BR6898979D0 - Aperfeicoamentos em ou relativos a dispositivos semicondutores e a processos para sua fabricacao - Google Patents

Aperfeicoamentos em ou relativos a dispositivos semicondutores e a processos para sua fabricacao

Info

Publication number
BR6898979D0
BR6898979D0 BR198979/68A BR19897968A BR6898979D0 BR 6898979 D0 BR6898979 D0 BR 6898979D0 BR 198979/68 A BR198979/68 A BR 198979/68A BR 19897968 A BR19897968 A BR 19897968A BR 6898979 D0 BR6898979 D0 BR 6898979D0
Authority
BR
Brazil
Prior art keywords
relating
manufacture
processes
semiconductor devices
semiconductor
Prior art date
Application number
BR198979/68A
Other languages
English (en)
Portuguese (pt)
Inventor
Lersel A Van
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6706641A external-priority patent/NL6706641A/xx
Application filed by Philips Nv filed Critical Philips Nv
Publication of BR6898979D0 publication Critical patent/BR6898979D0/pt

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
BR198979/68A 1967-05-12 1968-05-10 Aperfeicoamentos em ou relativos a dispositivos semicondutores e a processos para sua fabricacao BR6898979D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6706641A NL6706641A (https=) 1966-11-07 1967-05-12

Publications (1)

Publication Number Publication Date
BR6898979D0 true BR6898979D0 (pt) 1973-02-27

Family

ID=19800103

Family Applications (1)

Application Number Title Priority Date Filing Date
BR198979/68A BR6898979D0 (pt) 1967-05-12 1968-05-10 Aperfeicoamentos em ou relativos a dispositivos semicondutores e a processos para sua fabricacao

Country Status (3)

Country Link
BR (1) BR6898979D0 (https=)
DK (1) DK124293B (https=)
SE (1) SE327466B (https=)

Also Published As

Publication number Publication date
SE327466B (https=) 1970-08-24
DK124293B (da) 1972-10-02

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