BR7408264D0 - Processo aperfeicoado para a aplicacao seletiva de revestimento de metal sobre os componentes metalicos que atravessam um corpo isolante de elementos eletricos - Google Patents

Processo aperfeicoado para a aplicacao seletiva de revestimento de metal sobre os componentes metalicos que atravessam um corpo isolante de elementos eletricos

Info

Publication number
BR7408264D0
BR7408264D0 BR8264/74A BR826474A BR7408264D0 BR 7408264 D0 BR7408264 D0 BR 7408264D0 BR 8264/74 A BR8264/74 A BR 8264/74A BR 826474 A BR826474 A BR 826474A BR 7408264 D0 BR7408264 D0 BR 7408264D0
Authority
BR
Brazil
Prior art keywords
insulating body
metal coating
electrical elements
metallic components
selective application
Prior art date
Application number
BR8264/74A
Other languages
English (en)
Inventor
F Noz
Original Assignee
Galentan Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galentan Ag filed Critical Galentan Ag
Publication of BR7408264D0 publication Critical patent/BR7408264D0/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
BR8264/74A 1973-10-04 1974-10-04 Processo aperfeicoado para a aplicacao seletiva de revestimento de metal sobre os componentes metalicos que atravessam um corpo isolante de elementos eletricos BR7408264D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1421373 1973-10-04

Publications (1)

Publication Number Publication Date
BR7408264D0 true BR7408264D0 (pt) 1975-07-22

Family

ID=4398898

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8264/74A BR7408264D0 (pt) 1973-10-04 1974-10-04 Processo aperfeicoado para a aplicacao seletiva de revestimento de metal sobre os componentes metalicos que atravessam um corpo isolante de elementos eletricos

Country Status (6)

Country Link
US (1) US4007097A (pt)
JP (1) JPS5652120B2 (pt)
BR (1) BR7408264D0 (pt)
DE (1) DE2447092A1 (pt)
FR (1) FR2246658B3 (pt)
NL (1) NL7316245A (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4032422A (en) * 1975-10-03 1977-06-28 National Semiconductor Corporation Apparatus for plating semiconductor chip headers
US4302316A (en) * 1980-05-07 1981-11-24 The Perkin-Elmer Corporation Non-contacting technique for electroplating X-ray lithography
EP0121616A1 (en) * 1983-04-06 1984-10-17 S.G. Owen Limited A method of, and a machine for, electroplating
JPS62136596A (ja) * 1985-12-09 1987-06-19 Fuji Photo Film Co Ltd 金属ウエブへの連続電解処理装置
JP3308333B2 (ja) * 1993-03-30 2002-07-29 三菱電機株式会社 電解メッキ装置，及び電解メッキ処理方法
US6452406B1 (en) * 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US5397598A (en) * 1993-11-12 1995-03-14 International Business Machines Corporation Method for selectively coating a member having a shank by masking a portion of the shank with a washer
TWI460305B (zh) * 2010-11-30 2014-11-11 Ind Tech Res Inst 化學水浴法鍍膜設備

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3304244A (en) * 1963-10-30 1967-02-14 American Optical Corp Method of sealing fiber optic plates
GB1098182A (en) * 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
US3419480A (en) * 1965-03-12 1968-12-31 Westinghouse Electric Corp Anodic oxidation
US3506887A (en) * 1966-02-23 1970-04-14 Motorola Inc Semiconductor device and method of making same
JPS4831456B1 (pt) * 1970-03-03 1973-09-29
JPS472003U (pt) * 1971-01-23 1972-08-23

Also Published As

Publication number Publication date
FR2246658B3 (pt) 1977-07-15
DE2447092A1 (de) 1975-04-10
US4007097A (en) 1977-02-08
FR2246658A1 (pt) 1975-05-02
NL7316245A (nl) 1975-04-08
JPS5077231A (pt) 1975-06-24
JPS5652120B2 (pt) 1981-12-10

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