BR112016005595B8 - Arranjo para conexão em um sensor capacitivo eletrônico de alta temperatura, e, arranjo para montagem de um sensor capacitivo eletrônico de alta temperatura com um arranjo de conexão - Google Patents

Arranjo para conexão em um sensor capacitivo eletrônico de alta temperatura, e, arranjo para montagem de um sensor capacitivo eletrônico de alta temperatura com um arranjo de conexão

Info

Publication number
BR112016005595B8
BR112016005595B8 BR112016005595A BR112016005595A BR112016005595B8 BR 112016005595 B8 BR112016005595 B8 BR 112016005595B8 BR 112016005595 A BR112016005595 A BR 112016005595A BR 112016005595 A BR112016005595 A BR 112016005595A BR 112016005595 B8 BR112016005595 B8 BR 112016005595B8
Authority
BR
Brazil
Prior art keywords
arrangement
high temperature
connection
temperature sensor
capacitive high
Prior art date
Application number
BR112016005595A
Other languages
English (en)
Other versions
BR112016005595B1 (pt
BR112016005595A2 (pt
Inventor
Gundersen Tore
Original Assignee
Advantec Sensing As
Sentech As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantec Sensing As, Sentech As filed Critical Advantec Sensing As
Publication of BR112016005595A2 publication Critical patent/BR112016005595A2/pt
Publication of BR112016005595B1 publication Critical patent/BR112016005595B1/pt
Publication of BR112016005595B8 publication Critical patent/BR112016005595B8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
    • G01F23/263—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
    • G01F23/265—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors for discrete levels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/26—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
    • G01F23/263—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
    • G01F23/268—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors mounting arrangements of probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

MÉTODO PARA CONEXÃO DE UM CABO DE ALTA TEMPERATURA AO PAINEL DE CIRCUITO, ARRANJO PARA CONEXÃO EM UM SENSOR CAPACITIVO ELETRÔNICO DE ALTA TEMPERATURA, E, ARRANJO PARA MONTAGEM DE UM SENSOR CAPACITIVO ELETRÔNICO DE ALTA TEMPERATURA COM UM ARRANJO DE CONEXÃO. Conexão de uma sonda de medição capacitiva em temperaturas elevadas é alcançada por afixação direta de componentes metálicos de conexão em um substrato de temperatura. Um método e aparelho para um cabo de alta temperatura se conectar ao painel de circuito envolve uma série ou pluralidade de elementos de conexão que são soldados diretamente no painel de circuito e uma série ou pluralidade de elementos de conexão em combinação que são soldados a um painel de circuito secundário tendo blocos de soldagem para um cabo.
BR112016005595A 2013-09-16 2014-06-02 Arranjo para conexão em um sensor capacitivo eletrônico de alta temperatura, e, arranjo para montagem de um sensor capacitivo eletrônico de alta temperatura com um arranjo de conexão BR112016005595B8 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NO20131252 2013-09-16
NO20131252 2013-09-16
PCT/NO2014/050089 WO2015037998A1 (en) 2013-09-16 2014-06-02 Apparatus and method for conencting a cable to a high temperature circuit

Publications (3)

Publication Number Publication Date
BR112016005595A2 BR112016005595A2 (pt) 2017-08-01
BR112016005595B1 BR112016005595B1 (pt) 2022-07-12
BR112016005595B8 true BR112016005595B8 (pt) 2022-12-20

Family

ID=52665995

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016005595A BR112016005595B8 (pt) 2013-09-16 2014-06-02 Arranjo para conexão em um sensor capacitivo eletrônico de alta temperatura, e, arranjo para montagem de um sensor capacitivo eletrônico de alta temperatura com um arranjo de conexão

Country Status (7)

Country Link
US (1) US20160233595A1 (pt)
EP (1) EP3047707A4 (pt)
AU (1) AU2014319100B2 (pt)
BR (1) BR112016005595B8 (pt)
CA (1) CA2924338C (pt)
MY (1) MY188454A (pt)
WO (1) WO2015037998A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105371922B (zh) * 2015-12-15 2018-11-30 江南大学 一种磁力物位检测装置
DE102017214780A1 (de) * 2017-08-23 2019-02-28 Conti Temic Microelectronic Gmbh Sensorbauteil, Vormontageanordnung für ein Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5122064A (en) * 1991-05-23 1992-06-16 Amp Incorporated Solderless surface-mount electrical connector
US5315877A (en) * 1993-02-19 1994-05-31 Kavlico Corporation Low cost versatile pressure transducer
US5329819A (en) * 1993-05-06 1994-07-19 Kavlico Corporation Ultra-high pressure transducer
US5349865A (en) * 1993-08-30 1994-09-27 Kavlico Corporation Wide-pressure-range, adaptable, simplified pressure transducer
JP3111816B2 (ja) * 1993-10-08 2000-11-27 株式会社日立製作所 プロセス状態検出装置
US6766950B2 (en) * 1997-12-16 2004-07-27 Donald R. Hall Modular architecture sensing and computing platform
US6491528B1 (en) * 1998-12-24 2002-12-10 At&T Wireless Services, Inc. Method and apparatus for vibration and temperature isolation
US7100455B2 (en) * 2004-08-27 2006-09-05 Dresser-Nagano, Inc. System and method for pressure measurement
US8934263B2 (en) * 2011-08-01 2015-01-13 Honeywell International Inc. Protective cover for pressure sensor assemblies

Also Published As

Publication number Publication date
AU2014319100A1 (en) 2016-05-05
EP3047707A1 (en) 2016-07-27
BR112016005595B1 (pt) 2022-07-12
WO2015037998A1 (en) 2015-03-19
US20160233595A1 (en) 2016-08-11
BR112016005595A2 (pt) 2017-08-01
AU2014319100B2 (en) 2019-01-17
CA2924338A1 (en) 2015-03-19
CA2924338C (en) 2022-08-30
EP3047707A4 (en) 2017-05-17
MY188454A (en) 2021-12-09

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08G Application fees: restoration [chapter 8.7 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 02/06/2014, OBSERVADAS AS CONDICOES LEGAIS

B25D Requested change of name of applicant approved

Owner name: SENTECH AS (NO)

B25G Requested change of headquarter approved

Owner name: SENTECH AS (NO)

B25G Requested change of headquarter approved

Owner name: SENTECH AS (NO)