BRPI0514625A - surface with an adhesion-reducing microstructure and process for its production - Google Patents

surface with an adhesion-reducing microstructure and process for its production

Info

Publication number
BRPI0514625A
BRPI0514625A BRPI0514625-9A BRPI0514625A BRPI0514625A BR PI0514625 A BRPI0514625 A BR PI0514625A BR PI0514625 A BRPI0514625 A BR PI0514625A BR PI0514625 A BRPI0514625 A BR PI0514625A
Authority
BR
Brazil
Prior art keywords
microstructure
produced
production
adhesion
peaks
Prior art date
Application number
BRPI0514625-9A
Other languages
Portuguese (pt)
Inventor
Christian Hansen
Ursus Krueger
Manuela Schneider
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BRPI0514625A publication Critical patent/BRPI0514625A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

SUPERFìCIE COM UMA MICROESTRUTURA DIMINUIDORA DE ADERêNCIA E PROCESSO PARA SUA PRODUçãO A invenção refere-se a uma superfície com uma microestrutura diminuidora de aderência e um processo para sua produção. Tais microestruturas diminuidoras de aderência são conhecidas, para por exemplo, formar superfícies autolimpantes com o aproveitamento do chamado efeito lotus. De acordo com a invenção, está previsto, que a superfície seja produzida eletroquimicamente por meio de Reverse Pulse Plating, sendo produzida a microestrutura em si conhecida e simultaneamente ou em um estágio de processo posterior é produzida a nanoestrutura sobreposta à microestrutura. Isso pode ser obtido, por exemplo, em que o comprimento do pulso do pulso de corrente usado no Reverse Pulse Plating é selecionado na faixa de milissegundos com uma proporção de comprimento de pulso maior do que 1:3 (anódico:catódico). A seguir, a microestrutura produzida, constando de picos (19) e reentrâncias (20), é sobreposta por picos (19n) e reentrâncias (20n) com menores dimensões da nanoestrutura, com o que o efeito lotus obtido pela superfície pode ser vantajosamente melhorado.SURFACE WITH A ADHESIVE AND PROCESS REDUCING MICROSTRUCTURE FOR THEIR PRODUCTION The invention relates to a surface with an adhesion reducing microstructure and a process for its production. Such adhesion-lowering microstructures are known, for example, to form self-cleaning surfaces by utilizing the so-called lotus effect. According to the invention, it is envisaged that the surface is electrochemically produced by Reverse Pulse Plating, the microstructure itself being produced and simultaneously or at a later process stage the nanostructure superimposed on the microstructure is produced. This can be obtained, for example, where the current pulse pulse length used in Reverse Pulse Plating is selected in the millisecond range with a pulse length ratio greater than 1: 3 (anodic: cathodic). Next, the produced microstructure, consisting of peaks (19) and recesses (20), is overlaid by peaks (19n) and smaller recesses (20n) of the nanostructure, whereby the lotus effect obtained by the surface can be advantageously enhanced. .

BRPI0514625-9A 2004-08-26 2005-08-08 surface with an adhesion-reducing microstructure and process for its production BRPI0514625A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004041813A DE102004041813A1 (en) 2004-08-26 2004-08-26 Surface having an adhesion reducing microstructure and method of making the same
PCT/EP2005/053902 WO2006021507A1 (en) 2004-08-26 2005-08-08 Surface comprising a microstructure that reduces adhesion and associated production method

Publications (1)

Publication Number Publication Date
BRPI0514625A true BRPI0514625A (en) 2008-06-17

Family

ID=35445971

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0514625-9A BRPI0514625A (en) 2004-08-26 2005-08-08 surface with an adhesion-reducing microstructure and process for its production

Country Status (6)

Country Link
US (1) US20080217180A1 (en)
EP (1) EP1781841A1 (en)
CN (1) CN101048537B (en)
BR (1) BRPI0514625A (en)
DE (1) DE102004041813A1 (en)
WO (1) WO2006021507A1 (en)

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US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
US20100112286A1 (en) * 2008-11-03 2010-05-06 Bahadur Vaibhav A Superhydrophobic surfaces
US8545994B2 (en) * 2009-06-02 2013-10-01 Integran Technologies Inc. Electrodeposited metallic materials comprising cobalt
US8987632B2 (en) * 2009-10-09 2015-03-24 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of surface energy via direct laser ablative surface patterning
RU2570280C2 (en) 2010-04-28 2015-12-10 Кимберли-Кларк Ворлдвайд, Инк. Composite matrix of microneedles, containing nanostructures on surface
DK2563450T3 (en) 2010-04-28 2017-11-13 Kimberly Clark Co Apparatus for administering rheumatoid arthritis drug
US9522262B2 (en) 2010-04-28 2016-12-20 Kimberly-Clark Worldwide, Inc. Medical devices for delivery of siRNA
EP2563455A4 (en) 2010-04-28 2014-02-19 Kimberly Clark Co Method for increasing permeability of an epithelial barrier
US9303322B2 (en) * 2010-05-24 2016-04-05 Integran Technologies Inc. Metallic articles with hydrophobic surfaces
US8486319B2 (en) 2010-05-24 2013-07-16 Integran Technologies Inc. Articles with super-hydrophobic and/or self-cleaning surfaces and method of making same
US9492952B2 (en) 2010-08-30 2016-11-15 Endo-Surgery, Inc. Super-hydrophilic structures
US20120143228A1 (en) 2010-08-30 2012-06-07 Agency For Science Technology And Research Adhesive structure with stiff protrusions on adhesive surface
EP3542851B1 (en) 2011-10-27 2021-12-15 Sorrento Therapeutics, Inc. Implantable devices for delivery of bioactive agents
JP6100271B2 (en) 2011-10-27 2017-03-22 キンバリー クラーク ワールドワイド インコーポレイテッド Transdermal delivery of highly viscous bioactive agents
US20170246439A9 (en) 2011-10-27 2017-08-31 Kimberly-Clark Worldwide, Inc. Increased Bioavailability of Transdermally Delivered Agents
JP6153945B2 (en) 2011-12-29 2017-06-28 エシコン・インコーポレイテッドＥｔｈｉｃｏｎ， Ｉｎｃｏｒｐｏｒａｔｅｄ Adhesive structure having tissue penetrating protrusions on the surface
US8926881B2 (en) 2012-04-06 2015-01-06 DePuy Synthes Products, LLC Super-hydrophobic hierarchical structures, method of forming them and medical devices incorporating them
US8969648B2 (en) 2012-04-06 2015-03-03 Ethicon, Inc. Blood clotting substrate and medical device
US9278374B2 (en) 2012-06-08 2016-03-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modified surface having low adhesion properties to mitigate insect residue adhesion
DE102012112550A1 (en) 2012-12-18 2014-06-18 Lpkf Laser & Electronics Ag Method for metallizing a workpiece and a layer structure of a workpiece and a metal layer
CN108371567B (en) * 2013-01-11 2021-08-17 Bvw控股公司 Implantable superhydrophobic surfaces
DE102014006739B3 (en) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Process for coating surfaces with nanostructures, component produced by the process and use of the component
DE102014113097A1 (en) 2014-09-11 2016-03-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. A method of reducing soil adhesion to a substrate
CN106591896A (en) * 2016-12-06 2017-04-26 南京理工大学 Method for preparing super-hydrophobic copper surface of plant leaf structure

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US5326454A (en) * 1987-08-26 1994-07-05 Martin Marietta Corporation Method of forming electrodeposited anti-reflective surface coatings
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
US6080504A (en) * 1998-11-02 2000-06-27 Faraday Technology, Inc. Electrodeposition of catalytic metals using pulsed electric fields
EP1225972A4 (en) * 1999-09-24 2006-08-30 Semitool Inc Pattern dependent surface profile evolution of electrochemically deposited metal
US6309528B1 (en) * 1999-10-15 2001-10-30 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
DE10015855A1 (en) * 2000-03-30 2001-10-11 Basf Ag Application of the lotus effect in process engineering
US6478943B1 (en) * 2000-06-01 2002-11-12 Roll Surface Technologies, Inc. Method of manufacture of electrochemically textured surface having controlled peak characteristics
DE10064520A1 (en) * 2000-12-22 2002-07-04 Daimler Chrysler Ag Method for producing structured surface with self-cleaning effect on vehicles, comprises producing micro- or nano-structure on carrier by anodic oxidation and transferring this structure to the surface
US6827833B2 (en) * 2001-10-15 2004-12-07 Faraday Technology Marketing Group, Llc Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
WO2004001102A1 (en) * 2002-06-25 2003-12-31 Integran Technologies Inc. Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube
US20040011432A1 (en) * 2002-07-17 2004-01-22 Podlaha Elizabeth J. Metal alloy electrodeposited microstructures
CN1182297C (en) * 2002-12-10 2004-12-29 华中师范大学 Paper with nano structural surface possessing characters of super hydrophobicity and self-cleaning

Also Published As

Publication number Publication date
EP1781841A1 (en) 2007-05-09
US20080217180A1 (en) 2008-09-11
CN101048537B (en) 2010-06-16
CN101048537A (en) 2007-10-03
DE102004041813A1 (en) 2006-03-02
WO2006021507A1 (en) 2006-03-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2266 DE 10/06/2014.