BR112015010567A2 - método para fabricar um módulo eletrônico, e dispositivo de radiofrequência. - Google Patents

método para fabricar um módulo eletrônico, e dispositivo de radiofrequência.

Info

Publication number
BR112015010567A2
BR112015010567A2 BR112015010567A BR112015010567A BR112015010567A2 BR 112015010567 A2 BR112015010567 A2 BR 112015010567A2 BR 112015010567 A BR112015010567 A BR 112015010567A BR 112015010567 A BR112015010567 A BR 112015010567A BR 112015010567 A2 BR112015010567 A2 BR 112015010567A2
Authority
BR
Brazil
Prior art keywords
manufacturing
radio frequency
electronic module
frequency device
module
Prior art date
Application number
BR112015010567A
Other languages
English (en)
Inventor
Seban Frédérick
Fidalgo Jean-Christophe
Audouard Laurent
Ottobon Stéphane
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of BR112015010567A2 publication Critical patent/BR112015010567A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
BR112015010567A 2012-11-27 2013-11-25 método para fabricar um módulo eletrônico, e dispositivo de radiofrequência. BR112015010567A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12306467.7A EP2736001A1 (fr) 2012-11-27 2012-11-27 Module électronique à interface de communication tridimensionnelle
PCT/EP2013/074630 WO2014082967A1 (fr) 2012-11-27 2013-11-25 Module electronique a interface de communication tridimensionnelle

Publications (1)

Publication Number Publication Date
BR112015010567A2 true BR112015010567A2 (pt) 2017-07-11

Family

ID=47631234

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015010567A BR112015010567A2 (pt) 2012-11-27 2013-11-25 método para fabricar um módulo eletrônico, e dispositivo de radiofrequência.

Country Status (5)

Country Link
US (1) US10013651B2 (pt)
EP (2) EP2736001A1 (pt)
CN (1) CN104798087B (pt)
BR (1) BR112015010567A2 (pt)
WO (1) WO2014082967A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013008506A1 (de) * 2013-05-16 2014-11-20 Giesecke & Devrient Gmbh Herstellungsverfahren für tragbare Datenträger
EP3719707B1 (en) * 2014-11-07 2021-11-10 Murata Manufacturing Co., Ltd. Wireless communication device and method for manufacturing same
EP3059698B1 (fr) * 2015-02-20 2021-03-31 Thales Dis France SA Procédé de fabrication d'un module électronique simple face comprenant des zones d'interconnexion
US10826158B2 (en) 2018-02-27 2020-11-03 Thin Film Electronics Asa Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same
CN113035845B (zh) 2021-02-05 2022-07-12 珠海越亚半导体股份有限公司 具有天线的封装结构及其制作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4311493C2 (de) 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
JPH10193849A (ja) * 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
CN1179295C (zh) * 1997-11-14 2004-12-08 凸版印刷株式会社 复合ic模块及复合ic卡
EP0977145A3 (en) * 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
JP2001024145A (ja) * 1999-07-13 2001-01-26 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
FR2827986B1 (fr) * 2001-07-30 2004-04-02 Arjo Wiggins Sa Procede de fabrication d'un article comportant une couche fibreuse et au moins une puce electronique, et article ainsi obtenu
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
DE112010005633T5 (de) * 2010-07-09 2013-03-28 Hewlett-Packard Development Co., L.P. RFID-Antenne und 2D-Strichcode

Also Published As

Publication number Publication date
US10013651B2 (en) 2018-07-03
WO2014082967A1 (fr) 2014-06-05
US20150269473A1 (en) 2015-09-24
EP2926298A1 (fr) 2015-10-07
CN104798087A (zh) 2015-07-22
EP2736001A1 (fr) 2014-05-28
CN104798087B (zh) 2017-12-26

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]