BR112019027373B1 - HIGH POWER LASER SYSTEM AND LASER CUTTING DRILL - Google Patents

Abstract

Systems and apparatus for performing laser kerfing operations in boreholes. Systems and apparatus for providing a plurality of laser beams in a concentric ring laser beam pattern to create holes in the bottom of a borehole surface in a pattern corresponding to the laser beam pattern. The system having mechanical devices to remove laser weakened rock that is associated with the laser created holes, the mechanical devices forming a removal pattern that is the negative of the concentric ring pattern.

Description

Field of Invention

[01] Systems and apparatus for carrying out laser cutting operations in wells. Systems and apparatus for emitting multiple laser beams in a concentric ring laser beam pattern capable of producing holes in the bottom surface of a well in a pattern corresponding to the laser beam pattern. The system has mechanical devices to remove the weakened rock due to the holes produced by the laser, the mechanical devices forming a removal pattern that is negative to the pattern of concentric rings.

Description of the State of the Art

[02] The present inventions relate to tools, methods and high-power laser energy systems.

[03] As used herein, unless otherwise indicated, "high-power laser energy" means a laser beam with a power of at least 1 kW (kilowatt) approximately.

[04] As used herein, unless otherwise indicated, the term "soil" shall be given the broadest possible meaning, including in it soil, all natural materials, such as stone, and artificial materials, such as concrete, which are or can be found in soil, including, but not limited to, layers of rock formations such as granite, basalt, sandstone, dolomite, sand, salt, limestone, rhyolite, quartzite and shale.

[05] As used herein, unless otherwise indicated, the term "perforation" shall be given the broadest possible meaning, including any opening that is created in a material, a part, a surface, in the ground, in a formation, in a structure (e.g., building, protected military installation, nuclear power plant, offshore platform, or ship), or in a structure in the ground, being substantially deeper than it is wide, such as a well, a borehole, a well cavity, a micro well, a small diameter well (slimhole), an orifice, and other commonly used or known terms to define these types of long, narrow passages. Wells also include exploratory, production, abandoned, re-entered, reworked and injection wells. Although the orientation of wells is generally substantially vertical, they can also be oriented at an angle between vertical and horizontal, including the latter. As used herein, unless otherwise indicated, the "bottom" of a well, the "bottom surface" of the well, and similar terms refer to the end of the well; that is, the part of the well furthest away, following the line of the well, the well opening, the ground surface or the beginning of the well. The terms "side" and "wall" of a well should be given the broadest possible meanings, including the longitudinal surfaces of the well, whether or not a casing or lining is present; thus, these terms would include the sides of an open well or the sides of casing that has been placed within a well. Wells can be formed on the seabed under bodies of water, on dry land, in ice formations, or in other locations and arrangements.

[06] Wells are generally formed and advanced using well equipment with a rotating drilling tool, for example, a drill bit. As an example, and in general, when drilling in the ground, a drill bit is directed towards and into the ground, rotating to create a well in the ground. In general, to carry out the drilling operation the bit must be forced against the material to be removed with a force sufficient to exceed the resistance of that material to shear, compression or a combination of both.

[07] As used herein, unless otherwise indicated, the term "advance" in a well should be given the broadest possible meaning, including increasing the length of the well. Therefore, when advancing into a well, as long as the orientation is not horizontal, for example less than 90°, the depth of the well can also increase. The true vertical depth (TVD) of a well is the distance between the top or surface of the well and the depth at which the bottom of the well is located, measured along a straight vertical line. The measured depth (MD - measure depth) of a well is the distance measured along the actual path of the well from the top or surface to the bottom. As used herein, unless otherwise indicated, the term depth of a well will refer to MD. In general, a reference point for the top of the well may be used, such as the rotary table, the well platform, the wellhead, or opening or the surface of the structure on which the well is situated.

[08] As used herein, unless otherwise indicated, the terms "boring", "widening" a well, or terms similar to these, must be given the broadest possible meanings, including any activity carried out on the sides of a well. well, such as straightening; increasing the diameter of the well; the removal of materials from the sides of the well, such as paraffins or plaster; and the widening of the well.

[09] As used herein, unless otherwise indicated, the terms "drilling bit", "drill", "drilling bit", or terms similar to these, must be given the broadest possible meanings, including all tools designed or intended for drilling.

[10] In types of mechanical drilling, the State of the Art and the direction of practice predict that to advance in a well a great force must be used to push the bit against the bottom of the well while the bit is rotated. This force is referred to as weight-on-bit (WOB). Typically, tens of thousands of pounds of WOB are used to advance a well using a mechanical drilling process. Power drills cut rocks by applying crushing (compressive) and/or shear pressures created by rotating a cutting surface against the rock and applying a large amount of weight to the drill bit. For example, the WOB applied to an 8 3/4" PDC drill can be up to 15,000 lbs, and the WOB applied to an 8 3/4" cone drill can be up to 60,000 lbs. When mechanical drills are used for drilling hard and ultrahard rock, excessive WOB, rapid bit wear, and long tripping periods result in an actual drilling rate that is essentially economically unfeasible. The actual drilling rate is based on the total time required to complete the well and, for example, would include time spent tripping in and out of the well, as well as time required to repair or replace damaged and worn drill bits.

[11] In particular, it can be observed that the state of the art includes some attempted solutions involving laser systems, as is the case with document US2012074110A1. However, the objectives of such a document are completely different from those describing the present invention. Precisely, US2012074110A1 describes high-power laser systems, apparatus and methods for carrying out laser operations, in particular in environments where an optically obstructed medium may be present in the path of the laser beam, such as within the wellbore of an oil, gas well or geothermal, or below the surface of a body of water. In a completely different way, the present invention aims to emit multiple laser beams in a pattern of laser beams in concentric rings, producing holes in the surface of the bottom of a well and removing the weakened rock present at the bottom of the well as a result of said holes. Therefore, it is clear that the state of the art lacks solutions such as that of the present invention.

[12] As used herein, unless otherwise indicated, the terms "offshore" and "offshore drilling activities", or terms similar to these, shall be given the broadest possible meanings, including drilling activities carried out on or in any body of water, whether fresh or salt water, artificial or natural, such as rivers, lakes, canals, inland seas, oceans, seas, bays and gulfs, such as the Gulf of Mexico. As used herein, unless otherwise indicated, the term "offshore drilling rig" shall be given the broadest possible meaning, and includes fixed towers, supports, platforms, barges, jack-up platforms, floating platforms, drilling vessels, dynamically positioned drilling, semi-submersible and dynamically positioned semi-submersible drilling. As used herein, unless otherwise indicated, the term "seabed" shall be given the broadest possible meaning, including any surface of the ground which lies under, or at the bottom of, any body of water, whether artificial or natural and whether fresh or salt water. As used herein, unless otherwise indicated, the terms "well" and "drilling" shall be given the broadest possible meanings, including any well that is drilled, or produced by some other process, into the surface of the ground, e.g. on the seabed or seabed, and also including exploratory, production, abandoned, re-entered, reworked and injection wells.

[13] In general, the term “approximately”, as used herein, unless otherwise indicated, comprises in its meaning a variance or interval of ±10%, the experimental or instrument error associated with obtaining the indicated value and, preferably the largest of these.

[14] As used herein, unless otherwise indicated, the terms "at least" or "greater than" mean the same as "not less than" or "excluding less than" or "not less than" or "except if less than”. Thus, the term "at least 10kW" is equivalent to, and means the same as, the terms "not having a power of less than 10 kW" or "not having a power of less than 10 kW". Likewise, the term “greater than 10 kW” means the same as the terms “excluding a power of less than 10 kW” or “excluding a power of less than 10 kW.”

[15] This Background of the Invention section is intended to present various aspects of practice, which may be associated with embodiments of the present inventions. Thus, the content of this section provides a framework for a better understanding of the present inventions, and should not be viewed as an admission of preexisting practices.

Brief Description of the Invention

[16] It is desirable to develop systems and methods that enable the application of high-power laser energy against the bottom surface of a deep well to advance it in an economically viable manner and, in particular, that are capable of applying this laser energy High-power laser to drill through layers of rock formations, including granite, basalt, sandstone, dolomite, sand, salt, limestone, rhyolite, quartzite and shale, cost-effectively. More particularly, it is desirable to develop systems and methods that provide the ability to fire this high-power laser energy to drill through hard rock formations, such as granite and basalt, at a rate greater than previous conventional mechanical drilling operations. The present invention, among other things, solves these needs by providing the system, apparatus and methods described herein.

[17] A high power laser system is provided having a high power laser capable of emitting a high power laser beam having a wavelength, the laser beam in optical communication with a downhole composition that allows firing a pattern of laser beams against the surface of a well held in a formation in the ground, in which the improvement includes: a laser cutting assembly, where the laser cutting assembly forms part of the downhole composition; the laser cutting assembly comprising: an outer casing, the outer casing being capable of withstanding the pressures and conditions of the well at 3,000 m vertical depth; a sealed channel defining a cavity comprising multiple laser beam paths; the canal having a proximal end and a distal end sealed; the distal end comprising a pressure window transparent to the wavelength of the laser beam; the pressure window having a proximal side and a distal side; a fluid channel, the fluid channel being positioned outside the sealed channel and within the outer casing, the fluid channel defining a fluid flow path; with the proximal side of the pressure window oriented towards the cavity and the distal side oriented towards the fluid channel; a drill with a channel of laser beams and multiple cutters positioned on a distal face of the drill, so that the cutters can act on the bottom surface of the well; the laser beam channel in fluid communication with the fluid channel and defining a part of the fluid path; and extending the paths of the laser beams from the proximal end of the cavity through the cavity and to the proximal end of the pressure window through the pressure window to the fluid channel and the laser beam channel; where the path of the laser beam leaves the distal face of the drill; wherein the system is configured to produce 5 to 100 laser beams along 5 to 100 laser beam paths, and configured so that each laser beam has a cross section of between approximately 0.9 mm and approximately 3 mm.

[18] These apparatus, systems and methods are further provided having one or more of the following features: laser is approximately 40 kW to approximately 80 kW; the laser beam paths being parallel; having all laser beams the same cross section; the paths of the laser beams being spaced by a distance that is smaller than the cross-section of the beams; the paths of the laser beams being spaced by a distance that is greater than the cross-section of the beams; the paths of the laser beams being spaced from each other by a distance equal to the cross-section of the beams; where there are 5 to 40 laser beam paths, the drill defines a diameter of approximately 95 mm to approximately 330 and the pressure window has a diameter of at least 85% of the diameter of the drill; wherein the system is configured so that a laser beam has at least a power of approximately 2 kW; wherein the system is configured so that a laser beam has a power of approximately 2 kW to approximately 15 kW; and wherein the system is configured so that each laser beam has a power of approximately 2 kW to approximately 15 kW.

[19] These systems, apparatus and methods having one or more of the following characteristics are also provided: the composition is configured to withstand well pressures and conditions: 2,000 m vertical depth, and greater; at 3,000 m vertical depth, and greater; at 4,000 m vertical depth, and greater; at 5,000 m and greater, and at 7,000 m vertical depth and greater.

[20] A laser cutting drill comprising: a pressure window provided with a first surface and a second surface, having plural laser beam paths extending through the pressure window from the first surface to the second surface; the window having a gas that maintains contact with the first surface and a flowing liquid that maintains contact with the second surface; the paths of the laser beams separated from each other and configured so as not to overlap in the window; the bit having a cutting face for contacting the bottom surface of a well; the cutting face having multiple cutting elements spaced apart; with the rotation of the drill, the paths of the laser beams form an annular pattern of concentric rings, and when rotating, the cutting elements form an annular pattern of concentric rings of the cutting elements.

[21] These systems, apparatus and methods are further provided having one or more of the following characteristics: where the concentric rings of the laser pattern partially overlap with the concentric rings of the cutting element pattern; where the concentric rings of the laser pattern do not overlap with the concentric rings of the cutting element pattern; and where the laser beam paths are parallel.

[22] Additionally, a high-power laser system is provided having a high-power laser in optical communication with a downhole laser device that fires a pattern of laser beams against the surface of a well in a ground formation, wherein the improvement consists of: the downhole laser device to deliver a pattern of laser beams to the well surface, where the well surface is comprised of the formation; the laser beam pattern having multiple laser beam emissions; wherein by firing the laser beam in the laser beam pattern against the well surface, the laser beam removes material from the formation in a removal pattern that matches the laser beam pattern, thus leaving a pattern of remaining material, of material remaining from the formation, which is negative to the laser beam pattern; and a mechanical device capable of removing remaining material from the formation in the remaining material pattern

[23] Furthermore, these methods and apparatus are provided with one or more of the following characteristics: that the laser beam pattern consists of multiple linear emissions; that the laser beam pattern defines a lattice pattern of intersecting linear laser beam emissions; that the laser beam pattern consists of multiple spaced emissions; that the emissions have a cross section of approximately 0.5 mm to approximately 3 mm; that the majority of emissions comprising the laser beam pattern are circular and have a diameter of approximately 0.9 mm to approximately 3.0 mm; that most of the emissions that make up the laser beam pattern have a spacing between them of approximately 5 mm to approximately 40 mm; that most of the emissions that make up the laser beam pattern have a spacing between them of approximately 8 mm to approximately 25 mm; that the emissions pattern fills the bottom surface of a well and is adjacent to a sidewall of such well; that an outer diameter of the laser beam emission pattern is approximately 100 mm to approximately 250 mm; that an outer diameter of the laser beam emission pattern is approximately 140 mm to approximately 180 mm; that an outer diameter of the laser beam emission pattern is approximately 180 mm to approximately 250 mm; that laser emissions fill from approximately 10% to approximately 50% of the area of the laser beam pattern; that the laser emissions fill less than approximately 30% of the area of the laser beam pattern; that the laser emissions fill less than approximately 10% of the area of the laser beam pattern; and that the laser emissions fill less than approximately 2% of the area of the laser beam pattern.

[24] Additionally, these systems, methods and apparatus are provided with one or more of the following characteristics: that by firing the laser beam in the pattern of laser beams against the well surface, the laser beam removes the initial material formation in a pattern of removal that corresponds to the laser beam pattern, leaving a pattern of remaining material, of formation remnant material, that is negative to the laser beam pattern and that is approximately 50% or more of the initial training material; having a mechanical device capable of removing remaining material from the formation in the remaining material pattern; that the laser emission pattern is stationary and not rotating; that the laser beam firing pattern area is approximately 30 mm2 to approximately 320 mm2; the total laser firing area being less than approximately 10% of the laser pattern area and the remaining forming material being approximately 90% or more of the initial forming material; that the total laser emission area is less than approximately 5% of the laser pattern area and wherein the remaining formation material is approximately 95% or more of the initial formation material; that the total laser emission area is less than approximately 2% of the laser pattern area and that the remaining formation material is approximately 98% or more of the initial formation material; that the total laser emission area is less than approximately 1% of the laser pattern area and whereby the remaining formation material is approximately 99% or more of the initial formation material; and that the laser beam pattern comprises cutting gauges with laser beam emissions.

Brief Description of the Drawings

[25] FIG. 1 is a view of an embodiment of a laser cutting drill in accordance with the present inventions.

[26] FIG. 2 is a cross-sectional view of an embodiment of a pressure window assembly in accordance with the present inventions.

[27] FIG. 3 is a cross-sectional view of an embodiment of a pressure window assembly in accordance with the present inventions.

[28] FIG. 4 is a cross-sectional view of an embodiment of a laser cutting drill in accordance with the present inventions

[29] FIGS. 5A to 5D are schematic embodiments of the laser beam pattern for emitting laser beams in accordance with the present inventions.

[30] FIG. 6 is a view of an embodiment of a laser cutting assembly in accordance with the present inventions.

[31] FIG. 7 is a schematic view of an embodiment of a laser cutting assembly of the lower shaft composition in accordance with the present inventions.

[32] FIG. 8 is a schematic cross-sectional view of an embodiment of an implemented laser cutting drilling system in accordance with the present inventions.

Detailed Description of the Invention

[33] In general, embodiments of the present invention relate to methods, apparatus and systems for use in laser drilling a well in the ground and further relate to equipment, methods and systems for laser advancement these wells deep into the ground and at highly efficient advance rates.

[34] In general, the present inventions relate to methods, apparatus and systems for use in laser cutting drilling of a well in the ground and further relate to equipment, methods and systems for advancing the laser these wells deep into the ground and at highly efficient advance rates. These highly efficient feed rates are possible due to present mechanical cutting drilling methods.

[35] In mechanical laser cutting drilling of a well through and beneath the ground, such as in a soil formation, several small laser beams can be used to produce small holes, channels and ring-shaped cuts in the formation which forms the bottom or side wall of the well in a certain pattern. The small holes may be separated from each other in a predetermined pattern. The spots are rotated around a central axis of the downhole composition, which is typically coaxial with the well axis. The laser emissions are rotated around the device-well axis, resulting in a series of concentric ring-shaped cuts on the bottom surface of the well. The laser beam that produces the small and discrete holes or channels or cuts, with an arc shape (in case of pulsed emissions), or rings or channels or circular cuts (in case of continuous) in the formation, has the effect of breaking or damage surrounding rock (e.g. earth, rock formation). Thus, even though the laser beam does not directly break the rock, it can damage or weaken it in the area around the small hole created by the laser. Laser-affected material (e.g. rock, formation, earth) can be removed by mechanical means, hydraulic means or combinations and variations thereof. These means of removal may be, for example, a percussion drill, a cutter, a scraper, an auger, a roller, a fluid jet, a particle jet and other devices for cutting or removing soil known or hereafter developed. developed later. Substantially less force is required to remove laser-affected material than would be required to remove that material before it was damaged by the laser. The force required to remove laser-affected material may be 10%, 20%, 50%, or 60% less than that required to remove unaffected material (before laser damage).

[36] In one embodiment, small holes are created at the bottom of the well. The laser beams are directed at the bottom surface of the well and remove soil from the bottom to create a series of small holes in the bottom surface of the well. The laser beams to create the holes can be emitted simultaneously or at different times, such as staggered. In one embodiment, they are emitted in a predetermined time sequence, e.g., a specific emission in the laser beam pattern at a given time. The beams are at a fixed distance from each other and are rotated around the central axis of the device, the well, or both, forming circular channels on the surface of the well.

[37] The laser beams that form the emissions in the laser beam pattern can have the same or different wavelengths. The laser beams can have beam diameters, where they form the laser spot on the bottom of the well surface, that vary from approximately 0.2 mm to approximately 40 mm in cross section, with the cross sections being able to vary from 0 .5mm to approximately 2.5mm, from approximately 1mm to approximately 5mm, approximately 1mm, approximately 2mm and approximately 2.5mm.

[38] The spots (e.g., laser spots, shots or spots formed by shooting laser beams) that form the laser beam pattern may be circular, arcuate, elliptical, linear, square, rectangular or other shapes . Spots can be overlapping, partially overlapping or separated by predetermined distances and spacing. Spots can be staggered or aligned.

[39] Each laser beam spot has its own area, the sum of these areas provides a total surface area of the well that comes into direct contact with the laser. This area of direct contact with the laser is substantially smaller than the total surface area of the well. The area of direct contact with the laser, such as the total area of the laser spots, can be 50% or less, 60% or less, 80% or less, 90% or less, 95% or less than the surface area of the bottom of the well or a cross-sectional area of the well based on the diameter of the well.

[40] The laser spots are configured to form a pattern of laser beams. In embodiments, the laser beam pattern is the same size, the outer edges of the pattern are approximately the same diameter and shape of the well and the diameter of the well. In this way, the total area of the spots can be 50% or more smaller, 60% or smaller, 80% or smaller, 90% or smaller, 95% or smaller, 99% or smaller than the area of the laser pattern.

[41] Laser beam spots can have the same or different powers and can have the same or different wavelengths. The power of individual spots in a pattern can be 1 kW or greater, 2 kW or greater, 5 kW or greater, 15 kW or greater, 20 kW or greater, approximately 2 kW to approximately 15 kW, approximately 1 kW to approximately 10 kW, as well as higher and lower powers and powers within these ranges.

[42] An embodiment of a downhole laser cutting composition and a laser cutting drilling system, in generic form, is shown by the scheme of FIG. 7. This composition may have a drill section 705, which has a channel 706, where the laser beams and fluid exit towards the well surface. A chamber section 704, which has a sealed laser channel and a window that provides transition of the optical path from the channel section 704 to the drill section 705. A motor section 703, a connecting section 702, and a cable 701. One may also have, located in one or more sections, controllers, laser optics, optical assemblies (for, for example, shaping, directing or both, the laser beams), fluid flow channels (for example , to cool composition components, to direct a cutting fluid such as a water-based fluid or for both functions) and control and monitoring equipment, among other things.

[43] Turning to FIG. 1, a perspective view of a laser cutting composition 100 that is part of a downhole laser composition is shown. The laser cutting composition 100 has a body 104 that has a drill (or drill plate) 102 and a housing 105. The housing 105 has a distal end that is connected to the proximal end of the drill 102. The drill 102 has a side 107 that acts on the bottom surface of the well. The drill 102 has cutters (such as PDC cutters), e.g. 103a, 103b, 103c. The drill 102 has a channel (or laser beam channel) 107 through which laser beam paths and laser beams as well as fluid, e.g. an aqueous fluid, pass, forming a jet, e.g. a jet of water.

[44] Turning to FIG. 2, a cross-sectional view of one embodiment of a pressure window attachment assembly is shown. In one embodiment, this assembly is located between the body casing and the bit of the downhole laser cutting composition (BHA). In one embodiment, the casing 202 forms part of the body casing of the cutting composition. The housing has a distal side 203 that, in embodiments, engages with the proximal side of the drill. Window 211 is transparent to the wavelength of the laser beams, exerting little or no absorption on the emissions. The laser beams are transmitted along a laser beam path 216 in the direction of the arrows (a single path is shown as this is a cross-sectional view; however, there would be multiple beam paths in front and behind the path of beams 216). The laser beam traveling along beam path 216 would enter the window from the proximal side 211 (surrounded by gas) and exit the window from the distal side 212, which is surrounded by fluid. Thus, the proximal side 211 is the gas plane of the window and the distal side 212 is the fluid plane of the window, such as the aqueous plane of the window. The window 210 is held in place by a top mounting plate 215 and a gasket 214.

[45] Turning to FIG. 3, a cross-sectional view of one embodiment of a pressure window attachment assembly is shown. In one embodiment, this assembly is located between the body housing and the BHA cutting bit. In one embodiment, the housing 302 forms part of the housing body of the cutting composition. The housing has a distal side 303 that, in embodiments, engages against the proximal side of the drill. The window 311 is preferably transparent to the wavelength of the laser beams, exerting little or no absorption. Although a single laser beam path 316 is shown, there are several beam paths that are not shown in this view, because it is in cross section. The laser beam traveling along the beam path 316 enters the window through the proximal side 311 and exits the window 311 through the distal side 312, which is surrounded by a fluid. The proximal side 311 is the gas plane of the window and the distal side 312 is the fluid plane of the window, such as water. The 310 window is held in place by epoxy.

[46] Turning to FIG. 4, a cross-sectional view of a mechanical laser cutting composition 400 is shown, which can be used with a downhole tool, for example a BHA. The cutting assembly 400 has a housing 402 and a housing wall 403, in addition to a bit 401. The housing contains a chamber 404 which, in preferred embodiments, is a sealed channel containing a gas that can be pressurized. Chamber 404 is sealed and formed in part by window 407. Chamber 404 has a proximal end 405 and a distal end 406. The proximal end 405 receives the laser beam 408a, passing along the laser beam path 408. laser beam 408a, when traveling along the beam path 408, passes through the chamber 404 (and the gas contained in the chamber) reaching the window 407; is then transmitted through the window 407, leaving the window 407 to the laser beam channel 411, and leaving the laser beam channel 411 to form a spot on the surface of the well. And leaves the window. Although a single laser beam path 408 and a single laser beam 408a are shown, there are several additional beams and beam paths, which are not shown in this view because it is in cross section. Within the casing 402 and between the wall 403 and the chamber 404, there is a fluid channel 410. The fluid channel 410 joins the laser channel 411 in the drill 401 on the distal side of the window 407. In this way, the beam path laser beam and the laser beams exit the distal side of the window and enter the laser fluid channel, where they travel through the drill and exit the distal side of the drill as a series of individual laser beams in an elongated fluid jet.

[47] To avoid, reduce or minimize the absorption of laser energy by the fluid, for example the absorption produced by water at certain wavelengths, the window can be kept at a minimum distance from the surface of the well. Thus, this distance, which is the distance from the laser channel plus the height of the cutters 402, may be less than approximately 150 mm, less than approximately 100 mm, less than approximately 50 mm, less than approximately 25 mm, may be approximately 25mm to approximately 100mm, from approximately 25mm to approximately 75mm, from approximately 75mm to approximately 200mm, longest and shortest distance and all distances within these ranges. Likewise, the length of the laser channel may be less than approximately 150 mm, less than approximately 100 mm, less than approximately 50 mm, less than approximately 25 mm, may vary from approximately 25 mm to approximately 100 mm, from approximately 25 mm to approximately 75 mm, from approximately 75 mm to approximately 200 mm, greater and lesser distances and all distances within these ranges.

[48] The fluid channel 410 provides a fluid flow path 409. The fluid flow path 409 and the laser beam path 408 are brought together when the fluid channel 410 joins and forms a part of the laser channel 411.

[49] In operation, the cutting composition 401 is rotated and the laser beams form spots on the well surface. The spots are rotated around the cutting channels on the well surface, which are annular channels on that surface. Thus, a pattern of laser beams in concentric rings is achieved which, when directed against the surface of the well, removes the formation on the surface of the bottom of the well in concentric channels, like rings. Laser cutters, for example 412, which are located on the distal side 413 of drill bit 401, are also rotated and based on placement of the cutter from a mechanical removal pattern and when rotated against the downhole surface , remove the formation in a pattern corresponding to the mechanical removal pattern.

[50] The mechanical removal pattern may overlap, partially overlap, or not overlap the laser beam pattern. In the situation where there is no overlap with the laser beam pattern, the cutters would not come into contact with any rock that has been directly hit by the laser beam.

[51] Turning to FIG. 6, there is a view of an embodiment of the laser cutting composition. This composition has a body 600 which during operation would be rotated in the direction of arrow 601. The composition would produce several laser beams, for example 605a, 608a, along their respective laser beam paths 605, 608. As the box is rotated in the direction of arrow 601, the laser beams are rotated in the direction of arrows 607. The water jet 620 is shown exiting the laser cutting composition. For illustrative purposes, the assembly is shown as not being in contact with the bottom surface 612 of the well.

[52] Back to FIGS. 5A to 5D, schematic plan views of the laser beam patterns and mechanical removal patterns (where the laser beam is directed) on the bottom surface of the well are shown. In the embodiment of FIG. 5A, laser beam pattern 500a has a series of concentric continuous rings, for example 501a. The rings are located inside the well wall 505a. Between the rings there is an area of the bottom hole surface that is not directly hit by the laser beam, but which will be weakened by the laser beam (i.e. the material affected by the laser). The mechanical removal pattern consists of a series of rings, for example 502A, that follow or lie on the laser-affected material.

[53] In the embodiment of FIG. 5B, laser beam pattern 500b has a series of concentric rings, for example 501b, which are comprised of discrete or disconnected arcuate segments. The rings are located inside the well wall 505b. Between the rings there is an area of the bottom hole surface that is not directly hit by the laser beam, but which will be weakened by the laser beam (i.e. the material affected by the laser). The mechanical removal pattern consists of a series of rings, for example 502b, that follow or lie on the laser-affected material.

[54] In the embodiment of FIG. 5C, 500c laser beam pattern has a series of concentric continuous rings. Ring 501c is a wider and/or deeper ring located adjacent to well wall 505c. Ring 510c is a continuous ring, and a series of discontinuous rings, for example 511c, are located within ring 510c. Between the rings there is an area of the bottom hole surface that is not directly hit by the laser beam, but which will be weakened by the laser beam (i.e. the material affected by the laser). The mechanical removal pattern is a series of rings that follow or are attached to the material affected by the laser.

[55] In the embodiment of FIG. 5D, the laser beam pattern 500d has a single continuous ring 501d, which is located adjacent to the well wall 505d.

[56] In one embodiment, the laser beam pattern is a line of shots that form circular spots on the surface of the bottom of the well. Laser shots and circular spots have a diameter of approximately 0.4 mm to approximately 4.5 mm, approximately 0.9 mm to approximately 2.5 mm, and approximately 1.5 mm to approximately 2 mm. During drilling, the laser beam pattern is rotated around the downhole surface. In this way, the laser beam produces a series of arc-shaped holes that form a concentric ring removal pattern, leaving a pattern of the remaining well surface and the formation material that makes up the bottom surface of the well, which material remaining is between the rings and adjacent to them, and makes up a pattern that is negative to the laser beam firing pattern. If the laser beams are pulsed, the rings will be a series of disconnected arcuate rings. If the laser beams are continuous, the rings will be formed by circular holes. Combinations of pulsed and continuous patterns are contemplated; thus, for example, a continuous circular hole may be formed in or very close to the side wall of the well, and the disconnected arcuate rings be located within the outer circular ring. The spacing between the rings can be uniform, staggered, and staggered so that the trajectories of the shots (the circular holes) do not coincide with the trajectory of the cutter. In this way, the bottom surface of the well has two distinct areas, an area that has direct contact with the laser beam, the “laser removal area”; and another that has direct contact with the mechanical removal device (cutters, water jets, etc.), the “mechanical removal area”. In the preferred embodiment, the laser beam does not make direct contact with the mechanical removal area, nor do the cutters make direct contact with the laser removal area.

[57] Thus, in general and by way of example, it is provided in FIG. 8 a high-efficiency laser drilling system 1000 for creating a well 1001 in soil 1002. As used herein, the term "soil" shall have its broadest possible meaning, including, without limitation, rock layer formations, such as such as granite, basalt, sandstone, dolomite, sand, salt, limestone, rhyolite, quartzite and shale.

[58] FIG. 8 is a perspective view showing the ground surface 1030 and a section of the ground below the surface 1002. In general and by way of example, an electrical power source 1003 is provided, which provides electrical power through cables 1004 and 1005 to a laser 1006 and a cooler 1007 of the laser 1006. The laser emits a beam, i.e. laser energy, which can be transmitted by a laser beam transmission means 1008 to a coil of coiled tubing 1009. A fluid source 1010 is provided. The fluid is transported by the fluid transport means 1011 to the coiled tubing 1009.

[59] The coil of coiled tubing 1009 is rotated to extend and retract the coiled tubing 1012. Thus, the laser beam transmission means 1008 and the fluid transport means 1011 are connected to the coiled tubing 1009 through the rotary coupling 1013. The coiled tubing 1012 allows the transmission of the laser beam along its entire length, that is, “a means of transmitting high-power laser beams over a long distance”, up to the downhole composition 1014. The coiled tubing 1012 also allows transmitting the fluid along the entire length of the coiled tubing 1012 to the downhole composition 1014.

[60] Additionally, a support structure 1015 is provided, which contains an injector 1016, in order to facilitate the movement of the coiled tubing 1012 in the well 1001. Other additional support structures can be used, for example, structures such as cranes, cranes , masts, tripods or other structures of similar type, hybrids or combinations thereof. As drilling advances to greater depths from surface 1030, the use of a diverter 1017, a blow-out preventer 1018 (BOP), and a fluid and/or debris treatment system 1019 may be necessary. The coiled tubing 1012 is passed from the injector 1016 through the diverter 1017, the BOP 1018, a wellhead 1020 and enters the well 1001.

[61] The fluid, which may be water, brine, drilling fluid, or gas, is conveyed to the bottom 1021 of the well 1001. At that point, the fluid exits through or near the downhole laser cutting composition 1014 and It is used, among other things, to drag the cuttings created by the advancement and securing of the well. Thus, the diverter 1017 directs the fluid as it returns dragging gravel to the fluid and/or debris treatment system 1019 through the connector 1022. This treatment system 1019 is intended to prevent debris from escaping into the environment, in addition to separate and clean waste and release the clean fluid into the open air, if environmentally and economically viable, as would be the case if the fluid were nitrogen, return the clean fluid to the fluid source 1010 or, in other cases, store the used fluid for subsequent treatment and/or disposal.

[62] BOP 1018 serves to provide various levels of emergency well shutdown and/or containment, in the event of a high pressure event in the well, such as a potential well blowout. The BOP is attached to the 1020 wellhead. The wellhead, in turn, can be attached to the casing. For the sake of simplicity, the structural components of a well, such as casing, casing hangers, and cement, are not shown. It is understood that these components can be used and will vary according to the depth, type and geology of the well, among other factors.

[63] The downhole end 1023 of the coiled tubing 1012 is connected to the downhole laser cutting composition 1014. The downhole laser cutting composition 1014 contains the optics for emitting the laser beams 1024 into a pattern of laser beams formed by multiple shots of laser beams directed against the designated target, in the case of FIG. 1, the bottom 1021 of the well 1001. The downhole laser cutting composition 1014, for example, also contains transport means for the fluid.

[64] Therefore, in general, the system works to create and/or advance a well using energy generated by the laser in the form of a laser beam, transmitted from the laser, through the coil and into the coiled tubing. At this point, the laser is transmitted to the downhole composition, where it is directed at the ground and/or well surfaces in the form of a plurality of approximately 10, up to 50, up to 100 or more individual laser shots that form a pattern. of laser beams directed towards, for example, the bottom surface of the well. Upon contact with the ground surface and/or well, the laser beam spots have sufficient power (from approximately 2 kW to approximately 20 kW or more) to cut through, or otherwise affect, rocks and soil, creating areas of material removed by the laser that mirror the laser beam pattern, and an area of the ground that maintains a pattern that mirrors the laser beam pattern, while the rest of the material is also weakened by thermal and other effects from the laser beams. laser beam spots.

[65] The remaining material can then be removed by mechanical equipment, requiring significantly less effort than would be required to remove unaffected material; for example, the material before it is weakened by the laser. In a preferred embodiment, the material weakened by the laser, the formation or the soil, does not come into direct contact with the laser beam. Thus, in embodiments, the remaining forming material would not have been hit directly by the laser beam, and preferably would not have been hit by the laser beam or laser beam pattern. The weakened material is then removed mechanically by the use of, for example, a cutter, hammer, drill, probe or drill bit. Fluid and particle jets can also be used in conjunction with mechanical cutting equipment. The laser beam, at the point of contact, has sufficient power and is directed in such a way into the rocks and soil that the well creation capacity is comparable or superior to conventional mechanical drilling operation. Depending on the type of soil and rock and the properties of the laser beam, this cutting occurs by spalling, thermal dissociation, melting, vaporization or a combination of these phenomena.

[66] The fluid then drags the gravel out of the well. As drilling progresses, the coiled tubing unwinds and is extended deeper into the well. This way, the appropriate distance between the downhole composition and the bottom of the well can be maintained. If the downhole composition needed to be removed from the well, for example to line the well, the coil is retracted, causing the coiled tubing to be pulled out of the well. Additionally, the laser beam can be directed by the downhole composition or other laser directing tool disposed at the bottom of the wellbore, to perform operations such as drilling, controlled drilling, casing cutting and plug removal. The system can be installed in trailers or trailers for easy mobility, as its size and weight are substantially smaller than conventional mechanical drilling equipment.

[67] In addition to coiled tubing, well strings can be used, as well as wireline downhole tractors or other transport systems known in the industry.

[68] In one embodiment, the lasers are situated at or near the bottom of the well, or integrated as a downhole laser composition. This way, laser beams can be generated at the bottom. Downhole lasers and laser beam generation are detailed and disclosed in US Patent Publication No. 2016/0084008, publication incorporated herein in full by reference.

[69] Embodiments of laser drilling systems, downhole laser compositions, optical columns and other laser drilling systems and components thereof are disclosed and detailed in US Patent Nos. 8,511,401, 8,826,973, 9,244,235, 9,074,422, 8,571,368, 9,027,668 and 8,661,160, the complete publication of each of which is incorporated herein by reference.

[70] The laser can generate beams of more than 1 kW, approximately; more than 5 kW, approximately; more than 20 kW, approximately; more than 40 kW, approximately; from approximately 20 kW to approximately 40 kW; from approximately 1 kW to approximately 80 kW or more. The laser beams of each laser beam spot can be approximately 1 kW, 2 kW, 5 kW, 10 kW, 15 kW, 20 kW; from approximately 1 kW to approximately 20 kW and larger.

[71] The laser beam may have a wavelength from approximately 400 nm to approximately 1,550 nm, from approximately 400 nm to approximately 600 nm, less than approximately 800 nm, from approximately 450 nm to approximately 900 nm, from approximately 400 nm to approximately 500 nm, from approximately 500 nm to approximately 600 nm, from approximately 600 nm to approximately 700 nm and from approximately 900 nm to approximately 1,200 nm; longer or shorter wavelengths can be used as well.

[72] The present system may include one or more optical manipulators. An optical manipulator can generally control a laser beam, directing or positioning the laser beam to chip materials such as rocks. In some configurations, an optical manipulator can strategically guide a laser beam to chip away at materials such as rocks. For example, the distance to a well wall or rock can be controlled, as can the angle of impact. In some configurations, one or more steerable optical manipulators can control the direction and spatial width of one or more laser beams through one or more reflecting mirrors or crystal reflectors. In other configurations, the optical manipulator may be driven by an electro-optical switch, electroactive polymers, galvanometers, piezoelectric crystals and/or rotational/linear motors. In at least one pattern, a diode laser or fiber laser optical head may generally rotate on a vertical axis to increase the contact area. Various programmable values such as specific energy, specific power, pulse frequency, duration and the like can be implemented as time functions. Therefore, where to apply energy is something that can be strategically determined, programmed and executed in a way that improves the rate of penetration and/or laser/stone interaction to maximize the overall efficiency of well advancement, including reducing the number of steps critical path to well completion. One or more algorithms can be used to control the optical manipulator.

[73] In general, modalities of bottom-hole laser compositions (LBHA / Laser Bottom Hole Assembly) or bottom-hole compositions (BHA / Bottom Hole Assembly), terms that are interchangeable unless specifically instructed otherwise, may contain an external casing capable of withstanding the conditions of a downhole environment and optics to configure the shape and regulate the direction of the laser beam to the surfaces of the well, casing or formation that must be targeted. The composition may further contain or be associated with a system for delivering and directing fluid to the desired location in the well, a system for reducing, controlling or directing debris in the path of the laser beam to the surface of the material, a means for controlling the temperature of the optic, a means for controlling or commanding pressure around the optic, as well as other elements of the composition, and for monitoring and measuring equipment and apparatus, as well as other types of downhole equipment that are used in conventional mechanical drilling operations .

[74] LBHA and optics, in at least one aspect, can determine that a pattern of beam spots and a continuous beam shape are formed by a refractive, reflective, diffractive or transmissive lattice optical element. These optical elements can be made of fused silica, quartz, zinc selenide (ZnSe), silicon (Si), gallium arsenide (GaAs), yttrium aluminum garnet (YAG), polished metal, sapphire and/or diamond, not being limited to these only. Optical elements may be coated with such materials to reduce or enhance reflectivity.

[75] According to one or more aspects, one or more refractive lenses, diffractive elements, transmissive gratings and/or reflective lenses may be added to focus, sweep and/or change the pattern of beam spots emitted from the optical fibers positioned in a pattern. One or more refractive lenses, diffractive elements, transmissive gratings and/or reflective lenses may be added to focus, scan and/or change one or more continuous beam shapes from the light emitted by the beam shaping optics. A collimator can be positioned after the lens to shape the beam spots in the transverse plane of the optical path. The collimator may be a spherical lens, a spherical lens system composed of a convex lens, thick convex lens, diverging meniscus, biconvex lens, gradient refractive lens with a spherical profile and achromatic lens. The collimator may be composed of the following materials: fused silica, SF Schwerflint glasses (Schwerflint (flint glass), yttrium aluminum garnet (YAG) or a related material. The collimator may be coated to reduce or improve reflectivity or transmission These optical elements can be cooled by a purge liquid or gas.

[76] In some aspects, the optical fibers and one or more lenses of optical elements and beam shaping optics may be installed in a protective optical head composed of, for example, steel, chromium-molybdenum steel, steel coated with hard surface such as a chromium-nickel-cobalt alloy, titanium, tungsten carbide, diamond, sapphire or other suitable materials known in the industry, which may have a transmission window cut to emit light through the optical head.

[77] According to one or more aspects, a laser source may be coupled to multiple bundles of optical fibers with the distal end of the fiber arranged to combine fibers to form beam pairs such that the power density across of the pair of fiber bundles is within the removal zone; for example: spallation or vaporization zone, and one or more beam spots illuminate material, such as rocks, with the pairs of beams arranged in a pattern to remove or displace the rock formation.

[78] In one or more aspects, the pattern of beam pairs may be spaced such that light from the fiber beam pairs emerges into more beam spot patterns that make up the geometry of a rectangular grid, a circle, a hexagon, a cross, a star, a bow tie, a triangle, multiple lines in a matrix, multiple lines spaced a nonlinear distance apart, an ellipse, two or more lines at an angle, or a shape related. The pattern of the beam pairs may be spaced such that light from the fiber bundles emerges as one or more continuous beam shapes comprising the above geometric shapes. A collimator can be positioned at a predetermined distance in the same plane below the distal end of the pairs of fiber bundles. One or more beam shaping optics may be positioned a distance in the same plane below the distal end of the fiber bundle pairs. An optical element such as a non-asymmetric lens can be positioned at said distance in the same plane below the distal end of the pairs of fiber bundles, at an angle to the rock formation and rotated on an axis. Optical fibers can be single-mode and/or multimode. Optical fiber bundles can be composed of single-mode and/or multimode fibers. It is widely understood in the industry that the terms lens and optical elements, as used herein, are used in their broadest terms and therefore can also refer to any optical elements with power, such as reflective, transmissive or refractive elements. In some aspects, optical fibers may be constructed entirely of glass, hollow-core photonic crystals, and/or solid-core photonic crystals. Optical fibers can be coated with materials such as polyamide, polyamide, acrylate, carbon polyamide or double carbon/acrylate. The light may come from a diode laser, disk laser, chemical laser, fiber laser, or fiber optic source focused by one or more positive refractive lenses.

[79] In at least one aspect, types of positive refractive lenses may include non-axis-symmetric optics, such as a plano-convex lens, a biconvex lens, a positive meniscus lens, or a gradient index of refraction lens with a profile plano-convex gradient, a biconvex gradient profile, or positive meniscus gradient profile to focus one or more beam spots onto the rock formation. A positive refractive lens can be made of materials such as fused silica, sapphire, zinc selenide (ZnSe), yttrium aluminum garnet (YAG) or diamond. Said optical elements of the refractive lens can be directed in the plane of light propagation to increase/decrease the focal length. The light output from the fiber optic source may originate from multiple pairs of fiber optic beams forming a beam or pattern of beam spots and propagating the light to one or more positive refractive lenses.

[80] In some aspects, the positive refraction lens may be a microlens. Microlenses can be directed in the plane of light propagation to increase/decrease the focal length, as well as perpendicular to the plane of light propagation to change the beam. Microlenses can receive incident light to focus on multiple foci of one or more optical fibers, pairs of optical fiber bundles, fiber lasers, diode lasers; and receiving and sending light from one or more collimators, positive refraction lenses, negative refraction lenses, one or more mirrors, diffractive and reflective optical beam expanders, and prisms. In at least one aspect, the positive refraction lens can focus multiple beam spots into multiple foci to remove or displace rock formation.

[81] The apparatus and methods of the present invention can be used with well probes and equipment, such as in exploration and field development activities. Thus, by way of example and without limitation, they can be used with land-based platforms, land-based mobile platforms, fixed tower equipment, barge platforms, drilling ships, jack-up platforms and semi-submersible platforms. They can be used in operations to advance the well, completing well activities and maintenance. They can also be used in any application in which directing laser beams to a location, device or component located in a well, and preferably deep within the well, may be beneficial or useful.

[82] various modalities of systems, equipment, techniques, methods, activities and operations set forth in this specification may be used for various other activities and in other fields than those established herein. Furthermore, these modalities can, for example, be used with: other equipment or activities that may be developed in the future; and with existing equipment or activities that can be modified, in part, based on the details of this specification. Furthermore, the various embodiments set forth in this specification can be used together in various different combinations. Thus, for example, the configurations provided in the various embodiments of this specification may be used together, and the scope of protection granted to the present inventions should not be limited to a particular embodiment, pattern or arrangement that is established in a specific embodiment, in a example, or in an embodiment in a specific Figure.

[83] The invention may be configured in forms other than those specifically disclosed here, without departing from its spirit or essential characteristics. The described embodiments should be considered in all respects only as illustrative and not restrictive.

Claims (15)

1. High power laser system equipped with a high power laser for emitting a high power laser beam at a given wavelength, the laser in optical communication with a downhole assembly, to provide a beam pattern laser beam to a surface of a well, carried out in a formation, comprising: a laser cutting assembly, wherein the laser cutting assembly is a part of the downhole assembly; the laser cutting assembly comprising: I) an external housing, the external housing being capable of withstanding well pressures and conditions at 3000 m vertical depth; II) a sealed channel (404) that defines a cavity composed of several laser beam paths; the sealed channel having a proximal end (405) and a distal end (406), the distal end (406) having a pressure window (210; 310) transmissive to the wavelength of the laser beam, the window (210; 310 ) pressure having a proximal side (211; 311) and a distal side (212; 312); III) a fluid channel (410), the fluid channel positioned outside the sealed channel (404) and within the external housing, the fluid channel (410) defining a fluid flow path; IV) the proximal side (211; 311) of the pressure window (210; 310) facing the cavity and the distal side (212; 312) facing the fluid channel (410); V) a drill (102) provided with a laser beam channel (107) and multiple cutters (103a, 103b, 103c) positioned on a distal face of the drill, so that the cutters are capable of coupling with the surface bottom of the well; VI) the laser beam channel (107) in communication with the fluid channel (410) and defining a portion of the fluid path, where the laser beam paths extend from the proximal end of the cavity through the cavity to the proximal face (211; 311) of the pressure window (210; 310) through the pressure window into the fluid channel (410) and the laser beam channel, where the laser beam path leaves the distal face of the drill (102); the system characterized by being configured to deliver from 5 to 100 laser beams along 5 to 100 laser beam paths and so that each laser beam has a cross section of about 0.9 mm to 3 mm, and where the Laser cutting assembly is configured to be rotated around an axis so as to form an annular pattern of concentric laser pattern rings. 2. System according to claim 1, characterized by the fact that the laser is about 40 kW to 80 kW. 3. System according to claim 1, characterized by the fact that the laser beam paths are parallel. 4. System according to claim 1, characterized by the fact that all laser beams have the same cross section. 5. System according to claim 1, characterized by the fact that the laser beam paths are spaced by a distance that is smaller than the cross section of the beam. 6. System according to claim 1, characterized by the fact that the laser beam paths are spaced by a distance that is greater than the cross section of the beam. 7. System according to claim 1, characterized by the fact that two of the laser beam paths are spaced by a distance that is the same as the cross section of the beam. 8. System according to any one of claims 1 to 7, characterized in that there are from 5 to 40 laser beam paths and the drill (102) defines a diameter of about 95 mm to 330 mm, and the pressure window (210; 310) has a diameter of at least 85% of a diameter of the drill (102). 9. System according to any one of claims 1 to 7, characterized in that the system is configured so that a laser beam has a power of at least about 2 kW. 10. System according to any one of claims 1 to 7, characterized in that the system is configured so that a laser beam has a power of about 2 kW to 15 kW. 11. System according to any one of claims 1 to 7, characterized by the fact that the system is configured so that each laser beam has a power of about 2 kW to 15 kW. 12. Laser cutting bit (102) for a high-power laser system provided with a high-power laser for emitting a high-power laser beam at a given wavelength, as defined in claim 1, wherein: a) a pressure window (210; 310) is provided with a first surface and a second surface, having several laser beam paths that extend through the pressure window (210; 310) from the first surface to the second surface ; b) the pressure window (210; 310) is provided with a gas that maintains contact with the first surface and a flowing liquid that maintains contact with the second surface; c) the paths of the laser beams are separated from each other and configured so as not to overlap in the window (210; 310); d) the drill bit (102) is provided with a cutting face (107) for contacting the lower surface of a well, the cutting face having multiple cutting elements (103a, 103b, 103c) spaced apart from each other; the laser cutting drill (102) characterized by the fact that: e) with the rotation of the drill, the paths of the laser beams form an annular pattern of concentric laser pattern rings and where the rotation of the cutters forms an annular pattern of concentric cutter pattern rings. 13. Drill according to claim 12, characterized in that the concentric laser pattern rings partially overlap the concentric cutter pattern rings. 14. Drill according to claim 12, characterized in that the concentric laser pattern rings do not overlap the concentric cutter pattern rings 15. Drill, according to claim 12, characterized by the fact that the paths of the laser beams are parallel.