BR112021023447A2 - Aparelhos e métodos para alinhar dispositivos para sistemas lidar - Google Patents

Aparelhos e métodos para alinhar dispositivos para sistemas lidar

Info

Publication number
BR112021023447A2
BR112021023447A2 BR112021023447A BR112021023447A BR112021023447A2 BR 112021023447 A2 BR112021023447 A2 BR 112021023447A2 BR 112021023447 A BR112021023447 A BR 112021023447A BR 112021023447 A BR112021023447 A BR 112021023447A BR 112021023447 A2 BR112021023447 A2 BR 112021023447A2
Authority
BR
Brazil
Prior art keywords
methods
lidar systems
coupled
conductive member
aligning devices
Prior art date
Application number
BR112021023447A
Other languages
English (en)
Inventor
Anand Gopalan
Octavio Reyes Cristhian
S Hall David
Mathew Rekow
Richardson Tewell Thomas
Original Assignee
Velodyne Lidar Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Velodyne Lidar Usa Inc filed Critical Velodyne Lidar Usa Inc
Publication of BR112021023447A2 publication Critical patent/BR112021023447A2/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Combinations Of Printed Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Optical Radar Systems And Details Thereof (AREA)

Abstract

aparelhos e métodos para alinhar dispositivos para sistemas lidar. aparelhos e métodos para alinhar placas de circuito (por exemplo, para sistemas lidar) são revelados. de acordo com uma modalidade, um dispositivo eletrônico compreende um dispositivo secundário e um dispositivo de acoplamento acoplado ao dispositivo secundário. o dispositivo de acoplamento compreende uma pluralidade de membros condutores, incluindo um primeiro membro condutor e um segundo membro condutor. cada um dos membros condutores compreende uma primeira extremidade configurada para se acoplar eletricamente e mecanicamente a uma placa de circuito primária e uma segunda extremidade eletricamente e mecanicamente acoplada ao dispositivo secundário. a segunda extremidade do primeiro membro condutor é acoplada a um primeiro lado do dispositivo secundário e a segunda extremidade do segundo membro condutor é acoplada a um segundo lado do dispositivo secundário. o segundo lado do dispositivo secundário é oposto ao primeiro lado do dispositivo secundário.
BR112021023447A 2019-05-22 2020-05-22 Aparelhos e métodos para alinhar dispositivos para sistemas lidar BR112021023447A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962851447P 2019-05-22 2019-05-22
PCT/US2020/034345 WO2020237196A1 (en) 2019-05-22 2020-05-22 Apparatus and methods for aligning devices for lidar systems

Publications (1)

Publication Number Publication Date
BR112021023447A2 true BR112021023447A2 (pt) 2022-02-01

Family

ID=71083744

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021023447A BR112021023447A2 (pt) 2019-05-22 2020-05-22 Aparelhos e métodos para alinhar dispositivos para sistemas lidar

Country Status (7)

Country Link
US (2) US11169267B2 (pt)
EP (1) EP3959537A1 (pt)
JP (1) JP2022532934A (pt)
CN (1) CN114391110A (pt)
BR (1) BR112021023447A2 (pt)
MX (1) MX2021014254A (pt)
WO (1) WO2020237196A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2021014254A (es) 2019-05-22 2022-04-06 Velodyne Lidar Usa Inc Aparatos y metodos para alinear dispositivos para sistemas lidar.

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575167A (en) * 1984-04-02 1986-03-11 Minter Jerry B Electrical connector for printed circuit boards and the like
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
JP3309713B2 (ja) * 1996-06-10 2002-07-29 松下電器産業株式会社 プリント配線基板
JPH1187874A (ja) * 1997-09-04 1999-03-30 Rohm Co Ltd 一部が折り曲げられた電気回路基板およびその製法
JP2012256558A (ja) * 2011-06-10 2012-12-27 Meitaku Kogyo Kk 大判面光源装置
US9560760B2 (en) * 2013-05-28 2017-01-31 Intel Corporation Reduction of resonance in connectors
US10821222B2 (en) * 2014-07-21 2020-11-03 Medtronic Minimed, Inc. Smart connection interface
US20170195065A1 (en) 2015-12-31 2017-07-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-isolator that uses a generally rigid structure for board-to-board alignment and optical coupling
KR101866492B1 (ko) * 2015-12-31 2018-06-12 몰렉스 엘엘씨 전자기기용 카드 소켓
EP3636055B1 (en) * 2017-05-15 2022-11-30 Samtec Inc. Printed circuit board having commoned ground plane
US10630010B2 (en) * 2018-01-10 2020-04-21 Te Connectivity Corporation Stacked dual connector system
US10811799B2 (en) * 2018-02-09 2020-10-20 Metrospec Technology, L.L.C. Interconnectable circuit boards adapted for lateral in-plane bending
WO2019237581A1 (en) * 2018-06-13 2019-12-19 Hesai Photonics Technology Co., Ltd. Lidar systems and methods
CN110972393A (zh) * 2018-09-29 2020-04-07 鹏鼎控股(深圳)股份有限公司 电路板连接方法
MX2021014254A (es) 2019-05-22 2022-04-06 Velodyne Lidar Usa Inc Aparatos y metodos para alinear dispositivos para sistemas lidar.

Also Published As

Publication number Publication date
JP2022532934A (ja) 2022-07-20
US11169267B2 (en) 2021-11-09
US11867812B2 (en) 2024-01-09
CN114391110A (zh) 2022-04-22
MX2021014254A (es) 2022-04-06
EP3959537A1 (en) 2022-03-02
WO2020237196A1 (en) 2020-11-26
US20220057510A1 (en) 2022-02-24
US20200379117A1 (en) 2020-12-03

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]