BR9714182A - Componente para contatos de um medidor e procedimento para a respectiva fabricação - Google Patents

Componente para contatos de um medidor e procedimento para a respectiva fabricação

Info

Publication number
BR9714182A
BR9714182A BR9714182-8A BR9714182A BR9714182A BR 9714182 A BR9714182 A BR 9714182A BR 9714182 A BR9714182 A BR 9714182A BR 9714182 A BR9714182 A BR 9714182A
Authority
BR
Brazil
Prior art keywords
meter
component
contacts
procedure
welding tabs
Prior art date
Application number
BR9714182-8A
Other languages
English (en)
Inventor
Antonio Esteve Macia
Original Assignee
Mannesmann Vdo Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann Vdo Ag filed Critical Mannesmann Vdo Ag
Publication of BR9714182A publication Critical patent/BR9714182A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Patente de Invenção: <B>"COMPONENTE PARA CONTATOS DE UM MEDIDOR E PROCEDIMENTO PARA A RESPECTIVA FABRICAçãO"<D>. O componente (5) apresenta um suporte (6), que contém um número de pontes de contato (7) correspondente ao número de elementos de contato (2) do medidor (1) a ligar, que apresentam patilhas de soldadura (8, 9) que estão dobradas em ângulo reto voltadas uma para a outra. As patilhas de soldadura (8) podem ser enfiadas através da placa de circuitos impressos (3) e soldadas com as superfícies de contato (4) desta. Assim o suporte (6) encontra-se sobre o lado sem superfícies de contato da placa de circuitos impressos (3). As outras patilhas de soldadura (9), que ficam igualmente salientes em relação ao suporte (6) que é feito de plástico isolador elétrico, estão equipadas com aberturas (11), através das quais os elementos de contato (2) na altura da colocação do medidor (1) penetram na placa de circuitos impressos (3) e que podem ser soldadas mecanicamente tal como as patilhas de soldadura (8).
BR9714182-8A 1996-12-24 1997-12-18 Componente para contatos de um medidor e procedimento para a respectiva fabricação BR9714182A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19654382A DE19654382A1 (de) 1996-12-24 1996-12-24 Bauelement für eine Meßwerkkontaktierung und Verfahren zu dessen Herstellung
PCT/EP1997/007130 WO1998028819A1 (de) 1996-12-24 1997-12-18 Bauelement für eine messwerkkontaktierung und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
BR9714182A true BR9714182A (pt) 2000-02-29

Family

ID=7816233

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9714182-8A BR9714182A (pt) 1996-12-24 1997-12-18 Componente para contatos de um medidor e procedimento para a respectiva fabricação

Country Status (7)

Country Link
US (1) US6224389B1 (pt)
EP (1) EP0950271B1 (pt)
AU (1) AU732496B2 (pt)
BR (1) BR9714182A (pt)
DE (2) DE19654382A1 (pt)
ES (1) ES2175526T3 (pt)
WO (1) WO1998028819A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10017774B4 (de) * 2000-04-10 2005-03-10 Epcos Ag Befestigungsplatte, Befestigungsanordnung mit der Befestigungsplatte und Verwendung der Befestigungsplatte
DE10163574C2 (de) * 2001-12-21 2003-11-20 Siemens Ag Kontaktvorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE820915C (de) * 1948-04-16 1951-11-15 Robert Kapp Verfahren zur Herstellung von vielteiligen elektrischen und radio-elektrischen Apparaten
DE1095403B (de) * 1959-02-17 1960-12-22 Nordmende Anordnung zur Abschirmung einer Roehre in gedruckten Schaltungen
US4097101A (en) * 1976-11-22 1978-06-27 Augat Inc. Electrical interconnection boards with lead sockets mounted therein and method for making same
US4894018A (en) * 1988-08-08 1990-01-16 General Motors Corporation Low profile electrical connector
US4934943A (en) * 1989-05-12 1990-06-19 Acustar, Inc. Automated connector alignment assembly for connection of printed circuit boards
DE4039625A1 (de) 1990-12-12 1992-06-17 Vdo Schindling Kontakthuelse fuer ein messwerk
US5096440A (en) * 1991-05-10 1992-03-17 Kel Corporation Surface mount connector with circuit board retaining plate
DE4240454A1 (de) 1992-12-02 1994-06-09 Vdo Schindling Elektrische Verbindung bei einem Kombinations-Instrument

Also Published As

Publication number Publication date
EP0950271A1 (de) 1999-10-20
AU732496B2 (en) 2001-04-26
ES2175526T3 (es) 2002-11-16
DE59706911D1 (de) 2002-05-08
EP0950271B1 (de) 2002-04-03
WO1998028819A1 (de) 1998-07-02
US6224389B1 (en) 2001-05-01
DE19654382A1 (de) 1998-06-25
AU6206098A (en) 1998-07-17

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time
B15K Others concerning applications: alteration of classification

Ipc: H01R 12/58 (2011.01), G01R 1/073 (2006.0