BR9605389A - Banho eletrônico alcalino e processo para eletrodeposição de cu zn ou ni assim como de suas ligas - Google Patents
Banho eletrônico alcalino e processo para eletrodeposição de cu zn ou ni assim como de suas ligasInfo
- Publication number
- BR9605389A BR9605389A BR9605389A BR9605389A BR9605389A BR 9605389 A BR9605389 A BR 9605389A BR 9605389 A BR9605389 A BR 9605389A BR 9605389 A BR9605389 A BR 9605389A BR 9605389 A BR9605389 A BR 9605389A
- Authority
- BR
- Brazil
- Prior art keywords
- electrodeposition
- alloys
- well
- electronic bath
- alkaline
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9605389A BR9605389A (pt) | 1996-10-31 | 1996-10-31 | Banho eletrônico alcalino e processo para eletrodeposição de cu zn ou ni assim como de suas ligas |
BR9705186A BR9705186A (pt) | 1996-10-31 | 1997-10-30 | Banho eletrolìtico alcalino e processo para eletrodeposição de cu,zn ou ni, assim como de suas ligas |
PCT/BR1997/000062 WO1998018982A1 (en) | 1996-10-31 | 1997-10-31 | AN ALKALINE ELECTROLYTIC BATH AND A PROCESS FOR ELECTRODEPOSITION OF Cu, Zn, OR Ni, AS WELL AS THEIR ALLOYS |
AU50429/98A AU5042998A (en) | 1996-10-31 | 1997-10-31 | An alkaline electrolytic bath and a process for electrodeposition of cu, zn, or ni, as well as their alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9605389A BR9605389A (pt) | 1996-10-31 | 1996-10-31 | Banho eletrônico alcalino e processo para eletrodeposição de cu zn ou ni assim como de suas ligas |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9605389A true BR9605389A (pt) | 1998-07-28 |
Family
ID=4065660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9605389A BR9605389A (pt) | 1996-10-31 | 1996-10-31 | Banho eletrônico alcalino e processo para eletrodeposição de cu zn ou ni assim como de suas ligas |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5042998A (pt) |
BR (1) | BR9605389A (pt) |
WO (1) | WO1998018982A1 (pt) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6773573B2 (en) | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
CN102127783A (zh) * | 2011-01-25 | 2011-07-20 | 九星控股集团有限公司 | 一种在铝表面制备铜基微晶涂层的方法 |
DE102019107416A1 (de) * | 2019-03-22 | 2020-09-24 | RIAG Oberflächentechnik AG | Zusammensetzung zur elektrolytischen Vernickelung und Verfahren zur elektrolytischen Vernickelung mit einer solchen Zusammensetzung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5910999B2 (ja) * | 1980-06-30 | 1984-03-13 | キザイ株式会社 | 錫−鉛合金電気めつき液 |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5538617A (en) * | 1995-03-08 | 1996-07-23 | Bethlehem Steel Corporation | Ferrocyanide-free halogen tin plating process and bath |
-
1996
- 1996-10-31 BR BR9605389A patent/BR9605389A/pt not_active Application Discontinuation
-
1997
- 1997-10-31 AU AU50429/98A patent/AU5042998A/en not_active Abandoned
- 1997-10-31 WO PCT/BR1997/000062 patent/WO1998018982A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
AU5042998A (en) | 1998-05-22 |
WO1998018982A1 (en) | 1998-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA15 | Dismissal: dismissal - article 17, par. 2 of industrial property law |