BR7502672A - Processo aperfeicoado para estabilizar temporariamente componentes eletricos e eletronicos; dispositivo aperfeicoado para soldagem em massa de componentes eletricos e eletronicos; painel de circuitos aperfeicoado; composicao aperfeicoado compativel com solda e processo aperfeicoado para preservar um painel de circuito impresso, de oxidacao - Google Patents

Processo aperfeicoado para estabilizar temporariamente componentes eletricos e eletronicos; dispositivo aperfeicoado para soldagem em massa de componentes eletricos e eletronicos; painel de circuitos aperfeicoado; composicao aperfeicoado compativel com solda e processo aperfeicoado para preservar um painel de circuito impresso, de oxidacao

Info

Publication number
BR7502672A
BR7502672A BR3399/75A BR7503399A BR7502672A BR 7502672 A BR7502672 A BR 7502672A BR 3399/75 A BR3399/75 A BR 3399/75A BR 7503399 A BR7503399 A BR 7503399A BR 7502672 A BR7502672 A BR 7502672A
Authority
BR
Brazil
Prior art keywords
perfect
electronic components
welding
circuit panel
electrical
Prior art date
Application number
BR3399/75A
Other languages
English (en)
Portuguese (pt)
Inventor
K Boyton
Original Assignee
Hollis Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/469,536 external-priority patent/US3973322A/en
Priority claimed from US05/555,271 external-priority patent/US3966110A/en
Application filed by Hollis Engineering filed Critical Hollis Engineering
Publication of BR7502672A publication Critical patent/BR7502672A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
BR3399/75A 1974-05-13 1975-05-02 Processo aperfeicoado para estabilizar temporariamente componentes eletricos e eletronicos; dispositivo aperfeicoado para soldagem em massa de componentes eletricos e eletronicos; painel de circuitos aperfeicoado; composicao aperfeicoado compativel com solda e processo aperfeicoado para preservar um painel de circuito impresso, de oxidacao BR7502672A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US05/469,536 US3973322A (en) 1974-05-13 1974-05-13 Mass soldering system and method
US05/508,052 US4127692A (en) 1974-05-13 1974-09-23 Jig for mass soldering system
US05/555,271 US3966110A (en) 1974-09-23 1975-03-11 Stabilizer system with ultrasonic soldering

Publications (1)

Publication Number Publication Date
BR7502672A true BR7502672A (pt) 1976-03-23

Family

ID=27413104

Family Applications (1)

Application Number Title Priority Date Filing Date
BR3399/75A BR7502672A (pt) 1974-05-13 1975-05-02 Processo aperfeicoado para estabilizar temporariamente componentes eletricos e eletronicos; dispositivo aperfeicoado para soldagem em massa de componentes eletricos e eletronicos; painel de circuitos aperfeicoado; composicao aperfeicoado compativel com solda e processo aperfeicoado para preservar um painel de circuito impresso, de oxidacao

Country Status (11)

Country Link
JP (1) JPS50153273A (https=)
AR (1) AR209440A1 (https=)
AU (1) AU505736B2 (https=)
BR (1) BR7502672A (https=)
CA (1) CA1046353A (https=)
DE (1) DE2520124A1 (https=)
ES (1) ES437449A1 (https=)
FR (1) FR2271742B1 (https=)
GB (1) GB1508676A (https=)
IT (1) IT1035609B (https=)
NL (1) NL7505222A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523164A (en) * 1975-06-27 1977-01-11 Aiwa Co Method of securing electric components printed circuit board
JPS5392468A (en) * 1977-01-25 1978-08-14 Kondo Kenji Method of soldering printed circuit board
JPS54769A (en) * 1977-06-03 1979-01-06 Fujitsu Ltd Semiautomatic soldering system for print board
JPS54111675A (en) * 1978-02-22 1979-09-01 Fujitsu Ltd Soldering method of printed board
US10374645B2 (en) 2015-04-20 2019-08-06 Interdigital Ce Patent Holdings Holding slot for electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2333661A1 (de) * 1973-07-02 1975-01-23 Schmaltz Gmbh Friedr Kurbelwellenschleifmaschine

Also Published As

Publication number Publication date
FR2271742A1 (https=) 1975-12-12
IT1035609B (it) 1979-10-20
FR2271742B1 (https=) 1980-10-31
NL7505222A (nl) 1975-11-17
JPS50153273A (https=) 1975-12-10
AR209440A1 (es) 1977-04-29
AU505736B2 (en) 1979-11-29
GB1508676A (en) 1978-04-26
DE2520124A1 (de) 1975-11-27
AU8021275A (en) 1976-10-21
ES437449A1 (es) 1980-05-16
CA1046353A (en) 1979-01-16

Similar Documents

Publication Publication Date Title
BR7607463A (pt) Conjunto de paineis de circuito impresso
GB1521782A (en) Printed circuit board electrical component mounting method and apparatus
GB1544488A (en) Voltage multiplier for an electronic time apparatus
CA1002391A (en) Wave-soldering of printed circuits
JPS51115655A (en) Device for inserting printed substrate for electric parts
IT1063717B (it) Circuito fet perfezionato
IT1074003B (it) Pannello perfezionato per penna elettronica
BR7502672A (pt) Processo aperfeicoado para estabilizar temporariamente componentes eletricos e eletronicos; dispositivo aperfeicoado para soldagem em massa de componentes eletricos e eletronicos; painel de circuitos aperfeicoado; composicao aperfeicoado compativel com solda e processo aperfeicoado para preservar um painel de circuito impresso, de oxidacao
IT1064306B (it) Circuito oscillatore perfezionato
IL50642A0 (en) Mechanism for soldering electronic component leads to conductors
FR2289052A1 (fr) Dispositif sous forme de circuit imprime pour symetriseur a large bande
JPS52114971A (en) Device for mounting lead electronic parts to printed circuit substrate
AU1179976A (en) Printed circuit boards
SU577706A1 (ru) Устройство дл лужени печатных плат
JPS5383948A (en) Method of soldering print wiring plate and its device
BR7607515A (pt) Aperfeicoamento em relogio eletronico
AR212420A1 (es) Circuito electronico para grabadora electronica de estenciles
JPS523164A (en) Method of securing electric components printed circuit board
CA1035845A (en) Supporting device for printed circuit boards
BR7409884A (pt) Conjunto de cabecote para montagem de componentes eletricos em um painel de circuito impresso
BR7607511A (pt) Aperfeicoamento em relogio eletronico
AR212422A1 (es) Disposicion de circuito para grabadoras electronicas de estenciles
CA958041A (en) Method and apparatus for clamping electrical components to a printed circuit board
BR7604334A (pt) Circuito eletronico aperfeicoado para controle remoto
BR7607516A (pt) Aperfeicoamento em relogio eletronico