BR8700718A - PROCESS TO OBTAIN THE ELECTRIC AND MECHANICAL DIAPHRAGM AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES MADE BY THIS PROCESS - Google Patents
PROCESS TO OBTAIN THE ELECTRIC AND MECHANICAL DIAPHRAGM AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES MADE BY THIS PROCESSInfo
- Publication number
- BR8700718A BR8700718A BR8700718A BR8700718A BR8700718A BR 8700718 A BR8700718 A BR 8700718A BR 8700718 A BR8700718 A BR 8700718A BR 8700718 A BR8700718 A BR 8700718A BR 8700718 A BR8700718 A BR 8700718A
- Authority
- BR
- Brazil
- Prior art keywords
- electric
- support
- pressure sensor
- thick film
- film pressure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT67095/86A IT1203535B (en) | 1986-02-10 | 1986-02-10 | PROCEDURE FOR THE REALIZATION OF THE MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO BODIES IN PARTICULAR BETWEEN THE MEMBRANE AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES REALIZED WITH SUCH PROCEDURE |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8700718A true BR8700718A (en) | 1987-12-08 |
Family
ID=11299527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8700718A BR8700718A (en) | 1986-02-10 | 1987-02-10 | PROCESS TO OBTAIN THE ELECTRIC AND MECHANICAL DIAPHRAGM AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES MADE BY THIS PROCESS |
Country Status (12)
Country | Link |
---|---|
US (1) | US4771261A (en) |
JP (2) | JPS62190627A (en) |
BE (1) | BE1001888A3 (en) |
BR (1) | BR8700718A (en) |
CH (1) | CH670000A5 (en) |
DE (1) | DE3703925C2 (en) |
ES (1) | ES2004369A6 (en) |
FR (1) | FR2594286B1 (en) |
GB (1) | GB2186438B (en) |
IT (1) | IT1203535B (en) |
NL (1) | NL8700311A (en) |
PT (1) | PT84261B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5436795A (en) * | 1994-03-28 | 1995-07-25 | Texas Instruments Incorporated | Pressure transducer apparatus and method for making same |
FR2738705B1 (en) * | 1995-09-07 | 1997-11-07 | Sagem | ELECTROMECHANICAL SENSOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE |
AU2059597A (en) * | 1996-02-28 | 1997-09-16 | Sigma-Netics, Inc. | Improved strain gauge and method of manufacture |
DE19708325B4 (en) * | 1997-03-03 | 2007-06-14 | Sokymat Gmbh | Adhesive bond of electrically conductive parts |
US7151431B2 (en) * | 2001-02-16 | 2006-12-19 | Elantech Devices Corporation | Resistor element, stress sensor and method for manufacturing them |
DE102006031344A1 (en) | 2006-07-06 | 2008-01-10 | Epcos Ag | Electric component with a sensor element, method for encapsulating a sensor element and method for producing a plate assembly |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1403371A (en) * | 1972-01-12 | 1975-08-28 | Mullard Ltd | Semiconductor device arrangements |
JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
JPS5550131A (en) * | 1978-10-06 | 1980-04-11 | Hitachi Ltd | Electronic transmitter |
JPS574531A (en) * | 1980-06-10 | 1982-01-11 | Matsushita Electric Ind Co Ltd | Manufacture of electrostatic capacity type pressure sensor |
US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
JPS58162099A (en) * | 1982-03-23 | 1983-09-26 | 日本電信電話株式会社 | Method of producing multilayer printed circuit board |
FR2541828B1 (en) * | 1983-02-28 | 1985-09-13 | Inf Milit Spatiale Aeronaut | DEVICE FOR ELECTRICALLY CONNECTING BETWEEN TWO PRINTED CIRCUIT BOARDS AND METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS USING SUCH A DEVICE |
DE3316017A1 (en) * | 1983-05-03 | 1984-11-08 | Siegert GmbH, 8501 Cadolzburg | Method of making electrical connections in multisubstrate circuits, and multisubstrate circuits produced thereby |
JPS6033308A (en) * | 1983-08-04 | 1985-02-20 | Nippon Soda Co Ltd | Steel modifier |
GB8322473D0 (en) * | 1983-08-20 | 1983-09-21 | Int Computers Ltd | Printed circuit boards |
GB8403968D0 (en) * | 1984-02-15 | 1984-03-21 | Heraeus Gmbh W C | Chip resistors |
US4670733A (en) * | 1985-07-01 | 1987-06-02 | Bell Microsensors, Inc. | Differential pressure transducer |
-
1986
- 1986-02-10 IT IT67095/86A patent/IT1203535B/en active
-
1987
- 1987-02-02 GB GB08702241A patent/GB2186438B/en not_active Expired
- 1987-02-03 CH CH382/87A patent/CH670000A5/it not_active IP Right Cessation
- 1987-02-05 JP JP62025558A patent/JPS62190627A/en active Pending
- 1987-02-09 ES ES8700301A patent/ES2004369A6/en not_active Expired
- 1987-02-09 DE DE3703925A patent/DE3703925C2/en not_active Expired - Fee Related
- 1987-02-09 BE BE8700099A patent/BE1001888A3/en not_active IP Right Cessation
- 1987-02-09 FR FR878701548A patent/FR2594286B1/en not_active Expired - Lifetime
- 1987-02-10 US US07/013,099 patent/US4771261A/en not_active Expired - Fee Related
- 1987-02-10 NL NL8700311A patent/NL8700311A/en unknown
- 1987-02-10 PT PT84261A patent/PT84261B/en not_active IP Right Cessation
- 1987-02-10 BR BR8700718A patent/BR8700718A/en not_active IP Right Cessation
-
1996
- 1996-09-03 JP JP008894U patent/JPH09346U/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CH670000A5 (en) | 1989-04-28 |
FR2594286B1 (en) | 1991-09-13 |
GB2186438B (en) | 1989-02-01 |
IT8667095A0 (en) | 1986-02-10 |
NL8700311A (en) | 1987-09-01 |
GB2186438A (en) | 1987-08-12 |
DE3703925C2 (en) | 1998-12-10 |
US4771261A (en) | 1988-09-13 |
BE1001888A3 (en) | 1990-04-10 |
PT84261B (en) | 1989-09-14 |
DE3703925A1 (en) | 1987-08-13 |
JPS62190627A (en) | 1987-08-20 |
ES2004369A6 (en) | 1989-01-01 |
PT84261A (en) | 1987-03-01 |
IT1203535B (en) | 1989-02-15 |
JPH09346U (en) | 1997-06-10 |
GB8702241D0 (en) | 1987-03-11 |
FR2594286A1 (en) | 1987-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B21A | Patent or certificate of addition expired [chapter 21.1 patent gazette] |
Free format text: PATENTE EXTINTA EM 10/02/2002 |