CA1212588A - Solder delivery system - Google Patents
Solder delivery systemInfo
- Publication number
- CA1212588A CA1212588A CA000417263A CA417263A CA1212588A CA 1212588 A CA1212588 A CA 1212588A CA 000417263 A CA000417263 A CA 000417263A CA 417263 A CA417263 A CA 417263A CA 1212588 A CA1212588 A CA 1212588A
- Authority
- CA
- Canada
- Prior art keywords
- windows
- conductor
- layer
- window
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Abstract
ABSTRACT OF THE DISCLOSURE
A device for electrically connecting electrical con-ductors comprises a layer of polymeric material having one or more windows therein and a quantity of fusible conductive material e.g. solder, preferably in strip form, which will flow through the window or windows when heated, the or each window being capable of gripping a conductor to maintain it is position in the device. Preferably the windows have a narrow portion or neck to enable them to grip the conductors.
A device for electrically connecting electrical con-ductors comprises a layer of polymeric material having one or more windows therein and a quantity of fusible conductive material e.g. solder, preferably in strip form, which will flow through the window or windows when heated, the or each window being capable of gripping a conductor to maintain it is position in the device. Preferably the windows have a narrow portion or neck to enable them to grip the conductors.
Description
5~8 ~ 2 -This invention relates to devices for connecting electrical conductors~ and especially for terminating a plurality of closely spaced conductors to a conecctor or other substrate.
5Joining flat cable or ribbon cable to connectors can be accomplished by a number of different methods, with soldering being probably the most reliable.
~owever, if all the solder terminations must be done by hand, the costs involved and the time re~uired to perfo~m a multiplicity of repetitive soldering op-erations far outweigh any gains in reliability.
In addition, as connector pin spacing decreases, due to higher interconnection densities, the reliability of hand soldering decreases because of the possibility of solder bridging terminations and shorting out adjacent connectors. It would therefore be desirable to have a solder system in which all leads can be soldered to the connector simultaneously, rapidly and reliably for a wide range of a number of terminations and spacings.
20In the past, various systems have been developed for simultaneously applying a plurality of bodies of solder. One such system is that disclosed in U.S.
Patent number 3,396,894, which discloses the pre-packaging of metered amounts of flux and solder in a heat-reco~erable preformed polymer sheet which forces the solder into place. The patent teaches the use of discrete pieces of solder which must be precisely positioned above regions to be soldered. As heat is applied, the polymer sheet returns to its original flat configuration prior to solder melting.
~zs~
U.S. Patent 3,719,981 discloses an alternative method of applying solder balls, which are appro-priately spaced on the tacky surface of a pressure-sensitive tape, to solder bumps used for connections.
Both of the above methods rely on the positioning of the small pieces of solder immediately adjacent to the terminals which are to be soldered, and, because small pieces of solder are used, each of the solder systems disclosed is difficult to manufac~ure.
U.S. Patent number 3,750,252 discloses the use of a single continuous piece of solder to simultaneously solder a large number of terminals. The solder wire extends along a terminal strip and, on heating, the solder melts and coalesces on the individual contacts to form independent connectionsO
With the increasing use of ribbon or "flexprint"
cable, especially multilayer cable, which is analogous to flexible printed circuit board, and the decreasing size of many electronic assemblies, so that bulky connectors are disadvantageous, a method of terminating flat cables to flat substrates has also become ex-tremely desirable.
This invention provides a device for electrically connecting at least one first conductor to at least one second conductor, which comprises:
(al a layer of polymeric material having at least one window therein; and ~Z3L~5~3 (b) a strip of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow through the or each window when heated and to form a conductive connection between conductors placed on opposite sides of the polymeric layer;
the or each window being capable of gripping a first conductor to maintain it in position with respect to the device.
~he fusible, electrically conductive material may be formed from any of a number of materials, e.g. fusible plastics materials that have a high loading of a metal filler in the form of particles or flake. ~referably, however, the fusible, conduc-tive material comprises solder. As used herein, solder means any metal or metallic alloy used to join metallic surfaces by melting that metal or metallic allo~ and then allowing it to cool. A
solder strip, as used herein, means an elongated, continuous element of solder of any cross-section including, but not limited to, round, square, flat, or any other cross-section. Such a solder strip may contain a flux core and/or may be coated on ~0 all or a part of its outer surface with a flux coating. The strip may be perforated to enable better flow of a flux core.
In one pre~erred embodiment the device includes a tem-porary backing layer located on the polymeric layer, which backing layer is capable of being removed after the or each first con-ductor has been positioned in the device. Alternatively, the de-vice may include a ~L%5~18 - 5 - ~ ~
backing layer of such configuration that a part of the window or windows extends through the backing layer, the said part being adapted to receive the ends of conductors inserted therein.
The polymeric layers should preferably be made of materials capable of resisting elevated temperatures for the ti~e needed to melt and flow the solder, generally about 15 seconds~ Suitable materials in-clude, for example and not by way of limitation, polyvinylidene fluoride, poly(parabanic acid)~ and poly~pyromelittimide) or other high-temperature poly-amides or -imides. These polymers may be cross-linked by either chemicals or radiation to improve their high-temperature properties.
Lower-temperature polymers, such as polyethylene, etc., may be used depending on ~he particular use to which the terminator is to be put, and the choice of suitable materials is considered to bve within the scope of one skilled in the art in view of this dis-closure.
While the provision of adhesive and sealant layers is contemplated by this invention, and will be dis-cussed in more detail below with respect to certain preferred areas, it is also contemplated that the polymeric layers may themselves be intrinsically adhesive even though they are generally required to be non-melting in use. Such properties may be par-ticularly desirable Eor the window layer, and may be provided, for example, by extensive cross-linking of an adhesive material. By this means, the device may be adhered to a substrate in use.
L2Sl~3 The layer of polymeric material may be heat-recoverable or heat stable. He~t recoverable polymers and methods of rendering polymeric articles heat recoverable, are well known in the art. These are generally cross linked, at least partially crys-talline po-lymers, or mixtures incorporating them.
Preferably, however, it is heat stable.
The polymeric materials can be tailored to suit the intended use by the addition of fillers, e.g.
10 flame~retardantsr plasticizers, pigments, stahilizers, co-curing agents to facilitate cross-linking, etc.
The polymeric materials used in the construction of this invention are important in the transfer of thermal energy. While the primary heat transfer occurs lS through the metallic elements, including the con-ductors, terminals, and solder, a significant amount of heat is transf2rred through the window in a parallel manner. Additionally, the flux trapped within the window spaces is a significant source of circulatory 20 liquid and vapor mass heat transfer. The presence of these additional heat transfer paths contributes to the overall speed and quality of the desired solder connections.
According to another aspect, the invention pro-2S vides a method of electrically connecting at least one first conductor to at least one second conductor, which comprises positioning the or each first conductor and the or each second conductor on opposite sides of a B layer of polymeric material having one or more windows 30 therein and having a ~t~y-of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow i813 through the or each window when heated, maintaining the or each first conductor in position within the or one of the windows, and heating the device to melt the electrically conductive material ancl cause it to form a conductive connection between the or each first conduc-tor and the or each second conductor.
Figures 1 and 2 depicit a method of connection according to the invention.
Figure 3 depicts another method in which the device has a backing layer with holes through which the conductors may protrude, and Figure ~ depicts that embodiment with a cable ready for soldering.
Figure 5 depicts the use of windows shaped to retain the conductors of a cable, while Figure 6 is a side view of Figure 5; and Figures 7 and 8 show another form of device Figures 1 and 2 show a method of terminating a multi-conductor cable 89 by means of a device comprising a polymeric heat-stable layer 91 having an array of elongate windows 93 therein a strip of solder 97 extending accross the windows 93 and a temporary backing layer 95.
As shown in Fi~ure 1 a cable 89 with stripped conductors 90 is placed on the device. The backing layer 95 may adhere to the cable, and the system is placed initially so that the windows 93 are aligned with the conductors as they emerge from the cable insulation .
25~
As shown in Figure 2, a burnisher 92 or similar tool is stroked along the conductors in the direction of arrow A, away from the cable i.nsulation, to align the misaligned conductors. Downward pressure is also applied to cause the wires to move in the direction of arrow B and enter the windows 93, thus aligning them.
Pressure may then be applied tc the assembly to cause good adhesion of the aligned components, and alignment should thus be re ained until soldering, thus pre-venting deformation of individual wires within thecable during handling, etc.
Figure 3 depicts an another embodiment of this invention which also facilitates conductor alignment.
lf the backing layer 95 is placed so as to expose window 93 to the back via a small aperture 94 (or if the backing layer has suitable perforations), a hole for each wire is created. The misaligned wires may be straightened with a comb-like device 96 and the tips of the conductors 90 threaded through the apertures 94.
The comb may then be removed and the cable 89 bent in the direction of arrowlprod~ee afford the arrangement of Figure 4. If desired, before soldering occurs the cable may be pulled back (once the assembly is emplaced against the termination substrate) to leave no protruding conductor ends.
An additional feature of the window means of the invention is that they may keep conductors aligned during actual soldering. In particular, when soldering a multiplicity of small diameter wires to a printed wiring board, the wires may tend to fall off during application of heat and force. The windows may be further configured to minimize this tendency.
5~3~
g Maintenance of conductor alignment is shown in Figures 5 and 6 by one of many possible window shape variations. The windows 93 in window layer 91 have localized areas of restricted width ("grips") 98 on the precise locations desired which provide the positioning elements. The window layer portions adjacent to each end of the windows provide structural rigidity and location accuracy for every conductor~ In the case shownl the grip width is an interference fit to the diameter of the conductors 90, and partly overlays the solder strip 97, shown shaded. In such a case, the grips are preferably staggered so that the potential growth incurred when the conductors are forced into place may be absorbed by simple bending of the window frames~ The balance of the window remains wide enough to permit formation of a good solder fillet along the remaining conductor length, and the solder is placed to correctly guide the flow into each window. Figure 6 illustrates this in side Vi2W~
Another device is shown in figures 7 and 8 in which a heat stable polymeric layer 110 has a number of windows 112 each of which is formed with a narrow portion or neck 116 for gripping a conductor, the neck constituting a positioning element. The polymeric layer is placed over the substrate so that the windows 112 are in register with conductive regions of the substrate. The underside of the layer 110 is prefer-ably adhesive in nature so that it will adhere to the substrate. The layer 110 has a tear-off portion 119 which is then separated from the remainder of the layer along a line of weakness 120, e.g. a score-line or a line of perforations, and conductors 118 are then placed over the layer 110 so that they are gripped by 5l3~
-- 1 o the necks 116 of the windows and thereby held in alignment as shown in figure ~. The device may then be heated to fuse the solder strip 114 and form a connection between the conductors 118 and the con-ductive regions of the underlying substrate. Advan-tageously, the upper surface of the layer 110 is alsoadhesive in nature to assist in holding the conductors 118 in place.
Whilst the device preferably is formed with a tear-off strip 119, it is also possible to form the device initially as shown in figure 8.
5Joining flat cable or ribbon cable to connectors can be accomplished by a number of different methods, with soldering being probably the most reliable.
~owever, if all the solder terminations must be done by hand, the costs involved and the time re~uired to perfo~m a multiplicity of repetitive soldering op-erations far outweigh any gains in reliability.
In addition, as connector pin spacing decreases, due to higher interconnection densities, the reliability of hand soldering decreases because of the possibility of solder bridging terminations and shorting out adjacent connectors. It would therefore be desirable to have a solder system in which all leads can be soldered to the connector simultaneously, rapidly and reliably for a wide range of a number of terminations and spacings.
20In the past, various systems have been developed for simultaneously applying a plurality of bodies of solder. One such system is that disclosed in U.S.
Patent number 3,396,894, which discloses the pre-packaging of metered amounts of flux and solder in a heat-reco~erable preformed polymer sheet which forces the solder into place. The patent teaches the use of discrete pieces of solder which must be precisely positioned above regions to be soldered. As heat is applied, the polymer sheet returns to its original flat configuration prior to solder melting.
~zs~
U.S. Patent 3,719,981 discloses an alternative method of applying solder balls, which are appro-priately spaced on the tacky surface of a pressure-sensitive tape, to solder bumps used for connections.
Both of the above methods rely on the positioning of the small pieces of solder immediately adjacent to the terminals which are to be soldered, and, because small pieces of solder are used, each of the solder systems disclosed is difficult to manufac~ure.
U.S. Patent number 3,750,252 discloses the use of a single continuous piece of solder to simultaneously solder a large number of terminals. The solder wire extends along a terminal strip and, on heating, the solder melts and coalesces on the individual contacts to form independent connectionsO
With the increasing use of ribbon or "flexprint"
cable, especially multilayer cable, which is analogous to flexible printed circuit board, and the decreasing size of many electronic assemblies, so that bulky connectors are disadvantageous, a method of terminating flat cables to flat substrates has also become ex-tremely desirable.
This invention provides a device for electrically connecting at least one first conductor to at least one second conductor, which comprises:
(al a layer of polymeric material having at least one window therein; and ~Z3L~5~3 (b) a strip of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow through the or each window when heated and to form a conductive connection between conductors placed on opposite sides of the polymeric layer;
the or each window being capable of gripping a first conductor to maintain it in position with respect to the device.
~he fusible, electrically conductive material may be formed from any of a number of materials, e.g. fusible plastics materials that have a high loading of a metal filler in the form of particles or flake. ~referably, however, the fusible, conduc-tive material comprises solder. As used herein, solder means any metal or metallic alloy used to join metallic surfaces by melting that metal or metallic allo~ and then allowing it to cool. A
solder strip, as used herein, means an elongated, continuous element of solder of any cross-section including, but not limited to, round, square, flat, or any other cross-section. Such a solder strip may contain a flux core and/or may be coated on ~0 all or a part of its outer surface with a flux coating. The strip may be perforated to enable better flow of a flux core.
In one pre~erred embodiment the device includes a tem-porary backing layer located on the polymeric layer, which backing layer is capable of being removed after the or each first con-ductor has been positioned in the device. Alternatively, the de-vice may include a ~L%5~18 - 5 - ~ ~
backing layer of such configuration that a part of the window or windows extends through the backing layer, the said part being adapted to receive the ends of conductors inserted therein.
The polymeric layers should preferably be made of materials capable of resisting elevated temperatures for the ti~e needed to melt and flow the solder, generally about 15 seconds~ Suitable materials in-clude, for example and not by way of limitation, polyvinylidene fluoride, poly(parabanic acid)~ and poly~pyromelittimide) or other high-temperature poly-amides or -imides. These polymers may be cross-linked by either chemicals or radiation to improve their high-temperature properties.
Lower-temperature polymers, such as polyethylene, etc., may be used depending on ~he particular use to which the terminator is to be put, and the choice of suitable materials is considered to bve within the scope of one skilled in the art in view of this dis-closure.
While the provision of adhesive and sealant layers is contemplated by this invention, and will be dis-cussed in more detail below with respect to certain preferred areas, it is also contemplated that the polymeric layers may themselves be intrinsically adhesive even though they are generally required to be non-melting in use. Such properties may be par-ticularly desirable Eor the window layer, and may be provided, for example, by extensive cross-linking of an adhesive material. By this means, the device may be adhered to a substrate in use.
L2Sl~3 The layer of polymeric material may be heat-recoverable or heat stable. He~t recoverable polymers and methods of rendering polymeric articles heat recoverable, are well known in the art. These are generally cross linked, at least partially crys-talline po-lymers, or mixtures incorporating them.
Preferably, however, it is heat stable.
The polymeric materials can be tailored to suit the intended use by the addition of fillers, e.g.
10 flame~retardantsr plasticizers, pigments, stahilizers, co-curing agents to facilitate cross-linking, etc.
The polymeric materials used in the construction of this invention are important in the transfer of thermal energy. While the primary heat transfer occurs lS through the metallic elements, including the con-ductors, terminals, and solder, a significant amount of heat is transf2rred through the window in a parallel manner. Additionally, the flux trapped within the window spaces is a significant source of circulatory 20 liquid and vapor mass heat transfer. The presence of these additional heat transfer paths contributes to the overall speed and quality of the desired solder connections.
According to another aspect, the invention pro-2S vides a method of electrically connecting at least one first conductor to at least one second conductor, which comprises positioning the or each first conductor and the or each second conductor on opposite sides of a B layer of polymeric material having one or more windows 30 therein and having a ~t~y-of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow i813 through the or each window when heated, maintaining the or each first conductor in position within the or one of the windows, and heating the device to melt the electrically conductive material ancl cause it to form a conductive connection between the or each first conduc-tor and the or each second conductor.
Figures 1 and 2 depicit a method of connection according to the invention.
Figure 3 depicts another method in which the device has a backing layer with holes through which the conductors may protrude, and Figure ~ depicts that embodiment with a cable ready for soldering.
Figure 5 depicts the use of windows shaped to retain the conductors of a cable, while Figure 6 is a side view of Figure 5; and Figures 7 and 8 show another form of device Figures 1 and 2 show a method of terminating a multi-conductor cable 89 by means of a device comprising a polymeric heat-stable layer 91 having an array of elongate windows 93 therein a strip of solder 97 extending accross the windows 93 and a temporary backing layer 95.
As shown in Fi~ure 1 a cable 89 with stripped conductors 90 is placed on the device. The backing layer 95 may adhere to the cable, and the system is placed initially so that the windows 93 are aligned with the conductors as they emerge from the cable insulation .
25~
As shown in Figure 2, a burnisher 92 or similar tool is stroked along the conductors in the direction of arrow A, away from the cable i.nsulation, to align the misaligned conductors. Downward pressure is also applied to cause the wires to move in the direction of arrow B and enter the windows 93, thus aligning them.
Pressure may then be applied tc the assembly to cause good adhesion of the aligned components, and alignment should thus be re ained until soldering, thus pre-venting deformation of individual wires within thecable during handling, etc.
Figure 3 depicts an another embodiment of this invention which also facilitates conductor alignment.
lf the backing layer 95 is placed so as to expose window 93 to the back via a small aperture 94 (or if the backing layer has suitable perforations), a hole for each wire is created. The misaligned wires may be straightened with a comb-like device 96 and the tips of the conductors 90 threaded through the apertures 94.
The comb may then be removed and the cable 89 bent in the direction of arrowlprod~ee afford the arrangement of Figure 4. If desired, before soldering occurs the cable may be pulled back (once the assembly is emplaced against the termination substrate) to leave no protruding conductor ends.
An additional feature of the window means of the invention is that they may keep conductors aligned during actual soldering. In particular, when soldering a multiplicity of small diameter wires to a printed wiring board, the wires may tend to fall off during application of heat and force. The windows may be further configured to minimize this tendency.
5~3~
g Maintenance of conductor alignment is shown in Figures 5 and 6 by one of many possible window shape variations. The windows 93 in window layer 91 have localized areas of restricted width ("grips") 98 on the precise locations desired which provide the positioning elements. The window layer portions adjacent to each end of the windows provide structural rigidity and location accuracy for every conductor~ In the case shownl the grip width is an interference fit to the diameter of the conductors 90, and partly overlays the solder strip 97, shown shaded. In such a case, the grips are preferably staggered so that the potential growth incurred when the conductors are forced into place may be absorbed by simple bending of the window frames~ The balance of the window remains wide enough to permit formation of a good solder fillet along the remaining conductor length, and the solder is placed to correctly guide the flow into each window. Figure 6 illustrates this in side Vi2W~
Another device is shown in figures 7 and 8 in which a heat stable polymeric layer 110 has a number of windows 112 each of which is formed with a narrow portion or neck 116 for gripping a conductor, the neck constituting a positioning element. The polymeric layer is placed over the substrate so that the windows 112 are in register with conductive regions of the substrate. The underside of the layer 110 is prefer-ably adhesive in nature so that it will adhere to the substrate. The layer 110 has a tear-off portion 119 which is then separated from the remainder of the layer along a line of weakness 120, e.g. a score-line or a line of perforations, and conductors 118 are then placed over the layer 110 so that they are gripped by 5l3~
-- 1 o the necks 116 of the windows and thereby held in alignment as shown in figure ~. The device may then be heated to fuse the solder strip 114 and form a connection between the conductors 118 and the con-ductive regions of the underlying substrate. Advan-tageously, the upper surface of the layer 110 is alsoadhesive in nature to assist in holding the conductors 118 in place.
Whilst the device preferably is formed with a tear-off strip 119, it is also possible to form the device initially as shown in figure 8.
Claims (13)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A device for electrically connecting at least one first conductor to at least one second conductor, which comprises:
(a) a layer of polymeric material having at least one window therein; and (b) a strip of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow through the or each window when heated and to form a conductive connection between conductors placed on opposite sides of the polymeric layer; the or each win-dow being capable of gripping a first conductor to maintain it in position with respect to the device.
(a) a layer of polymeric material having at least one window therein; and (b) a strip of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow through the or each window when heated and to form a conductive connection between conductors placed on opposite sides of the polymeric layer; the or each win-dow being capable of gripping a first conductor to maintain it in position with respect to the device.
2. A device as claimed in Claim 1, wherein the or at least one of the windows has a neck portion that is capable of gripping the first conductor.
3. A device as claimed in Claim 1, which includes a tem-porary backing layer located on the polymeric layer, which back-ing layer is capable of being removed after the or each first conductor has been positioned in the device.
4. A device as claimed in Claim 1, which includes a back-ing layer of such configuration that a part of the window or windows extends through the backing layer, the said part being adapted to receive the ends of conductors inserted therein.
5. A device as claimed in Claim 1, wherein the electrically conductive material comprises solder.
6. A device as claimed in Claim 1, wherein the layer of polymeric material has adhesive character.
7. A device as claimed in Claim 1, which includes one or more further layers having the window or windows extending there-through.
8. A device as claimed in any one of Claims 3, 4 or 7, wherein at least one of the layers of the device has adhesive character.
9. A device as claimed in Claim 1, wherein the layer of polymeric material has a plurality of windows therein.
10. A device as claimed in Claim 1, wherein the layer of polymeric material has at least two rows of windows therein and a quantity of conductive material is disposed adjacent to each row of windows.
11. A method of electrically connecting at least one first conductor to at least one second conductor, which comprises positioning the or each first conductor and the or each second conductor on opposite sides of a layer of polymeric material having one or more windows therein and having a strip of fusible electrically conductive material disposed with respect to the window or windows to allow the conductive material to flow through the or each window when heated, maintaining the or each first con-ductor in position within the or one of the windows, and heating the device to melt the electrically conductive material and cause it to form a conductive connection between the or each first con-ductor and the or each second conductor.
12. A method as claimed in Claim 11, which includes the step of burnishing the or each conductor into the window or win-dows.
13. A method as claimed in Claim 11 or Claim 12, wherein the or each first conductor is so positioned that it extends through one of the windows.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US328,762 | 1981-12-08 | ||
| US06/328,762 US4484704A (en) | 1980-06-09 | 1981-12-08 | Solder delivery system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1212588A true CA1212588A (en) | 1986-10-14 |
Family
ID=23282333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000417263A Expired CA1212588A (en) | 1981-12-08 | 1982-12-08 | Solder delivery system |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1212588A (en) |
-
1982
- 1982-12-08 CA CA000417263A patent/CA1212588A/en not_active Expired
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |