BR9810600A - Spiro-polyglycidyl compounds and their use in epoxy resins - Google Patents
Spiro-polyglycidyl compounds and their use in epoxy resinsInfo
- Publication number
- BR9810600A BR9810600A BR9810600-7A BR9810600A BR9810600A BR 9810600 A BR9810600 A BR 9810600A BR 9810600 A BR9810600 A BR 9810600A BR 9810600 A BR9810600 A BR 9810600A
- Authority
- BR
- Brazil
- Prior art keywords
- aryl
- epoxy resins
- hydrated
- partially
- spirobis
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D493/00—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system
- C07D493/02—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system in which the condensed system contains two hetero rings
- C07D493/10—Spiro-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D407/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
- C07D407/14—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing three or more hetero rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
Abstract
Patente de Invenção: <B>"COMPOSTOS ESPIRO-POLIGLICIDILA E SEU USO EM RESINAS EPóXI"<D>. Composto poliglicidila dotado em média com mais que dois, de preferência mais que dois e meio, particularmente preferível mais que três grupos glicidila por molécula e um valor de T~ g~ (determinado por DSC, velocidade de aquecimento = 20°C/min) maior do que 20°C, com base num 1,1'-espirobis-indano polifuncional de fórmula I ou uma mistura de diferentes 1,1'-espirobis-indanos polifuncionais de fórmula geral I onde Z é uma ligação simples direta ou -O-, mais que dois de R~ 1~, R~ 2~, R~ 3~ e R~ 4~ são -OH, -O-CO-R-CO-OH, -O-R-OH, -O-CO-NH-R-NH-CO-O-R-OH ou [O-C~ m~H~ 2m~]~ n~-OH, onde m é um número inteiro de 2 a 4, n é um número inteiro de 1 a 20, e R é C~ 1-8~ alquileno, C~ 5-8~ cicloalquileno, C~ 6-14~ arileno ou C~ 6-14~ arileno parcialmente hidratado, e o restante R~ 1~, R~ 2~, R~ 3~ e R~ 4~ são um átomo de hidrogênio ou -O-C~ 1-8~ alquila, -O-C~ 5-8~ cicloalquila, -O-C~ 6-14~ arila, -O-C~ 6-14~ arila parcialmente hidratada ou (met)acrilato; e R~ 5~, R~ 6~, R~ 7~ e R~ 8~ são independentemente um do outro, C~ 1-8~ alquila, C~ 5-8~ cicloalquila, C~ 6-14~ arila, C~ 6-14~ arila parcialmente hidratada, ou um átomo de hidrogênio, para a produção de artigos moldados, revestimentos, materiais matrizes ou adesivos.Invention Patent: <B> "SPYRO-POLYGLYCIDIL COMPOUNDS AND THEIR USE IN EPOXY RESINS" <D>. Polyglycidyl compound provided on average with more than two, preferably more than two and a half, particularly preferable more than three glycidyl groups per molecule and a T ~ g ~ value (determined by DSC, heating rate = 20 ° C / min) greater than 20 ° C, based on a polyfunctional 1,1'-spirobis-indane of formula I or a mixture of different polyfunctional 1,1'-spirobis-indanes of general formula I where Z is a direct single bond or -O -, more than two of R ~ 1 ~, R ~ 2 ~, R ~ 3 ~ and R ~ 4 ~ are -OH, -O-CO-R-CO-OH, -OR-OH, -O-CO- NH-R-NH-CO-OR-OH or [OC ~ m ~ H ~ 2m ~] ~ n ~ -OH, where m is an integer from 2 to 4, n is an integer from 1 to 20, and R is C ~ 1-8 ~ alkylene, C ~ 5-8 ~ cycloalkylene, C ~ 6-14 ~ arylene or C ~ 6-14 ~ partially hydrated arylene, and the remainder R ~ 1 ~, R ~ 2 ~, R ~ 3 ~ and R ~ 4 ~ are a hydrogen atom or -OC ~ 1-8 ~ alkyl, -OC ~ 5-8 ~ cycloalkyl, -OC ~ 6-14 ~ aryl, -OC ~ 6-14 ~ partially aryl hydrated or (meth) acrylate; and R ~ 5 ~, R ~ 6 ~, R ~ 7 ~ and R ~ 8 ~ are independently of each other, C ~ 1-8 ~ alkyl, C ~ 5-8 ~ cycloalkyl, C ~ 6-14 ~ aryl, C ~ 6-14 ~ partially hydrated aryl, or a hydrogen atom, for the production of molded articles, coatings, matrix materials or adhesives.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH174497 | 1997-07-16 | ||
| PCT/EP1998/004168 WO1999003851A1 (en) | 1997-07-16 | 1998-07-06 | Polyglycidyl spirocompounds and their use in epoxy resins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR9810600A true BR9810600A (en) | 2000-07-11 |
Family
ID=4217575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR9810600-7A BR9810600A (en) | 1997-07-16 | 1998-07-06 | Spiro-polyglycidyl compounds and their use in epoxy resins |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1015440A1 (en) |
| JP (1) | JP2002511874A (en) |
| KR (1) | KR20010021700A (en) |
| CN (1) | CN1264373A (en) |
| BR (1) | BR9810600A (en) |
| TW (1) | TW515815B (en) |
| WO (1) | WO1999003851A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002022600A2 (en) | 2000-09-15 | 2002-03-21 | Anormed Inc. | Chemokine receptor binding heterocyclic compounds |
| JP7004181B2 (en) * | 2016-10-18 | 2022-01-21 | 日産化学株式会社 | Epoxy resin composition for forming printed wiring boards |
| WO2020158574A1 (en) * | 2019-01-31 | 2020-08-06 | 富士フイルム株式会社 | Composition for heat conductive materials, heat conductive material, heat conductive sheet, and device with heat conductive layer |
| CN114401992A (en) | 2019-07-05 | 2022-04-26 | 艾欧麦克斯治疗股份公司 | Antibodies to IGSF11(VSIG3) that bind IGC2 and uses thereof |
| US20240010720A1 (en) | 2020-07-06 | 2024-01-11 | Iomx Therapeutics Ag | Antibodies binding igv of igsf11 (vsig3) and uses thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1167489A (en) * | 1968-07-18 | 1969-10-15 | Dow Chemical Co | Process for Producing a Thermosettable Epoxidized Novolac Resin |
| US4672102A (en) * | 1985-12-23 | 1987-06-09 | The Dow Chemical Company | Polyhydroxy ethers containing spirobiindanols |
| JPH0892231A (en) * | 1994-09-22 | 1996-04-09 | Mitsui Toatsu Chem Inc | Spirobiindan diglycidyl ether and its production |
-
1998
- 1998-07-06 WO PCT/EP1998/004168 patent/WO1999003851A1/en not_active Application Discontinuation
- 1998-07-06 CN CN98807230A patent/CN1264373A/en active Pending
- 1998-07-06 JP JP50637699A patent/JP2002511874A/en active Pending
- 1998-07-06 EP EP98941293A patent/EP1015440A1/en not_active Withdrawn
- 1998-07-06 BR BR9810600-7A patent/BR9810600A/en not_active IP Right Cessation
- 1998-07-06 KR KR1020007000259A patent/KR20010021700A/en not_active Application Discontinuation
- 1998-07-14 TW TW087111417A patent/TW515815B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010021700A (en) | 2001-03-15 |
| EP1015440A1 (en) | 2000-07-05 |
| WO1999003851A1 (en) | 1999-01-28 |
| TW515815B (en) | 2003-01-01 |
| JP2002511874A (en) | 2002-04-16 |
| CN1264373A (en) | 2000-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Transfer |
Owner name: VANTICO AG (CH) |
|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A,8A E 9A ANUIDADES. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1909 DE 07/08/2007. |