BRPI0408051A - composição de poliamida termoplástica e artigo - Google Patents

composição de poliamida termoplástica e artigo

Info

Publication number
BRPI0408051A
BRPI0408051A BRPI0408051-3A BRPI0408051A BRPI0408051A BR PI0408051 A BRPI0408051 A BR PI0408051A BR PI0408051 A BRPI0408051 A BR PI0408051A BR PI0408051 A BRPI0408051 A BR PI0408051A
Authority
BR
Brazil
Prior art keywords
article
polyamide composition
thermoplastic polyamide
thermoplastic
composition
Prior art date
Application number
BRPI0408051-3A
Other languages
English (en)
Inventor
Win-Chung Lee
Avelino F Lima
I-Chung W Wang
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BRPI0408051A publication Critical patent/BRPI0408051A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

"COMPOSIçãO DE POLIAMIDA TERMOPLáSTICA E ARTIGO". A presente invenção refere-se a composições e mIsturas de poliamida reforçadas com carga mineral que compreende de 10 a 45% em peso de polivinilbutiral.
BRPI0408051-3A 2003-03-14 2004-03-12 composição de poliamida termoplástica e artigo BRPI0408051A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45488903P 2003-03-14 2003-03-14
PCT/US2004/007730 WO2004083307A1 (en) 2003-03-14 2004-03-12 Composition comprising polyamide, polyvinylbutyral and mineral filler and articles made therefrom

Publications (1)

Publication Number Publication Date
BRPI0408051A true BRPI0408051A (pt) 2006-02-14

Family

ID=33029923

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0408051-3A BRPI0408051A (pt) 2003-03-14 2004-03-12 composição de poliamida termoplástica e artigo

Country Status (11)

Country Link
US (1) US20040266931A1 (pt)
EP (1) EP1606350A1 (pt)
JP (1) JP2006520421A (pt)
KR (1) KR20050111356A (pt)
CN (1) CN1761719A (pt)
AU (1) AU2004221893A1 (pt)
BR (1) BRPI0408051A (pt)
CA (1) CA2518526A1 (pt)
MX (1) MXPA05009613A (pt)
TW (1) TW200502295A (pt)
WO (1) WO2004083307A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050004308A1 (en) * 2003-03-14 2005-01-06 Win-Chung Lee Polyamide and polyvinylbutyral compositions and blends having enhanced surface properties and articles made therefrom
US20060079621A1 (en) * 2004-06-24 2006-04-13 Win-Chung Lee Toughened polyacetal compositions and blends having low surface gloss
US7491761B2 (en) * 2005-11-01 2009-02-17 Solutia Incorporated Poly(vinyl butyral) pellets
CN102070901B (zh) * 2010-11-18 2012-06-27 陈桂兰 一种密封条材料及其制备方法
FR3018220B1 (fr) * 2014-03-07 2020-08-14 Saint-Gobain Placo Plaque acoustique a base de platre.
CN104987708A (zh) * 2015-08-03 2015-10-21 金宝丽科技（苏州）有限公司 一种纤维增强尼龙复合材料及其制备方法
CN106497038A (zh) * 2016-11-02 2017-03-15 安徽隆宇塑业有限公司 一种尼龙66复合材料

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1367075A (fr) * 1962-07-11 1964-07-17 Gen Electric Perfectionnements apportés aux compositions résineuses à base de polycarbonates aromatiques, et aux procédés pour leur production
SE340695B (pt) * 1963-05-31 1971-11-29 Monsanto Co
US4174358A (en) * 1975-05-23 1979-11-13 E. I. Du Pont De Nemours And Company Tough thermoplastic nylon compositions
US4399246A (en) * 1982-08-06 1983-08-16 E. I. Du Pont De Nemours & Co. Filled polyamide compositions with silanes and sulfonamides
US4795768A (en) * 1985-07-11 1989-01-03 Union Carbide Corporation Impact promoters for mineral-filled thermoplastics
US4740538A (en) * 1986-07-03 1988-04-26 Engelhard Corporation Coated minerals for filling plastics
EP0457190B1 (en) * 1990-05-14 1995-02-01 Sekisui Chemical Co., Ltd. Interlayers for use in sound-insulating laminated glasses
US5340654A (en) * 1992-04-23 1994-08-23 Sekisui Kagaku Kogyo Kabushiki Kaisha Interlayer film for laminated glass
DE69433719T2 (de) * 1993-08-19 2005-03-24 General Electric Co. Mineralgefüllte thermoplastische Formmasse
DE4332114A1 (de) * 1993-09-22 1995-03-23 Hoechst Ag Polypropylen-Formmasse mit verbesserten Oberflächeneigenschaften
DE69429453T2 (de) * 1993-10-13 2002-08-01 E.I. Du Pont De Nemours And Co., Wilmington Polyamidzusammensetzungen zäh gemacht durch wiedergewonnenem plastifiziertem polyvinylbutyral
US5571851A (en) * 1994-01-28 1996-11-05 J.M. Huber Corporation Reinforcing fillers for plastics systems
US6202976B1 (en) * 1998-10-07 2001-03-20 Guardian Industries Corporation Plastic rearview mirror mount
DE19936002A1 (de) * 1999-07-30 2001-02-08 Faber Castell A W Verbundwerkstoff
DE19938159A1 (de) * 1999-08-16 2001-02-22 Huels Troisdorf Verbundsicherheitsglas sowie PVB-Folie zu seiner Herstellung
JP2004506072A (ja) * 2000-08-10 2004-02-26 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリビニルブチラール（ｐｖｂ）廃物を処理可能なペレットへ変換する方法
US7138454B2 (en) * 2002-09-06 2006-11-21 E. I. Du Pont De Nemours And Company Toughened, glass filled polyamide compositions and blends having improved stiffness, and articles made therefrom
US20050004308A1 (en) * 2003-03-14 2005-01-06 Win-Chung Lee Polyamide and polyvinylbutyral compositions and blends having enhanced surface properties and articles made therefrom

Also Published As

Publication number Publication date
AU2004221893A1 (en) 2004-09-30
WO2004083307A1 (en) 2004-09-30
US20040266931A1 (en) 2004-12-30
EP1606350A1 (en) 2005-12-21
CA2518526A1 (en) 2004-09-30
CN1761719A (zh) 2006-04-19
KR20050111356A (ko) 2005-11-24
MXPA05009613A (es) 2005-10-18
JP2006520421A (ja) 2006-09-07
TW200502295A (en) 2005-01-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A, 6A, 7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.