CA1026014A - Semiconductor component with pressure contact - Google Patents

Semiconductor component with pressure contact

Info

Publication number
CA1026014A
CA1026014A CA232,081A CA232081A CA1026014A CA 1026014 A CA1026014 A CA 1026014A CA 232081 A CA232081 A CA 232081A CA 1026014 A CA1026014 A CA 1026014A
Authority
CA
Canada
Prior art keywords
pressure contact
semiconductor component
semiconductor
component
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA232,081A
Other languages
English (en)
French (fr)
Inventor
Herbert Vogt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CA1026014A publication Critical patent/CA1026014A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
CA232,081A 1974-07-24 1975-07-23 Semiconductor component with pressure contact Expired CA1026014A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2435637A DE2435637C3 (de) 1974-07-24 1974-07-24 Halbleiteranordnung mit Druckkontakt

Publications (1)

Publication Number Publication Date
CA1026014A true CA1026014A (en) 1978-02-07

Family

ID=5921414

Family Applications (1)

Application Number Title Priority Date Filing Date
CA232,081A Expired CA1026014A (en) 1974-07-24 1975-07-23 Semiconductor component with pressure contact

Country Status (8)

Country Link
US (1) US4008487A (es)
JP (1) JPS5549775B2 (es)
CA (1) CA1026014A (es)
DE (1) DE2435637C3 (es)
ES (1) ES439672A1 (es)
FR (1) FR2280204A1 (es)
GB (1) GB1479112A (es)
IT (1) IT1039916B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110552A (en) * 1975-03-26 1976-09-30 Okayasu Shoten Kk 244 mechirenshikuroarutanooru oyobi sonoketsugotaikarashikuropuranooru oyobi sonoketsugotainojudoho
JPS51141859A (en) * 1975-06-03 1976-12-07 Kanemi Soko Kk Process for preparing cyclopranol
US4093958A (en) * 1976-12-09 1978-06-06 Motorola, Inc. Semiconductor device assembly with improved fatigue resistance
US4118249A (en) * 1977-08-30 1978-10-03 The United States Of America As Represented By The United States Department Of Energy Modular assembly of a photovoltaic solar energy receiver
JPS5739065Y2 (es) * 1979-03-05 1982-08-27
JPS5739066Y2 (es) * 1979-03-05 1982-08-27
JPS5739067Y2 (es) * 1979-03-05 1982-08-27
JPS5812280B2 (ja) * 1979-06-06 1983-03-07 天野製薬株式会社 シクロブラノ−ル又はその有機酸エステルの製造方法
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
GB2164213B (en) * 1984-09-06 1988-07-13 Nec Corp Structure for connecting leadless chip carrier
EP0216090A1 (de) * 1985-08-30 1987-04-01 Siemens Aktiengesellschaft Gehäuse für ein im Betrieb Verlustwärme abgebendes Schaltungsbauteil
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
JPS455387Y1 (es) * 1966-11-10 1970-03-14
JPS4728728U (es) * 1971-04-22 1972-12-01
JPS5215676Y2 (es) * 1971-08-05 1977-04-08
JPS4857524U (es) * 1971-11-08 1973-07-23

Also Published As

Publication number Publication date
DE2435637C3 (de) 1979-04-05
DE2435637B2 (de) 1978-07-27
ES439672A1 (es) 1977-03-16
JPS5549775B2 (es) 1980-12-13
IT1039916B (it) 1979-12-10
DE2435637A1 (de) 1976-02-05
JPS5140077A (es) 1976-04-03
GB1479112A (en) 1977-07-06
US4008487A (en) 1977-02-15
FR2280204A1 (fr) 1976-02-20

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