BR6677512D0 - Processo para a preparacao de uma liga a base de cobre e liga obtida pela aplicacao do mesmo - Google Patents

Processo para a preparacao de uma liga a base de cobre e liga obtida pela aplicacao do mesmo

Info

Publication number
BR6677512D0
BR6677512D0 BR177512/66A BR17751266A BR6677512D0 BR 6677512 D0 BR6677512 D0 BR 6677512D0 BR 177512/66 A BR177512/66 A BR 177512/66A BR 17751266 A BR17751266 A BR 17751266A BR 6677512 D0 BR6677512 D0 BR 6677512D0
Authority
BR
Brazil
Prior art keywords
alloy
copper
preparation
application
same
Prior art date
Application number
BR177512/66A
Other languages
English (en)
Portuguese (pt)
Inventor
E Caule
M Pryor
P Sperry
Original Assignee
Olin Mathieson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Mathieson filed Critical Olin Mathieson
Publication of BR6677512D0 publication Critical patent/BR6677512D0/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
    • C23C8/10—Oxidising
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
BR177512/66A 1965-03-03 1966-03-03 Processo para a preparacao de uma liga a base de cobre e liga obtida pela aplicacao do mesmo BR6677512D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US436746A US3341369A (en) 1965-03-03 1965-03-03 Copper base alloys and process for preparing same

Publications (1)

Publication Number Publication Date
BR6677512D0 true BR6677512D0 (pt) 1973-05-31

Family

ID=23733663

Family Applications (1)

Application Number Title Priority Date Filing Date
BR177512/66A BR6677512D0 (pt) 1965-03-03 1966-03-03 Processo para a preparacao de uma liga a base de cobre e liga obtida pela aplicacao do mesmo

Country Status (8)

Country Link
US (1) US3341369A (xx)
BE (1) BE698501A (xx)
BR (1) BR6677512D0 (xx)
CH (1) CH479707A (xx)
DE (1) DE1533342B1 (xx)
GB (1) GB1135313A (xx)
NL (1) NL6602702A (xx)
SE (1) SE314571B (xx)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475227A (en) * 1966-10-04 1969-10-28 Olin Mathieson Copper base alloys and process for preparing same
US4113475A (en) * 1976-04-09 1978-09-12 Kennecott Copper Corporation Tarnish resistant copper alloy
US4330599A (en) * 1980-06-09 1982-05-18 Olin Corporation Composite material
US4362262A (en) * 1980-06-09 1982-12-07 Olin Corporation Method of forming a composite material
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4500028A (en) * 1982-06-28 1985-02-19 Olin Corporation Method of forming a composite material having improved bond strength
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
GB2152082A (en) * 1983-12-27 1985-07-31 United Technologies Corp Enhancement of superalloy resistance to environmental degradation
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4769345A (en) * 1987-03-12 1988-09-06 Olin Corporation Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US4967260A (en) * 1988-05-04 1990-10-30 International Electronic Research Corp. Hermetic microminiature packages
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
EP0745146B1 (en) * 1994-02-17 2002-07-24 United Technologies Corporation Oxidation resistant coating for titanium alloys

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2192495A (en) * 1933-06-17 1940-03-05 Heraeus Vacuumschmelze Ag Beryllium-copper alloys
DE672170C (de) * 1933-06-18 1941-05-06 Heraeus Vacuumschmelze Akt Ges Verguetbare Beryllium-Kupfer-Legierungen
US2075002A (en) * 1933-08-03 1937-03-23 American Brass Co Copper-silicon-aluminum alloys
US2057003A (en) * 1934-10-17 1936-10-13 Bugher Clarence Concealed roofing nail
US2075003A (en) * 1936-07-30 1937-03-23 Daniel R Hull Copper-silicon-aluminum alloy
US2237774A (en) * 1940-07-23 1941-04-08 Chase Brass & Copper Co Treating silicon copper-base alloys
DE823351C (de) * 1943-09-08 1951-12-03 Ici Ltd Elektrischer Widerstandskoerper
DE833858C (de) * 1949-09-02 1952-03-13 Isabellen Huette Heusler Komm Kupfer-Silizium-Legierung
US3259491A (en) * 1963-05-21 1966-07-05 Olin Mathieson Copper base alloys and process for preparing same

Also Published As

Publication number Publication date
BE698501A (xx) 1967-11-03
CH479707A (de) 1969-10-15
DE1533342B1 (de) 1970-12-23
GB1135313A (en) 1968-12-04
US3341369A (en) 1967-09-12
SE314571B (xx) 1969-09-08
NL6602702A (xx) 1966-09-05

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