BR112012033461A2 - processo de caracterização da sensibilidade de componentes eletrônicos em relação a mecanismos destrutivos - Google Patents

processo de caracterização da sensibilidade de componentes eletrônicos em relação a mecanismos destrutivos

Info

Publication number
BR112012033461A2
BR112012033461A2 BR112012033461A BR112012033461A BR112012033461A2 BR 112012033461 A2 BR112012033461 A2 BR 112012033461A2 BR 112012033461 A BR112012033461 A BR 112012033461A BR 112012033461 A BR112012033461 A BR 112012033461A BR 112012033461 A2 BR112012033461 A2 BR 112012033461A2
Authority
BR
Brazil
Prior art keywords
characterization
sensitivity
relation
electronic components
destructive mechanisms
Prior art date
Application number
BR112012033461A
Other languages
English (en)
Inventor
Florent Miller
Sébastien Morand
Original Assignee
Eads Europ Aeronautic Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eads Europ Aeronautic Defence filed Critical Eads Europ Aeronautic Defence
Publication of BR112012033461A2 publication Critical patent/BR112012033461A2/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G01R31/2848—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms using simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B1/00—Measuring instruments characterised by the selection of material therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/31816—Soft error testing; Soft error rate evaluation; Single event testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
BR112012033461A 2010-07-01 2011-06-30 processo de caracterização da sensibilidade de componentes eletrônicos em relação a mecanismos destrutivos BR112012033461A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1055292A FR2962225B1 (fr) 2010-07-01 2010-07-01 Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs
PCT/EP2011/061034 WO2012001119A1 (fr) 2010-07-01 2011-06-30 Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs

Publications (1)

Publication Number Publication Date
BR112012033461A2 true BR112012033461A2 (pt) 2016-11-22

Family

ID=43598246

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012033461A BR112012033461A2 (pt) 2010-07-01 2011-06-30 processo de caracterização da sensibilidade de componentes eletrônicos em relação a mecanismos destrutivos

Country Status (9)

Country Link
US (1) US9506970B2 (pt)
EP (1) EP2588874A1 (pt)
JP (1) JP6023050B2 (pt)
CN (1) CN102959416B (pt)
BR (1) BR112012033461A2 (pt)
CA (1) CA2803054A1 (pt)
FR (1) FR2962225B1 (pt)
IL (1) IL223823A (pt)
WO (1) WO2012001119A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9904750B2 (en) 2014-03-07 2018-02-27 The Boeing Company System and method to predict whether a protection circuit is likely to prevent a latent failure within a monitored circuit
WO2018148377A1 (en) 2017-02-08 2018-08-16 Vanderbilt University Efficient laser-induced single-event latchup and methods of operation
JP6870740B2 (ja) * 2017-08-22 2021-05-12 富士通株式会社 ソフトエラー検査方法、ソフトエラー検査装置及びソフトエラー検査システム
JP7145826B2 (ja) * 2019-08-27 2022-10-03 三菱電機株式会社 Ｓｅｂ耐性評価方法およびｓｅｂ耐性評価装置
CN111737934A (zh) * 2020-06-30 2020-10-02 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 功率器件的敏感区域检测方法、计算机设备及存储介质
CN114676571B (zh) * 2022-03-25 2024-03-22 扬州大学 一种功率器件的单粒子硬错误鉴别方法
JP2024039422A (ja) * 2022-09-09 2024-03-22 株式会社デンソー 特性予測システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4572954A (en) * 1984-06-11 1986-02-25 The United States Of America As Represented By The Secretary Of The Air Force Radiation measuring system using transister flux sensors
US4786865A (en) * 1986-03-03 1988-11-22 The Boeing Company Method and apparatus for testing integrated circuit susceptibility to cosmic rays
US6800852B2 (en) * 2002-12-27 2004-10-05 Revera Incorporated Nondestructive characterization of thin films using measured basis spectra
US7019311B1 (en) * 2004-03-25 2006-03-28 Sandia Corporation Laser-based irradiation apparatus and methods for monitoring the dose-rate response of semiconductor devices
US7787779B2 (en) * 2005-05-06 2010-08-31 Purdue Research Foundation Photonic time-domain electromagnetic signal generator and system using the same
US20080142899A1 (en) * 2006-08-04 2008-06-19 Silicon Space Technology Corporation Radiation immunity of integrated circuits using backside die contact and electrically conductive layers
US8299767B1 (en) * 2006-08-18 2012-10-30 Picor Corporation Dynamic safe operating area control
US7499308B2 (en) * 2007-03-21 2009-03-03 International Business Machines Corporation Programmable heavy-ion sensing device for accelerated DRAM soft error detection
US8024163B2 (en) * 2007-07-23 2011-09-20 International Business Machines Corporation Method and apparatus for executing multiple simulations on a supercomputer
FR2920882B1 (fr) * 2007-09-06 2010-02-26 Eads Europ Aeronautic Defence Procede de caracterisation des conditions d'utilisation d'un composant electronique permettant de limiter sa sensibilite aux interactions energetiques
US8886779B2 (en) * 2007-10-19 2014-11-11 Oracle America, Inc. Performance modeling for SOA security appliance
FR2923021B1 (fr) * 2007-10-26 2010-02-19 Eads Europ Aeronautic Defence Procede de determination de la sensibilite des composants electroniques vis-a-vis des particules.
CN100538378C (zh) * 2007-11-22 2009-09-09 北京圣涛平试验工程技术研究院有限责任公司 获取单粒子现象截面与重离子线性能量转移关系的方法

Also Published As

Publication number Publication date
IL223823A (en) 2017-04-30
FR2962225A1 (fr) 2012-01-06
JP6023050B2 (ja) 2016-11-09
US20130099774A1 (en) 2013-04-25
FR2962225B1 (fr) 2012-08-17
CA2803054A1 (fr) 2012-01-05
CN102959416A (zh) 2013-03-06
EP2588874A1 (fr) 2013-05-08
WO2012001119A1 (fr) 2012-01-05
US9506970B2 (en) 2016-11-29
CN102959416B (zh) 2016-02-03
JP2013531797A (ja) 2013-08-08

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11T Dismissal of application maintained [chapter 11.20 patent gazette]