BRPI0915983A2 - electrical circuit structure - Google Patents

electrical circuit structure

Info

Publication number
BRPI0915983A2
BRPI0915983A2 BRPI0915983A BRPI0915983A BRPI0915983A2 BR PI0915983 A2 BRPI0915983 A2 BR PI0915983A2 BR PI0915983 A BRPI0915983 A BR PI0915983A BR PI0915983 A BRPI0915983 A BR PI0915983A BR PI0915983 A2 BRPI0915983 A2 BR PI0915983A2
Authority
BR
Brazil
Prior art keywords
electrical circuit
flexible substrate
circuit board
circuit structure
rear face
Prior art date
Application number
BRPI0915983A
Other languages
Portuguese (pt)
Inventor
Inui Tadashi
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI0915983A2 publication Critical patent/BRPI0915983A2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

estrutura de circuito elétrico a presente invenção refere-se a uma estrutura de circuito elétrico com a qual a ocorrência de geração de som causada pela vibração de um elemento de circuito montado em um substrato 5 flexível conectado a uma placa de circuito é suprimida. a estrutura de circuito elétrico inclui um membro mecânico (9) na forma de uma armação dotada de um fundo fechado;uma placa de circuito (1) na superfície da qual um elemento de circuito elétrico é formado, sendo a placa de circuito acomodada no membro mecânico (9); um substrato flexível (10) que possui um terminal de conexão formado em uma extremidade (10a) dele, sendo o terminal de conexão conectado a um terminal de eletrodo (7) formado na placa de circuito (1), e que é dobrada para trás e presa a uma face traseira do membro mecânico (9) na outra extremidade oposta a uma extremidade (10a); e um elemento de circuito mon tado em uma parte do substrato flexível (10) que é dobrada para trás para a face traseira do membro mecânico (9), em que o substrato flexível (10) é preso à face traseira do membro mecânico (9) através de uma fita adesiva de tecido não tecido que emprega um tecido não tecido como um material base.Electrical Circuit Structure The present invention relates to an electrical circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate 5 connected to a circuit board is suppressed. the electrical circuit structure includes a mechanical member (9) in the form of a frame with a closed bottom, a circuit board (1) on the surface of which an electrical circuit element is formed, the circuit board being accommodated on the member. mechanical (9); a flexible substrate (10) having a connection terminal formed at one end (10a) thereof, the connection terminal being connected to an electrode terminal (7) formed on the circuit board (1), and which is folded back and attached to a rear face of the mechanical member (9) at the other end opposite one end (10a); and a circuit element mounted on a portion of the flexible substrate (10) which is folded back to the rear face of the mechanical member (9), wherein the flexible substrate (10) is secured to the rear face of the mechanical member (9). ) through a nonwoven fabric adhesive tape employing a nonwoven fabric as a base material.

BRPI0915983A 2008-07-18 2009-07-15 electrical circuit structure BRPI0915983A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008187519 2008-07-18
PCT/JP2009/062794 WO2010008016A1 (en) 2008-07-18 2009-07-15 Electric circuit structure

Publications (1)

Publication Number Publication Date
BRPI0915983A2 true BRPI0915983A2 (en) 2019-04-09

Family

ID=41550418

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0915983A BRPI0915983A2 (en) 2008-07-18 2009-07-15 electrical circuit structure

Country Status (7)

Country Link
US (1) US8416362B2 (en)
EP (1) EP2306795B1 (en)
JP (1) JP5053438B2 (en)
CN (1) CN102077699A (en)
BR (1) BRPI0915983A2 (en)
RU (1) RU2468547C2 (en)
WO (1) WO2010008016A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9107316B2 (en) * 2013-09-11 2015-08-11 Eastman Kodak Company Multi-layer micro-wire substrate structure
CN105458541B (en) * 2015-12-18 2017-12-26 安徽华东光电技术研究所 EMI constant current power supply filtering module and preparation method thereof
JP2018026395A (en) * 2016-08-08 2018-02-15 ソニーセミコンダクタソリューションズ株式会社 Imaging element package and camera module
CN110995894A (en) * 2019-11-20 2020-04-10 瑞声科技(新加坡)有限公司 Screen sounding modular structure with exciter attached to screen and mobile communication terminal

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880186B2 (en) 1989-06-28 1999-04-05 株式会社日立製作所 Liquid crystal display
JP3203736B2 (en) * 1992-02-13 2001-08-27 株式会社日立製作所 Tape carrier package for liquid crystal driver and liquid crystal display device
JP3729113B2 (en) 1994-09-16 2005-12-21 セイコーエプソン株式会社 Electronics
US5822030A (en) 1994-09-16 1998-10-13 Seiko Epson Corporation Liquid crystal display device, its mounting structure and electronic device
RU2171497C2 (en) * 1996-11-12 2001-07-27 НАГРА АйДи С.А. Maps and method for producing maps
DE69631552T2 (en) 1996-11-12 2004-12-23 Nagrald S.A. Methods of making cards
DE19803020C2 (en) 1998-01-27 1999-12-02 Siemens Ag Chip card module for biometric sensors
JP3257555B2 (en) * 2000-08-04 2002-02-18 株式会社日立製作所 Liquid crystal display
JP2004020703A (en) 2002-06-13 2004-01-22 Nanox Corp Liquid crystal display device
JP4543772B2 (en) * 2003-09-19 2010-09-15 セイコーエプソン株式会社 Electro-optical device and electronic apparatus
JP2006235453A (en) * 2005-02-28 2006-09-07 Sanyo Epson Imaging Devices Corp Liquid crystal display device
CN2876829Y (en) * 2006-03-08 2007-03-07 胜华科技股份有限公司 Optical display module structure
JP4841372B2 (en) 2006-09-21 2011-12-21 日東電工株式会社 Double-sided adhesive tape

Also Published As

Publication number Publication date
US20110116003A1 (en) 2011-05-19
JPWO2010008016A1 (en) 2012-01-05
EP2306795A4 (en) 2012-12-19
WO2010008016A1 (en) 2010-01-21
EP2306795A1 (en) 2011-04-06
RU2011101588A (en) 2012-08-27
JP5053438B2 (en) 2012-10-17
RU2468547C2 (en) 2012-11-27
US8416362B2 (en) 2013-04-09
CN102077699A (en) 2011-05-25
EP2306795B1 (en) 2013-12-04

Similar Documents

Publication Publication Date Title
BRPI0915983A2 (en) electrical circuit structure
JP2006229046A5 (en)
WO2008090646A1 (en) Backlight device and flat display using it
BRPI0604773A (en) nonwoven laminate, elastomer, nonwoven
BR112015001010A2 (en) stretch release article
TW200833222A (en) Structure of mounting shield cover and display device
JP2008539557A5 (en)
BRPI0520789A2 (en) absorbent article comprising moisture sensing means
MX2012004496A (en) Liquid crystal display device and television receiver.
ATE481265T1 (en) MONITORING/ENTERTAINMENT SYSTEM FOR A CHILD SEAT
RU2013135651A (en) MOUNTING PANEL WITH EXTENDED LANGUAGE
ATE429550T1 (en) RECOVERABLE SEALING TAPE
TW200641446A (en) Circuit board and display device having the same
TW200702756A (en) Polarizer assembly, method of manufacturing the same and method of manufacturing panel assembly having the same
BR0101654A (en) Controlled electronic unit, and method of manufacturing a controlled electronic unit
TW200715919A (en) Dual-layered flexible circuit board
JPWO2011013509A1 (en) Electronic equipment
WO2018232790A1 (en) Backlight module and liquid crystal display module
JP2008203829A5 (en)
JP2015230402A (en) Display device
BRPI0418349A (en) flexible carrier with an electrically conductive structure
ATE515049T1 (en) BACKLIT BUTTON ARRANGEMENT WITH A REDUCED THICKNESS
JP2007048845A (en) Fitting structure of electronic circuit unit
CN201994064U (en) Hard disc fixing device
JP2007305936A5 (en)

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A, 7A, 8A E 9A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2519 DE 16-04-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]