BR112023020110A2 - ACTIVE ELECTRONIC SCAN ARRANGEMENT - Google Patents

ACTIVE ELECTRONIC SCAN ARRANGEMENT

Info

Publication number
BR112023020110A2
BR112023020110A2 BR112023020110A BR112023020110A BR112023020110A2 BR 112023020110 A2 BR112023020110 A2 BR 112023020110A2 BR 112023020110 A BR112023020110 A BR 112023020110A BR 112023020110 A BR112023020110 A BR 112023020110A BR 112023020110 A2 BR112023020110 A2 BR 112023020110A2
Authority
BR
Brazil
Prior art keywords
thermal
trms
tim
height
pedestals
Prior art date
Application number
BR112023020110A
Other languages
Portuguese (pt)
Inventor
Bingqian Lu
Mohan Bhowmik Lal
Michael Buckley
Tom Walter
Rajan Komanduri Varada
Original Assignee
Hughes Network Systems Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/657,340 external-priority patent/US20220321239A1/en
Application filed by Hughes Network Systems Llc filed Critical Hughes Network Systems Llc
Publication of BR112023020110A2 publication Critical patent/BR112023020110A2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/24—Polarising devices; Polarisation filters 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

arranjo eletronicamente escaneado ativo. trata-se de um aesa (arranjo eletronicamente escaneado ativo), incluindo: um substrato pcb (placa de circuito impresso) com uma superfície anversa; trms (módulos de transmissão/recepção) dispostos na superfície anversa; pedestais térmicos em que cada pedestal térmico inclui uma parede, com uma altura de parede, incluindo superfícies de parede e uma das superfícies de parede sendo uma superfície de contato; e um tim (material de interface térmica), com uma altura tim, disposto entre uma superfície de contato respectiva dos pedestais térmicos e a superfície anversa. os pedestais térmicos são discretos em relação um ao outro, as superfícies de contato dos pedestais térmicos são intercaladas sobre os trms, os pedestais térmicos não entram em contato com os trms, o tim é eletricamente e termicamente condutor, e a altura da parede mais a altura de tim é suficiente para suprimir ressonâncias dos trms abaixo de uma frequência maior do que as bandas de frequência de tx e de rx dos trms.active electronically scanned array. it is an aesa (active electronically scanned array), including: a pcb (printed circuit board) substrate with an obverse surface; trms (transmission/reception modules) arranged on the obverse surface; thermal pedestals wherein each thermal pedestal includes a wall, with a wall height including wall surfaces and one of the wall surfaces being a contact surface; and a tim (thermal interface material), with a height tim, disposed between a respective contact surface of the thermal pedestals and the obverse surface. thermal pedestals are discrete with respect to each other, the contact surfaces of the thermal pedestals are interleaved over the trms, the thermal pedestals do not contact the trms, the tim is electrically and thermally conductive, and the height of the wall plus tim height is sufficient to suppress resonances of the trms below a frequency higher than the tx and rx frequency bands of the trms.

BR112023020110A 2021-04-01 2022-03-31 ACTIVE ELECTRONIC SCAN ARRANGEMENT BR112023020110A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163169770P 2021-04-01 2021-04-01
US202163266262P 2021-12-30 2021-12-30
US17/657,340 US20220321239A1 (en) 2021-04-01 2022-03-30 Cavity Resonance Suppression Using Discrete Thermal Pedestals in Active Electronically Scanned Array
PCT/US2022/071452 WO2022213096A1 (en) 2021-04-01 2022-03-31 Cavity resonance suppression using discrete thermal pedestals in active electronically scanned array

Publications (1)

Publication Number Publication Date
BR112023020110A2 true BR112023020110A2 (en) 2023-11-14

Family

ID=81346385

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112023020110A BR112023020110A2 (en) 2021-04-01 2022-03-31 ACTIVE ELECTRONIC SCAN ARRANGEMENT

Country Status (4)

Country Link
EP (1) EP4315500A1 (en)
BR (1) BR112023020110A2 (en)
CA (1) CA3212422A1 (en)
WO (1) WO2022213096A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109616455A (en) * 2014-08-26 2019-04-12 三菱电机株式会社 High-frequency model
US9942975B2 (en) * 2015-10-05 2018-04-10 Raytheon Company Scalable thermal solution for high frequency panel array applications or other applications
CN108352623A (en) * 2015-10-30 2018-07-31 三菱电机株式会社 high frequency antenna module and array antenna device
WO2019190595A2 (en) * 2017-10-05 2019-10-03 Anokiwave, Inc. Method and apparatus for heat sinking high frequency ic with absorbing material
US10319700B1 (en) * 2017-12-30 2019-06-11 Intel Corporation Stacked semiconductor architecture including semiconductor dies and thermal spreaders on a base die

Also Published As

Publication number Publication date
CA3212422A1 (en) 2022-10-06
EP4315500A1 (en) 2024-02-07
WO2022213096A1 (en) 2022-10-06

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