BRPI0418750A - fita adesiva sensìvel à pressão, de dupla face, método para fabricar a mesma e método para montar um objeto em um substrato - Google Patents

fita adesiva sensìvel à pressão, de dupla face, método para fabricar a mesma e método para montar um objeto em um substrato

Info

Publication number
BRPI0418750A
BRPI0418750A BRPI0418750-4A BRPI0418750A BRPI0418750A BR PI0418750 A BRPI0418750 A BR PI0418750A BR PI0418750 A BRPI0418750 A BR PI0418750A BR PI0418750 A BRPI0418750 A BR PI0418750A
Authority
BR
Brazil
Prior art keywords
adhesive tape
substrate
mounting
fabricating
pressure
Prior art date
Application number
BRPI0418750-4A
Other languages
English (en)
Portuguese (pt)
Inventor
Thomas C Epple
Donald L Chapman
Original Assignee
Avery Dennison Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Company filed Critical Avery Dennison Company
Publication of BRPI0418750A publication Critical patent/BRPI0418750A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/10—Layered products comprising a layer of natural or synthetic rubber next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/383—Natural or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI0418750-4A 2004-04-14 2004-04-14 fita adesiva sensìvel à pressão, de dupla face, método para fabricar a mesma e método para montar um objeto em um substrato BRPI0418750A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2004/011506 WO2005110737A1 (en) 2004-04-14 2004-04-14 Microsphere containing electron beam cured pressure-sensitive adhesive tapes and methods of making and using same

Publications (1)

Publication Number Publication Date
BRPI0418750A true BRPI0418750A (pt) 2007-09-11

Family

ID=35394051

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0418750-4A BRPI0418750A (pt) 2004-04-14 2004-04-14 fita adesiva sensìvel à pressão, de dupla face, método para fabricar a mesma e método para montar um objeto em um substrato

Country Status (5)

Country Link
EP (1) EP1735147A4 (https=)
JP (1) JP2007532751A (https=)
CN (1) CN1956845A (https=)
BR (1) BRPI0418750A (https=)
WO (1) WO2005110737A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007052069A1 (de) 2007-07-20 2009-01-22 Tesa Ag Verfahren zur Korrosionsschutzbehandlung von Metalloberflächen
DE102008004388A1 (de) * 2008-01-14 2009-07-16 Tesa Ag Geschäumte, insbesondere druckempfindliche Klebemasse, Verfahren zur Herstellung sowie die Verwendung derselben
DE102008032195A1 (de) 2008-07-09 2010-01-14 Tesa Se Verfahren zur Korrosionsschutzbehandlung von Metalloberflächen
BRPI0914379A2 (pt) 2008-10-29 2015-10-20 3M Innovative Properties Co "adesivo, artigo médico e método para adesão de um substrato médico a um substrato biológico"
KR102001292B1 (ko) * 2008-10-29 2019-07-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자빔 경화된 실리콘 물질
US9771499B2 (en) 2010-09-10 2017-09-26 Henkel IP & Holding GmbH Adhesive having structural integrity and insulative properties
JP5639272B2 (ja) 2010-09-10 2014-12-10 ヘンケル・ユーエス・アイピー・リミテッド・ライアビリティ・カンパニーＨｅｎｋｅｌ ＵＳ ＩＰ ＬＬＣ 断熱性が改善された接着剤
US9657200B2 (en) 2012-09-27 2017-05-23 Henkel IP & Holding GmbH Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
EP2565244A1 (de) * 2011-08-31 2013-03-06 Weiss Chemie + Technik GmbH & Co. KG Doppelseitig selbstklebendes Band
CN103946327B (zh) * 2011-12-19 2016-03-16 印度坎普尔理工学院 可重复使用的复合粘合剂
US9273230B2 (en) 2012-11-16 2016-03-01 Henkel IP & Holding GmbH Hot melt assist waterborne adhesives and use thereof
JP2016521306A (ja) 2013-04-15 2016-07-21 スリーエム イノベイティブ プロパティズ カンパニー （メタ）アクリレート基及びオレフィン基を有する架橋剤を含む接着剤並びに方法
RU2659965C1 (ru) 2013-11-27 2018-07-04 ХЕНКЕЛЬ АйПи ЭНД ХОЛДИНГ ГМБХ Связующая композиция для изоляционных изделий
WO2015157019A1 (en) * 2014-04-11 2015-10-15 3M Innovative Properties Company Pressure sensitive adhesive coated articles suitable for bonding to rough surfaces
AU2015292856B2 (en) 2014-07-23 2018-12-06 Henkel Ag & Co. Kgaa Expandable coating compositions and use thereof
MX2019014565A (es) 2017-07-18 2020-02-07 Henkel IP & Holding GmbH Calentamiento dielectrico de composiciones espumables.
TWI795430B (zh) 2017-08-25 2023-03-11 美商3M新設資產公司 容許無損傷移除的黏著劑物品
US12157619B2 (en) 2017-08-25 2024-12-03 Henkel Ag & Co. Kgaa Process for forming improved protective eco-friendly pouch and packaging and products made therefrom
BR112020003831B1 (pt) 2017-08-25 2023-03-07 3M Innovative Properties Company Artigo adesivo para montagem de um objeto em uma superfície
BR112020003577B1 (pt) 2017-08-25 2024-02-20 Graphic Innovators, Llc Métodos para produzir material de embalagem protetoras e para fabricar uma bolsa almofadada protetora
EP3527361A1 (de) 2018-02-16 2019-08-21 Henkel AG & Co. KGaA Verfahren zur herstellung eines mehrschichtigen substrats

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05112184A (ja) * 1991-10-21 1993-05-07 Sekisui Chem Co Ltd 自動車用外装部材及びその製造方法並びに貼付方法
JP2547833Y2 (ja) * 1992-05-13 1997-09-17 株式会社三社電機製作所 制振、消音性能を有する両面接着テープ
US6217981B1 (en) * 1997-10-13 2001-04-17 3M Innovative Properties Company Adhesive sheet and method for producing the same
JPH11116749A (ja) * 1997-10-16 1999-04-27 Kuraray Co Ltd 熱可塑性樹脂組成物及びその製造方法
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
US20030082362A1 (en) * 2001-07-31 2003-05-01 Khandpur Ashish K. High cohesive strength pressure sensitive adhesive foam
US20040131846A1 (en) * 2002-12-19 2004-07-08 Epple Thomas C. Microsphere containing electron beam cured pressure-sensitive adhesive tapes and methods of making and using same

Also Published As

Publication number Publication date
WO2005110737A1 (en) 2005-11-24
EP1735147A1 (en) 2006-12-27
CN1956845A (zh) 2007-05-02
EP1735147A4 (en) 2007-12-19
JP2007532751A (ja) 2007-11-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.