BRPI0907567A2 - Sistema de disposição - Google Patents

Sistema de disposição

Info

Publication number
BRPI0907567A2
BRPI0907567A2 BRPI0907567-4A BRPI0907567A BRPI0907567A2 BR PI0907567 A2 BRPI0907567 A2 BR PI0907567A2 BR PI0907567 A BRPI0907567 A BR PI0907567A BR PI0907567 A2 BRPI0907567 A2 BR PI0907567A2
Authority
BR
Brazil
Prior art keywords
disposal system
disposal
Prior art date
Application number
BRPI0907567-4A
Other languages
English (en)
Inventor
Klaus Biester
Peter Kunow
Volker Zabe
Original Assignee
Cameron Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200820001968 external-priority patent/DE202008001968U1/de
Priority claimed from DE200820002312 external-priority patent/DE202008002312U1/de
Application filed by Cameron Int Corp filed Critical Cameron Int Corp
Publication of BRPI0907567A2 publication Critical patent/BRPI0907567A2/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14337Housings specially adapted for power drive units or power converters specially adapted for underwater operation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1434Housings for electronics exposed to high gravitational force; Cylindrical housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Rectifiers (AREA)
BRPI0907567-4A 2008-02-13 2009-02-12 Sistema de disposição BRPI0907567A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200820001968 DE202008001968U1 (de) 2008-02-13 2008-02-13 Anordnungssystem
DE200820002312 DE202008002312U1 (de) 2008-02-20 2008-02-20 Anordnungssystem
PCT/EP2009/001011 WO2009100914A2 (en) 2008-02-13 2009-02-12 Arrangement system

Publications (1)

Publication Number Publication Date
BRPI0907567A2 true BRPI0907567A2 (pt) 2015-07-14

Family

ID=40848057

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0907567-4A BRPI0907567A2 (pt) 2008-02-13 2009-02-12 Sistema de disposição

Country Status (4)

Country Link
US (2) US8619434B2 (pt)
EP (1) EP2250862B1 (pt)
BR (1) BRPI0907567A2 (pt)
WO (1) WO2009100914A2 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2979177B1 (fr) * 2011-08-19 2014-05-23 Valeo Sys Controle Moteur Sas Bloc de puissance pour onduleur de vehicule electrique
DE102011085650B4 (de) * 2011-11-03 2022-09-01 Robert Bosch Gmbh Befestigung eines Steuergerätes für ein Getriebesteuermodul an einer Trägerplatte
US9777966B2 (en) 2014-01-30 2017-10-03 General Electric Company System for cooling heat generating electrically active components for subsea applications
WO2015188882A1 (en) * 2014-06-13 2015-12-17 Abb Technology Ltd Arrangement for subsea housing of electric components and manufacturing of the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4888663A (en) 1986-03-25 1989-12-19 Hughes Aircraft Company Cooling system for electronic assembly
US4922381A (en) * 1986-03-25 1990-05-01 Hughes Aircraft Company Stacked circuit cards and guided configurations
DE3621930A1 (de) * 1986-06-30 1988-01-07 Bosch Gmbh Robert Mehrplatten-hybdridgeraet mit integrierter waermeableitung
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US5435733A (en) * 1993-11-12 1995-07-25 Hughes Aircraft Company Connector assembly for microelectronic multi-chip-module
US5579207A (en) * 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
US5701233A (en) * 1995-01-23 1997-12-23 Irvine Sensors Corporation Stackable modules and multimodular assemblies
DE19645636C1 (de) * 1996-11-06 1998-03-12 Telefunken Microelectron Leistungsmodul zur Ansteuerung von Elektromotoren
US6181567B1 (en) * 1997-06-04 2001-01-30 Ncr Corporation Method and apparatus for securing an electronic package to a circuit board
US6176308B1 (en) * 1998-06-08 2001-01-23 Camco International, Inc. Inductor system for a submersible pumping system
ATE324025T1 (de) * 1998-09-09 2006-05-15 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Wärmeleitende einlegematte für elektrische und elektronische geräte
DE20115474U1 (de) 2001-09-19 2003-02-20 Biester Klaus Gleichspannungs-Wandlervorrichtung
EP1235471A1 (en) * 2001-02-27 2002-08-28 STMicroelectronics Limited A stackable module
US6476476B1 (en) * 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
DE20115475U1 (de) 2001-09-19 2003-02-20 Biester Klaus Gleichspannungs-Wandlervorrichtung
FR2872992B1 (fr) * 2004-07-09 2006-09-29 Valeo Vision Sa Assemblage electronique a drain thermique notamment pour module de commande de lampe a decharge de projecteurs de vehicule automobile
US7511967B2 (en) * 2007-02-20 2009-03-31 United Technologies Corporation Avionics enclosure

Also Published As

Publication number Publication date
EP2250862B1 (en) 2019-06-12
US20140078697A1 (en) 2014-03-20
WO2009100914A2 (en) 2009-08-20
EP2250862A2 (en) 2010-11-17
WO2009100914A3 (en) 2009-11-05
US8619434B2 (en) 2013-12-31
US9622371B2 (en) 2017-04-11
US20110019385A1 (en) 2011-01-27

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 10A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2501 DE 11-12-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.