BRPI1008673A2 - método de fabricação de molde de estrutura de eletrodo para uso no mesmo. - Google Patents

método de fabricação de molde de estrutura de eletrodo para uso no mesmo.

Info

Publication number
BRPI1008673A2
BRPI1008673A2 BRPI1008673A BRPI1008673A BRPI1008673A2 BR PI1008673 A2 BRPI1008673 A2 BR PI1008673A2 BR PI1008673 A BRPI1008673 A BR PI1008673A BR PI1008673 A BRPI1008673 A BR PI1008673A BR PI1008673 A2 BRPI1008673 A2 BR PI1008673A2
Authority
BR
Brazil
Prior art keywords
electrode structure
making method
mold making
structure mold
electrode
Prior art date
Application number
BRPI1008673A
Other languages
English (en)
Inventor
Hidekazu Hayashi
Kazuhiko Tsuda
Tokio Taguchi
Original Assignee
Sharp Kabushiki Kaisha Also Trading As Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha Also Trading As Sharp Corp filed Critical Sharp Kabushiki Kaisha Also Trading As Sharp Corp
Publication of BRPI1008673A2 publication Critical patent/BRPI1008673A2/pt

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/118Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424Moulding surfaces provided with means for marking or patterning
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/12Anodising more than once, e.g. in different baths
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/18After-treatment, e.g. pore-sealing
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/18After-treatment, e.g. pore-sealing
    • C25D11/24Chemical after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2905/00Use of metals, their alloys or their compounds, as mould material
    • B29K2905/02Aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
BRPI1008673A 2009-03-05 2010-03-02 método de fabricação de molde de estrutura de eletrodo para uso no mesmo. BRPI1008673A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009052502 2009-03-05
PCT/JP2010/001403 WO2010100894A1 (ja) 2009-03-05 2010-03-02 型の製造方法およびそれに用いられる電極構造

Publications (1)

Publication Number Publication Date
BRPI1008673A2 true BRPI1008673A2 (pt) 2016-03-08

Family

ID=42709461

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1008673A BRPI1008673A2 (pt) 2009-03-05 2010-03-02 método de fabricação de molde de estrutura de eletrodo para uso no mesmo.

Country Status (7)

Country Link
US (1) US8641884B2 (pt)
EP (1) EP2405036B1 (pt)
JP (1) JP4617402B2 (pt)
CN (1) CN102105624B (pt)
BR (1) BRPI1008673A2 (pt)
RU (1) RU2480540C1 (pt)
WO (1) WO2010100894A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112012010861A2 (pt) * 2009-11-10 2016-04-05 Unilever Nv dispositivo livre de congelamento e método para produzir um dispositivo livre de congelamento
TWI508872B (zh) * 2010-07-26 2015-11-21 Mitsubishi Rayon Co 奈米壓印用模具的製造裝置以及奈米壓印用模具的製造方法
JP2012243948A (ja) * 2011-05-19 2012-12-10 Mitsubishi Rayon Co Ltd ナノインプリント用モールドの製造方法
CN105451966B (zh) 2013-08-14 2017-03-15 三菱丽阳株式会社 圆柱状纳米压印用模具的制造方法,和纳米压印用再生模具的制造方法
WO2016108077A1 (en) * 2014-12-31 2016-07-07 Essilor International (Compagnie Generale D'optique) Method of mirror coating an optical article and article thereby obtained
US11598902B2 (en) * 2019-09-30 2023-03-07 Canon Kabushiki Kaisha Optical member, optical apparatus, imaging apparatus, and manufacturing method of optical member

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002542A (en) * 1976-02-09 1977-01-11 Corning Glass Works Thin film capacitor and method
JP3308091B2 (ja) * 1994-02-03 2002-07-29 東京エレクトロン株式会社 表面処理方法およびプラズマ処理装置
DE19708776C1 (de) 1997-03-04 1998-06-18 Fraunhofer Ges Forschung Entspiegelungsschicht sowie Verfahren zur Herstellung derselben
US7048841B2 (en) * 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
DE10019720A1 (de) * 2000-04-20 2001-10-31 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
DE10020877C1 (de) * 2000-04-28 2001-10-25 Alcove Surfaces Gmbh Prägewerkzeug, Verfahren zum Herstellen desselben, Verfahren zur Strukturierung einer Oberfläche eines Werkstücks und Verwendung einer anodisch oxidierten Oberflächenschicht
US7066234B2 (en) 2001-04-25 2006-06-27 Alcove Surfaces Gmbh Stamping tool, casting mold and methods for structuring a surface of a work piece
RU2186159C1 (ru) * 2001-01-19 2002-07-27 Государственное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" Способ нанесения покрытия на деталь из алюминия и алюминиевых сплавов
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7374646B2 (en) * 2003-01-31 2008-05-20 Ebara Corporation Electrolytic processing apparatus and substrate processing method
US20050023149A1 (en) * 2003-06-05 2005-02-03 Tsutomu Nakada Plating apparatus, plating method and substrate processing apparatus
JP4406553B2 (ja) 2003-11-21 2010-01-27 財団法人神奈川科学技術アカデミー 反射防止膜の製造方法
US20070235342A1 (en) 2004-10-01 2007-10-11 Canon Kabushiki Kaisha Method for manufacturing nanostructure
JP4368384B2 (ja) 2004-12-03 2009-11-18 シャープ株式会社 反射防止材、光学素子、および表示装置ならびにスタンパの製造方法およびスタンパを用いた反射防止材の製造方法
JP2009034148A (ja) 2007-07-31 2009-02-19 Kyoto Platec:Kk フィルタ及びその製造方法
EP2400044B1 (en) * 2009-02-17 2016-09-07 Sharp Kabushiki Kaisha Method for producing mold

Also Published As

Publication number Publication date
US8641884B2 (en) 2014-02-04
CN102105624B (zh) 2012-12-26
EP2405036B1 (en) 2017-11-08
JPWO2010100894A1 (ja) 2012-09-06
EP2405036A4 (en) 2013-01-02
US20110315557A1 (en) 2011-12-29
JP4617402B2 (ja) 2011-01-26
RU2480540C1 (ru) 2013-04-27
WO2010100894A1 (ja) 2010-09-10
EP2405036A1 (en) 2012-01-11
CN102105624A (zh) 2011-06-22

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]