BR102018067834A2 - METHOD TO IMPROVE THE SOUND QUALITY OF AN OSTEOCONDUCTION HEADPHONE AND OSTEOCONDUCTION HEADPHONE - Google Patents

Abstract

method for improving the sound quality of an osteoconductive headset and osteoconductive headset the methods and devices described herein are related to improving the sound quality of an osteoconductive headset. the sound quality of the osteoconductive headset is adjusted in the generation of sound, sound transfer and reception of sound from the osteoconductive headset, creating vibration generation modes and vibration transfer structures.

Description

METHOD TO IMPROVE THE SOUND QUALITY OF AN OSTEOCONDUCTION HEADPHONE AND OSTEOCONDUCTION HEADPHONE

TECHNICAL FIELD

[01] The present invention patent describes an osteoconductive headset to improve sound quality, particularly the sound of heavy bass, and refers to the reduction of sound leakage and methods to increase user comfort when using the osteoconductive headset.

BACKGROUND OF THE INVENTION

[02] In general, sound can be heard because vibrations are transferred from the external ear canal to the eardrum by air. Then, vibrations in the eardrum can incite auditory nerves to allow a person to perceive the vibrations of sound.

[03] An osteoconductive headset can transfer vibrations through the person's skin, subcutaneous tissues and bones to the auditory nerves, thus allowing the person to hear the sound.

SUMMARY

[04] The present invention patent refers to a high performance osteoconductive headset.

[05] The present invention patent describes an osteoconductive headset to improve the sound quality of the headset through specific designs.

[06] The osteoconductive headset can include a vibration unit and a headset support that connects the vibration unit. The vibration unit can include at least one contact surface. The contact surface can, at least partially, come into contact with the user, directly or indirectly. The pressure between the user and the contact surface of the vibration unit can be greater than a first threshold value and less than a second threshold value. The pressure between the user and the contact surface of the vibration unit can be greater than a third threshold value and less than a next threshold value. Preferably, the first threshold can be higher than the third threshold, the first threshold can improve the transmission efficiency of high frequency signals and can improve the sound quality of high frequency signals; preferably, the third threshold value can be a minimum force causing the contact surface of the vibration unit to make contact with the user; the next threshold value can be a minimum force in which the contact surface of the vibration unit makes the user feel sore; preferably, the second threshold value can be less than the fourth threshold value and can improve the transmission efficiency of low frequency signals and the sound quality of low frequency signals; preferably, the first threshold can be 0.2N; the second threshold can be 1.5N; the third threshold value can be 0.1N; the fourth threshold value can be 5N. The sound quality of the osteoconductive headset may be related to the pressure distribution on the contact surface of the vibration unit. A frequency response curve of the osteoconduction system can be an overlap of the frequency response curves for each point on the contact surface. In some embodiments, the pressure between the contact surface and the user can be 0.1N-5N; preferably, the pressure can be 0.2N-0.4N; more preferably, the pressure can be 0.2N-3N; most preferably, the pressure may be 0.2 N-1.5 N; and most preferably, the pressure can be 0.3 N-1.5 N.

[07] In one embodiment, the present invention patent relates to an osteoconductive headset to reduce sound leakage. The osteoconductive headset may include a vibration unit. The vibration unit can at least include a contact surface. The contact surface can, at least partially, come into contact with a user, directly or indirectly. The contact surface can include at least a first contact area and a second contact area.

[08] In another embodiment, the present patent refers to an osteoconductive headset to improve its sound quality. The osteoconductive headset may include a housing element, a transducer and a first vibration-conducting plate. The first vibration-conducting plate can physically connect to the transducer. The first vibration-conducting plate can physically connect to the housing element. The transducer can generate at least one resonance peak.

[09] Optionally, the transducer can include a vibration plate and a second vibration-conducting plate. The transducer can include at least one voice coil and at least one magnetic circuit system. The voice coil can be physically connected to the vibration plate, the magnetic circuit system can be physically connected to the second vibration conducting plate. The stiffness coefficient of the vibration plate may be greater than that of the second vibration-conducting plate. The first vibration-conducting plate and the second vibration-conducting plate can be elastic plates. Optionally, at least two first rods can converge to the center of the first vibrating conductive plate. Preferably, the thickness of the first vibration-conducting plate can be from 0.005mm to 3mm; more preferably, the thickness can be from 0.01mm to 2mm; preferably, the thickness can be from 0.01 mm to 1 mm; and still preferably, the thickness can be 0.02mm-0.5mm.

BRIEF DESCRIPTION OF THE DRAWINGS

[010] The present description is further described in terms of exemplary embodiments. These exemplary embodiments are described in detail, with reference to the drawings. The drawings are not to scale. These embodiments are exemplary, non-limiting embodiments, in which similar reference numbers represent similar structures across the various views of the drawings, and in which: [011] Figure 1 illustrates a process for osteoconductive headset with that a user's ears generate auditory sense;

[012] Figure 2-A illustrates an exemplary configuration of the vibration generating portion of the osteoconductive headset in accordance with some of the modes of the present description;

[013] Figure 2-B illustrates an exemplary structure of the vibration generating portion of the osteoconductive earpiece according to some embodiments of the present description;

[014] Figure 2-C illustrates an exemplary structure of the portion of vibration generation of the osteoconductive headset according to some embodiments of the present description;

[015] Figure 3-A shows an equivalent vibration model of the vibration generating portion of the osteoconductive headset according to some of the examples in this description;

[016] Figure 3-B shows a vibration response curve of the osteoconductive headset according to some embodiments of the present description;

[017] Figure 4 shows an example diagram that illustrates a system for transmitting sound vibration from the osteoconductive headset according to some of the embodiments of the present description;

[018] Figure 5-A and figure 5-B illustrate a top view and a side view of the osteoconductive headset panel connections in accordance with some embodiments of the present description, respectively;

[019] Figure 6 illustrates a structure of the vibration generating portion of the osteoconductive headset in accordance with some embodiments of the present description;

[020] Figure 7 shows a vibration response curve of the osteoconductive headset when the osteoconductive headset works in accordance with some of the embodiments of the present description;

[021] Figure 8 shows a vibration response curve of the osteoconductive headset when the osteoconductive headset works in accordance with some of the embodiments of the present description;

[022] Figure 9 shows a frequency response curve for the osteoconductive headset according to some embodiments of the present description;

[023] Figure 10 shows an equivalent model of the vibration generation and transfer system of the osteoconductive headset according to some of the embodiments of the present description;

[024] Figure 11 illustrates an osteoconductive headset structure according to some embodiments of the present description;

[025] Figure 12-A and Figure 12-B show vibration response curves of the osteoconductive headset according to some embodiments of the present description;

[026] Figure 13-A and Figure 13-B show a method for measuring the clamping force of the osteoconductive headset in accordance with some embodiments of the present description;

[027] Figure 13-C shows a vibration response curve of the osteoconductive headset according to some embodiments of the present description;

[028] Figure 14 shows a way to adjust the clamping force of the osteoconductive headset according to some embodiments of the present description;

[029] Figure 15-A and figure 15-B illustrate structures of the osteoconductive headset and a combined vibration unit according to some embodiments of the present description;

[030] Figure 16 shows a frequency response curve for the osteoconductive headset according to some embodiments of the present description;

[031] Figure 17 illustrates a structure of the osteoconductive headset and the combined vibration unit according to some embodiments of the present description;

[032] Figure 18-A shows an equivalent vibration model of the vibration portion of the osteoconductive headset according to some embodiments of the present description;

[033] Figure 18-B shows a vibration response curve of the osteoconduction earpiece according to a specific embodiment of the present description;

[034] Figure 19-A illustrates a structure of the vibration generating portion of the osteoconductive headset according to a specific embodiment of the present description;

[035] Figure 19-B shows a vibration response curve of the osteoconductive headset according to a specific embodiment of the present description;

[036] Figure 19-C shows a sound leak curve from the osteoconductive headset according to a specific embodiment of the present description;

[037] Figure 20 illustrates a structure of the vibration generating portion of the osteoconductive headset according to a specific embodiment of the present description.

[038] Figure 21 -A shows an application scenario for the osteoconductive headset according to a specific embodiment of the present description;

[039] Figure 21 -B shows a vibration response curve of the osteoconductive headset according to a specific embodiment of the present description;

[040] Figure 22 illustrates a structure of the vibration generating portion of the osteoconductive headset according to a specific embodiment of the present description;

[041] Figure 23 illustrates an osteoconductive headset panel structure according to a specific embodiment of the present description;

[042] Figure 24 illustrates gradient structures on the outer side of the contact surface of the osteoconductive earpiece according to a specific embodiment of the present description;

[043] Figure 25-A and figure 25-B show the vibration response curves of the osteoconductive headset according to a specific embodiment of the present description;

DETAILED DESCRIPTION OF THE INVENTION

[044] To illustrate the technical solution of some embodiments more clearly, according to the present description, the figures described in the embodiments will be explained below. Apparently, the following description of the drawings are only a few embodiments of the present description, and cannot limit the scope of the present description. Those skilled in the art, without creative efforts, will be able to apply these designs in other similar applications based on this description.

[045] As used in the specification and the claims, the singular form of "one", "one" and "o / a" includes plural referents unless the context clearly dictates otherwise. In general, the term "understand" and "include" includes only those steps and elements that have been clearly identified, and those steps and elements cannot be elements of a unique list, method or application, they can also contain other steps or elements. The term "based on" means "based at least partially on". The term "an embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment". Definitions of other terms are given in the descriptions that follow.

[046] In the descriptions of related technologies on osteoconduction, the term "osteoconductive headset" or "osteoconductive headset" can be used. The description is simply a form of osteoconductive applications, for those skilled in the art, the "headset" or "headset" can also be forwarded by other similar words, such as "headset", "hearing aid" and others. In fact, the various embodiments of the present description can easily be applied to hearing aids, except for headphones. For example, after understanding the basic principles of the osteoconductive headset, those skilled in the art can make modifications and changes in various ways and details. Especially, if the osteoconductive headset has a function to receive and process ambient sound, the headset can be used as a hearing aid. For example, a microphone can capture the sound of a user or a microphone holder, and the sound that can be processed according to an algorithm (or a generated electrical signal), can be transmitted to the osteoconductive headset. That is, the osteoconductive headset can be added with a function of capturing sound and transmitting the sound to the user or to the microphone bearer after processing the sound, so that the osteoconductive headset can achieve the function of a osteoconductive hearing aid. Just as an example, the algorithm can include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional treatment, tinnitus treatment, range compression wide multi-channel dynamics, active hiss suppression, volume control or the like, or a combination of them.

[047] The osteoconductive headset can transfer sound to a person's auditory system through their bone, and then an auditory sense can be generated.

[048] Figure 1 illustrates a process for the osteoconductive headset to generate an auditory sense. In step 101, the osteoconductive headset can obtain or generate signals that contain audio information. In step 102, the osteoconductive headset can generate vibrations according to the signals. In step 103, vibrations can be transmitted to the sensor terminal 104 by a transfer system. In some embodiments, the osteoconductive headset can capture or generate signals that contain audio information and convert the audio information into sound vibrations by a transducer. Then the sound can be transmitted to a person's sensory organs, and so the sound can be heard. In general, the auditory system, the sense organs, etc., mentioned above can be part of a human being or an animal. It should be noted that the osteoconductive headset descriptions below cannot be limited to a human, but can also be applied to other animals.

[049] The above description of the osteoconductive headset function process is just a specific embodiment, it cannot be considered as the only viable implementation. Apparently, for those skilled in the art, after discovering the basic principles of the osteoconductive headset, several modifications and changes can be made in the implementation and in the stages of incorporating the osteoconductive headset, but these changes and modifications remain in the scope of the present description as described above. For example, an additional signal modification or signal improvement step can be added between step 101 and step 102. The additional step can improve or modify the signal obtained in 101 according to certain algorithms or parameters. In addition, the additional step can be added between step 102 and step 103. The additional step can modify or improve the vibration generated at 102 according to the audio signal at 101 or ambient parameters. Likewise, the additional step of modifying vibration or improving vibration, for example, noise cancellation, automatic gain control, suppression of acoustic feedback, wide dynamic range compression, active environment recognition, active anti-noise, directional treatment, tinnitus treatment, compression of wide multi-channel dynamic range, suppression of active tinnitus, volume control and the like, or a combination of these, can be implemented between step 103 and step 104. Modifications and changes remain within the scope of this description.

[050] The methods and steps described here can be performed in any suitable order, or performed simultaneously. In addition, without deviating from the spirit and range of matter, an individual stage can be excluded from any method. All aspects of any of the embodiments described above may be combined with each other, in order to constitute other embodiments without losing the desired effects.

[051] Specifically, in step 101, the osteoconductive headset can obtain or generate signals that contain sound information in different ways. Sound information can refer to video files or audio files with specific data formats and can also refer to general data or files that can be converted to be sound through specific approaches eventually. Signals that contain sound information can be retrieved from a memory unit in the osteoconductive headset itself, or can be retrieved from an information generation system, a storage system, or a shipping system outside the osteoconductive headset. . The sound signals discussed herein may include, but are not limited to, electrical signal, optical signal, magnetic signal, mechanical signal or the like, or a combination of these. In principle, as long as the signals include sound information that can be used to generate vibrations, they can be processed as sound signals. Signals may not be limited to one signal source, and may come from multiple signal sources. Multiple signal sources can be independent or dependent on each other. Methods for generating or transmitting sound signals can be wired or wireless, real-time or delayed. For example, an osteoconductive headset can receive signals that contain sound information over wires or wirelessly, or obtain data directly from the storage medium and generate sound signals. An osteoconductive hearing aid can include a component to capture ambient sound and can convert the mechanical vibration of the sound into electrical signals, so electrical signals can be processed through amplifiers to meet special requirements. Wired connections may include, but are not limited to, metal cables, optical cables or a combination of these. For example, coaxial cables, communication cables, flexible cables, spiral cables, non-metallic sheathed cables, metallic sheathed cables, multi-core cables, twisted pair cables, ribbon cables, shielded cables, telecommunications cables, paired cables, parallel core wire and twisted pair.

[052] The examples described above can be used for illustrative purposes. Wired connections can include other types, such as other types of carriers for transmitting electrical or optical signals. Wireless connections may include, without limitation, radio communication, free space optical communication, voice communication, electromagnetic induction, etc. Radio communication can include IEEE802.11, IEEE802.15 (such as Bluetooth and ZigBee technology, etc.), the first generation of mobile communication technology, second generation mobile communication technology (for example, FDMA, TDMA , SDMA, CDMA and SSMA, etc.), general packet radio service technology, third generation mobile communication (such as CDMA2000, WCDMA, TD-SCDMA and WiMAX), fourth generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), proximity field communication (NFC) and other technologies operating in the ISM band (for example, 2.4 GHz, etc. ); free space optical communication can include visible light, infrared signals, etc. voice communication can include sound signals, ultrasonic signals, etc. electromagnetic induction may include, but is not limited to, proximity field communication technology. [053] The examples mentioned above are used for purposes of illustration, the wireless medium may also include other types, for example, Z wave technology, other paid radio frequency bands for civil and military use or other radio frequency bands and or similar , or a combination of these. For example, in some application scenarios, the osteoconductive headset can acquire sound signals from other devices using Bluetooth technology or acquire data from a storage unit in the osteoconduction converter itself and can generate sound signals.

[054] The storage device / storage unit may include direct attached storage, network connected storage, storage area network and other storage systems. Storage devices can include, but are not limited to, common types of storage devices, for example, solid state storage device (hybrid solid state SSD drives, etc.), mechanical hard drive, USB flash memory, card flash memory, memory cards (such as CF, SD, etc.), other drivers (such as CD, DVD, HD DVD, Blu-ray, etc.), random access memory (RAM) and read memory (ROM) and or the like, or a combination thereof. RAM can include, but is not limited to, decimal counter, selectron, line delay memory, Williams tube, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T- RAM) and zero-capacitor random access memory (Z-RAM) and or similar, or a combination thereof. ROM may include, but is not limited to, magnetic bubble memory, magnetic button line memory, film memory, magnetic board line memory, core memory, magnetic drum memory, CD-ROM, hard drive, tape magnetic, previously NVRAM (non-volatile memory), phase shift memory, magnetoresistive random memory, ferroelectric random memory, non-volatile SRAM, flash memory, electronic rewritable auto-read memory, erasable programmable read-only memory, programmable read-only memory, armored stack memory for reading, connected to the floating door of random access memory, nano random memory, racetrack memory, variable resistive memory, programmable metallization cell, etc. The storage device / storage unit mentioned above are merely a few examples, the storage medium used in the storage device / storage unit is not limited.

[055] In step 102, the osteoconductive headset can convert signals that contain sound information into vibrations and generate sounds. The osteoconductive headset can use a specific transducer to convert signals into mechanical vibrations that accompany energy conversion. The conversion process can include multiple types of coexistence and energy conversion. For example, electrical signals can be converted directly into mechanical vibrations by the transducer to generate sounds. As another example, sound information can be included in optical signals, which can be converted to mechanical vibrations by a specific transducer. Other types of energy that can be converted and coexist when the transducer works may include magnetic energy, thermal energy or the like. The energy conversion mode of the transducer can include, without limitation, moving coil, electrostatic, piezoelectric, moving iron, pneumatic, electromagnetic, etc. The range of the frequency response and the sound quality of the osteoconductive headset can be affected by the energy conversion modes and properties of each physical component of the transducer. For example, in the moving coil transducer, as columnar coils can be connected with a vibration plate, the vibration plate can vibrate in a magnetic field when it is guided by the coil and generate sound. Factors, such as expansion and contraction of materials, fold deformation, size, shape and fixed mode of the vibration plate, the magnetic density of the permanent magnet, etc., can have a major impact on the sound quality of the osteoconductive headset. . As another example, the vibration plate can have an inverted mirror structure, a centimeter structure or an asymmetric structure; the vibration plate can have a non-continuous porous structure, so the vibration plate can obtain a greater displacement to make the osteoconductive headset more sensitive, improve the power of vibrations and sounds. As yet another example, the vibration plate can have a ring structure that can have two or more rods converging to a center of the ring.

[056] Apparently, for those skilled in the art, after understanding the basic principles of improving the sound quality of the osteoconductive headset, you can obtain optimal sound quality by making choices, combinations, modifications or changes in the factors mentioned above. For example, it may be possible to obtain better sound quality to use high-density permanent magnet and more optimized plate materials and structure configurations.

[057] The term "sound quality" can indicate the quality of the sounds, which refers to post-processing, transmission or similar audio fidelity. In an audio device, sound quality can include audio intensity and magnitude, audio frequency, audio tones, or harmonic or similar components. When sound quality is assessed, measurement methods and assessment criteria for objective analysis of sound quality can be used, other methods that combine different elements of sound and subjective feelings to assess various properties of sound quality may also be used. used, so the sound quality may be affected during the process of sound generation, sound transmission and sound reception.

[058] There may be several methods for implementing the vibrations from the osteoconductive headset. Figures 2-A and 2-B illustrate an exemplary structure of a vibration generating portion of the osteoconductive headset according to a specific embodiment of the present description. The vibration generating portion of the osteoconductive headset may include a housing element 210, a panel 220, a transducer 230 and a connector 240. [059] Panel 220 can transmit vibrations through tissues and bones to the auditory nerves, which can allow a human to hear sounds. Panel 220 can come into contact with human skin directly, or through a vibration transfer layer made of specific materials (will be described in detail below). Specific materials can be selected from low density materials, for example, plastic (for example, but not limited to, polyethylene, blow molding nylon, engineering plastic), rubber or single material or composite materials, which can reach the same performance. Rubber may include, but is not limited to, general purpose and specific rubber. General purpose rubber may include, but is not limited to, natural rubber, isoprene rubber, styrene-butadiene rubber, butadiene rubber, chloroprene rubber, etc. The specific rubber may include, but is not limited to, nitrile rubber, silicone rubber, fluorine rubber, polysulfide rubber, urethane rubber, chlorohydrin rubber, acrylic rubber, propylene oxide rubber. Styrene-butadiene rubber may include, but is not limited to, emulsion polymerization and solution polymerization. Composite materials can include, but are not limited to, reinforced materials, for example, glass fibers, carbon fibers, boron fibers, graphite fibers, fiber, graphene fibers, silicon carbide fibers or aramid fibers. Composite materials can also be composed of other organic and / or inorganic materials, such as various types of glass fiber reinforced by unsaturated polyester and epoxy, glass fiber with phenolic resin matrix. Other materials used as a vibration transfer layer may include silicone, polyurethane (polyurethane), polycarbonate (polycarbonate) or a combination of these. Transducer 230 can convert electrical signals into mechanical vibrations based on a specific principle. Panel 220 can be connected with transducer 230 and can be guided by transducer 230 to vibrate. The connector 240 can connect the panel 220 and the housing element 210 and can attach the transducer 230 to the housing element. When transducer 230 transfers vibrations to panel 220, vibrations can be transferred to housing element 210 through connector 240, which can cause housing element 210 to vibrate, and can change the vibration mode of panel 220 , in order to influence the vibrations transferred to the skin through panel 220.

[060] It should be noted that the way of attaching the transducer and the panel to the housing element may not be limited to the way shown in figure 2-B. For those skilled in the art, whether to use connector 240, different materials used to manufacture connector 240, the way of attaching transducer 230 or panel 220 to housing element 210, there may be different mechanical impedance characteristics and result in different vibration transmission effects, affecting the vibration efficiency of the entire vibration system and producing different sound qualities.

[061] For example, instead of using connectors, the panel can be glued directly to the housing element using glue, or by tightening or welding. If a connector with adequate tensile strength is used, the connector can absorb shock and reduce the vibratory energy transmitted to the housing element, in order to effectively suppress sound leakage caused by the vibration of the housing element, to help prevent abnormal sounds caused by possible abnormal resonance, and to improve sound quality. The connector located inside or at different positions of the housing element can have different effects on the efficiency of the vibration transmission, preferably the connector can allow the transducer to be in different status, such as suspended, supported and so on.

[062] Figure 2-B is a form of connection. The connector 240 can be connected with the upper part of the housing element 210. Figure 2-C is another embodiment of the connection. Panel 220 can protrude out of an opening of housing element 210. Panel 220 can connect with transducer 230 through connection portion 250 and and connect to housing element 210 through connector 240.

[063] In some other embodiments, the transducer can be attached to the housing element with other means of connection. For example, the transducer can be attached to the inner bottom of the housing element via the connector or the bottom of the transducer (one side of the transducer that connects to the panel is defined as the top, the counter part is defined as the bottom ) can be attached to the housing element by hanging spring, or the upper part of the transducer can be attached to the housing element, or the transducer can be connected to the housing element by multiple connectors with different locations or a combination thereof. [064] In some embodiments, the connector may have elasticity. The elasticity of the connector can be affected by materials, thicknesses, structure and other aspects of the connector. Connector materials may include, without limitation, steel (for example, not limited to stainless steel, carbon steel), light alloy (for example, without limitation, aluminum, beryllium copper, magnesium alloys, titanium alloys), plastic (eg, but not limited to, polyethylene, blow molding nylon, plastic, etc.). It can also be a single material or composite material to achieve the same performance. Composite materials can include, but are not limited to, reinforced materials, such as glass fibers, carbon fibers, boron fibers, graphite fibers, graphene fibers, silicon carbide fibers, aramid fibers or the like. The composite materials can also be other organic and / or inorganic composite materials, such as various types of glass fiber reinforced by unsaturated polyester and epoxy, a glass fiber comprising a phenolic resin matrix. The thickness of the connector cannot be less than 0.005mm; preferably, the thickness can be from 0.005 mm to 3 mm; more preferably, the thickness can be from 0.01mm to 2mm; preferably, the thickness can be from 0.01 mm to 1 mm; and most preferably, the thickness can be from 0.02mm to 0.5mm.

[065] The connector may have an annular structure, preferably containing at least one annular ring, and more preferably, containing at least two annular rings. The annular rings can be concentric rings or non-concentric rings, and can be connected to each other by means of at least two rods that converge from the outer ring to a center of the inner ring. More preferably, there can be at least one oval ring and, preferably, there can be at least two oval rings. The different oval rings can have different radius curvatures, and the oval rings can be connected to each other through rods. More preferably, there can be at least one square ring. The connector structure can be configured as a card. Preferably, hollow patterns can be configured on the board; more preferably, the area of the hollow patterns may not be less than the area of the non-hollow portion of the connector. It should be noted that the material, the structure, the thickness of the connector as described above can be combined in any way to obtain different connectors. For example, the annular connector can have a different thickness distribution, preferably, the thickness of the ring can be equal to the thickness of the shank, more preferably, the thickness of the shank can be greater than the thickness of the ring and preferably the thickness of the inner ring may be greater than the thickness of the outer ring.

[066] Those skilled in the art can choose materials, position, means of connection of the connector according to different application scenarios, or they can also modify, improve or combine different properties of the connector, which remain in the range described above. In some embodiments, the connector described above may not necessarily be required, the panel can be directly connected to the housing element and can also be attached to the housing element using glue. It should be noted that the shape, size, proportions, etc. of the vibration generation portion may not be limited to the contents described in figure 2A, 2B or figure 2C in the practical application of the osteoconductive headset. Those skilled in the art can make some changes according to the contents described in the figures, considering other possible factors that influence the sound quality, such as the degree of sound leakage, frequency tone generation, usage mode or similar.

[067] Well-designed and tested transducers and panels can overcome many problems that the osteoconductive headset often faces. For example, the osteoconductive headset may have a sound leak problem. Here, the hollow sound can refer to the sound that can be generated by the vibration of the headset and be transferred to the surrounding environment when the osteoconductive headset works, so others in the environment can hear the sound from the headset . The reasons for the sound leak may include the vibration of the housing element caused by vibration transmitted by the transducer and panels through the connector, or the vibration of the housing element caused by the vibration of the air in the housing element, the vibration of the air being caused by the vibration of the transducer. Figure 3-A shows an equivalent vibration model of the vibration generating part of the osteoconductive headset. The vibration generating portion may include a fixed end 301, a housing element 311 and a panel 321. The connection between the fixed end 301 and the housing element 311 can be equivalent to the connection formed by an elastomer 331 and a damping element 332. The connection between the housing element 311 and the panel 321 can be equivalent as the connection formed by an elastomer 341. The fixed end 301 can be a point or an area whose location can be relatively stable during vibration (will be described in details below). The elastomer 331 and the damping element 332 can be determined according to the means of connection between a headset support / headset strap and the housing element. Influencing factors for determining the elastomer and damping element may include stiffness, shape or materials of the headset support / headset strap and material properties of the connection part between the headset support / headset strap. headset and housing element. The headset / headphone holder can provide pressure between the osteoconduction headset and the user. The elastomer 341 can be determined according to the means of connection between the panel 321 (or the system formed by the panel and the transducer) and the housing element 311. Influencing factors may include the connector 240 mentioned above.

[068] Equation 1: Vibration equation: [069] Where: m is the mass of the housing element 311; x1 is the displacement of panel 321; x2 is the displacement of the housing element 311; R is vibration damping; k1 is the stiffness coefficient of elastomer 341; k2 is the stiffness coefficient of the elastomer 331. In a situation of constant vibration state (without considering transient responses), the relationship between the vibration of the housing element and the vibration of the panel x2 / x1 is given by equation 2: [070 ] Equation 2: [071] The relationship between the vibration of the housing element and the vibration of the x2 / x1 panel may reflect a degree of sound leak. In general, the higher the x2 / x1 value, the greater the vibration of the housing element in relation to the actual vibration transmitted to the auditory system, the greater the sound leak in the same volume. The lower the x2 / x1 value, the lower the vibration of the housing element may be relative to the actual vibration transmitted to the auditory system, the lower the sound leak with the same volume. Thus, factors that influence the leakage of the osteoconductive headset sound may include means of connection between panel 321 (or a system that includes panel and transducer) and housing element 311 (stiffness coefficient k1 of the elastomer 341), the headset holder / headset strap, and the housing element system (k2, R, m). In one embodiment, the stiffness coefficient k2 of elastomer 331, the mass of the housing element m, the damping R can relate to the shape of the osteoconductive headset and the way of using the osteoconductive headset. . After k2, m, R are determined, the relationship between x2 / x1 and the stiffness coefficient of 341 k1 elastomer is shown in figure 3-B.

[072] As shown in figure 3-B, the differential stiffness coefficient kl can affect the x2 / x1 ratio of the vibration amplitude of the housing element to the vibration amplitude of the panel. When the frequency f is greater than 200Hz, the vibration of the housing element is less than the vibration of the panel (x2 / x1 <1). When f increases, the vibration of the housing element may gradually become less. In particular, as shown in figure 3-B, for different values of k1 (the stiffness coefficient k1 is defined as 5 times, 10 times, 20 times, 40 times, 80 times and 160 times the value of k2 from left to right). right), when the frequency is higher than 400 Hz, the vibration of the housing element is less than 1/10 of the panel vibration (x2 / x1 <0.1). In a particular embodiment, the reduction of the stiffness coefficient k1 (for example, using a connector 240 with a small stiffness coefficient) can effectively reduce the vibration of the housing element, thereby reducing sound leakage.

[073] In some embodiments, sound leakage can be reduced using a connector with specific materials and connection means. For example, the panel, the transducer and the housing element can be connected via an elastic connector, so the amplitude of vibration of the housing element can be small, even if the amplitude of vibration of the panel is greater, in order to reduce the sound leak. The materials used for the connector may include, without limitation, stainless steel, beryllium copper, plastic (such as polycarbonate), etc. The connector shapes can be multifaceted. For example, the connector can be a torus, and at least two rods can converge to the center of the torus. The log thickness cannot be less than 0.005 mm; preferably, the thickness can be from 0.005 mm to 3 mm; more preferably, the thickness can be from 0.01 mm to 2 mm; preferably, the thickness can be from 0.01 mm to 1 mm; and most preferably, the thickness can be from 0.02 mm to 0.5 mm. In another embodiment, the connector can be a ring plate configured with multiple continuous annular holes. A gap can be between two adjacent annular holes. As another example, the housing element or at least a portion of the housing element can be made of sound absorbing materials. The sound-absorbing materials can be used on one or more internal / external surfaces of the housing element, or a portion of an internal / external surface of the housing element. Sound-absorbing materials can refer to materials capable of absorbing sound energy based on one or more mechanisms, such as their physical properties (eg, without limitation, porosity), membrane action, resonance action. In particular, sound-absorbing materials can be porous materials or materials with a porous structure, including but not limited to, organic fibrous material (e.g., but not limited to, natural fibers, organic synthetic fibers, etc.), inorganic fibrous material (eg, but not limited to, glass cotton, slag wool, rock wool and aluminum silicate wool, etc.), metallic sound-absorbing material (eg metallic fiber sound-absorbing plate, foam metallic, etc.), rubber sound-absorbing material, foam sound-absorbing material (eg, but not limited to, polyurethane foam, polyvinyl chloride foam, polystyrene foam, latex, phenolic resin foam, etc.). Sound absorbing materials can also be flexible materials that absorb sound by resonance, including but not limited to closed cell foams; membranous materials, including, but not limited to, plastic films, cloth, canvas, fabric or leather; plate material, including, but not limited to, such as hard panels, plastic plates, plastic plates, metal plates) or perforated plates (for example, manufactured by drilling holes in plate materials). The sound-absorbing materials can be a combination of one or more of these materials, or they can be composite materials. Sound-absorbing materials can be used in the housing element, or can be configured in the vibration transfer layer.

[074] The housing element, the vibration transfer layer and the panel here can constitute a vibration unit of the osteoconduction unit. The transducer can be located on the vibration unit and can transfer vibrations to the vibration unit by connecting the housing element and the panel. Preferably, at least more than 1% of the vibration unit can be sound absorbing materials; more preferably, at least more than 5%; and preferably, at least more than 10%. Preferably, at least more than 5% of the housing element can be sound absorbing materials; more preferably, at least more than 10%; more preferably, at least more than 40%; and still preferably, at least more than 80%. It should be noted that the embodiments described above to improve the sound quality of the osteoconductive headset can be selected or combined to obtain various embodiments, these embodiments remain within the scope of the present description.

[075] The above description of the structure of the vibration generating portion of the osteoconductive headset is merely a specific embodiment, it should not be considered as the only viable implementation. Apparently, for those skilled in the art, after understanding the basic principles and without abandoning the principle, it is possible to modify and alter the specific structure and connection means to generate vibrations, but these modifications and changes will still be within the scope described above. For example, the connection portion 250 in figure 2-B and figure 2-C can be a part of the panel 220, adhered to the transducer 230 using glue; the connection portion 250 can also be a part of the transducer (for example, a convex portion on a vibration plate), adhered to the panel 220 using glue; connection portion 250 can also be a separate component, adhered to panel 220 and transducer 230 using glue. It is clear that the way of connecting the connection portion 250 and the panel 220 or the transducer 230 may not be limited to the connection, those skilled in the art can also learn other means of connection that are still within the present disclosure, for example, via tightening or welding. Preferably, the panel 220 and the housing element 210 can be directly adhered using glue, more preferably, by components such as the elastic element 240, preferably additionally, by adding the vibration transfer layer 220 on the outside of the panels (described in details below) to connect housing element 210. It should be noted that connection portion 250 is a schematic drawing illustrating the connection between various components, those skilled in the art can use similar components with different shapes and similar functions to replace the connection part, these alternatives and changes are still within the scope of the description above.

[076] In step 103, the sound can be transmitted to the auditory system through a sending system. The sending system can transmit sound vibrations directly to the auditory system through media or perform certain processing operations before the sound is transmitted to the auditory system.

[077] Figure 4 is a form of embodiment that illustrates the sound transmission system. When the osteoconductive headset works, the 401 headset can come into contact with the ears, cheeks or forehead and other parts, and transmit sound vibrations to the skin 402, the subcutaneous tissue 403, bone 404, cochlea 405, the sound can be transmitted to the brain by the auditory nerve. The sound quality that a person perceives can be affected by means of transmission and other factors that affect the physical properties of the transmission media. For example, the density and thickness of skin and subcutaneous tissues, the shape and density of bones and other tissues that vibrations pass through in the transmission process can have an impact on the quality of the final sound. In addition, in the transmission process, the part of the osteoconductive headset can come into contact with the human body and the transformation efficiency of the vibrations of human tissues can affect the quality of the final sound. [078] For example, the osteoconductive headset panel can transmit vibrations to the human auditory system through human tissue, so that changes in the panel materials, the contact area, the shape and / or the size and the interaction strength between the panel and the skin, can affect the efficiency of sound transmission, thus affecting sound quality. For example, under the same unit, the vibrations being transmitted through panels of different sizes can have different distributions on a connection surface between the panel and a user, thus making a difference in volume and sound quality. Preferably, the size of the panel cannot be less than 0.15 cm2, more preferably, not less than 0.5 cm2, even more preferably, not less than 2 cm2. For example, the panel can vibrate when the transducer vibrates, a connection point between the panel and the transducer can be at a vibrating center of the panel. Preferably, the mass distribution of the panel around the vibrating center may be homogeneous (the vibrating center may be the physical center of the panel), and more preferably, the mass distribution of the panel around the vibrating center may not be homogeneous ( the vibrating center can be deviated from the physical center of the panel). In some embodiments, a vibrating plate can connect to multiple panels, these multiple panels can have the same or different shapes or materials. These various panels may or may not be connected to each other. The various panels can transmit vibrations in different ways. The vibration signals between different panels can be complementary to generate a stable frequency response. In some embodiments, it is possible to effectively reduce irregular vibrations caused by the deformation of a panel at high frequency and obtain an ideal frequency response, when a large vibration plate is divided into multiple smaller ones.

[079] It should be noted that the physical properties of the panel, such as mass, size, shape, stiffness and vibration damping, and so on, can affect the efficiency of the panel's vibration. Those skilled in the art can choose suitable materials to make the panel according to practical requirements, or different shapes of the panel can be obtained by injection molding. Preferably, the shape of the panel can be rectangular, circular, oval; more preferably, the shape of the panel can be standard after cutting the edges of the rectangle, circle or oval (for example, cutting a circle symmetrically to obtain an oval, etc.); preferably, the panel can be configured with cavities in the panel. Panel materials may include, but are not limited to, acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), poly (ethylene terephthalate), polyester (PES), polycarbonate (PC), polyamide (PA), polyvinyl chloride (PVC), polyurethane (PU), polyvinylidene chloride, polyethylene (PE), polymethyl methacrylate (PMMA), polyether ether (PEEK), phenolic (PF), urea-formaldehyde (UF), melamine formaldehyde (MF), some metal alloys (e.g. aluminum, chromium-molybdenum steel, scandium alloys, magnesium alloys, titanium, magnesium, lithium alloys, nickel alloys, etc. ), composite materials, etc. Related parameters may include relative density, tensile strength, elastic modulus, Rockwell hardness. Preferably, the relative density of the panel materials can be 1.02-1.50, more preferably 1.14-1.45, and most preferably 1.15-1.20. The tensile strength of the panel may not be less than 30 MPa, more preferably not less than 33MPa-52MPa, and preferably not less than 60MPa. The elastic modulus of panel material can be 1.0 GPa-5.0 gPa, more preferably 1.4GPa-3.0 GPa, and most preferably 1.8 GPa-2.5 GPa. , the hardness of the panel material (Rockwell hardness) can vary from 60 to 150, more preferably 80-120 and, preferably, 90-100. In particular, taking into account both materials and tensile strength, the relative density can be 1.02-1.1, the tensile strength can be 33MPa-52MPa, and more preferably, the relative density can be 1.20-1.45, and the tensile strength can be 56-66MPa.

[080] In some other embodiments, the outer side of the panel can be wrapped with a vibration transfer layer. The vibration transfer layer can come into contact with the skin and the vibration system, including the panel and the vibration transfer layer, can transmit sound vibrations to human tissues. Preferably, the outer side of the panel can be wrapped with a vibration transfer layer, and more preferably, multiple layers; the vibration transfer layers can be made of one or more types of materials, and different vibration transfer layers can be made of different materials or the same material; the multiple vibration transfer layers can be superimposed in a direction perpendicular to the panel, or can be arranged along the direction parallel to the panel, or a combination of the two.

[081] The materials of the vibration transfer layer may have some adsorbability, flexibility and certain chemical properties, for example, plastic (for example, but not limited to, polyethylene, blow molding nylon, plastic, etc.), rubber or other unique material or composite materials. Rubber may include, but is not limited to, general purpose rubber and special rubber. General purpose rubber may include, but is not limited to, natural rubber, isoprene rubber, styrene-butadiene rubber, butadiene rubber, chloroprene rubber, etc. Special rubber may include, but is not limited to, nitrile rubber, silicone rubber, fluorine rubber, polysulfite rubber, urethane rubber, epichlorohydrin rubber, acrylic rubber, propylene oxide rubber. Styrene-butadiene rubber may include, but is not limited to, emulsion polymerization and solution polymerization. Composite materials can include, but are not limited to, reinforced materials, for example, glass fibers, carbon fibers, boron fibers, graphite fibers, fiber, graphene fibers, silicon carbide fibers or aramid fibers. Composite materials can also be other organic and / or inorganic composite materials, such as various types of glass fiber reinforced by unsaturated polyester and epoxy, fiberglass comprising a phenolic resin matrix. Other materials used to form the vibration transmission layer may include silicone, polyurethane (Poly Urethane), polycarbonate (Poly Carbonate) or a combination of these.

[082] The vibration transfer layer can affect the frequency response of the system, change the sound quality of the osteoconductive headset and protect the elements within the housing element. For example, the vibration transfer layer can smooth the system's frequency response by changing the panel's vibration mode. The panel's vibration mode can be affected by panel properties, connection means between the panel and the vibration transfer layer, vibration frequency, etc. Panel properties can include mass, size, shape, stiffness, vibration damping, etc. Preferably, the thickness of the panel may be non-uniform (for example, the thickness in the center may be greater than the thickness at the edges). The connection medium between the panel and the vibration transfer layer may include glue cementation, tightening, welding, etc. The panel can be connected to the vibration transfer layer using glue. Different frequencies of vibration can correspond to different modes of vibration of the panel, including translation and translation-torsion in a disorderly manner. The panel with a specific vibration mode at a specific vibration frequency can change the sound quality of the osteoconductive headset. Preferably, the specific frequency range can be 20Hz-20000Hz, more preferably 400Hz-10000Hz, even more preferably 500Hz-2000Hz, and most preferably 800Hz-1500Hz.

[083] Preferably, the vibration transfer layer as described above can be wound on the outside of the panel to be one side of the vibration unit. Different regions in the vibration transfer layer can have different vibration transfer properties. For example, the vibration transfer layer can include a first contact surface and a second contact surface. More preferably, the first contact surface can be configured with holes to reduce its area. The outer side surface (facing the user) of the vibration transfer layer can be smooth or not smooth. Preferably, the first contact surface and the second contact surface may not be in the same plane. More preferably, the second contact surface can be above the first contact surface. More preferably, the first contact surface and the second contact surface can constitute a step structure. The first contact surface and the second contact surface can be made of different materials or the same material and can be made of one or more types of materials used in the vibration transfer layer described above. The above description in relation to the clamping force is only one embodiment of the present description, those skilled in the art can modify the structure and methods described above according to practical requirements, but the modifications are still within the present description. For example, the vibration transfer layer may not be necessary, the panel can contact the user directly, the panel can be configured with contact surfaces with different areas and different contact surfaces can have properties similar to the first area of contact. contact and the second contact area described above. As another example, the contact surface can include a region of a third contact surface and the third contact area can be configured with different structures than the first contact area and the second contact area, and these structures can help to reduce the vibration of the housing element, suppress sound leakage and improve the frequency response.

[084] Figure 5-A and figure 5-B are specific embodiments showing a front view and a side view of the connection between the vibration transfer layer and the panel, respectively. The panel 501 and the vibration transfer layer 503 can be adhered using the glue 502, the connection formed by the glue can be located at both ends of the panel 501, the panel 501 can be located with a housing element formed by the transfer layer of vibration 503 and the housing element 504. Preferably, the first contact area can be a region where the panel 501 is projected on the vibration transfer layer 503, a second contact area can refer to the area around the first contact area.

[085] The vibration transfer layer and the panel can be completely adhered by glue, which can alter the panel's properties, such as mass, size, shape, stiffness, vibration damping, vibration modes, etc., and lead to greater vibration transfer efficiency; the vibration transfer layer and the panel can be partially adhered by glue, so that the air between the panel and the non-adherent transfer layer area can increase the conduction of low-frequency vibration sound and improve the effect of conducting sound at low-medium frequencies. Preferably, the bonded area can be from 1% to 98% of the panel area. More preferably, the bonded area can be from 5% to 90% of the area of the panel. Preferably, the bonded area can be 10% to 60% of the panel area. Preferably, the glued area can be 20% to 40% of the panel area. In some embodiments, the glue cannot be used between the panels and the transfer layer, so the efficiency of the vibration transfer may be different than when using the glue and the sound quality may change. In a specific embodiment, the vibration modes of the osteoconductive headset components can be changed by changing the way the glue is used, thereby altering the sound producing and transmitting effects. In addition, the properties of the glue, such as hardness, shear strength, tensile strength and ductility, etc., can also affect the sound quality of the osteoconductive headset. Preferably, the tensile strength of the glue may not be less than 1MPa. Most preferably, the tensile strength cannot be less than 2MPa. Most preferably, the tensile strength cannot be less than 5MPa. Preferably, the elongation at break can vary between 100% and 500%. More preferably, the elongation at break can vary from 200% to 400%. Preferably, the shear strength of the glue cannot be less than 2 MPa, and more preferably, not less than 3MPa. Preferably, the Shore hardness of the glue can be 25 to 30, more preferably, 30-50. The glue can include one type of glue or a combination of various types of glue with different properties. The connection force between the panel and the glue or between the glue and the plastic can also be limited in a certain range, for example, but not limited to, 8MPa-14MPa. It should be noted that the materials of the vibration transfer layer may include, but are not limited to, silica, plastic or other materials with a certain biological absorption, flexibility and chemical resistance. Those skilled in the art can also choose glue with different types and properties, panel materials and vibration transfer layer materials according to practical requirements, which can determine the sound quality to some extent.

[086] Figure 6 is the specific embodiment that illustrates the means of connecting components of the vibration generating portion of the osteoconductive headset. The transducer can be connected to the housing element 620, the panel 630 can be attached to the vibration transfer layer 640 using the glue 650 and the edges of the vibration transfer layer 640 can be connected to the housing 620. In different embodiments , the frequency response can be altered by changing the distribution, hardness and quantity of the 650 glue, or by changing the hardness of the 640 vibration transfer layer, thereby altering the sound quality. Preferably, there may be no glue between the panel and the vibration transfer layer. More preferably, there may be glue completely applied between the panel and the vibration transfer. More preferably, there may be partially applied glue between the panel and the vibration transfer layer. Even more preferably, the area of glue application between the panel and the vibration transfer cannot be greater than the area of the panel.

[087] Those skilled in the art can decide the amount of the glue according to practical requirements. In one embodiment, as shown in figure 7, the frequency response can be affected by different means of connection using glue. Three curves can correspond to frequency responses under different amounts of glue between the vibration transfer layer and the panel: without glue, partially applied and fully applied, respectively. It can be concluded that the resonance frequency of the osteoconductive headset can be shifted to a lower frequency domain when no glue is applied or little glue is applied between the vibration transfer layer and the panel, in relation to the situation in that the glue is fully applied between the vibration transfer layer and the panel. The connection of the glue between the vibration transfer layer and the panel can indicate the effect of the vibration transfer layer on the vibration system. Thus, the frequency response curve can be changed by varying the glue connection. [088] Those skilled in the art can adjust and modify the connection mode and amount of glue according to the practical requirements of frequency responses, thus improving the sound quality of the system. Likewise, in another embodiment, figure 8 shows the impacts of vibration transfer layers with different hardness on the vibration response curves. The solid line is a response curve corresponding to the osteoconductive headset with a more difficult vibration transfer layer, the dotted line is the response curve corresponding to the osteoconductive headset with a softer transfer layer. It can be concluded that the vibration transfer layers with different hardness can lead to different frequency responses of the osteoconductive headset. The greater the hardness of the vibration transmission layer, the more high frequency vibrations can be transmitted; the lower the hardness of the vibration transmission layer, the more low frequency vibrations can be transmitted. The vibration transfer layers with different materials (not limited to silica, plastic, etc.) can achieve different sound qualities. For example, a vibration transfer layer of the osteoconductive headset made of 45 degree silica gel may have a better high frequency sound effect and a vibration transfer layer of the osteoconductive headset made of 45 degree silica gel. 75 gram silica can have a better low-frequency sound effect. As used here, the low frequency sound refers to the sound frequency below 500 Hz, an intermediate frequency refers to the frequency of the sound that is in the range 500Hz to 4000Hz, the high frequency sound refers to at a sound frequency above 4000Hz.

[089] Of course, the above description of the vibration transfer layer and the glue is just one embodiment that affects the sound quality of the osteoconductive headset and should not be considered as the only possible embodiment. Apparently, those skilled in the art, after understanding the basic principles of the sound quality of the osteoconductive headset, can adjust and modify the elements and means of connection of the vibration generating portion of the osteoconductive headset without deviating. of the principles, but these adjustments and modifications are still within the scope of the above descriptions. For example, the vibration transfer layer can be made of any type of materials or be customized according to the user's usage habit. Paste with different hardness after curing between the vibration transfer layer and the panel can influence the sound quality of the osteoconductive headset. In addition, increasing the thickness of the vibration transfer layer can have an equivalent effect as increasing the mass of the vibration system, which can also decrease the resonance frequency of the system. Preferably, the thickness of the transfer layer can be from 0.1 mm to 10 mm. More preferably, the thickness can be from 0.3 mm to 5 mm. Preferably, the thickness can be from 0.5 mm to 3 mm. And still preferably, the thickness can be from 1 mm to 2 mm. The tensile strength of the transfer layer, viscosity, hardness, tear resistance, elongation, etc., can also have an impact on the sound quality of the system. The tensile force refers to the force required to tear a unitary area of a vibration transfer layer sample. Preferably, the tensile strength may be 3.0 MPa-13 MPa. Most preferably, the tensile strength can be 4.0MPa-12.5MPa. Preferably, the tensile strength can be 8.7 MPa-12MPa. Preferably, the Shore hardness of the transfer layer can be 5 to 90, more preferably 10-80, and most preferably 20-60. Elongation of the transfer layer refers to increasing the percentage of the transfer layer in relation to the original length when the transfer layer breaks. Preferably, the elongation can be 90% -1200%. More preferably, the elongation can be from 160% to 700%. More preferably, the elongation can be 300% -900%. The tear force refers to a resistance force to prevent a notch or a notch in the transfer layer from expanding when an external force is applied to the transfer layers. Preferably, the tear strength can be 7kN / m-70kN / m. More preferably, the tear strength can be 11kN / m-55kN / m. More preferably, the tear strength can be 17kN / m-47kN / m.

[090] In some embodiments, the connector between the transducer and the housing element may be a flexible connector. Connector materials may include, without limitation, steel (for example, but not limited to, stainless steel, carbon steel, etc.), light alloy (for example, without limitation, aluminum alloys, beryllium, magnesium, titanium alloys , etc.), plastic (for example, but not limited to, polyethylene, blow molding nylon, plastic, etc.), can also be a single material or composite materials that have the same performance. Composite materials can include, but are not limited to, reinforced materials, such as glass fibers, carbon fibers, boron fibers, graphite fibers, graphene fibers, silicon carbide fibers, aramid fibers or the like. Composite materials can also be other organic and / or inorganic composite materials, such as various types of glass fiber reinforced by unsaturated polyester and epoxy, glass fiber with phenolic resin matrix. [091] The thickness of the connector cannot be less than 0.005 mm, preferably 0.005 mm - 3 mm, more preferably 0.01 mm-2 mm, preferably 0.01 mm -1 mm, and still preferably 0.02 mm at 0.5mm. The connector may have an annular structure, preferably containing at least one annular ring, and preferably containing at least two annular rings. The ring can be a concentric ring or a non-concentric ring and can be connected to each other by means of at least two rods that converge from the outer ring to the center of the inner ring. More preferably, there can be at least one oval ring. More preferably, there can be at least two oval rings. The different oval rings can have different radii of curvature, and the oval rings can be connected to each other through rods. More preferably, there can be at least one square ring. The structure of the connector can be in the form of a plate. The hollow patterns can probably be configured on the board. Most preferably, the areas of the hollow patterns may not be less than the area of the non-hollow portion of the connector. It should be noted that the materials, structures and thicknesses of the connector described above can be combined in any way to obtain different connectors. For example, the annular connector can have different thickness distributions. Preferably, the thickness of the ring can be equal to the thickness of the rod. More preferably, the thickness of the rod may be greater than the thickness of the ring. More preferably, the thickness of the inner ring may be greater than the thickness of the outer ring.

[092] The above description of the vibration transfer from the osteoconductive headset is merely a specific embodiment, it cannot be considered as a single viable implementation. Apparently, those skilled in the art, after understanding the basic principle of the osteoconductive headset, can make several modifications and changes in the types and details of the vibrations in the osteoconductive headset, but these changes and modifications are still in the scope described above. . For example, an implantable osteoconductive aid can come into direct contact with the bones directly and transmit sound vibrations directly to the bone, without going through the skin or subcutaneous tissue, which can prevent attenuation and changes in the frequency response caused by the skin or by the subcutaneous tissue in the vibration transformation process. As another example, in some application scenarios, teeth can be used to conduct sound, which indicates that an osteoconductive device can come into contact with the teeth and transmit sound vibrations to the surrounding bones and tissues through the teeth, reducing thus the effect of the skin on the frequency response during a vibration process. The above description of the osteoconductive headset applications is just a specific embodiment, those skilled in the art, after understanding the basic principle of the osteoconductive speaker, can use the osteoconductive headset in different scenarios. The sound transfer in the application scenarios can be partially changed according to the description above, but these changes will still be in the description above.

[093] In step 104, the quality of the sound that a person feels can also be related to their auditory system. Different people may have different sensitivities for sound with different frequencies. In some embodiments, the level of sensitivity to sound at different frequencies can be shown on a curve of equal intensity. Some people may not be sensitive to the sound signals in a specific frequency range, so the curve of equal loudness may indicate that a response intensity of the corresponding frequency may be less than the response intensities of other frequencies. For example, some people may not be sensitive to high frequency sound signals, the intensity of the high frequency response may be less than the response intensity of the sound signals from other frequencies. Some people may not be sensitive to low frequency sound signals, the intensity of the low frequency response may be less than the response intensity of sound signals from other frequencies. As used here, the low frequency sound refers to a sound with a frequency below 500 Hz, the intermediate frequency sound refers to a sound with a frequency of 500Hz to 4000Hz s, the high frequency sound refers to sound with a frequency higher than 4000Hz.

[094] Of course, the low frequency and the high frequency of sound can be relative, for some special people, their auditory system may have different responses to sound with different frequency ranges. Changing or selectively adjusting the sound intensity distribution within the corresponding frequency ranges generated by the osteoconductive headset, can provide different hearing experiences for special people. It should be noted that the sound signals discussed above with a high frequency, an intermediate frequency or a low frequency can be used to describe the hearing intervals of a normal person, it can also be used to describe the sound intervals of nature that a headset needs to transmit.

[095] In one embodiment, the equal intensity of certain people's hearing systems can be curve 3 as shown in figure 10. A point near peak A may indicate that these people may be more sensitive to sound at the frequency corresponding to point A than other points with different frequencies (for example, point B, as shown in figure 10). The frequencies that may be insensitive to the human auditory system can be compensated by designing the osteoconductive headset. Curve 4 can be a frequency response curve compensated in relation to curve 3, a resonance peak can appear near point B. The frequency response curve 4 generated by the osteoconductive headset can be combined with the frequency response 3 when sound is received by the ear, which can make the sound a person hears more ideal and much wider in the frequency range. In some ways, the frequency at point A can be around 500Hz, the frequency at point B can be around 2000Hz. It should be noted that the above embodiments to compensate for certain frequencies of the osteoconductive headset cannot be considered as the only viable embodiment, those skilled in the art, after understanding the principles, can establish appropriate peak values and the way to compensate frequencies according to practical applications.

[096] Apparently, those versed in the technique, after understanding the basic principles of the osteoconductive headset, can make several modifications and changes in the types and details of the vibrations in the osteoconductive headset, but these changes and modifications will still be in place. scope described above. For example, the frequency response compensation method of the osteoconductive headset as described above can also be applied to an osteoconductive hearing aid. For people with hearing impairment, it can compensate for insensitivity to the specific frequency range by creating one or more types of frequency response characteristics of the osteoconductive hearing aid. In practical applications, osteoconductive hearing aids can intelligently select or adjust frequency responses according to user input. For example, the system can automatically obtain the equal-loudness curve from the user or the user can enter its equal-loudness curve, so the system can compensate for the specific frequency responses of the osteoconductive headset based on the equal-loudness curve. In one embodiment, for points with less intensity on the curve of equal loudness (for example, a minimum point on the curve), the amplitude of the frequency response of the osteoconductive headset close to the point can be increased in order to obtain the quality of desired sound. Likewise, for points with greater intensity on the curve of equal loudness (for example, a maximum point on the curve), the amplitude of the frequency response of the osteoconductive headset close to the point may be decreased. In addition, there may be multiple maximum points or minimum points on the frequency response curve or the curve of equal loudness as described above, the corresponding compensation curve (frequency response curve) may also have multiple maximum or minimum values. For those skilled in the art, the above descriptions relating to hearing sensitivity, the "equal sound curve" can be replaced by similar words, such as "volume curve", "auditory response curve", etc. In fact, auditory sensitivity can also be considered as a sound frequency response, in the descriptions of various embodiments of the present description, the sound quality of the osteoconductive headset can be obtained by combining the sensitivity of man with the sounds and the frequency response of the osteoconductive headset.

[097] In general, the sound quality of an osteoconductive headset can be affected by several factors, such as the physical properties of the components, the vibration transfer ratio between the components, the vibration transfer ratio between the headset and the external environment, vibration transfer efficiency of the vibration transfer system or similar. The components of the osteoconductive headset may include a vibration generating element (such as a transducer), elements for attaching the headset (such as a headset / headphone strap), vibration (such as the panel and the vibration transfer layer). The vibration transfer relationships between the components and between the headset and the external environment can be determined by the way the headset is in contact with a user (such as clamping force, contact area, form of contact).

[098] Figure 11 is an equivalent diagram that illustrates the vibration generation and vibration transfer system of the osteoconduction converter. The equivalent system of an osteoconductive headset can include fixed ends 1101, a sensor terminal 1102, a vibration unit 1103 and a transducer 1104. Fixed ends 1101 can be connected to the vibration unit 1103 via the transfer ratio K1 (ie K4 in figure 4), sensor terminal 1102 can be connected to vibration unit 1103 via transfer ratio K2 (ie R3 and K3 in figure 4), vibration unit 1103 can be connected with transducer 1104 through transfer ratio K3 (R4, K5 in figure 4).

[099] The 1103 vibration unit can include the panel and the transducer. The transfer ratios K1, K2 and K3 can be used to describe the relationships between the corresponding components in the equivalent osteoconductive headset system (described in detail below). The vibration equations of the equivalent system can be expressed as: [0100] Equation 8: [0102] where m3 is an equivalent mass of the vibration unit 1103; m4 is an equivalent mass of transducer 1104; x3 is an equivalent displacement of the vibration unit 1103; x4 is an equivalent displacement of transducer 1104; k3 is an equivalent elastic coefficient between the sensor terminal 1102 and the vibration unit 1103; k4 is an equivalent elastic coefficient between the fixed ends 1101 and the vibration unit 1103; k5 is an equivalent elastic coefficient between transducer 1104 and vibration unit 1103; R3 is equivalent damping between sensor terminal 1102 and vibration unit 1103; R4 is equivalent damping between transducer 1104 and vibration unit 1103; f3 and f4 are forces of interaction between vibration unit 1103 and transducer 1104.

[0103] The equivalent amplitude of the A3 vibration unit is given by Equation 10.

[0104] Equation 10: [0105] Where: f0 denotes a driving force of the unit; ω denotes a vibration frequency. Factors affecting the frequency response of the osteoconductive headset may include the generation of vibration (including, but not limited to, the vibration unit, the transducer, the housing element and the connection between them, such as M3, M4, K5, R4 in formula (10)), the transfer of vibration (including, but not limited to, skin contact, the properties of the headset support / headset strap, such as K3, K4, R3 on formula (10)). The frequency response and sound quality of the osteoconductive headset can also be affected by changing the structure of each component and parameters of the connections between each component of the osteoconductive headset, for example, changing the size of the clamping force it can be equivalent to changing K4, changing the glue connection can be equivalent to changing R4 and K5, changing the hardness, elasticity, cushioning of relevant materials can be equivalent to changing K3 and R3.

[0106] In one embodiment, the location of the fixed ends 1101 can refer to relatively fixed points or areas at some locations in the vibration process, these points or areas can be considered as the fixed ends. The fixed ends can consist of certain components, or they can also be determined by the structure of the osteoconductive headset. For example, the osteoconductive headset can be suspended, attached or absorbed around a man's ear, or it can fit on a man's skin through a special design for the structure or appearance of the osteoconductive headset. .

[0107] Sensor terminal 1102 can be a person's hearing system for receiving sound signals. The 1103 vibration unit can be used to protect, support and connect the transducer. The vibration unit 1103 can include a vibration transfer layer to transmit vibrations to a user, a panel that contacts a user directly or indirectly, and a housing element to protect and support other vibration generating components. Transducer 1104 can generate sound vibrations.

[0108] The K1 transfer ratio can connect the fixed ends 1101 and the vibration unit 1103, showing the vibration transfer relationship between the fixed ends and the vibration generating portions. K1 can be determined based on the shape and structure of the osteoconductive headset. For example, the osteoconductive headset can be attached to a man's head by a U-shaped headset holder / headset strap. The osteoconductive headset can also be configured in a helmet, a fire mask or a specific mask, glasses or the like. Different structures and shapes of the osteoconductive headset can have an effect on the K1 transfer ratio, in addition, the structure of the osteoconductive headset can include materials, mass, etc., from different parts of the osteoconductive headset. The transfer interface K2 can connect the sensor terminal 1102 and the vibration unit 1103.

[0109] K2 may depend on components of the transfer system. The transfer may include, without limitation, the transfer of sound through a user's tissue to the user's hearing system. For example, when sound is transferred to the auditory system through the skin, subcutaneous tissues, bones, etc., the physical properties of various parts and relationships of mutual connection between the various parts can impact K2. In addition, the vibration unit 1103 can come into contact with fabrics, in various embodiments, the contact surfaces can be layers of vibration transfer or side surfaces of the panel, the shapes and sizes of the contact surface, the force between the vibration unit 1103 and the tissues can influence the transfer coefficient K2.

[0110] The transfer coefficient K3 between the vibration unit 1103 and the transducer 1104 may depend on connection properties within the vibration generating unit of the osteoconductive headset. The transducer and the vibration unit can be connected rigidly or flexibly, or changing the relative positions of the connector between the vibration unit and the transducer can affect the transducer to transfer vibrations to the vibration unit, especially the transfer efficiency of the panel, thus affecting the K3 transfer ratio.

[0111] When using the osteoconductive headset, the process of generating and transferring sound can affect the quality of the sound a user feels. For example, the fixed ends, the sense terminal, the vibration unit, the transducer and the transfer ratio K1, K2 and K3, etc., mentioned above can have an impact on the sound quality. It should be noted that K1, K2 and K3 are only descriptions for the connection modes involved in different parts of the device or the system may include, but is not limited to, the physical connection mode, force conduction mode, transfer efficiency, sound, etc.

[0112] The description of the equivalent osteoconductive headset system is merely a specific embodiment, it should not be considered as the only viable embodiment. Apparently, those skilled in the art, after understanding the basic principles of the osteoconductive headset, can make several modifications and changes in the types and details of the vibrations in the osteoconductive headset, but these changes and modifications will still be in the scope described. above. For example, K1, K2 and K3 described above can refer to simple vibrations or mechanical transfer modes, or they can also include complex non-linear transfer systems. Transfer relationships can be formed by directional connections between each portion, or they can be transferred in unrelated ways.

[0113] Figure 12 is a structure diagram showing an osteoconductive headset in accordance with some embodiments of the present description. As shown in the figure, the osteoconductive headset can include a headset holder / headset strap 1201, a vibration unit 1202 and a transducer 1203. The vibration unit 1202 can include a contact surface 1202a and a housing element 1202b. Transducer 1203 is fitted inside the vibration unit 1202 and connects to it. Preferably, the vibration unit 1202 can further include a panel and a vibration transfer layer which can be described above, and the contact surface 1202a can be the surface in contact with the vibration unit 1202 and a user. More preferably, the contact surface 1202a can be the outer surface of the vibration-conducting layer.

[0114] During use, the osteoconductive headset can be attached to some special parts of a user's body, for example, on the head, through the headset holder / headset strap 1201, which provides clamping force between the 1202 vibrating unit and the user. Contact surface 1202a can connect to transducer 1203 and maintain contact with a user to transfer vibrations to the user. A relatively fixed position when the osteoconductive headset works, can be selected as a fixed end 1101 as illustrated in figure 11. In some embodiments of the present description, the osteoconductive headset has a symmetrical structure and driving forces provided by two-sided transducers are the same and opposite, and the midpoint of the headphone / headband holder can be selected as an equivalent fixed end according to, for example, a 1204 position. In some other ways In practice, the driving forces provided by the transducers on two sides are uneven, in other words, the osteoconductive headset generates stereo, or the osteoconductive headset has an asymmetric structure, and another point or area of connecting / disconnecting the headphone / headband holder can be chosen as the equivalent fixed end. The fixed end described here can be a relatively fixed equivalent end when the osteoconductive headset works. The fixed end 1101 and the vibration unit 1202 can be connected by the headphone / headband holder 1201, and the transition ratio K1 can refer to the headphone / headband holder 1201 and the clamping force provided by the headset holder / headset strap 1201, which depends on the physical properties of the headset holder / headset strap 1201. Preferably, the variable physical parameters of the headset holder headset / headset strap 1201, for example, clamping force, weight or the like, can alter the sound transmission efficiency of the osteoconductive headset and can affect the frequency response in the specific frequency range. For example, the headset holder / headset strap with material of different intensity can provide different clamping forces. The variation in the structure of the headset support / headset strap, for example, when adding the auxiliary device with elastic force can also change the clamping force, thus affecting the efficiency of sound transmission. Different sizes of the headset holder / headset strap can also affect the clamping force, which increases as the distance between two vibration units decreases.

[0115] In order for the headset support / headset strap to obtain a certain clamping force, those skilled in the art can make variations or modifications based on real situations, such as choosing materials with different stiffness, module or size variable of the headset / headband support under the teaching of this disclosure. It should be noted that the variable clamping force can affect not only the efficiency of sound transmission, but also the user experience in the lower frequency range. The clamping force described here refers to the pressure between a contact surface and a user. Preferably, the clamping force is between 0.1N-5N. More preferably, the clamping force ranges from 0.1 N to 4 N. More preferably, the clamping force ranges from 0.2 N to 3 N. More preferably, the clamping force ranges from 0.2 N to 1.5 N. And preferably, the clamping force ranges from 0.3 N at 1.5 N.

[0116] The clamping force of the headset holder / headset strap can be determined by materials. Preferably, the materials used in the headset support / headset strap may include plastic with a certain hardness, for example, acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene ( PP), Polyethylene (PE), Polycarbonate (PC), Polyamides (PA), polyvinyl polymer (PVC), polyurethane (PU), polyethylene (PE), polymethylmethacrylate (PMMA), Polyetheretherketone (PEEK), formaldehyde melamine (MF) or similar, or any combination thereof. More preferably, the materials for the headphone / headband holder may include metal, alloy (e.g. aluminum alloy, chromium-molybdenum alloy, scandium alloy, magnesium alloy, titanium alloy, alloy magnesium-lithium, nickel alloy) or similar, etc. In addition, the materials of the headset holder / headset strap may include memory materials. Memory materials may include, but are not limited to, memory alloy, memory polymer, inorganic memory material, etc. The memory alloy can include titanium-nickel-copper memory alloy, titanium-nickel-iron memory alloy, titanium-nickel-chromium memory alloy, copper and nickel-based memory alloy, memory-based alloy copper and aluminum, memory alloy based on copper and zinc, memory alloy based on iron, etc. The memory polymer can include, but is not limited to, polynorbornene, trans-polyisoprene, styrene-butadiene, cross-linked polyethylene, polyurethanes, lactones, fluorine-containing polymers, polyamides, cross-linked polyolefin, polyester, etc. Inorganic memory material may include, without limitation, memory ceramics, memory glass, garnet, mica, etc. In addition, the memory material may have selected the memory temperature. Preferably, the memory temperature cannot be less than 10 ° C. Most preferably, the memory temperature cannot be less than 40 ° C. Most preferably, the memory temperature cannot be less than 60 ° C. Preferably, the memory temperature cannot be less than 100 ° C. The percentage of memory material in the headset holder / headset strap cannot be less than 5%. Most preferably, the percentage cannot be less than 7%. Most preferably, the percentage cannot be less than 15%. Most preferably, the percentage cannot be less than 30%. Preferably, the percentage cannot be less than 50%. The headphone / headband holder here refers to the structure that is behind and that provides clamping force for the osteoconductive headset. The memory materials may be in locations other than the headset support / headset strap. Preferably, the memory material may be in the centralized pressure location of the headset support / headset strap, for example, but not limited to, in joints between the headset support / headset strap and the vibration unit, symmetrical center of the earphone holder / strap, or in a location where the lines inside the earphone holder / earphone strap have been intensively distributed. In some embodiments, the headset support / strap can be made of memory alloy, this reduces the difference in grip strength for different users and improves the consistency of tone quality that is affected by the grip strength. In some embodiments, the earphone holder / strap can be made of a sufficiently elastic memory alloy, thus being able to recover its original shape after a major deformation and, in addition, it can maintain the clamping force evenly after a long deformation. In some embodiments, the headset / headset strap made of memory alloy can be light enough and flexible enough to provide great distortion and distortion and be better coupled to a user.

[0117] The lamp force provides pressure between the surface of the vibration generating portion of the osteoconductive headset and a user. Figure 13-A and figure 13-B are embodiments to illustrate vibration response curves with different pressures between the contact surface and a user. The clamping force below a certain threshold may not be suitable for transmitting high frequency vibration. As illustrated in figure 13-A, for the same source of vibration (sound source), the intermediate frequency and high frequency vibration (sound) received by the user when the clamping force is 0.1N can be less than 0.2N and 1.5N. That is, the effect of the intermediate frequency and the high frequency parts at 0.1N may be weaker than those from 0.2N to 1.5N. Likewise, the clamping force above a certain threshold may not be suitable for transmitting low frequency vibration. As illustrated in figure 13-B, for the same source of vibration (sound source), the intermediate frequency and low frequency vibration (sound) received by the user when the clamping force is 5.0N can be less than 0 , 2N and 1.5N. That is, the effect of the low frequency part in 5.0N may be weaker than that of 0.2 N to 1.5 N.

[0118] In some embodiments, the pressure between the contact surface and the user can be maintained in a certain range, based on both the appropriate choice of the headset support material / headset strap and an appropriate structure headphone / headband support bracket. The pressure between the contact surface and the user can be greater than a threshold. Preferably, the threshold is 0.1 N. Most preferably, the threshold is 0.2 N. More preferably, the threshold is 0.3 N. And preferably, the threshold is 0.5 N. For those skilled in the art, a number of modifications and changes can be deduced for the materials or the structure of the headset support / headset strap in light of the principle that the clamping force provided by the headset osteoconduction alters the frequency responses of the osteoconduction system, and a range of clamping force that satisfies the different tone quality requirements can be defined. However, these modifications and changes are not outside the scope of this description.

[0119] The clamping force of the osteoconductive headset can be tested with certain devices or methods. Figure 14-A and Figure 14-B illustrate an exemplary embodiment of testing the clamping force of the osteoconductive headset. Point A and point B can be close to the head unit / headband vibration unit of the osteoconductive headset. In the testing process, one of points A or B can be corrected, and another of points A or point B, except the fixed point, can connect a force gauge. When a distance between point A and point B is in the range of 125mm ~ 155mm, the clamping force can be obtained. Figure 14-C illustrates three frequency vibration response curves corresponding to different clamping forces of the osteoconductive headset. The clamping forces corresponding to the three curves can be 0N, 0.61N and 1.05N, respectively. FIG 14-C shows that the loads on the osteoconductive headset vibration unit, which can be generated by a user's face, can be greater with an increasing clamping force of the osteoconductive headset, and the vibrations of vibration area can be reduced. An osteoconductive headset with too little clamping force or too great clamping force can lead to an irregularity (for example, a range of 500Hz to 800Hz in curves corresponding to 0N and 1.05N, in retrospect) in the response of frequency during vibration. If the clamping force is too great (for example, the curve corresponding to 1.05N), a user may feel uncomfortable, the vibrations from the osteoconductive headset may be reduced and the volume may be reduced; if the clamping force is too small (for example, the curve corresponding to 0N), a user may experience more obvious vibrations from the osteoconductive headset.

[0120] It should be noted that the above descriptions about changing the clamping force of the osteoconductive headset are provided for illustration purposes only and should not be the only viable embodiments. It should be evident that, for those skilled in the art, several variations can be made in changing the clamping force of the osteoconductive headset in light of the principles of osteoconduction. However, these variations are not outside the scope of the present description. For example, materials with memory can be used in the headset for the osteoconductive headset, which can allow the osteoconductive headset to have a radian to accommodate different user heads, can have good elasticity, can increase comfort when wearing the osteoconductive headset, and can facilitate adjustment of the clamping force. In addition, an elastic band 1501 used to adjust the clamping force can be installed on the headset of the osteoconductive headset, as shown in figure 15, the elastic band can provide additional recovery force when the headphone / headphone strap is compressed or stretched out of balance.

[0121] The transfer rate K2 between the sensor terminal 1102 and the vibration unit 1103 can also affect the frequency response of the osteoconduction system. The volume of sounds heard by a user's ear depends on the energy received by a user's cochlea. Energy can be affected by several parameters during transmission, which can be expressed by the following equation 11. [0122] Equation 11: [0123] where P is linear for the energy received by the cochlea; S is a contact area between the contact surface 502a and a user's face; α is a dimension change coefficient f (a, R] denotes an effect of an acceleration α of a point on the contact surface and tightening R of contact between the contact surface and the skin of a user in the transmission of energy; L refers to the damping of any contact points in the mechanical wave transmission, that is, a transmission impedance for an area of the unit.

[0124] In terms of (11), the transmission impedance L can have impacts on the sound transmission and the vibration transmission efficiency of the osteoconduction system can be related to the transmission impedance L. The frequency response curve of the Osteoconduction system can be a superposition of frequency response curves from multiple points on the contact surface. Factors that change impedance can include a size of the energy transmission area, a shape of the energy transmission area, the roughness of the energy transmission area, a pressure on the energy transmission area or a distribution of the transmission area of energy, pressure on the area of transmission of energy, etc. For example, the effect of sound transmission can vary by changing the structure and shape of the 1202 vibration unit, thereby changing the sound quality of the osteoconductive headset. Simply as an example, the sound transmission effect can be changed by changing the corresponding physical characteristics of the contact surface 1202a of the vibration unit 1202.

[0125] Apparently, those versed in the technique, after understanding the basic principles of the osteoconductive headset, can make several modifications and changes in steps and details of the contact surface of the osteoconductive headset, but these changes and modifications still are within the scope described above. For example, the number of convex portions and concave portions cannot be limited to Figure 17, and changes made to convex portions, concave portions or contact surface patterns may still be within the description above. In addition, the contact surfaces of at least one vibration unit of the osteoconductive earpiece may have the same or different shapes or materials. The effects of vibrations transferred through different contact surfaces may differ due to the properties of the contact surfaces, which can result in different sound effects.

[0126] As shown in figure 11, the vibration mode of transducer 1104 in the osteoconductive headset vibration system and the K3 connection means between transducer 1104 and vibration unit 1103 can also have an impact on the effect of system sound. Preferably, the transducer may include a vibrating plate, a vibrating conducting plate, a coil set and a magnetic circuit system. Most preferably, the transducer may include a vibration device combined with a plurality of vibration plates and conductive vibration plates. The frequency response of the system to generate sounds can be influenced by the physical properties of the vibration plates and the vibration conductive plates, and vibration plates and vibration conductive plates with specific sizes, shapes, materials, thicknesses and modes for vibration transmission. , etc., can be selected to meet actual requirements.

[0127] Figures 18-B and 18-A are embodiments of the combined vibration device, which may include a combined vibration component consisting of a 1801 vibrating conductor plate and a 1802 vibrating plate. The 1801 vibrating conductive plate it can be configured as a first ring 1813, which can be configured with three first rods 1814 that converge to the center of the first ring and the center of convergence of the first three rods can be fixed in the center of the first ring. The center of the vibration plate 1802 can include grooves 1802 suitable for the center of convergence and the first three rings 1813. The vibration plate 1802 can be configured with a second ring 1821 and three second rods 1822. The radius of the second ring 1821 can be different from the vibrating conductor plate 1801. The thickness of the second rods 1822 can be different from the first rods 1814. The first rods 1814 and the second rods 1822 can be mounted interlaced, but not limited to an interlaced angle of 60 degrees.

[0128] The first rods and the second rods can be straight rods or other shapes that satisfy specific requirements, and there can be more than two rods symmetrically or asymmetrically to satisfy economic or practical requirements. The 1801 vibrating conductor plate can be thin and elastic. The vibration conductor plate 1801 can be arranged in the center of the groove 1820 of the vibration plate 1802. A voice coil 1808 can be configured under the second ring 1821 connected to the vibration plate 1802. The combined vibration unit can also include a plate base 1812 on which an 1810 ring magnet is configured. An internal magnet 1811 can be configured concentric within the annular magnet 1810; an internal magnetic flux conduction plate can be configured on the upper surface of the internal magnet 1811 and an annular magnetic flux conduction plate 1807 can be configured on the 1810 annular magnet. A gasket 1806 can be fixed on the upper part of the conductive plate ring. magnetic flux 1807 and the first ring 1813 of the 1801 vibrating conductor plate can be connected with the 1806 gasket. The entire composite vibration unit can be connected to external components or users via the 1830 panel. The combined vibration device can come into contact contact with external components through an 1830 panel, the 1830 panel can be fixed in the center of convergence and be tightened in the center of the 1801 vibrating conductor plate and the 1802 vibrating plate.

[0129] The combined vibration unit made up of the vibration plate and the vibration conducting plate can lead to two resonance peaks as shown in figure 19 due to the superposition of vibrations from two sources of vibration. The resonance peaks can be offset by adjusting sizes, materials or other parameters of the two components. A resonance peak within a low frequency can change in a direction with lower frequencies, and a resonance peak with a high frequency can change in a direction with higher frequencies. Preferably, the stiffness of the vibrating plate may be greater than that of the vibrating conducting plate. Under ideal conditions, a smooth frequency response can be obtained, which is illustrated as a dotted curve in figure 19. These resonance peaks can be adjusted within a frequency range that can be captured by human ears, or a frequency range that A person's ears cannot hear. Preferably, the two resonance peaks may be outside the frequency range that a person can hear. Most preferably, one resonance peak may be within the frequency range that can be captured by human ears, and another peak may be outside the frequency range that a person can hear. Most preferably, the two resonance peaks can be within the frequency range that can be captured by human ears. More preferably, the two resonance peaks may be within the frequency range that can be captured by human ears, and the peak frequency may be in the range 80Hz-18000Hz. More preferably, the two resonance peaks can be within the frequency range that can be captured by human ears, and the peak frequency can be in the range of 200Hz-15000Hz. Most preferably, the two resonance peaks can be within the frequency range that can be captured by human ears, and the peak frequency can be in the range of 500Hz to 12000Hz. More preferably, the two resonance peaks can be within the frequency range that can be captured by human ears, and the peak frequency can be in the range 800Hz to 11000Hz. There may be a distance between the frequency values of the resonance peaks. For example, the distance between the frequency values of the two resonance peaks can be at least 500Hz, preferably 1000Hz, more preferably 2000Hz; and more preferably, 5000Hz. To achieve a better effect, the two resonance peaks can be within the frequency range that can be captured by human ears, and the discrepancy between the peak value of the two resonance peaks can be at least 500Hz. Preferably, the two resonance peaks can be within the frequency range that can be captured by human ears and the distance between the frequency values of the two cooling peaks can be at least 1000Hz. More preferably, the two resonance peaks can be within the frequency range that can be captured by human ears and the distance between the frequency values of the two resonance peaks can be at least 2000 Hz. More preferably, the two resonance peaks can be in the frequency range that can be captured by human ears and the distance between the frequency values of the two resonance peaks can be at least 3000 Hz. More preferably, the two resonance peaks can be within of the frequency range that can be captured by human ears and the distance between the frequency values of the two resonance peaks can be at least 4000Hz. One resonance peak may be within the frequency range that can be captured by human ears, another may be outside the frequency range that a person can hear, and the distance between the frequency values of the two resonance peaks may be at least 500Hz. Preferably, one resonance peak may be in the frequency range that can be captured by human ears, another may be outside the frequency range that a person can hear, and the distance between the frequency values of the two resonance peaks may be at least 1000Hz. More preferably, one resonance peak may be within the frequency range that can be captured by human ears, another may be outside the frequency range that a person can hear, and the distance between the frequency values of the two resonance peaks may be at least 2000Hz. Most preferably, one peak response may be within the frequency range that can be captured by human ears, another may be outside the frequency range that a person can hear, and the distance between the frequency values of the two resonance peaks may be at least 3000Hz . More preferably, one resonance peak may be within the frequency range that can be captured by human ears, another may be outside the frequency range that a person can hear, and the distance between the frequency values of the two resonance peaks may be at least 4000Hz. Both resonance peaks can be within the frequency range of 5Hz-30000Hz, and the distance between the frequency values of the two resonance peaks can be at least 400Hz. Preferably, both resonance peaks can be within the frequency range of 5Hz to 30000Hz, and the distance between the frequency values of the two resonance peaks can be at least 1000Hz. More preferably, the two resonance peaks can be within the frequency range of 5Hz to 30000Hz, and the distance between the frequency values of the two resonance peaks can be at least 2000Hz. More preferably, both resonance peaks can be within the frequency range of 5Hz to 30000Hz, and the distance between the frequency values of the two resonance peaks can be at least 3000Hz. Preferably, the two resonance peaks can be within the frequency range of 5Hz to 30000Hz, and the distance between the frequency values of the two resonance peaks can be at least 4000Hz. Both resonance peaks can be within the 20Hz-20000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 400Hz. Preferably, both resonance peaks can be within the frequency range of 20Hz to 20000Hz, and the distance between the frequency values of the two resonance peaks can be at least 1000Hz. More preferably, both resonance peaks can be within the frequency range of 20Hz-20000Hz, and the distance between the frequency values of the two resonance peaks can be at least 2000Hz. More preferably, the two resonance peaks can be within the frequency range of 20Hz to 20000Hz, and the distance between the frequency values of the two resonance peaks can be at least 3000Hz. Preferably, the two resonance peaks can be in the frequency range of 20Hz to 20000Hz, and the distance between the frequency values of the two resonance peaks can be at least 4000Hz. Both resonance peaks can be within the 100Hz-18000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 400Hz. Preferably, both resonance peaks can be within the frequency range of 100Hz-18000Hz, and the distance between the frequency values of the two resonance peaks can be at least 1000Hz. More preferably, the two resonance peaks can be within the frequency range of 100Hz-18000Hz, and the distance between the frequency values of the two resonance peaks can be at least 2000Hz. More preferably, both resonance peaks can be within the frequency range of 100Hz-18000Hz, and the distance between the frequency values of the two resonance peaks can be at least 3000Hz. Preferably, the two resonance peaks can be within the frequency range of 100Hz to 18000Hz, and the distance between the frequency values of the two resin peaks can be at least 4000Hz. Both resonance peaks can be within the 200Hz-12000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 400Hz. Preferably, the two resonance peaks can be within the frequency range of 200Hz-12000Hz, and the distance between the frequency values of the two resonance peaks can be at least 1000Hz. More preferably, both resonance peaks can be within the 200Hz-12000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 2000Hz. More preferably, both of the two resonance peaks can be within the 200Hz-12000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 3000Hz. Preferably, the two resonance peaks can be within the frequency range of 200Hz to 12000Hz, and the distance between the frequency values of the two resonance peaks can be at least 4000Hz. Both resonance peaks can be within the 500Hz-10000Hz frequency range, and the distance between the frequency values of the two resonance peaks can be at least 400Hz. Preferably, both resonance peaks can be within the frequency range 500Hz to 10000Hz, and the distance between the frequency values of the two resonance peaks can be at least 1000Hz. More preferably, both resonance peaks can be within the frequency range of 500Hz-10000Hz, and the distance between the frequency values of the two resonance peaks can be at least 2000Hz. More preferably, the two resonance peaks can be within the frequency range of 500Hz-10000Hz, and the distance between the frequency values of the two resonance peaks can be at least 3000Hz. Preferably, preferably, the two resonance peaks can be within the frequency range of 500Hz-10000Hz, and the distance between the frequency values of the two resonance peaks can be at least 4000Hz. This can extend the range of the headset's resonance response, thus achieving more ideal sound quality. It should be noted that, in real applications, there may be multiple vibration plates and vibration plates to form multi-layered vibrating structures corresponding to different frequency response ranges, thus obtaining diatonic, full-range, high-vibration vibrations. quality of the headset, or it can cause the frequency response curve to meet the requirements in a specific frequency range. For example, to satisfy the requirements for normal hearing, an osteoconductive hearing aid can be configured with a transducer including one or more vibration plates and vibrating conductive plates with a resonant frequency in the range 100Hz-10000Hz. Descriptions of the combined vibration unit, including a vibration plate and a vibration conducting plate, can be found in Chinese patent application CN201110438083.9, filed on December 23, 2011, entitled “A Bone Conduction Headset and a Composite Vibration Unit ", the contents of which are hereby incorporated by reference.

[0130] As shown in figure 18, in another embodiment, the vibration system may include a vibration plate 2002, a first vibration conductor plate 2003 and a second vibration conductor plate 2001. The first vibration conductor plate 2003 can attach a vibration plate 2002 and the second vibration conductor plate 2001 to a housing element 2019. A combined vibration system including the vibration plate 2002, the first vibration conductor plate 2003, and the second vibration conductor plate 2001 they can lead to at least two resonance peaks and a smoother frequency response curve in the auditory system, thus improving the sound quality of the osteoconductive headset. The equivalent model of the Vibration System can be shown in figure 19-A.

[0131] 2101 is a housing element, 2102 refers to a panel, 2103 is a voice coil, 2104 is a magnetic circuit vibration, 2105 is a first vibrating conductor plate, 2106 is a second vibrating conductor plate vibration and 2107 is a vibration plate. The first vibrating conducting plate, a second vibrating conducting plate and a vibrating plate can be abstracted as components with elasticity and cushioning; a housing element, the panel, a voice coil and the magnetic circuit system can be abstracted as blocks of equivalent mass. [0132] Equation 12: system vibration equation [0133] Equation 13: [0134] Equation 14: [0135] Where: F is a driving force; K6 is an equivalent stiffness coefficient of the second vibration-conducting plate; K7 is an equivalent stiffness coefficient of the vibration plate; K8 is an equivalent stiffness coefficient of the first vibration-conducting plate; R6 is equivalent damping of the second vibration-conducting plate; R7 is an equivalent damping of the vibration plate; R8 is equivalent damping of the first vibration-conducting plate; m5 is a mass of the panel; m6 is a mass of the magnetic circuit system; m7 is a mass of the voice coil; x5 is a displacement of the panel; x6 is a displacement of the magnetic circuit system; x7 is a displacement of the voice coil, and the amplitude of panel 2102 can be: [0136] Equation 15: [0137] where ω is an angular frequency of vibrations; f_0 is a driving force of the unit.

[0138] The vibration system of the osteoconductive headset can transfer vibrations to a user through a panel. According to equation 15, the vibration efficiency can be related to the stiffness coefficients of the vibration plate, the first vibration conductive plate and the second vibration conductive plate and vibration damping. Preferably, the stiffness coefficient of the vibration plate k7 may be greater than the second vibration coefficient k6 and the stiffness coefficient of the vibration plate k7 may be greater than the first vibration factor k8. The number of resonance peaks generated by the vibration system combined with the first vibration conducting plate can be greater than the combined vibration system without the first vibration conducting plate, preferably at least three resonance peaks. More preferably, at least one resonance peak may be outside the range that can be captured by human ears. Most preferably, the resonance peaks can be within the range that can be captured by human ears. More preferably, the resonance peaks can be within the range that can be captured by human ears, and the peak frequency value cannot be greater than 18000Hz. Most preferably, the resonance peaks can be within the range that can be captured by human ears, and the peak frequency value cannot be greater than 100Hz-15000Hz. More preferably, the resonance peaks can be within the range that can be captured by human ears, and the peak frequency value can be no more than 200Hz-12000Hz. Most preferably, the resonance peaks may be within the range that can be captured by human ears, and the peak frequency value may not exceed 500Hz-11000Hz. There may be distances between the frequency values of the resonance peaks. For example, there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of not less than 200Hz. Preferably, there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of not less than 500Hz. More preferably, there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of not less than 1000Hz. More preferably, there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of not less than 2000Hz. More preferably, there can be at least two cooling peaks with a distance from the frequency values between the two resonance peaks of not less than 5000Hz. To achieve a better effect, all resonance peaks can be within the range that can be captured by human ears, and there can be at least two resonance peaks with a distance of frequency values between the two resonance peaks of not less than 500Hz. Preferably, all resonance peaks can be within the range that can be captured by human ears, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of not less than 1000Hz. More preferably, all resonance peaks can be within the range that can be captured by human ears, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of not less than 2000Hz. More preferably, all resonance peaks can be within the range that can be captured by human ears, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of not less than 3000Hz. Most preferably, all resonance peaks can be within the range that can be captured by human ears, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of not less than 4000Hz. Two of the three resonance peaks can be within the frequency range that can be captured by human ears, and another one may be outside the frequency range that a person can hear, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks not less than 500Hz. Preferably, two of the three resonance peaks may be within the frequency range that can be captured by human ears, and another may be outside the frequency range that a person can hear, and there may be at least two resonance peaks within a distance of frequency values between the two resonance peaks of not less than 1000Hz. More preferably, two of the three resonance peaks may be within the frequency range that can be captured by human ears, and another may be outside the frequency range that a person can hear and there may be at least two resonance peaks within range of the values of frequency between the two resonance peaks not less than 2000Hz. More preferably, two of the three resonance peaks may be within the frequency range that can be captured by human ears, and another may be outside the frequency range that a person can hear, and there may be at least two resonance peaks with distances from the values of frequency between the two resonance peaks, not less than 3000Hz. More preferably, two of the three resonance peaks may be within the frequency range that can be captured by human ears, and another may be outside the frequency range that a person can hear and there may be at least two resonance peaks within range of the values of frequency between the two resonance peaks not less than 4000Hz. One of the three resonance peaks may be within the frequency range that can be captured by human ears, and the other two may be outside the frequency range that a person can hear, and there may be at least two resonance peaks within range of the values of frequency between the two resonance peaks not less than 500Hz. Preferably, one of the three resonance peaks can be within the frequency range that can be captured by human ears, and the other two can be outside the frequency range that a person can hear, and there can be at least two resonance peaks with a distance frequency values between the two resonance peaks of not less than 1000 Hz. More preferably, one of the three resonance peaks may be within the frequency range that can be captured by human ears, and the other two may be outside the frequency range that a person can hear, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of not less than 2000Hz. Most preferably, one of the three resonance peaks can be within the frequency range that can be captured by human ears, and the other two can be outside the frequency range that a person can hear, and there can be at least two resonance peaks with a distance frequency values between the two resonance peaks of not less than 3000Hz. More preferably, one of the three resonance peaks can be within the frequency range that can be captured by human ears, and the other two can be outside the frequency range that a person can hear, and there can be at least two resonance peaks within a distance frequency values between the two resonance peaks of not less than 4000Hz. All resonance peaks can be within the frequency range of 5Hz-30000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 400Hz. Preferably, all resonance peaks can be within the frequency range of 5Hz to 30000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 1000Hz. Most preferably, all resonance peaks can be within the frequency range of 5Hz to 30000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 2000Hz. Most preferably, all resonance peaks can be within the frequency range of 5Hz-30000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 3000Hz. Preferably, all resonance peaks can be within the frequency range of 5Hz to 30000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 4000Hz. All resonance peaks can be within the 20Hz-20000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 400Hz. Preferably, all resonance peaks can be within the 20Hz-20000Hz frequency range, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 1000Hz. Most preferably, all resonance peaks can be within the 20Hz-20000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 2000Hz. Most preferably, all resonance peaks can be within the frequency range of 20Hz to 20000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 3000Hz. Preferably, all resonance peaks can be within the frequency range of 20Hz to 20000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 4000Hz. All resonance peaks can be within the 100Hz-18000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 400Hz. Preferably, all resonance peaks can be within the frequency range of 100Hz-18000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 1000Hz. Most preferably, all resonance peaks can be within the frequency range of 100Hz-18000Hz, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 2000Hz. Most preferably, all resonance peaks can be within the frequency range of 100Hz-18000Hz, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 3000Hz. Preferably, all resonance peaks can be within the frequency range of 100Hz-18000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 4000Hz. All resonance peaks can be within the 200Hz-12000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 400Hz. Preferably, all resonance peaks can be within the 200Hz-12000Hz frequency range, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 1000Hz. Most preferably, all resonance peaks can be within the 200Hz-12000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 2000Hz. Most preferably, all resonance peaks can be within the 200Hz-12000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 3000Hz. Preferably, all resonance peaks can be within the 200Hz-12000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 4000Hz. All resonance peaks can be within the 500Hz-10000Hz frequency range, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 400Hz. Preferably, all resonance peaks can be within the 500Hz-10000Hz frequency range, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 1000Hz. More preferably, all resonance peaks can be within the frequency range of 500Hz-10000Hz, and there can be at least two resonance peaks with a distance of the frequency values between the two resonance peaks of at least 2000Hz. Most preferably, all resonance peaks can be within the 500Hz-10000Hz frequency range, and there can be at least two resonance peaks with a distance from the frequency values between the two resonance peaks of at least 3000Hz. Preferably, all resonance peaks can be within the 500Hz-10000Hz frequency range, and there can be at least two resonance peaks with a distance of the frequency values between the two resin peaks of at least 4000Hz. In one embodiment, the combined vibration system including the vibration plate, the first vibration conducting plate and the second vibration conducting plate can lead to a frequency response as shown in figure 19-B. The vibration system combined with the first vibration conductor plate can lead to three obvious resonance peaks, which can improve the sensitivity of the frequency response in the low frequency range (around 600Hz), obtain smoother frequency responses and improve sound quality.

[0139] The resonance peaks can be shifted by changing the parameters of the first vibrating conductive plate, such as size and materials, in order to obtain an ideal frequency response eventually. Preferably, the first vibration-conducting plate can be an elastic plate, and the elasticity can be determined according to the materials, thicknesses, structures or the like. The materials of the first vibration-conducting plate may include, but are not limited to, steel (for example, without limitation, stainless steel, carbon steel, etc.), light alloy (for example, without limitation, aluminum, beryllium copper, magnesium alloy, titanium alloy, etc.), plastic (for example, not limited to polyethylene, blow molding nylon, plastic, etc.), can be a single material or a composite of materials that achieve the same performance . Composite materials can include, but are not limited to, reinforced materials, such as glass fibers, carbon fibers, boron fibers, graphite fibers, graphene fibers, silicon carbide fibers, aramid fibers or the like. The composite materials can also be other organic and / or inorganic composite materials, such as various types of glass fiber reinforced by unsaturated polyester and epoxy, a glass fiber comprising a phenolic resin matrix. The thickness of the first vibration-conducting plate must not be less than 0.005 mm. Preferably, the thickness can be from 0.005 mm to 3 mm. More preferably, the thickness can be from 0.01 mm to 2 mm. Most preferably, the thickness can be 0.01mm-1mm. Preferably, the thickness can be from 0.02 mm to 0.5 mm. The first vibration-conducting plate may have an annular structure, preferably including at least one annular ring, preferably including at least two annular rings. The annular ring can be a concentric ring or a non-concentric ring and can connect through at least two rods that converge from the outer ring to the center of the inner ring. More preferably, there can be at least one oval ring. More preferably, there can be at least two oval rings. Different oval rings can have different radii of curvature, and the oval rings can connect through rods. More preferably, there can be at least one square ring. The first vibration-conducting plate may also be in the form of a plate. Preferably, hollow patterns can be configured on the board. And, more preferably, the area of the hollow patterns cannot be less than the area of the non-hollow portion. It should be noted that the materials, structures or thickness described above can be combined in any way to obtain different vibration-conducting plates. For example, the annular vibration conducting plate may have a different thickness distribution. Preferably, the thickness of the ring can be equal to the thickness of the rod. More preferably, the thickness of the rod may be greater than the thickness of the ring. Even more preferably, the thickness of the inner ring may be greater than the thickness of the outer ring.

[0140] Example 1: [0141] The headset holder / headset strap as described may include memory alloy. The headset support / headphone strap can fit in the curves of different users' heads and have good elasticity and better wearing comfort. The headset holder / headset strap can recover its original shape from a deformed state continued for a certain period of time. As used here, the time period can refer to ten minutes, thirty minutes, one hour, two hours, five hours, or it can also refer to one day, two days, ten days, one month, one year or one long period of time. The clamping force that the headset support / headset strap provides can remain stable and cannot gradually decrease over time. The intensity of the pressure between the osteoconductive headset and the surface of a user's body may be within an appropriate range, in order to avoid pain or vibration sensation caused by undue pressure when the user wears the osteoconductive headset. . And the clamping force of the osteoconductive headset can be within a range of 0.2N ~ 1.5N when the osteoconductive headset is used.

[0142] Example 2 [0143] The elastic coefficient of the headset support / headset strap can be kept within a specific range, which results in the low frequency frequency response curve value (for example, less 500Hz) being greater than the value of the high frequency frequency response curve (for example, above 4000Hz).

[0144] Example 3 [0145] The osteoconductive headset can be combined in a spectacle frame or in a helmet or mask with a special function.

[0146] Example 4 [0147] A portable osteoconduction device can include multiple frequency response curves. A user or a tester can choose an appropriate response curve for hearing compensation according to an actual response curve for a person's auditory system. In addition, according to actual requirements, a vibration unit in the osteoconductive hearing aid can allow the osteoconductive hearing aid to generate an optimal frequency response in a specific frequency range, such as 500Hz-4000Hz.

[0148] Example 5 [0149] The vibration generating portion of an osteoconductive headset can be shown in figure 20-A. An osteoconductive headset transducer may include a magnetic circuit system that includes a 2210 magnetic flux conduction plate, a 2211 magnet and a 2212 magnetizer, a 2214 vibration plate, a 2215 coil, a first vibration conducting plate 2216 and a second vibration conducting plate 2217. Panel 2213 can project out of housing element 2219 and can connect with vibration plate 2214 using glue. The transducer can be attached to the housing element 2219 via the first vibrating conductive plate 2216 which forms a suspended structure. [0150] A combined vibration system including the vibration plate 2214, the first vibration conductor plate 2216 and the second vibration conductor plate 2217 can generate a smoother frequency response curve in order to improve the sound quality of the osteoconductive headset. The transducer can be attached to the housing element 2219 via the first vibration conductive plate 2216 to reduce the vibrations that the transducer transfers to the enclosure, effectively reducing the sound leak caused by the housing vibration and reducing the effect of the vibration of the housing element. box housing in sound quality. Figure 20-B shows frequency response curves of the vibration intensities of the housing element of the vibration generating portion and the panel with frequencies. The bold line can refer to the frequency response of the vibration generating portion, including the first vibration conductive plate 2216, and the thin line can refer to the frequency response of the vibration generating portion without the first vibration conducting plate. vibration 2216. As shown in figure 20-B, the vibration intensity of the osteoconductive headset housing element without the first vibration conductive plate may be greater than that of the osteoconductive headset with the first vibration plate when the frequency is over 500Hz. Figure 20-C shows a comparison of the sound leak between a circumstance that the osteoconductive headset includes the first 2216 vibrating conductor plate and another circumstance that the osteoconductive headset does not include the first vibrating conductive plate. 2216. The sound leak when the osteoconductive headset includes the first vibrating conductor plate may be less than the sound leak when the osteoconductive headset does not include the first vibrating conductor plate in the intermediate frequency range ( for example, about 1000Hz). It can be concluded that the use of the first vibration-conducting plate between the panel and the box can effectively reduce the vibration of the box, thus reducing sound leakage.

[0151] The first vibration-conducting plate can be made of materials, for example, but not limited to stainless steel, copper, plastic, polycarbonate or the like, and the thickness can be in the range of 0.01 mm-1 mm.

[0152] Example 6 [0153] As shown in figure 21, panel 2313 can be configured with vibration transfer layer 2320 (for example, but not limited to silica gel) to produce a certain deformation to fit the skin of a user. A portion of contact with panel 2313 in the vibration transfer layer 2320 may be larger than a portion that is not in contact with panel 2313 in the vibration transfer layer 2320 to form a stepped structure. The portion not in contact with panel 2313 on the vibration transfer layer 2320 can be configured with one or more holes 2321. The holes in the vibration transfer layer can reduce sound leakage: the connection between panel 2313 and the housing element 2319 through the vibration transfer layer 2320 can be weakened and the vibrations transferred from the panel 2313 to the housing element 2319 through the transport layer 2320 can be reduced, thereby reducing the sound leak caused by the vibration of the housing element; the area of the 2320 vibration transfer layer configured with holes in the non-protruding portion can be reduced, thereby reducing air leakage and sound caused by air vibration; the vibration of the air in the housing element can be guided and neutralized with the vibration of the air caused by the housing element 2319, thus reducing the leakage of sound.

[0154] Example 7 [0155] As the panel can protrude out of the housing element, in the meantime, the panel can connect with the housing element through the first vibrating conductive plate, the degree of coupling between the the panel and the housing element can be quite reduced and the panel can come into contact with a user with greater freedom to adapt complex contact surfaces (as shown in figure 22-A), since the first vibrating conductive plate provides a certain amount deformation. The first vibration-conducting plate can tilt the panel with respect to the housing element at an angle. Preferably, the angular inclination cannot exceed 5 degrees.

[0156] The vibration efficiency may differ from the contact states. A better contact state can lead to greater vibration transfer efficiency. As shown in figure 22-B, the bold line shows the efficiency of the vibration transfer with a better contact state and the thin line shows a worse contact state. It can be concluded that the best contact state can correspond to a greater efficiency of vibration transfer. [0157] Example 8 [0158] The widest can be added around the housing element. When the housing element comes into contact with a user's skin, the wider surroundings can facilitate a uniform distribution of applied force and improve the user's wearing comfort. As shown in figure 23, there may be a height difference d0 between panel 2513 and the widest surrounding 2510. The strength of the skin in relation to panel 2513 can decrease the distance d between panel 2510 and the widest surrounding. When the force between the osteoconductive headset and the user is greater than the force applied to the first vibrating conductor plate with a deformation of d0, the extra force can be transferred to the user's skin through the wider 2510, without influencing the fixation force of the vibration portion and the consistency of the fixation force can be improved, thus guaranteeing the sound quality.

[0159] Example 9 [0160] The shape of the panel can be shown in figure 24, and a connector 2620 between a panel 2610 and a transducer (not shown in figure 26) can be illustrated by the dotted line. The transducer can transfer vibrations to panel 2610 through connector 2620 and connector 2620 can be located at a center of vibration on panel 2610. The distance between the center of connector 2620 and both sides of panel 2610 can be L1 and L2, respectively. The contact characteristics between the panel and a user's skin and the efficiency of vibration transfer can be changed by varying the size of panel 2610 and the location of connector 2626 on panel 2610. Preferably, the ratio of L1 to L2 can be greater than 1. More preferably, the ratio of L1 to L2 can be greater than 1.61. More preferably, the ratio of L1 to L2 can be greater than 2. For another example, a large panel, a central panel or a small panel can be configured in the vibration unit. The large panel used here can refer to the panel in figure 24, whose area may be larger than that of the 2620 connector. The area of the central panel may be equal to the area of the 2620 connector. The area of the small panel may be smaller than than the area of the 2620 connector. Different panel sizes and different locations of the 2620 connector can lead to different distributions of vibrations on the user's skin, thus introducing differences in volume and sound quality.

[0161] The embodiments described above are merely implements of the present description, and the descriptions may be specific and detailed, but these descriptions cannot limit the present description. It should be noted that those versed in the technique, without deviating from the concepts of the osteoconductive headset, can make several modifications and changes, for example, the sound transfer approaches described in the specification, but these combinations and modifications are still in the scope of this description. CLAIMS:

Claims (15)

1. Method for improving the sound quality of an osteoconductive headset, characterized by the fact that it comprises provision of an osteoconductive headset, the osteoconductive headset including a vibration unit, the vibration unit, at least, including a contact surface that is directly or indirectly in contact with a user, a pressure between the contact surface and the user being greater than 0.1 N, and the pressure between the contact surface and the user being less than 5N. 2. Method, according to claim 1, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2 N and less than 4 N. 3. Method, according to claim 1, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2 N and less than 3 N. 4. Method according to claim 1, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2 N and less than 1.5 N. 5. Method according to claim 1, characterized by the fact that the pressure between the contact surface and the user is greater than 0.3 N and less than 1.5 N. 6. Method according to claim 1, characterized by the fact that the pressure is distributed evenly on the contact surface. 7. Method according to claim 1, characterized by the fact that a frequency response from an osteoconductive headset is a superposition of frequency responses from each point on the contact surface. 8. Osteoconduction headset, characterized by the fact that it comprises a vibration unit, the vibration unit, at least, including a contact surface that contacts directly or indirectly with a user, a pressure between the contact surface and the user being greater than 0.1 N and the pressure between the contact surface and the user being less than 5N. 9. Headphone, according to claim 8, characterized by the fact that the osteoconductive headset includes a headset holder and the headset holder being made of materials including memory alloy or engineering plastic . 10. Headphone, according to claim 8, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2N and less than 4N. 11. Headphone, according to claim 8, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2 N and less than 3 N. 12. Headphone, according to claim 8, characterized by the fact that the pressure between the contact surface and the user is greater than 0.2 N and less than 1.5 N. 13. Headphone, according to claim 8, characterized by the fact that the pressure between the contact surface and the user is greater than 0.3N and less than 1.5 N. 14. Headphone, according to claim 8, characterized by the fact that the pressure is distributed evenly on the contact surface. 15. Headphone according to claim 8, characterized by the fact that a frequency response of the osteoconductive headset is a superposition of frequency responses from each point on the contact surface.