BRPI0514029A - revestimento não eletrÈnico com partìculas de nanÈmetro - Google Patents

revestimento não eletrÈnico com partìculas de nanÈmetro

Info

Publication number
BRPI0514029A
BRPI0514029A BRPI0514029-3A BRPI0514029A BRPI0514029A BR PI0514029 A BRPI0514029 A BR PI0514029A BR PI0514029 A BRPI0514029 A BR PI0514029A BR PI0514029 A BRPI0514029 A BR PI0514029A
Authority
BR
Brazil
Prior art keywords
particles
electronic
nanometer particles
improved
coating
Prior art date
Application number
BRPI0514029-3A
Other languages
English (en)
Inventor
Edward Mccomas
Original Assignee
Universal Chemicals Technologi
Edward Mccomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Chemicals Technologi, Edward Mccomas filed Critical Universal Chemicals Technologi
Publication of BRPI0514029A publication Critical patent/BRPI0514029A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

REVESTIMENTO NãO ELETRÈNICO COM PARTìCULAS DE NANÈMETRO A adição de partículas de nanómetros aos banhos de revestimento de metal não eletrónico reduz ou elimina a semeação em banhos de revestimento não eletrónico. A semeação reduzida resulta em menos inclusões ou corrosões na cobertura. Usualmente o esquema de freqüente limpeza de tanque e manutenção pode ser aumentado além dos 2-3 dias normais. As propriedades do revestimento podem ser melhoradas pela co-deposição das partículas no banho. As propriedades tais como densidade, resistência à corrosão, e resistência ao desgaste são melhoradas.
BRPI0514029-3A 2004-08-02 2005-08-01 revestimento não eletrÈnico com partìculas de nanÈmetro BRPI0514029A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/903,687 US20060024447A1 (en) 2004-08-02 2004-08-02 Electroless plating with nanometer particles
PCT/US2005/027396 WO2006017490A1 (en) 2004-08-02 2005-08-01 Electroless plating with nanometer particles

Publications (1)

Publication Number Publication Date
BRPI0514029A true BRPI0514029A (pt) 2008-05-27

Family

ID=35732583

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0514029-3A BRPI0514029A (pt) 2004-08-02 2005-08-01 revestimento não eletrÈnico com partìculas de nanÈmetro

Country Status (8)

Country Link
US (2) US20060024447A1 (pt)
EP (1) EP1778473A1 (pt)
JP (1) JP2008508431A (pt)
KR (1) KR20070052775A (pt)
BR (1) BRPI0514029A (pt)
CA (1) CA2575471A1 (pt)
MX (1) MX2007001324A (pt)
WO (1) WO2006017490A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070045966A1 (en) * 2005-08-31 2007-03-01 Caterpillar Inc. Coatings for metal-metal seal surfaces
US7410544B2 (en) * 2006-04-21 2008-08-12 Freescale Semiconductor, Inc. Method for cleaning electroless process tank
US7481150B2 (en) * 2006-08-29 2009-01-27 Compact Automation Products, Llc Fluid cylinder for high temperature applications
KR100856873B1 (ko) 2007-01-05 2008-09-04 연세대학교 산학협력단 무전해도금용 촉매활성 방법
WO2011094441A1 (en) * 2010-01-27 2011-08-04 Rubin Jerry A Coated surgical and dental implements and implants with superior heat dissipation and toughness
EP2458030A1 (en) 2010-11-30 2012-05-30 Alfa Laval Corporate AB Method of coating a part of a heat exchanger and heat exchanger
CN107475763B (zh) * 2017-08-15 2019-02-22 重庆新久融科技有限公司 一种具有自润滑膜层的铝合金模板及其加工方法
CN107814579B (zh) * 2017-10-19 2020-05-08 水利部杭州机械设计研究所 一种超疏水纳米陶瓷材料及其形成的涂层
EP3828966A1 (en) 2019-11-28 2021-06-02 2706649 Ontario Ltd Active element, hydrogen generating apparatus and electrical energy generating apparatus
EP3868707A1 (en) 2020-02-19 2021-08-25 2706649 Ontario Ltd Hydrogen developing body and process of making the same
EP3916123A1 (en) * 2020-05-29 2021-12-01 2706649 Ontario Ltd Active element, process for making the same, and electrochemical apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE33767E (en) * 1971-12-15 1991-12-10 Surface Technology, Inc. Method for concomitant particulate diamond deposition in electroless plating, and the product thereof
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4407869A (en) * 1981-08-24 1983-10-04 Richardson Chemical Company Controlling boron content of electroless nickel-boron deposits
US4830889A (en) * 1987-09-21 1989-05-16 Wear-Cote International, Inc. Co-deposition of fluorinated carbon with electroless nickel
US5087434A (en) * 1989-04-21 1992-02-11 The Pennsylvania Research Corporation Synthesis of diamond powders in the gas phase
RU2051092C1 (ru) * 1991-12-25 1995-12-27 Научно-производственное объединение "Алтай" Алмазсодержащее вещество и способ его получения
FI965182A (fi) * 1996-04-04 1997-10-05 Conenor Oy Menetelmä ja laite puristetun muovituotteen tekemiseksi ja muovituote
JPH08232073A (ja) * 1995-02-27 1996-09-10 Kuwana Shoji Kk 無電解複合めっき被膜及びその製造方法
DE59812090D1 (de) * 1997-08-09 2004-11-11 Roche Diagnostics Gmbh Analysevorrichtung zur in-vivo-analyse im körper eines patienten
US6156390A (en) * 1998-04-01 2000-12-05 Wear-Cote International, Inc. Process for co-deposition with electroless nickel
US6066406A (en) * 1998-05-08 2000-05-23 Biocontrol Technology, Inc. Coating compositions containing nickel and boron
KR100776421B1 (ko) * 2000-12-21 2007-11-16 에드워드 맥코마스 니켈, 붕소 및 입자를 함유한 코팅 조성물
JP4245310B2 (ja) * 2001-08-30 2009-03-25 忠正 藤村 分散安定性に優れたダイヤモンド懸濁水性液、このダイヤモンドを含む金属膜及びその製造物
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Also Published As

Publication number Publication date
KR20070052775A (ko) 2007-05-22
EP1778473A1 (en) 2007-05-02
US20060024514A1 (en) 2006-02-02
CA2575471A1 (en) 2006-02-16
US20060024447A1 (en) 2006-02-02
MX2007001324A (es) 2008-03-04
JP2008508431A (ja) 2008-03-21
WO2006017490A1 (en) 2006-02-16

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B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 7A E 8A ANUIDADES.

B08I Publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2258 DE 15/04/2014 POR TER SIDO INDEVIDA.

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 7A, 8A, 9A, 10A, 11A, 12A, 13A, 14A E 15A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.