AR001013A1 - METHOD FOR IMPLEMENTING AN ELECTRONIC ELEMENT IN AN ELECTRONIC CARD BODY AND BODIES OF ELECTRONIC CARDS THAT INCLUDE IT. - Google Patents

METHOD FOR IMPLEMENTING AN ELECTRONIC ELEMENT IN AN ELECTRONIC CARD BODY AND BODIES OF ELECTRONIC CARDS THAT INCLUDE IT.

Info

Publication number
AR001013A1
AR001013A1 AR10149196A AR10149196A AR001013A1 AR 001013 A1 AR001013 A1 AR 001013A1 AR 10149196 A AR10149196 A AR 10149196A AR 10149196 A AR10149196 A AR 10149196A AR 001013 A1 AR001013 A1 AR 001013A1
Authority
AR
Argentina
Prior art keywords
electronic
card body
electronic element
card
implementing
Prior art date
Application number
AR10149196A
Other languages
Spanish (es)
Original Assignee
Solaic Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic Sa filed Critical Solaic Sa
Publication of AR001013A1 publication Critical patent/AR001013A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

El método de la invención permite que el elemento electrónico (3), especialmente un microcircuito provisto de lengüetas de contacto (4) en una desus caras, puede ser implantado en una cara (1) de un cuerpo de tarjeta electrónica hecha en material termoplástico. El método comprende un pasoconsistente en calentar el cuerpo de la tarjeta como mínimo en una zona de implante destinada a recibir el elemento electrónico, de modo de ablandar elmaterial termoplástico ablandado, la cara provista con lengüetas de contacto está situada sobre el lado opuesto al cuerpo de la tarjeta. El método secaracteriza porque comprende un paso preliminar consistente en posicionar, en las lengüetas de contacto (4) del elemento electrónico (3), pastillas (5) dematerial conductor, todas ellas de la misma o casi la misma altura, y porque el paso de embutido consiste en ejercer una presión apropiada sobre laspastillas (5) hasta que sus extremos libres están al ras con la cara deimplante (1) del cuerpo de la tarjeta.The method of the invention allows the electronic element (3), especially a microcircuit provided with contact tabs (4) on one of its faces, to be implanted in one side (1) of an electronic card body made of thermoplastic material. The method comprises a step consisting of heating the card body at least in an implant area intended to receive the electronic element, so as to soften the softened thermoplastic material, the face provided with contact tabs is located on the side opposite the body of the card. the card. The method is characterized in that it comprises a preliminary step consisting of positioning, on the contact lugs (4) of the electronic element (3), tablets (5) of conductive material, all of them of the same or almost the same height, and because the passage of Sausage consists of exerting appropriate pressure on the pads (5) until their free ends are flush with the implant face (1) of the card body.

AR10149196A 1995-02-24 1996-02-23 METHOD FOR IMPLEMENTING AN ELECTRONIC ELEMENT IN AN ELECTRONIC CARD BODY AND BODIES OF ELECTRONIC CARDS THAT INCLUDE IT. AR001013A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9502177A FR2731132B1 (en) 1995-02-24 1995-02-24 METHOD FOR IMPLANTING AN ELECTRONIC ELEMENT, IN PARTICULAR A MICROCIRCUIT, INTO AN ELECTRONIC CARD BODY, AND ELECTRONIC CARD BODY COMPRISING AN ELECTRONIC ELEMENT THUS IMPLANTED

Publications (1)

Publication Number Publication Date
AR001013A1 true AR001013A1 (en) 1997-08-27

Family

ID=9476477

Family Applications (1)

Application Number Title Priority Date Filing Date
AR10149196A AR001013A1 (en) 1995-02-24 1996-02-23 METHOD FOR IMPLEMENTING AN ELECTRONIC ELEMENT IN AN ELECTRONIC CARD BODY AND BODIES OF ELECTRONIC CARDS THAT INCLUDE IT.

Country Status (5)

Country Link
AR (1) AR001013A1 (en)
AU (1) AU4491996A (en)
BR (1) BR9603596A (en)
FR (1) FR2731132B1 (en)
WO (1) WO1996026501A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304777B4 (en) * 2003-02-05 2006-11-23 Infineon Technologies Ag Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0128822B1 (en) * 1983-06-09 1987-09-09 Flonic S.A. Method of producing memory cards, and cards obtained thereby
BE1002529A6 (en) * 1988-09-27 1991-03-12 Bell Telephone Mfg Method for an electronic component assembly and memory card in which it is applied.
FR2686996B1 (en) * 1992-01-31 1996-02-02 Solaic Sa METHOD FOR MANUFACTURING A MEMORY CARD COMPRISING A MICROMODULE EQUIPPED WITH A COVER, AND MEMORY CARD THUS OBTAINED.
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.

Also Published As

Publication number Publication date
FR2731132A1 (en) 1996-08-30
AU4491996A (en) 1996-09-11
WO1996026501A1 (en) 1996-08-29
BR9603596A (en) 1999-06-15
FR2731132B1 (en) 1997-04-04

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