and delete pins 14 employing a 27 rout ~ng head 82 of the type illustrated in l~ig. 14. A routing head 82 oii the type I!
,, l~ f~
-shown is provided for each fixture to have a continuous wire 80 routed. The 2 routing head 82 is cspable of ~ a~as movement only, and routing of the continuous 3 insulated wire 80 oc~urs as an X-Y a~cis table supporting one or more fixtures 4 I I moves subjacent the routing hesd 82 under numerical controL Any equi~alent S , means to achieve the above~escribed relative head and fi2cture movement mày be 6 I j substituted for the illustrated technique.
7 l'The routing head 82 includes ~ bushing 84 having a bore sized to receive 8 `, tubular steel member 86. The illustrated head includes a tubular member 86 with 9 ' !an outer diameter of ~pprosimately .020 inch and an im~er diameter of 1approsimately .010 inch, permitting free passage of the continuous wire 8Q through the member 86. A nesible tubul~r member 88 is concentric~lly affi~ced to the 2 ~b~ar mernber 86 as i~lus~ated in Fig. 14. The fle~ible tubul~r member 88 13 ,, permits routing of the continuous wire 80 just above the adhesive layer 6214 ' and allows fle2~ure in the event the member 88 traverses a previously routed 15 I segment of the continuous wire 80.
16 llRou'dng of the continuous wire 80 is performed in accordance with defined 17 li routing conventions illustrated schematically in Pigs. 15A through 15D, and in 18 i!~ esamples shown in Pigs. 16A and 16B. The routing conventions assure that 19 ¦~e wire 80, after rotrting and mating with a circuit board in accordance with t~is ¦method~ wm confront selected conductive pads provided on the circuit boa.-d 21 Shanks of guide pins 18 and delete pins 14 serve designated f~mctions in the routing 22 ~ proce~i and in combination define intended locations of interconnectior~ intended 23 locations of w~re severance, and permissible wire routing channels.
24 Intended interconnection locations are defined by wire routing paths in which the continuous wire 80 passes diagonaJly between a guide pin 18 and a delete 26 l ¦ pin 14 as i~ustrated in Figs. 15~ and lSR. Alternatively, an intended 27 ' interconnec~ion location is defined by wire 80 ~avel around an ar~ of the guide pin ' ' , i . -.
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z~ 34 18 adjacent delete pins 14, as shown in Fig. 15D. Wire 80 routing between a 2 1! pair of delete pins 14 disposed above and below a row centerline 90 in the manner 3 li i31ustrated in Fig. 15C defines an intended location of wire 80 severance between 4 j¦ the r~spective delete pins 14. The wire 80 msy be routed freely without 11 interconnection or severance between vertical channels 92 or horizont 1 rows 94, 6 j illustrated in Fig. 16A. The continuous wire may be routed only once through each 7 ¦ intended interconnection location.
8 !I These routing conventiorls will be further understood by reference to the 9 ¦¦ purely illustrative esample provided below.
l . .
~LO~IlNG EgAMPLE
1 Referring to Fig. 16A, routing of the continuous wire 80 is initiated after anchoring the wire 80 at the edge of the fisture. A continuous ~re 80 is routed 12 jl through vertical channel 96 in confronting relation with guide pin 98 and then 13 ! through horizontal row 100 to guide pin 102. The wire 80 pssses diagonally 14 i between delete pins 104 and 106 defining a first location of wir~e severance 108 between delete pins 104 and 106. l~e wire 80 is then routed d~agon lly betwe~n 16 delete pin 106 and guide pin 110 defining an intenàed first p<~int of inter~onnection 17 112 adjacent guide pin 110. The wire 80 is then routed in confront~g relation with 18 guide pin 112 through horizontal row 114, vertical channel 116 and in comronling 1~ il relation with guide pin 118. The w~re 80 is then routed diagona~y between guide ! pin 118 and delete pin 120 defini~ a second point of interconnection 122 adjacent 21 , guide pin 118 in this first wire net. The wire 80 is then routed around guide pin 122 22 11¦ and guide pin 124 defining a third intended location of interconne~tion 126 adjacent 23 jl guide pin 124. A fourth intended location of interconne-~tion 126 is define~d by 24 ¦~ routing of the wire 80 in confronting relation with guide pin 128 and diagonally :
';
_~ between guide pin 12~ and delete pin 130. The wire is routed diagonally between - 2 I delete pins 130 and 132 thereby defining an intended location of wire severance 3 ll completing points of intended interconnection in this first wire net. The wire 80 is 4 I then routed around guide pin 134, guide pin 136 and disgon~lly betwe~en delete pin l 138 and 140 defining an intended locstion of wire severance. The wire is ne~t 6 l~ routed adjacent pin 134 defining a first point of intended wire interconnection in a 7 1¦ second wire net sdjacent to guide pin 134. A second point of intended wire 8 jj interconnection is obtained by routing the wire 80 around guide pin 138 slong the 9 1I portion of the guide pin circ~lmference adjacent delete pins 14~ and 142. A third lD l point of wire inter~onnection is achieved by routing the wire 80 diagonally between 11 1 dele~e pin 144 a~d guide pin 146, snd a finsl point of w~re 80 inter~onnection ~n this 12 ¦ second wire net 3s achieved by routing the wire 80 in confron'dng relation ~rith i3 1I guide pin 148 and diagonally to delete pin 150. The wire is routed between delete 14 . pins lS0 and 152 def~ an intended location of wire severence between these 15 1I delete pins and finally the wire 80 is routed to the perimeter o~ ~e f~t~re where 16 ¦¦ it is anchored.
1~ 1! After routing o~ the continuous wire 80 along a predetermined path in 18 ¦ acs~ordance with defined wiring conventions, the upper release ~yer 64 which w~c 19 I previously peel~bly resno~red from t`he adhesive layer 62 of the tirst multilayered ¦ sheet is slideably disposed over shanks of respective guide pin~s and delete pins and 21 1 in confronting relation with the continuous routed wLre 8~, as i~l~ated in Pi~. 17.
22 ~ ~ pres~2re plate 154 illustrated in Fig. 18 and having guide pin apertures 156 on 23 1l centers corresponding to centers of guide pin apertures 16 o~ ~e wir~ng fixture 24 ' plste 10 is disposed above the guide pi~ such that guide pin apertures 156 coaxiallv !, ~lign with shan3cs of guide pins lR. It is noted that the pressure plate ~54 includes 26 1 no co~TespondLng apertures for the delete pins 14. After co~cial alignment of the 2? ~ pressure plate 154 over the fistllre plate 10, a compressive pressure is applied to 28 1 the fi~t~e pLate 10 and pressure plate 154 thereby adhe~ ~e continuous wire 80 29 1 to the underlying adhesive layer 62 while slideably ~ging delete pins 14 downward l -18-into delete pin apertures 48 of the clearance plate 44 disposed below the fi~ture - 2 il plate 10. The pressure plate 44 is thereupon removed prep ratory to the severing 3 i l operation.
4 ¦¦ The continuous wire ao is ne~ct severed to form a plur litg of wire nets using S ¦ a cutting head 158 of the type illustrated in Fig. 20. The cutting head 158 has a 6 1 tubular b~rel 160 tapered at an end 162 and defining a ~rc~lar cutting edge 164.
¦ The cut~ g edge 164 in the presently illustrated embodiment is of .035 inch 8 1¦ diameter. A pheumaticslly operated stripper pin 165 is lo~qted within the bore of 9 ¦! tubuhr barrel 16û
10 1 I The cuttin~ head 158 is ~ertically disposed with respect to the wir~ ~ture plate 10 and is a~ted for ;~ ~s movement. Pl~ral c~r~ting heads 158 may be 12 ! ¦ disposed above a numb~r of wir~ fixture pl~tes 10 thereby permit~ing 13 ¦¦ simultaneous severance of the w~res 30 in each of 2 p~ra~ of fi~tures. The Il 14 i l wiring ~isture p~te 10 is disposed on an X-Y sxis ta~le which moves under 15 ,l automated numerical control to position the fi~h~re plate 10 such that an intended 16 'il location of wire 8û severance is precisely aligned subjace~t the c~tting edge 164 of 17 il the cutting head 158. The cutting head 158 is actuated ~or downward movement 18 ~¦ and the cutting edge 164 of the barrel 160 impacts the layers disposed on the 19 fisture, stamping out a circl~lar sectian of release paper 64, ~re 80, adhesi~e 62, relesse paper 68, and a plug from t~e cutter baclcing plate ~4. After seversn~e of 21 the wire 80, the cutting head 158 retracts vertically to a position above the 22 i i severed wire 80 locatiorL The stripper pin 166 is thereupon actuated for a~l 23 ll movement in the bore of the b r.rel 160 to eject waste material disposed in ~e 24 ' I bore as a consequence of the severing operatiorL Typic ny, a source of vacuum i 25 I disposed adjacent the cutting head 158 for removPl of ~he waste material after 26 I ejection from the bore of the balTel 16û by stripper pin 16~. The wire 80 is severed 2~ ~ in the above manner at ~n intended location of wire se~erance thereby forming a '.
Il - 19 -~ 1 ; wire mat comprising a plurslity of wire nets. The continuous wire 80 illustrated in 2 the wiring example of Fig. 16A is shown following the severing operation in Fig. 21.
3 ~ Following the severing operation, the release layer 64 is peelably removed 4 from the adhesive layer 62 as shown in ~ig~ 22.
5 I In sccordance with the present method, 8 second multilayer sheet 168 61I comprising an upper release layer 170, an adhesive layer 172 and a lower release ~¦ layer 17~ is precisely egistered above a cirel~it bo~rd in accordance with the 8 1l present invention, and the adhesive layer 17~ is adhered to the cir~uit bo~rd ~76 9 ,¦ ~ollowing pee~e removal of the lower releqce layer 174 of the sheet 168. T)le 10 1I second multil~yer sheet incl~lde~ guide pu~ apertures haviDg center locqtiolls and 11 il diameters identical to those of the first multilayered sheet 60. It is nated that the 12 1,¦ second multil lyer sheet include no delete pin apertures.
The circuit board 176 employed in practicing the present invention has _ 14 ' plurqlity of pin socket receiving spertures 178. Each aperture is plated through 15 !1 during the board fabrication process, and conductive material on the aperture wa31 161 1 electricqlly communicate with a conductive pad 180 adjacent each aperture 17 Conductive pads Pre .025 inch in width and .050 inch in length 18!i The second multilayer sheet 168, sfter removal of the lo~qer release layer 19~ 174, is applied to the circuit bo~rd 176 such th~t the adllesive layer 172 confronts 23~ the circwt board 176 surface. Precise alignment of the sheet 168 with the circuit 21! board 176 csuses conductive pads 180 to be e~posed through apertures of the 22' multilayer sheet 160.
23 The spertures 178 of the circuit board 176 are .040 inch in diameter and ~re 24 disposed in rows and columns corresponding in center locations to the center 25 I locations of guide pin apertures 16 of the wiring fisture plate 10.
26 I The sdhesive layer 172 is a~hered to the printed circuit board 176 under 2~ l, slight sompressive pressure, and fo31owing adheren~e of the adhe~Ye layer 172 the 28il upper release layer 1~0 of the multilayer sheet 168 is peelably removed from ~e 2g1 adhesive layer 172. The printed circuit bo~rd 176 and adhered adhesive layer 172 !
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., 4~
are coaxiPlly aligned above respective guide pins 18, as illustrated in Fig. 26. The printed circuit board 176 is disposed such that the adhesive lsyer 172 confronts the 3 plurality of wire nets and the underlying a~hesive layer 62.
4 l~ The socket pin receiving a~>erb~res 178 of the circuit board 176 are of 5 , dia~meter smaller than the diameter of the shank 30 of the guide pin 18, as 6 1l previously indicated. The diameter of the socket pin receiving apertures 178 is 7 11 .040 inch, snd the diameter of the shank 30 of dele~e pin 18 is .065 inch The 81 chamfered end 32 of . ~uide pin 18 precisely align with apertures 178 upon 9', applica~on of compressive pressure to the fixture 10 and circuit ~oard 178.
10~ a mating operation, the plurality of wire nets are adhered to the circ~nt b~d 176. Continued application of comprecsive pressure to the circ~t board 176 12. and the fi2cture lQ urges the guide pu~s 18 downward thraugh the fi2~ture plate 10 131! and into the clearance plate 44, as illus~ated in Fig. 27. Adhesive l~yers 1~2 and 14, 78 achieve adhesive cont ct under compressive pressure thereby precisely locating 15wire nets of the wire 80 on the circtlit bd 1~6. By re con of ~e regis~ration of 16 I~ the wire nets ~nth the circuit board 176 achieved in accordance wi~ this invention, 17 ~I selected points of wire nets confront selected conductive pads 180 after mating of 18 ¦I the wire mat with the circ~it board 176, as ~lustrated in ~ig. 27. The circt2it jl board 176 with adhesi~lre layers 172 snd 62, wire nets embedded t~erein and releace 2S~ qyer 66 are the removed from the fist~lre. After removal of t~e circuit board 21 176 and adhered wire mat from the fi~ture, the release layer 66 is peelably 22 ~ removed from the adhesive Layer 62. A low durometer rubber pad 182 is applied in 23 confronting relation to ~e adhesive l~yer 62, and compressive pressure is applied 24 to the circuit board 176 and r~ber psd 182 to conforma31y coat the wire net 83 and circuit board 176 with adhesive materiaL
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., ~LZ~4,~4 Following this conformal coating step, the circuit board 176 is placed in an . . .
2 ~ oven and heated at elevated tempera~ure to cure the thermoplastic adhesive layer.
3 Typic lly~ the adheshe is cured for three (3) hours at a temperture of 260 ~.
4 1l The circuit board 176 is ne~t coated with a solder ~ux by spraying, brushing, 5 j or any other suitable technique and the costed board is subjected to elevated 6 li temperature briefly to increase the viscosity of the fl~. The b~ard 176 is then 7 il loaded onto an ~-Y a~s table, having positioned thereovOE a solderi~g head 182 of 8 ,I the type illus~ated in Pigs. 29~ Emd 2sB. The table ~s c~ntroi~ed to dis~ose a g I i conducti~re pad 180 ha~ a wire confronting ~he pad, direc'dy beneath the 10 ~ soldersng head 182. ~he sold~ head 182, upon actuadon, moves downw~rd from the position illustrated in ~ig. 29A to the position illustrated in ~ig. 29B, urg~ng the 12 !! insulated wire into contact with the pad 180 snd caus~ the wire insul~tion to 13 ~i vaporize in the vicinity of a pad 180. The pad 180 and confron'dng wire are heated, 14 . and solder on the respective pad reflows around the wire to comple~e the 15 ' ' interconnection of the ~rire with the selected pad. The ~-Y axis table and 16 soldering he~d 182 are automatically cycled until a~l ~nres confro~ting conductive 17 .' pads 180 have been soldered to the respective pads. Upon completion of the solde~g operation, the circuit board 176 is fully inter~oMected in acc.orda;nce 19 1¦ with a pre-defined cir~uit wiring patterIL
20¦1~he wired c~rcuit board produced in accordance wi~ the present i~e~ion is 21 1 ultrasonically cleaned preparatory to insertion of pin receiving so~cets, integ.rated 22 circuits and other electric~l components. The circuit bo~rd 176 in accordance with 23 ~, the present invention is adapted to accommodate ~11 commonly avail~ble dual i~
24 i line components. Integrated circ~its having .4 inch or .S Lnch inte~row spacing are 25 , accommodated by slight deformation of integrated circwt lea~; to fit between 2f; ', selected columns of integrated circuit pin sockets ~isposed within pin soc~cet 27 Il. receiving apertures locsted on .45 inch spacing.
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~1, The above deseribed invention is ill--~trative of a novel method and circuit 2 board which permits improved~production efficiencies and overcomes significant3 ¦ disadvantages of-~ior wiring method. Other modifications, embodiments and 4 ~I departllres from the present disclosure are possible without departing from the 5 j inventive concep~ contained herein. Consequently, the invention is to be viewed ~s 6 ! embracing each and every novel feature and novel combination of features present 7 li in or posse~ed b~ the tech~ique and ~rticles herein disclosed and are limited solely 8 ~I by the scope and spirit of the appended ~ ;ms.
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Claims (12)
1. A method for producing a wired circuit board comprising the steps of:
routing a continuous insulated wire along a predetermined path through a plurality of pins projecting from a fixture plate;
fastening the continuous wire to a supporting layer to maintain said wire in a fixed position along said path;
mating a circuit board having a plurality of conductive pads disposed on the surface of the board with the wire such that selected points of the wire confront selected ones of the conductive pads; and interconnecting said selected points of the wire with selected ones of said conductive pads.
routing a continuous insulated wire along a predetermined path through a plurality of pins projecting from a fixture plate;
fastening the continuous wire to a supporting layer to maintain said wire in a fixed position along said path;
mating a circuit board having a plurality of conductive pads disposed on the surface of the board with the wire such that selected points of the wire confront selected ones of the conductive pads; and interconnecting said selected points of the wire with selected ones of said conductive pads.
2. The method of claim 1 further including, after said routing step, the step of severing the continuous wire at at least one selected location to form a plurality of wire segments.
3. The method of claim 1 wherein said fastening step includes the step of adhering the continuous wire to a supporting layer of adhesive material.
4. The method of claim 3 further including, after said routing step, the step of severing the continuous wire at at least one selected location to form a plurality of wire segments.
5. The method of claim 3 wherein said severing step is performed between said fastening step and said mating step.
6. The method of claim 3 wherein said severing step is performed between said mating step and said interconnecting step.
7. The method of claim 2 wherein said interconnecting step includes the step of soldering selected points of the wire to selected ones of the conductive pads confronted by said wire.
8. A method of producing a wired circuit board comprising the steps of:
routing a continuous wire along a predetermined path through first and second pluralities of pins projecting from a fixture plate;
adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path;
removing said second plurality of pins from said fixture plate; and mating a circuit board having a plurality of conductive pads disposed in a predetermined arrangement on said board with the wire such that selected points of the wire confront selected conductive pads on the circuit board.
routing a continuous wire along a predetermined path through first and second pluralities of pins projecting from a fixture plate;
adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path;
removing said second plurality of pins from said fixture plate; and mating a circuit board having a plurality of conductive pads disposed in a predetermined arrangement on said board with the wire such that selected points of the wire confront selected conductive pads on the circuit board.
9. The method of claim 8 wherein said mating step includes the steps of:
adhering a second adhesive layer to said circuit board on a first circuit board side;
compressing said circuit board and second adhesive layer adhered thereto into confronting contact with said first adhesive layer to adhere said wire to said circuit board between said first and second adhesive layers.
adhering a second adhesive layer to said circuit board on a first circuit board side;
compressing said circuit board and second adhesive layer adhered thereto into confronting contact with said first adhesive layer to adhere said wire to said circuit board between said first and second adhesive layers.
10. The method of claim 8, further including after said mating step, a step of curing said first adhesive layer at a predetermined temperature for a predetermined time.
11. The method of claim 9, further including after said routing step, a step of severing the continuous wire at at least one selected location to form a plurality of wire segments.
12. A method of producing a wired circuit board comprising the steps of:
loading a first plurality of pins in a first plurality of apertures of a first fixture plate having a wiring surface such that one end of said first plurality of pins projects above said wiring surface;
loading a second plurality of pins in a first plurality of apertures of a second fixture plate having an upper surface such that one end of each of said second plurality of pins projects above said upper surface;
locating said first fixture plate with said first plurality of pins disposed therein over said second fixture plate with said second plurality of pins disposed therein such that said one end of at least some of said second plurality of pins projects through said second plurality of apertures in said first fixture plate and above said wiring surface;
routing a continuous wire along a predetermined path through said first and second pluralities of pins projecting above said wiring surface of said first fixture plate;
adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path;
withdrawing said second fixture plate and said second plurality of pins disposed therein from said first fixture plate;
adhering a second adhesive layer to a wiring surface of a circuit board having a plurality of electrically conductive pads disposed in a predetermined arrangement on said wiring surface;
registering said circuit board above said first adhesive layer and wire adhered thereto such that the second adhesive layer adhered to the wiring surface confronts the first adhesive layer;
compressing the first adhesive layer and adhered continuous wire into confronting adhered contact with the second adhesive layer adhered to said circuit board such that selected points of the continuous wire confront selected ones of the conductive pads;
soldering selected points of the continuous wire to selected ones of said pads; and severing the continuous wire at selected locations to form a plurality of wire segments interconnecting selected ones of said pads.
loading a first plurality of pins in a first plurality of apertures of a first fixture plate having a wiring surface such that one end of said first plurality of pins projects above said wiring surface;
loading a second plurality of pins in a first plurality of apertures of a second fixture plate having an upper surface such that one end of each of said second plurality of pins projects above said upper surface;
locating said first fixture plate with said first plurality of pins disposed therein over said second fixture plate with said second plurality of pins disposed therein such that said one end of at least some of said second plurality of pins projects through said second plurality of apertures in said first fixture plate and above said wiring surface;
routing a continuous wire along a predetermined path through said first and second pluralities of pins projecting above said wiring surface of said first fixture plate;
adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path;
withdrawing said second fixture plate and said second plurality of pins disposed therein from said first fixture plate;
adhering a second adhesive layer to a wiring surface of a circuit board having a plurality of electrically conductive pads disposed in a predetermined arrangement on said wiring surface;
registering said circuit board above said first adhesive layer and wire adhered thereto such that the second adhesive layer adhered to the wiring surface confronts the first adhesive layer;
compressing the first adhesive layer and adhered continuous wire into confronting adhered contact with the second adhesive layer adhered to said circuit board such that selected points of the continuous wire confront selected ones of the conductive pads;
soldering selected points of the continuous wire to selected ones of said pads; and severing the continuous wire at selected locations to form a plurality of wire segments interconnecting selected ones of said pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000578900A CA1262494A (en) | 1983-11-04 | 1988-09-29 | Routing fixture for producing a wired circuit board |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/549,484 US4627162A (en) | 1983-11-04 | 1983-11-04 | Method of producing a wired circuit board |
| US549,484 | 1983-11-04 | ||
| CA000541306A CA1247257A (en) | 1983-11-04 | 1987-07-03 | Wiring system employing wire mat |
| CA000578900A CA1262494A (en) | 1983-11-04 | 1988-09-29 | Routing fixture for producing a wired circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000541306A Division CA1247257A (en) | 1983-11-04 | 1987-07-03 | Wiring system employing wire mat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1262494A true CA1262494A (en) | 1989-10-24 |
Family
ID=25671403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000578900A Expired CA1262494A (en) | 1983-11-04 | 1988-09-29 | Routing fixture for producing a wired circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1262494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115279048A (en) * | 2022-09-26 | 2022-11-01 | 四川英创力电子科技股份有限公司 | Automatic conveying device for baking circuit board |
-
1988
- 1988-09-29 CA CA000578900A patent/CA1262494A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115279048A (en) * | 2022-09-26 | 2022-11-01 | 四川英创力电子科技股份有限公司 | Automatic conveying device for baking circuit board |
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