BR112015009655B1 - método e aparelho para formar em um substrato um padrão de um material - Google Patents

método e aparelho para formar em um substrato um padrão de um material Download PDF

Info

Publication number
BR112015009655B1
BR112015009655B1 BR112015009655-7A BR112015009655A BR112015009655B1 BR 112015009655 B1 BR112015009655 B1 BR 112015009655B1 BR 112015009655 A BR112015009655 A BR 112015009655A BR 112015009655 B1 BR112015009655 B1 BR 112015009655B1
Authority
BR
Brazil
Prior art keywords
substrate
layer
pattern
ink
printing
Prior art date
Application number
BR112015009655-7A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112015009655A2 (pt
Inventor
Dror Kella
Eyal Negreanu
Gidi Amir
Mark Sandler
Yaron Grinwald
Original Assignee
Hewlett-Packard Indigo B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Indigo B.V. filed Critical Hewlett-Packard Indigo B.V.
Publication of BR112015009655A2 publication Critical patent/BR112015009655A2/pt
Publication of BR112015009655B1 publication Critical patent/BR112015009655B1/pt

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/24—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 whereby at least two steps are performed simultaneously
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Textile Engineering (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Laminated Bodies (AREA)
BR112015009655-7A 2012-10-31 2012-10-31 método e aparelho para formar em um substrato um padrão de um material BR112015009655B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/071638 WO2014067578A1 (en) 2012-10-31 2012-10-31 Method and apparatus for forming on a substrate a pattern of a material

Publications (2)

Publication Number Publication Date
BR112015009655A2 BR112015009655A2 (pt) 2017-07-04
BR112015009655B1 true BR112015009655B1 (pt) 2020-12-29

Family

ID=47115974

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015009655-7A BR112015009655B1 (pt) 2012-10-31 2012-10-31 método e aparelho para formar em um substrato um padrão de um material

Country Status (6)

Country Link
US (2) US10588221B2 (enExample)
EP (1) EP2915414B1 (enExample)
CN (1) CN104854967B (enExample)
BR (1) BR112015009655B1 (enExample)
IN (1) IN2015DN03284A (enExample)
WO (1) WO2014067578A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016025755A1 (en) * 2014-08-13 2016-02-18 R.R. Donnelley & Sons Company Method and apparatus for producing an electronic device
US9514432B2 (en) 2014-08-19 2016-12-06 R.R. Donnelley & Sons Company Apparatus and method for monitoring a package during transit
US10377095B2 (en) 2015-08-20 2019-08-13 Hp Indigo B.V. Printed facets
US9691303B2 (en) 2015-09-14 2017-06-27 R.R. Donnelley & Sons Company Electronic label having a timer function
WO2017067604A1 (en) 2015-10-23 2017-04-27 Hewlett-Packard Indigo B.V. Laminates
CN107921733B (zh) 2015-10-23 2020-09-29 惠普印迪戈股份公司 层压件
WO2017067606A1 (en) 2015-10-23 2017-04-27 Hewlett-Packard Indigo B.V. Heat transfer printing
CN107924155B (zh) * 2015-10-28 2021-04-20 惠普印迪戈股份公司 电子照相印刷
WO2017120226A1 (en) 2016-01-04 2017-07-13 R.R. Donnelley & Sons Company Multiple detector apparatus and method for monitoring an environment
US9785881B2 (en) 2016-02-15 2017-10-10 R.R. Donnelley & Sons Company System and method for producing an electronic device
AU2019200607B2 (en) * 2016-07-28 2019-10-10 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
US10342136B2 (en) 2016-09-23 2019-07-02 R.R. Donnelley & Sons Company Monitoring device
US10445692B2 (en) 2017-03-06 2019-10-15 Cryovac, Llc Monitoring device and method of operating a monitoring device to transmit data
WO2018222877A1 (en) 2017-05-31 2018-12-06 R.R. Donnelley & Sons Company Electronic device, method and apparatus for producing an electronic device, and composition therefor
US10682837B2 (en) 2017-06-09 2020-06-16 The Proctor & Gamble Company Method and compositions for applying a material onto articles
EP3911130A1 (en) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transferring viscous materials
US20220302339A1 (en) * 2021-03-16 2022-09-22 Applied Materials, Inc. Led transfer materials and processes
WO2025024144A1 (en) 2023-07-26 2025-01-30 Eastman Kodak Company Articles with electrically-conductive pattern and methods of making
US20250037900A1 (en) 2023-07-26 2025-01-30 Eastman Kodak Company Article with electrically-conductive pattern

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775439A (en) 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US5591290A (en) 1995-01-23 1997-01-07 Wallace Computer Services, Inc. Method of making a laminate having variable adhesive properties
US5676787A (en) 1995-06-07 1997-10-14 Borden Decorative Products, Inc. Method for making repositionable wall covering and intermediate for same
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
EP1051885A1 (en) * 1998-02-06 2000-11-15 FLEXcon Company, Inc. Thin film transferable electric components
US7364769B2 (en) * 2003-05-13 2008-04-29 Ricoh Company, Ltd. Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
US7560215B2 (en) * 2004-10-04 2009-07-14 Hewlett-Packard Development Company, L.P. Printed circuit board printing system and method using liquid electrophotographic printing
WO2006076610A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
JP4580830B2 (ja) * 2005-07-08 2010-11-17 株式会社日立製作所 画像形成方法及びそれを用いた画像形成装置
JP4730232B2 (ja) * 2006-07-05 2011-07-20 株式会社日立製作所 基板への導電パターン形成装置および導電パターン形成方法
JP2009028943A (ja) 2007-07-25 2009-02-12 Hideo Hamada 転写印刷シート
US8417171B2 (en) * 2008-10-24 2013-04-09 Eastman Kodak Company Method and apparatus for printing embossed reflective images
CN101420064A (zh) * 2008-12-08 2009-04-29 宗小林 一种射频识别标签天线的制备方法
JP5546943B2 (ja) * 2010-05-12 2014-07-09 株式会社アフィット 回路基板の製造方法
CN102452239A (zh) 2010-10-22 2012-05-16 韩国科学技术院 图案转印方法和图案转印装置以及利用该方法制造的产品

Also Published As

Publication number Publication date
IN2015DN03284A (enExample) 2015-10-09
US10588221B2 (en) 2020-03-10
CN104854967B (zh) 2018-05-22
EP2915414B1 (en) 2020-10-07
BR112015009655A2 (pt) 2017-07-04
WO2014067578A1 (en) 2014-05-08
US11206738B2 (en) 2021-12-21
CN104854967A (zh) 2015-08-19
US20200163222A1 (en) 2020-05-21
EP2915414A1 (en) 2015-09-09
US20150351250A1 (en) 2015-12-03

Similar Documents

Publication Publication Date Title
BR112015009655B1 (pt) método e aparelho para formar em um substrato um padrão de um material
JP5238696B2 (ja) プリント及びプリント製品用の方法及びその装置
US8661661B2 (en) Process for the production of a circuit portion on a substrate
ES2768251T3 (es) Un aparato, un método para establecer un patrón conductor en un sustrato aislante plano, el sustrato aislante plano y un conjunto de chips del mismo
KR20070098648A (ko) 일렉트로포토그래피를 이용하여 인쇄 전자 회로를 제조하기위한 시스템 및 방법
US8497057B2 (en) Method of producing electronic circuit boards using electrophotography
US20120110843A1 (en) Printed electronic circuit boards and other articles having patterned conductive images
EP1717645B1 (en) Intermediate transfer member having a compressible layer and an external heating
US11464115B2 (en) Method for depositing functional traces
US20100159648A1 (en) Electrophotograph printed electronic circuit boards
CN100472356C (zh) 用于承载中间电子照相图像的中间转印部件
KR102870962B1 (ko) 인쇄된 전기 전도성 라인을 생성하기 위한 시스템, 장치, 및 방법
CN115250577A (zh) 一种具有导电图案的粘弹性衬底及其制备方法和应用
US10025178B2 (en) Patterning device
CN110678813B (zh) 具有电阻性涂层的流体施加装置
JP2000029319A (ja) 湿式電子写真装置

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 31/10/2012, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 11A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2746 DE 22-08-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.