BR9603596A - Process for implanting an electronic element in a face of an electronic card body made of thermoplastic material, notably a microcircuit and electronic card body - Google Patents

Process for implanting an electronic element in a face of an electronic card body made of thermoplastic material, notably a microcircuit and electronic card body

Info

Publication number
BR9603596A
BR9603596A BR9603596A BR9603596A BR9603596A BR 9603596 A BR9603596 A BR 9603596A BR 9603596 A BR9603596 A BR 9603596A BR 9603596 A BR9603596 A BR 9603596A BR 9603596 A BR9603596 A BR 9603596A
Authority
BR
Brazil
Prior art keywords
card body
electronic card
electronic
microcircuit
implanting
Prior art date
Application number
BR9603596A
Other languages
Portuguese (pt)
Inventor
Benoit Thevenot
Original Assignee
Solaic Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic Sa filed Critical Solaic Sa
Publication of BR9603596A publication Critical patent/BR9603596A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
BR9603596A 1995-02-24 1996-01-09 Process for implanting an electronic element in a face of an electronic card body made of thermoplastic material, notably a microcircuit and electronic card body BR9603596A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9502177A FR2731132B1 (en) 1995-02-24 1995-02-24 METHOD FOR IMPLANTING AN ELECTRONIC ELEMENT, IN PARTICULAR A MICROCIRCUIT, INTO AN ELECTRONIC CARD BODY, AND ELECTRONIC CARD BODY COMPRISING AN ELECTRONIC ELEMENT THUS IMPLANTED
PCT/FR1996/000035 WO1996026501A1 (en) 1995-02-24 1996-01-09 Method for embedding a microcircuit in the body of an electronic card

Publications (1)

Publication Number Publication Date
BR9603596A true BR9603596A (en) 1999-06-15

Family

ID=9476477

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9603596A BR9603596A (en) 1995-02-24 1996-01-09 Process for implanting an electronic element in a face of an electronic card body made of thermoplastic material, notably a microcircuit and electronic card body

Country Status (5)

Country Link
AR (1) AR001013A1 (en)
AU (1) AU4491996A (en)
BR (1) BR9603596A (en)
FR (1) FR2731132B1 (en)
WO (1) WO1996026501A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304777B4 (en) * 2003-02-05 2006-11-23 Infineon Technologies Ag Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
BE1002529A6 (en) * 1988-09-27 1991-03-12 Bell Telephone Mfg Method for an electronic component assembly and memory card in which it is applied.
FR2686996B1 (en) * 1992-01-31 1996-02-02 Solaic Sa METHOD FOR MANUFACTURING A MEMORY CARD COMPRISING A MICROMODULE EQUIPPED WITH A COVER, AND MEMORY CARD THUS OBTAINED.
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.

Also Published As

Publication number Publication date
FR2731132A1 (en) 1996-08-30
FR2731132B1 (en) 1997-04-04
WO1996026501A1 (en) 1996-08-29
AU4491996A (en) 1996-09-11
AR001013A1 (en) 1997-08-27

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law