BR7702277A - Processo para o apassivamento de elementos semi-condutores de juncao que sao parte de uma porcao de material semi-condutor;e dispositivo semi-condutor - Google Patents

Processo para o apassivamento de elementos semi-condutores de juncao que sao parte de uma porcao de material semi-condutor;e dispositivo semi-condutor

Info

Publication number
BR7702277A
BR7702277A BR7702277A BR7702277A BR7702277A BR 7702277 A BR7702277 A BR 7702277A BR 7702277 A BR7702277 A BR 7702277A BR 7702277 A BR7702277 A BR 7702277A BR 7702277 A BR7702277 A BR 7702277A
Authority
BR
Brazil
Prior art keywords
semi
passion
conductor
conductive junction
junction elements
Prior art date
Application number
BR7702277A
Other languages
English (en)
Portuguese (pt)
Inventor
L Gandolfi
R Rocak
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Publication of BR7702277A publication Critical patent/BR7702277A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body
BR7702277A 1976-04-14 1977-04-12 Processo para o apassivamento de elementos semi-condutores de juncao que sao parte de uma porcao de material semi-condutor;e dispositivo semi-condutor BR7702277A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT22280/76A IT1059086B (it) 1976-04-14 1976-04-14 Procedimento per la passivazione di dispositivi a semiconduttore di potenza ad alta tensione inversa

Publications (1)

Publication Number Publication Date
BR7702277A true BR7702277A (pt) 1977-12-20

Family

ID=11194095

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7702277A BR7702277A (pt) 1976-04-14 1977-04-12 Processo para o apassivamento de elementos semi-condutores de juncao que sao parte de uma porcao de material semi-condutor;e dispositivo semi-condutor

Country Status (7)

Country Link
US (1) US4126931A (OSRAM)
JP (1) JPS6026296B2 (OSRAM)
BR (1) BR7702277A (OSRAM)
DE (1) DE2716419A1 (OSRAM)
FR (1) FR2348573A1 (OSRAM)
GB (1) GB1569931A (OSRAM)
IT (1) IT1059086B (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54106599A (en) * 1978-02-09 1979-08-21 Hitachi Chem Co Ltd Preparation of polyamide intermediate for semiconductor processing
SE8306663L (sv) * 1982-12-08 1984-06-09 Int Rectifier Corp Forfarande for framstellning av halvledaranordning
JPH0716077B2 (ja) * 1985-10-11 1995-02-22 三菱電機株式会社 半導体レーザ装置の製造方法
US6025268A (en) * 1996-06-26 2000-02-15 Advanced Micro Devices, Inc. Method of etching conductive lines through an etch resistant photoresist mask
TW554639B (en) * 2002-10-04 2003-09-21 Au Optronics Corp Method for fabricating an OLED device and the solid passivation
WO2012122415A2 (en) * 2011-03-08 2012-09-13 Lorillard Tobacco Company Phase transition compositions used to impart reduced ignition propensity to smoking articles
GB2558147B (en) 2015-11-05 2020-11-11 Abb Schweiz Ag Power semiconductor device and method for producing a power semiconductor device
JP6903375B2 (ja) * 2017-04-19 2021-07-14 株式会社ディスコ デバイスチップの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375419A (en) * 1965-02-25 1968-03-26 Union Carbide Corp Field effect transistor with poly-p-xylylene insulated gate structure and method
US3432919A (en) * 1966-10-31 1969-03-18 Raytheon Co Method of making semiconductor diodes
GB1261378A (en) * 1968-07-08 1972-01-26 Internat Rectifier Company Gre Improvements relating to the encapsulation of semiconductor devices and other electrical components
GB1285708A (en) * 1968-10-28 1972-08-16 Lucas Industries Ltd Semi-conductor devices
US3895429A (en) * 1974-05-09 1975-07-22 Rca Corp Method of making a semiconductor device
US4037306A (en) * 1975-10-02 1977-07-26 Motorola, Inc. Integrated circuit and method

Also Published As

Publication number Publication date
FR2348573A1 (fr) 1977-11-10
US4126931A (en) 1978-11-28
FR2348573B1 (OSRAM) 1982-08-13
GB1569931A (en) 1980-06-25
JPS6026296B2 (ja) 1985-06-22
DE2716419A1 (de) 1977-11-03
IT1059086B (it) 1982-05-31
JPS52144968A (en) 1977-12-02

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