CA1132085A - Continuous contact plater and method - Google Patents
Continuous contact plater and methodInfo
- Publication number
- CA1132085A CA1132085A CA286,378A CA286378A CA1132085A CA 1132085 A CA1132085 A CA 1132085A CA 286378 A CA286378 A CA 286378A CA 1132085 A CA1132085 A CA 1132085A
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- Canada
- Prior art keywords
- roller
- contact points
- plating
- contact
- belts
- Prior art date
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Abstract
ABSTRACT OF THE DISCLOSURE
A continuous contact plater is disclosed having a pair of opposed belts for grasping and driving contact points through a pair of opposed jaws to be plated by contact on an anode roller, the movement of the contact points describing a helical trace on the roller. A metering roller is provided to adjustably determine the concentration of the plating fluid on the annode roller, and a tray is positioned beneath the anode roller to the end that a porous sleeve on the anode roller constantly passes into the electro-plating solution in the tray. Adjustment means are provided to adjust the roller with regard to the contact points between the opposed belts, the latter being fixed with regard to the frame of the unit.
A continuous contact plater is disclosed having a pair of opposed belts for grasping and driving contact points through a pair of opposed jaws to be plated by contact on an anode roller, the movement of the contact points describing a helical trace on the roller. A metering roller is provided to adjustably determine the concentration of the plating fluid on the annode roller, and a tray is positioned beneath the anode roller to the end that a porous sleeve on the anode roller constantly passes into the electro-plating solution in the tray. Adjustment means are provided to adjust the roller with regard to the contact points between the opposed belts, the latter being fixed with regard to the frame of the unit.
Description
~3X~3S
Field of Invention:
The field of the invention includes e]ectrolytic treatment apparatus often found classified in the United States Patent Office under Class 20~;
., I
and a process of exchanging metal on a workpiece often found 0 classified in Class 204 as well.
Description of the Prior Art:
he prior art is exemplified in United States Patents 936,472; 3,661,752; and 3,904,489; and also in French Patent 331930 and Patents in Great Britain Mumbers 760016 and 18643 (the I latter published in 189~).
In the prior art type devices, rotary member~ for light frictional engagement with -the cathode are shown.
~loving contact is also shown for purposes of wi~ing away bubbles, electrodeposition, and the like, so that the electric plating ac,ion will proceed without eontamination or film barriers on the surface to be plated. The prior art, however, fails to deal with the modern problems of gold plating, partieularly as applicable to the p-Lating of contact points on a curvilinear surface. In the plating of such contact points, the prior art techniques have involved dipping in the anode, and therefore plating portions of the contact which do not require plating. Where precious metals such as goId are employed in the plating, this overplating even to the extent of 100%, doubles the cost of material which is a signi- ¦
ficaDt st in the gold platinq of any prod~lct Also because ,j i -2~
3~s~
1 the prior art involves dippinq, there is no way of discretely determining the specific area to be plated, much less deter-mining the exact thickness to be plated on the discrete area.
SUMMARY O~ THE INVENTION
The present invention includes a method for continuous plating of a discrete area on a convex curvilinear surface of each of a plurality of aligned electronic contact points com-prising the steps of: confining and oreintating the contact points to allow movement thereof along a fixed axis of travel, engaging the same orientated contact points to move the thus orientated contact points with -their discrete area plated firmly againsta plating member; applying a predetermined amount of plating solution on the plating member to constantly wet the same in a controllable electrodeposition quantityi electrically energizing the contact points as a cathode and the plating solution as an anode; rotating the plating member to pass the plating solution on its surface onto the discrete area of the convex curvilinear surface oE the contact points which are passed against the plating member, whereby contact points can be plated with a metal on the discrete area of the convex curvilinear surface intended for electrical contact with another member, without plating the reat portion or other portions of the contact points which otherwise have no electri-cal relationship in a circuit.
The invention also includes a device for continuous contact plating of a plurality of contact points having a curvilinear portion comprising, in combination, a plating member having an axis of rotation and a wettable surface, a bath for electrolytic solution for supplying such solution to said plating member, a transport means oriented to move such contact points across l said plating member and in contact therewith, means for positioning a plurality of contact points along a bandolier for feeding the same into said transport means, and means for electrically energizing such contact points as a cathode and electrically energizing said bath as an anode, whereby the contact points may be passed against the wettable surface of the roller for plating of a discrete area of the curvilinear portion of such contact points.
Furthermore, the invention includes a metallic electrical contact element having a discrete convex curvilinear surface portion intended for electrical contact, said surface having a localized conductive electrodeposited contact area thereon.
The contact area decreases in thickness from the center thereof to define a thin edge substantially free of plated metal build up common to electrodeposition techniques using masking. Such a contact area also has area also has substantially uniform density. _ ~0 3a 1 According to an aspect of the invention, a method for plating a discrete contact point on a carrier of electronic contacts is disclosed.
According to another aspect of the invention is the plating of a contact point at only the point where the same will make electrical contact with a plated finger on a printed circuit board, and to control the plated dimensional portion of the contact as well as the thickness of the plated metal.
Still another aspect of the present invention is the continuous contact plating of a plurali-ty of contacts secured to a bandolier or carrier, the length of which may be effectively endless.
Still another aspect of the invention is an apparatus for carrying out the above which is readily adjustable in its basic respects, easy to service, and economical to construct, operate and maintain.
DESCRIPTION OF T~E DRAWINGS
Further objects and advantages of the present invention will become apparent as the following description proceeds, taken in eonjunction with the aeeompaying drawings in whieh:
FIG.lis a perspective partially broken rear view of the subject continuous plate.
FIG. 2 is an enlarged partially broken view illustrating the feed guide for delivering a plurality of bandolier secured contact points to theopposed driving belts.
FIG. 3 is a partially diagrammatic broken view of a rear portion of the unit taken in perspective and illustrating parti-cularly the relationship between the opposed jaws, the plating roller and the adjustment of the plating holder.
i~:
3L~L^3~85 1 FIG. 4 is a rear elevation of the mechanism shown in FIG. 3 in substantially the same scale.
FIG. 5 is a partially diagrammatic view illustrating ~ /
4a ) 3/1 ~/ 7f~ '' n~ 7- 0()l) 32t~35 . Il the drive mechanism for the carrier belts.
FIG. 6 is an end view of the mechanism shown in FIGS. 3 and 4 in slightly enlarged scale.
FIG. 7 is a top view of the jaws, driving belt, and anode roller bro~en at the midportion thereof.
FIG. 8 is an enlarged, partially broken transverse sectional view of the relationship between the jaws, driving belt and roller taken along section line 8-8 of FIG. 7.
FIG. 9 is a plan view of a typical bandolier of a plurality of contact points.
THE METHOD
The method for continuous contact plating of a curvi-linear contact point presupposes contacts 51 in a bandolier 50 as shown in FIG. 9. The contact points are positioned so that the bandolier is essentially perpendicular to the contact point.
Ihereafter the contact points and bando]ier are oriented to pass the same along a longitudinal axis. ~ rol1er having an absorbent peripheral surface is positioned for driving rotatably with its long axis in parallel relationship to the bandolier, and its longitudinal axis. An electrolytic bath is provided for fluid contact with an absorbent surface on the roller. The bandolier and its contained contact points are then moved along the a~is parallel to the axis of the roller with the contact points in tangential contact with the absorbent surface. The resultant action is to follow a helical path along the absorben-t surface of the roller with the contact points ener~ized as a cathode, and the electrolyt-ic solution electrically energized, particularly as to the absorbent portion of the roller, as an anode. The method also contemplates means in pressure relation-ship to the absorbent surface of the roller to control the amount of plating solution that is passed thereabout for purposes of plating.
- THE APPARATUS
The continuous plater 10 is shown in rear elevation, 5 and perspectively, in FIG. 1. There it will be seen that the continuous plater 10 includes a main frame 11, and a plurality of carrier belts 12. The carrier belts 12 include an upper belt 18 and a lower belt 19, which are positioned to tangentially engage each other and pass through the jaws 14 which orient the same 10 for tangential helical trace contact with an anode roller 15.
A plating solution tray 16 is positioned beneath the anode roller 15, and provided with an electrolytic solution for purposes of plating, usually plating gold to the contact points. The entire continuous plater 10 presupposes a treatmen-t to the contact 15 points prior to entering the plater and treatment thereafter. It is therefore a continuous plater 10, as a part of a total proces-sing apparatus for contact points.
To be noted in FIG. 1 is -the drive motor 20 for the anode roller 15. A feed guide sprocket 21 is provided immediately 20 adjacent the feed point 60, the same being the point where the upper belt 18 and the lower belt 19 first come into contiguous contact for the feeding of the contact points.
Turning now to FIG. 8, it will be se;en that the jaws 14 include an upper jaw 42 and a lower jaw 44. The same are 25 secured to jaw bracket 41 which is permanently affixed to the frame 11 of the continuous plater 10. The bandolier 50 is grasped by the opposed upper belt 18 and lower belt 19, and so positioned that the contact point 56 is in contact relationship - with the absorbent sleeve 24 of the roller 15. A meter roller 30 22 is provided for adjustable pressure contact against the porous sleeve 24, so that as the roller passes through the l~L3Z~B5 1 electrolyte 58, the amount of retained fluid after passing the metering roller 22 can be controlled by adjustment. The upper and lower belts 18, 19 may be of a closed cell foam like material, or solid rubber, depending upon the contacts being fed.
The roller 15 allows transfer of the electrolytic solution from the plating solution tray 16 to roller 15 and subsequently to the contact points. This is preferably accomplished by use of the absorbant sleeve 24; however, other alternatives are possible. The important feature is that the roller must transfer the plating solution from the solution tray to the electrical contact point or controllable electrodeposition quantity.
The contacts, while generally secured to a bandolier, may take varying forms. As shown in FIG. 9, the bandolier 50 has a plurality of contacts 51 secured thereto by means of a fastener 52, in this instance opposed jaws. The band 54 is provided with a plurality of drive holes 55 which permit it to be sprocket fed for movement.
The electrical contacts 51 shown in the enlargement of FIG. 8 have the metal plated areas 100 which form the electrical contact points. The thickness of the contact points decreases radially outward from the center thereof and each contact point joins with the body of the contact 51 at the thin edge 102. Thus, it can be appreciated that the thickness of the contact points decreases to provide an essentially flush junction with the underlying support portion of the contact. Furthermore, the inter-action of the rotating roller and the movement of thecontacts reduce the~
~:~3~
1 15 is secured to a roller frame 25 which includes a pair of roller frame legs 26, a roller frame base 28, and opposed roller frame posts 29 to which the roller 15 is mounted. The roller frame legs 26 are mounted at a pivot 30 to the main frame 11.
A horizontal adjusting member 31 is provided at each end of the lower frame 25, immediately adjacent the pivot 30. Vertical adjustment means 32 are provided beneath the base 28 of the roller frame 25, and as noted in FIG. 4, by rotating the knob 34, the pads 59 bear upon the lower face of the base 28, and raise and lower the same. Here it will be appreciated that the adjustment takes a very modest arcuate path, but the same is of no major movement inasmuch as the adjustment of the roller 15 with regard to the position of the jaws 14 and the contained bandolier 50 is empirical.
Turning now to FIG. 5 it will be seen that the upper and lower belts 18, 19 are driven by a belt motor 35 through a given sprocket mechanism to a plurality of belt pulleys 36.
The upper belt and lower belt 18, 19 are reeved around the ~5 ~i -s~
pulleys to insure a firm flow and continuous drive. The motor braket 38 permits some adjustment of the belt motor 35, and cooperates with the idler adjustment 40 (see Fig. 1) to adjustably secure the tension and frictional engagement of the belts 18, 19 with the pulleys 36.
In Fig. 6 the bracket 45 for the metering rollersS~dis-closed, the same being urged by the spring 46 into compressive relationship with the roller 15. An adjustment nut 48 is provided to further adjust the yieldable relationship between the metering roll 22 and the anode roller 15, the bracket 45 being pivoted arund pivot point 49.
It is highly desirable to lead the bandolier 50 into the feed point 60 defined by the position where the upper belt 18 and lower belt 19 come together, the alignment to be as close as possible. It will be appreciated that to accomplish this purpose, a feed guide sprocket assembly 21 may be usefully employed (see Fig. 2). The assembly comprises an upper inner toothed wheel 61 and an upper ~uter toothed wheel 62. The teeth 66 are positioned circumferentially to penetrate the drive holes 55 of the bandolier 50. The driving effort of the upper and lower belts 18, 19, will rotate the toothed w~ee~ 61, 62, and pull the bandolier 50 between the teeth 66 and the lower inner guide wheel 64 and the outer lower guide wheel 65. Other alterna-tives are available for the feed guide sprocket assembly 21, such as a pair of opposed plates. The principal result to be achieved is one of presenting the bandolier 50 in a path substantially co-incident with the feed point 60, and the trace of the upper and lower belts 18, 19 as they pass through the opposed jaws 42,44.
For purposes of cleaning, an eccentric tray mount assembly 30 70 (see Fig. 1) in which a single crank 71 may be rotated to the ~ ) 3~1~/7~ . 7 - n n ~
' ' 3~
end that the four contact rollers 72 suppor~ing the tray 16 lower their contact points, and the tray 16 may be removed from its fluid bath relationship with the roller 15 for cleaning, replenishing the electrolytic solution, or otherwise engaging in the maintenance and operation of the subject continuous plater 10.
~l-though particular embodiments of the invention have been shown and described in full here, there is no intention to ¦ thereby limit the invention to the details of such em~odiments.
L0 ¦ On the contrary, the intention is to cover all modifica-tions, ~ alternatives, embodiments, usages and equivalen-ts of a continuous ¦ contact plater and method as fall within the spirit and scope of he invention, s eclf~cation and the appended ~laim .
_9_
Field of Invention:
The field of the invention includes e]ectrolytic treatment apparatus often found classified in the United States Patent Office under Class 20~;
., I
and a process of exchanging metal on a workpiece often found 0 classified in Class 204 as well.
Description of the Prior Art:
he prior art is exemplified in United States Patents 936,472; 3,661,752; and 3,904,489; and also in French Patent 331930 and Patents in Great Britain Mumbers 760016 and 18643 (the I latter published in 189~).
In the prior art type devices, rotary member~ for light frictional engagement with -the cathode are shown.
~loving contact is also shown for purposes of wi~ing away bubbles, electrodeposition, and the like, so that the electric plating ac,ion will proceed without eontamination or film barriers on the surface to be plated. The prior art, however, fails to deal with the modern problems of gold plating, partieularly as applicable to the p-Lating of contact points on a curvilinear surface. In the plating of such contact points, the prior art techniques have involved dipping in the anode, and therefore plating portions of the contact which do not require plating. Where precious metals such as goId are employed in the plating, this overplating even to the extent of 100%, doubles the cost of material which is a signi- ¦
ficaDt st in the gold platinq of any prod~lct Also because ,j i -2~
3~s~
1 the prior art involves dippinq, there is no way of discretely determining the specific area to be plated, much less deter-mining the exact thickness to be plated on the discrete area.
SUMMARY O~ THE INVENTION
The present invention includes a method for continuous plating of a discrete area on a convex curvilinear surface of each of a plurality of aligned electronic contact points com-prising the steps of: confining and oreintating the contact points to allow movement thereof along a fixed axis of travel, engaging the same orientated contact points to move the thus orientated contact points with -their discrete area plated firmly againsta plating member; applying a predetermined amount of plating solution on the plating member to constantly wet the same in a controllable electrodeposition quantityi electrically energizing the contact points as a cathode and the plating solution as an anode; rotating the plating member to pass the plating solution on its surface onto the discrete area of the convex curvilinear surface oE the contact points which are passed against the plating member, whereby contact points can be plated with a metal on the discrete area of the convex curvilinear surface intended for electrical contact with another member, without plating the reat portion or other portions of the contact points which otherwise have no electri-cal relationship in a circuit.
The invention also includes a device for continuous contact plating of a plurality of contact points having a curvilinear portion comprising, in combination, a plating member having an axis of rotation and a wettable surface, a bath for electrolytic solution for supplying such solution to said plating member, a transport means oriented to move such contact points across l said plating member and in contact therewith, means for positioning a plurality of contact points along a bandolier for feeding the same into said transport means, and means for electrically energizing such contact points as a cathode and electrically energizing said bath as an anode, whereby the contact points may be passed against the wettable surface of the roller for plating of a discrete area of the curvilinear portion of such contact points.
Furthermore, the invention includes a metallic electrical contact element having a discrete convex curvilinear surface portion intended for electrical contact, said surface having a localized conductive electrodeposited contact area thereon.
The contact area decreases in thickness from the center thereof to define a thin edge substantially free of plated metal build up common to electrodeposition techniques using masking. Such a contact area also has area also has substantially uniform density. _ ~0 3a 1 According to an aspect of the invention, a method for plating a discrete contact point on a carrier of electronic contacts is disclosed.
According to another aspect of the invention is the plating of a contact point at only the point where the same will make electrical contact with a plated finger on a printed circuit board, and to control the plated dimensional portion of the contact as well as the thickness of the plated metal.
Still another aspect of the present invention is the continuous contact plating of a plurali-ty of contacts secured to a bandolier or carrier, the length of which may be effectively endless.
Still another aspect of the invention is an apparatus for carrying out the above which is readily adjustable in its basic respects, easy to service, and economical to construct, operate and maintain.
DESCRIPTION OF T~E DRAWINGS
Further objects and advantages of the present invention will become apparent as the following description proceeds, taken in eonjunction with the aeeompaying drawings in whieh:
FIG.lis a perspective partially broken rear view of the subject continuous plate.
FIG. 2 is an enlarged partially broken view illustrating the feed guide for delivering a plurality of bandolier secured contact points to theopposed driving belts.
FIG. 3 is a partially diagrammatic broken view of a rear portion of the unit taken in perspective and illustrating parti-cularly the relationship between the opposed jaws, the plating roller and the adjustment of the plating holder.
i~:
3L~L^3~85 1 FIG. 4 is a rear elevation of the mechanism shown in FIG. 3 in substantially the same scale.
FIG. 5 is a partially diagrammatic view illustrating ~ /
4a ) 3/1 ~/ 7f~ '' n~ 7- 0()l) 32t~35 . Il the drive mechanism for the carrier belts.
FIG. 6 is an end view of the mechanism shown in FIGS. 3 and 4 in slightly enlarged scale.
FIG. 7 is a top view of the jaws, driving belt, and anode roller bro~en at the midportion thereof.
FIG. 8 is an enlarged, partially broken transverse sectional view of the relationship between the jaws, driving belt and roller taken along section line 8-8 of FIG. 7.
FIG. 9 is a plan view of a typical bandolier of a plurality of contact points.
THE METHOD
The method for continuous contact plating of a curvi-linear contact point presupposes contacts 51 in a bandolier 50 as shown in FIG. 9. The contact points are positioned so that the bandolier is essentially perpendicular to the contact point.
Ihereafter the contact points and bando]ier are oriented to pass the same along a longitudinal axis. ~ rol1er having an absorbent peripheral surface is positioned for driving rotatably with its long axis in parallel relationship to the bandolier, and its longitudinal axis. An electrolytic bath is provided for fluid contact with an absorbent surface on the roller. The bandolier and its contained contact points are then moved along the a~is parallel to the axis of the roller with the contact points in tangential contact with the absorbent surface. The resultant action is to follow a helical path along the absorben-t surface of the roller with the contact points ener~ized as a cathode, and the electrolyt-ic solution electrically energized, particularly as to the absorbent portion of the roller, as an anode. The method also contemplates means in pressure relation-ship to the absorbent surface of the roller to control the amount of plating solution that is passed thereabout for purposes of plating.
- THE APPARATUS
The continuous plater 10 is shown in rear elevation, 5 and perspectively, in FIG. 1. There it will be seen that the continuous plater 10 includes a main frame 11, and a plurality of carrier belts 12. The carrier belts 12 include an upper belt 18 and a lower belt 19, which are positioned to tangentially engage each other and pass through the jaws 14 which orient the same 10 for tangential helical trace contact with an anode roller 15.
A plating solution tray 16 is positioned beneath the anode roller 15, and provided with an electrolytic solution for purposes of plating, usually plating gold to the contact points. The entire continuous plater 10 presupposes a treatmen-t to the contact 15 points prior to entering the plater and treatment thereafter. It is therefore a continuous plater 10, as a part of a total proces-sing apparatus for contact points.
To be noted in FIG. 1 is -the drive motor 20 for the anode roller 15. A feed guide sprocket 21 is provided immediately 20 adjacent the feed point 60, the same being the point where the upper belt 18 and the lower belt 19 first come into contiguous contact for the feeding of the contact points.
Turning now to FIG. 8, it will be se;en that the jaws 14 include an upper jaw 42 and a lower jaw 44. The same are 25 secured to jaw bracket 41 which is permanently affixed to the frame 11 of the continuous plater 10. The bandolier 50 is grasped by the opposed upper belt 18 and lower belt 19, and so positioned that the contact point 56 is in contact relationship - with the absorbent sleeve 24 of the roller 15. A meter roller 30 22 is provided for adjustable pressure contact against the porous sleeve 24, so that as the roller passes through the l~L3Z~B5 1 electrolyte 58, the amount of retained fluid after passing the metering roller 22 can be controlled by adjustment. The upper and lower belts 18, 19 may be of a closed cell foam like material, or solid rubber, depending upon the contacts being fed.
The roller 15 allows transfer of the electrolytic solution from the plating solution tray 16 to roller 15 and subsequently to the contact points. This is preferably accomplished by use of the absorbant sleeve 24; however, other alternatives are possible. The important feature is that the roller must transfer the plating solution from the solution tray to the electrical contact point or controllable electrodeposition quantity.
The contacts, while generally secured to a bandolier, may take varying forms. As shown in FIG. 9, the bandolier 50 has a plurality of contacts 51 secured thereto by means of a fastener 52, in this instance opposed jaws. The band 54 is provided with a plurality of drive holes 55 which permit it to be sprocket fed for movement.
The electrical contacts 51 shown in the enlargement of FIG. 8 have the metal plated areas 100 which form the electrical contact points. The thickness of the contact points decreases radially outward from the center thereof and each contact point joins with the body of the contact 51 at the thin edge 102. Thus, it can be appreciated that the thickness of the contact points decreases to provide an essentially flush junction with the underlying support portion of the contact. Furthermore, the inter-action of the rotating roller and the movement of thecontacts reduce the~
~:~3~
1 15 is secured to a roller frame 25 which includes a pair of roller frame legs 26, a roller frame base 28, and opposed roller frame posts 29 to which the roller 15 is mounted. The roller frame legs 26 are mounted at a pivot 30 to the main frame 11.
A horizontal adjusting member 31 is provided at each end of the lower frame 25, immediately adjacent the pivot 30. Vertical adjustment means 32 are provided beneath the base 28 of the roller frame 25, and as noted in FIG. 4, by rotating the knob 34, the pads 59 bear upon the lower face of the base 28, and raise and lower the same. Here it will be appreciated that the adjustment takes a very modest arcuate path, but the same is of no major movement inasmuch as the adjustment of the roller 15 with regard to the position of the jaws 14 and the contained bandolier 50 is empirical.
Turning now to FIG. 5 it will be seen that the upper and lower belts 18, 19 are driven by a belt motor 35 through a given sprocket mechanism to a plurality of belt pulleys 36.
The upper belt and lower belt 18, 19 are reeved around the ~5 ~i -s~
pulleys to insure a firm flow and continuous drive. The motor braket 38 permits some adjustment of the belt motor 35, and cooperates with the idler adjustment 40 (see Fig. 1) to adjustably secure the tension and frictional engagement of the belts 18, 19 with the pulleys 36.
In Fig. 6 the bracket 45 for the metering rollersS~dis-closed, the same being urged by the spring 46 into compressive relationship with the roller 15. An adjustment nut 48 is provided to further adjust the yieldable relationship between the metering roll 22 and the anode roller 15, the bracket 45 being pivoted arund pivot point 49.
It is highly desirable to lead the bandolier 50 into the feed point 60 defined by the position where the upper belt 18 and lower belt 19 come together, the alignment to be as close as possible. It will be appreciated that to accomplish this purpose, a feed guide sprocket assembly 21 may be usefully employed (see Fig. 2). The assembly comprises an upper inner toothed wheel 61 and an upper ~uter toothed wheel 62. The teeth 66 are positioned circumferentially to penetrate the drive holes 55 of the bandolier 50. The driving effort of the upper and lower belts 18, 19, will rotate the toothed w~ee~ 61, 62, and pull the bandolier 50 between the teeth 66 and the lower inner guide wheel 64 and the outer lower guide wheel 65. Other alterna-tives are available for the feed guide sprocket assembly 21, such as a pair of opposed plates. The principal result to be achieved is one of presenting the bandolier 50 in a path substantially co-incident with the feed point 60, and the trace of the upper and lower belts 18, 19 as they pass through the opposed jaws 42,44.
For purposes of cleaning, an eccentric tray mount assembly 30 70 (see Fig. 1) in which a single crank 71 may be rotated to the ~ ) 3~1~/7~ . 7 - n n ~
' ' 3~
end that the four contact rollers 72 suppor~ing the tray 16 lower their contact points, and the tray 16 may be removed from its fluid bath relationship with the roller 15 for cleaning, replenishing the electrolytic solution, or otherwise engaging in the maintenance and operation of the subject continuous plater 10.
~l-though particular embodiments of the invention have been shown and described in full here, there is no intention to ¦ thereby limit the invention to the details of such em~odiments.
L0 ¦ On the contrary, the intention is to cover all modifica-tions, ~ alternatives, embodiments, usages and equivalen-ts of a continuous ¦ contact plater and method as fall within the spirit and scope of he invention, s eclf~cation and the appended ~laim .
_9_
Claims (26)
OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A method for continuous plating of a discrete area on a convex curvilinear surface of each of a plurality of aligned electronic contact points comprising the steps of: confining and orientating the contact points to allow movement thereof along a fixed axis of travel, engaging the same orientated contact points to move the thus orientated contact points with their discrete areas placed firmly against a rotatable plating member; applying a predetermined amount of plating solution on the plating member to wet the same in a controllable electro-deposition quantity; electrically energizing the contact points as a cathode and the plating solution as an anode; rotating the plating member to pass the plating solution on its surface onto the discrete area on the convex curvilinear surface of the contact points which are passed against the plating member, whereby the contact points can be plated with a metal on the discrete area of the convex curvilinear surface intended for electrical contact with another member, without plating the rear portion or other portions of the contact points which otherwise have no electrical function in a circuit.
2. In the method of claim 1, using gold as the plating metal.
3. In the method of claim 1, using a longitudinal carrying strip to secure the contact points.
4. In the method of claim 2, using a longitudinal carrying strip to secure the contact points and wherein said plating member is a roller having an absorbent sleeve.
5. In the method of claim 2, 3 or 4, including opposed jaws in combination with opposed belts to grasp said aligned contact points for movement along said fixed axis of travel, wherein said opposed jaws are in frictional engagement with said opposed belts.
6. In the method of claim 1, including opposed jaws in combination with opposed belts to grasp said aligned contact points for movement along said fixed axis of travel, wherein said opposed jaws are in frictional engagement with said opposed belts.
7. A device for continuous contact plating of a plurality of contact points each having a convex curvilinear portion comprising, in combination, a bath for electrolytic solution, a roller having an axis of rotation and a wettable surface positioned for rotation within said electrolytic bath which is located generally below said roller, a transport means having two facing surfaces oriented along an axis parallel to the axis of rotation of the roller for advancing the contact points, means for positioning a plurality of contact points along a bandolier arranged for feeding into said transport means, and means for electrically energizing the bandolier as a cathode and electrically energizing said bath as an anode, whereby the convex curvilinear portions of contact points to be plated are positioned outwardly and to one side of said bandolier and passed longitudinally against the wettable surface of the roller for transfer of electrolytic solution to the contact points.
8. In the device of claim 7, a metering roll positioned for tangential engagement with the roller, an absorbent surface on the roller, and means for adjusting the compressive relationship between the metering roll and the roller having an absorbent surface, whereby the amount of electrolytic solution carried by said roller for application to such contact points may be varied.
9. In the device of claim 7 or 8, a roller frame pivotally secured to a main frame, and means for adjusting the roller with regard to the main frame, and means securing the transport means with respect to the main frame, whereby the relative position of the transport means and the contact points being plated and the roller is determined by the adjustment of the roller with regard to the position of the transport means.
10. A device as claimed in claim 7 or 8, wherein said transport means and said positioning means ensure essentially tangential contact of the curvilinear portion of such contact points with said wettable roller.
11. A device as claimed in claim 7 or 8, wherein said transport means and said roller are positioned such that the movement of such contact points relative to said roller define a helical trace on the surface of said roller.
12. A device as claimed in claim 7 or 8, wherein said transport means and said positioning means ensure essentially tangential contact of the curvilinear portion of such contact points with said wettable roller and the movement of such contact points across said wettable roller defines a helical trace.
13. A device for continuous plating of a plurality of contact points having a curvilinear portion comprising, in combination, a bath for electrolytic solution; a roller having an absorbent surface positioned for rotation within said bath;
a pair of opposed endless belts oriented along an axis parallel to the axis of rotation of the roller; means for urging the opposed belts into yieldable contact with each other; means for driving the opposed belts at substantially the same speed;
means for positioning a plurality of contact points for feeding the same into the space between the opposed belts; means for adjusting the opposed belts in relative relationship to the rotating roller having an absorbent surface; and means for electrically energizing such contact points as a cathode and electrically energizing the roller as an anode, whereby the contact points may be passed on a helical trace on the absorbent surface parallel to the axis of rotation of the roller having an absorbent surface.
a pair of opposed endless belts oriented along an axis parallel to the axis of rotation of the roller; means for urging the opposed belts into yieldable contact with each other; means for driving the opposed belts at substantially the same speed;
means for positioning a plurality of contact points for feeding the same into the space between the opposed belts; means for adjusting the opposed belts in relative relationship to the rotating roller having an absorbent surface; and means for electrically energizing such contact points as a cathode and electrically energizing the roller as an anode, whereby the contact points may be passed on a helical trace on the absorbent surface parallel to the axis of rotation of the roller having an absorbent surface.
14. In the device of claim 13, a metering roll positioned for tangential engagement with the roller having an absorbent surface and means for adjusting the compressive relationship between the metering roll and the roller having an absorbent surface, whereby the amount of electrolytic solution transferred from said bath to the roller may be predetermined.
15. In the device as claimed in claim 13, a roller frame pivotally secured to a main frame; and means for adjusting the roller with regard to the main frame, and means securing the belts with respect to the main frame, whereby the relationship between the contact points being plated and the roller is determined by the adjustment of the roller relative to the belts and contact points.
13 The device as claimed in claim 13 or 14, wherein said means for positioning includes guide means positioned between said opposed belts and said roller to engage and direct a carrier of contacts along a longitudinal path substantially coincident to the interface between the upper and lower drive belts.
17. In the device of claim 14, a roller frame pivotally secured to a main frame, and means for adjusting the roller with regard to the main frame, and means securing the belts with respect to the main frame, whereby the relationship between the contact points being plated and the roller is determined by the adjustment of the roller relative to the belts and contact points.
18. The device of claim 15, wherein said means for positioning includes guide means positioned between said opposed belts and said roller to engage and direct the contact points along a longitudinal path substantially coincident to the interface between the upper and lower drive belts.
19. A method for a continuous plating of a discrete area on a convex curvilinear surface on a plurality of aligned electronic contact points comprising the steps of: confining and orientating the contact points to allow movement thereof along a fixed axis of travel; providing a roller plating member and a transport means, said transport means oriented along an axis parallel to the axis of rotation of the roller and advancing the contact points along said transport means; the roller plating member having a retaining sleeve in anode rotary relationship to the contact points; rotating the roller plating member to pass a retained plating solution in said sleeve onto the discrete areas of the convex curvilinear surfaces of the contact points; electrically energizing the contact points as a cathode and passing the same longitudinally against the rotation of the roller plating member thereby defining a helical path across the roller plating member; applying a predetermined amount of plating solution onto the retaining sleeve to wet the same with a controllable electrodeposition quantity; whereby the contact points can be plated with a metal on the discrete areas of the convex curvilinear surfaces for electrical contact with another member without plating the rear portion or other portions of the contact points which otherwise have no electrical function in a circuit.
20. The method of claim 19, including using gold as the plating metal.
21. The method of claim 19, including using a longitudinal carrying strip to secure the contact points.
22. The method of claim 19, 20, or 21, including using opposed jaws in combination with opposed belts to grasp said aligned contact points for movement along said fixed axis of travel, wherein said opposed jaws are in frictional engagement with said opposed belts.
23. The method of claim 20, including using a longitudinal carrying strip to secure the contact points.
24. A device for continuous contact plating of a plurality of contact points each having a convex curvilinear portion comprising, in combination, a plating member having an axis of rotation and a wettable surface, a bath for electrolytic solution for supplying such solution to said plating member, a transport means having two facing surfaces oriented to move such contact points across said plating member and in contact therewith, means for positioning a plurality of contact points along a bandolier for feeding the same into said transport means, and means for electrically energizing such contact points as a cathode and electrically energizing said bath as an anode, whereby such contact points may be passed against the wettable surface of the plating member for plating of a discrete area of the curvilinear portion of such contact points.
25. A device as claimed in claim 24, wherein said transport means and said positioning means are orientated to provide tangential contact of the curvilinear portion of such points with said plating member.
26. A device as claimed in claim 24 or 25 wherein said plating member has an absorbent surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA286,378A CA1132085A (en) | 1977-09-09 | 1977-09-09 | Continuous contact plater and method |
| CA000377966A CA1144522A (en) | 1977-09-09 | 1981-05-04 | Continuous contact plater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA286,378A CA1132085A (en) | 1977-09-09 | 1977-09-09 | Continuous contact plater and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1132085A true CA1132085A (en) | 1982-09-21 |
Family
ID=4109489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA286,378A Expired CA1132085A (en) | 1977-09-09 | 1977-09-09 | Continuous contact plater and method |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1132085A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
-
1977
- 1977-09-09 CA CA286,378A patent/CA1132085A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6241860B1 (en) | 1998-05-20 | 2001-06-05 | Process Automation International, Ltd. | Electroplating machine |
| US6251234B1 (en) | 1998-05-20 | 2001-06-26 | Process Automation International, Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
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| MKEX | Expiry |